JPH02122541A - Transfer device for semiconductor wafer - Google Patents
Transfer device for semiconductor waferInfo
- Publication number
- JPH02122541A JPH02122541A JP63275723A JP27572388A JPH02122541A JP H02122541 A JPH02122541 A JP H02122541A JP 63275723 A JP63275723 A JP 63275723A JP 27572388 A JP27572388 A JP 27572388A JP H02122541 A JPH02122541 A JP H02122541A
- Authority
- JP
- Japan
- Prior art keywords
- arm
- wafer
- support surface
- wafers
- orientation flat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims description 9
- 230000002093 peripheral effect Effects 0.000 claims abstract description 7
- 235000012431 wafers Nutrition 0.000 claims description 112
- 230000000694 effects Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000004308 accommodation Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Abstract
Description
【発明の詳細な説明】
し産業上の利用分野］
本発明は半導体ウェーハを移載する装置に関し、より具
体的には所定の間隔で上下に積み重ねられた複数の半導
体ウェーハをウェーハキャリアとウェーハボートとの間
で移載する装置に関する。[Detailed Description of the Invention] Industrial Application Field] The present invention relates to an apparatus for transferring semiconductor wafers, and more specifically, the present invention relates to an apparatus for transferring semiconductor wafers, and more specifically, a plurality of semiconductor wafers stacked vertically at predetermined intervals are transferred between a wafer carrier and a wafer boat. Concerning equipment to be transferred to and from
［従来の技術］
従来、多数の半導体ウェーハを上下に積み重ねた状態で
、例えば縦形炉方式により薄躾形成処理を施すことは、
−度に多数のウェーハの処理が可能な為作業上有利であ
り、品質の一定した半導体デバイスの効率の良い製造を
可能とする。[Prior Art] Conventionally, it has been difficult to perform a thin wafer formation process on a large number of semiconductor wafers stacked one above the other using, for example, a vertical furnace method.
- It is advantageous in terms of operation since it is possible to process a large number of wafers at a time, and it enables efficient manufacturing of semiconductor devices of constant quality.
つＩ−ハはシリコン又はゲルマニウム等の半導体結晶か
らなる円柱状のインゴットを径方向に薄く切ったもので
厚さ６００μｓ程度、直径３〜１０インチの円板の形状
を呈しており、該円板の方向性を示す為にあらかじめ、
インゴットの側面にその長手方向に沿って設けられた所
定の幅とを持ったオリフラ（オリエンテーション・フラ
ット）が設けられる。I-Ha is a cylindrical ingot made of semiconductor crystals such as silicon or germanium, cut into thin pieces in the radial direction, and has the shape of a disk with a thickness of about 600 μs and a diameter of 3 to 10 inches. In order to indicate the direction of
An orientation flat having a predetermined width is provided along the longitudinal direction of the ingot.
多数のウェーハは、所定の間隔で上下に積み重ねられた
状態で、ウェーハを処理する際に処理装置の中に収容す
る為のウェーハボートと、ウェーハを処理装置の外にて
収容し、移動する為のウェーハキャリアとの間で移載さ
れる。ウェーハの該移載は例えば特開昭６１−２６３５
３３号明ａｍでルウェーハを支持する。支持手段と、ウ
ェーハボートおよびウェーハキャリアに対して支持手段
を相対的に往復動させる駆動手段とを有し、−括して上
下に積み重ねられた状態を保った１１でウェーハを移載
する移載装置によりなされる。A large number of wafers are stacked vertically at predetermined intervals, and there is a wafer boat for storing the wafers inside the processing equipment when processing the wafers, and a wafer boat for storing and moving the wafers outside the processing equipment. The wafer is transferred to and from the wafer carrier. The transfer of wafers is described in, for example, Japanese Patent Application Laid-Open No. 61-2635.
No. 33 Akiam supports Lewafer. A transfer device comprising a support means and a drive means for reciprocating the support means relative to a wafer boat and a wafer carrier, and for transferring wafers with 11 in which the wafers are collectively stacked vertically. This is done by a device.
［発明が解決しようとする課題］
しかしながら、従来の移載装置によれば、つ工−ハキャ
リアに収容された多数のウェーハのオリフラが所望の方
向に沿っている保証はなく特につＩ−ハキャリアを移載
装置にセットする際にオリフラがずれる為に、オリフラ
が所望の方向に向いていないまま、収容されたウェーハ
をウェーハボートに移載する事態が発生し、この場合に
は、ウェーハボートの支持点にオリフラが向いてつｌ−
八が支持点から外れることにより、ウェーハ落下の事故
や処理後のウェーハにたわみが発生するという欠点があ
った。[Problems to be Solved by the Invention] However, with the conventional transfer device, there is no guarantee that the orientation flats of a large number of wafers accommodated in a wafer carrier are aligned in a desired direction, especially for I-wafers. Because the orientation flat shifts when the carrier is set on the transfer device, a situation occurs where the accommodated wafers are transferred to the wafer boat without the orientation flat facing in the desired direction.In this case, the wafer boat With the orientation flat facing the support point of l-
There are disadvantages in that the wafer may fall off from the support point and the wafer may fall or the wafer may be warped after processing.
本発明の目的は、ウェーハキャリアに収容されたウェー
ハを、オリフラが所望の方向に向いていない場合にも、
所望の方向へ向けてから、ウェーハボートに確実に移載
する装置を提供する事にある。An object of the present invention is to move a wafer housed in a wafer carrier even when the orientation flat is not oriented in a desired direction.
It is an object of the present invention to provide a device that reliably transfers wafers to a boat after directing them in a desired direction.
［課題を解決する為の手段］
本発明によれば前記の目的は、所定の間隔で上下に積み
重ねられた状態で収容されており、オリフラがそろえら
れるべき所望の方向を有する多数の半導体ウェーハを移
動用収容部と処理用収容部との間で前記状態を保ちつつ
移載する装置であって、
前記状態にあり且つ前記オリフラが前記所望の方向の付
近を向いている多数のウェーハの夫々の周縁曲面部の一
部と嵌合する多数の湾曲した溝を規定する第１の支持面
を先端部に有すると共に前記第１の支持面と反対の根元
の側に伸張する第１のアームと、
前記状態にあり且つ前記オリフラが前記所望の方向を向
いている多数のウェーハの夫々のオリフラ部と嵌合する
多数の真直ぐな溝を規定する第２の支持面を先端部に有
すると共に前記第２の支持面と反対の根元の側に伸張す
る第２のアームであって、前記第１のアームと前記第２
のアームとが同一軌道線上を伸張し且つ前記第１の支持
面と前記第２の支持面とが対面するように配置された第
２のアームと、
前記第１のアームと前記第２のアームとを前記同一軌道
線上において往復運動させる駆動手段とからなり、
前記第１のアームの先端部は、前記移動用収容部におい
て前記ウェーハを出し入れする第１の開口部の反対側に
設けられた第１の通過手段および前記第１の開口部を通
過するように構成され、且つ前記第２のアームの先端部
は、前記処理用収容部において前記ウェーハを出し入れ
する第２の開口部の反対側に設けられた第２の通過手段
および前記第２の開口部を通過するように構成されたこ
とを特徴とする装置
によって達成される。[Means for Solving the Problems] According to the present invention, the above-mentioned object is to store a large number of semiconductor wafers that are housed in a vertically stacked state at predetermined intervals and have a desired direction in which the orientation flats are to be aligned. An apparatus for transferring and loading a plurality of wafers between a moving storage section and a processing storage section while maintaining the above-mentioned state, wherein each of a large number of wafers is in the above-mentioned state and the orientation flat is facing near the desired direction. a first arm having a first support surface at its distal end defining a plurality of curved grooves that fit with a portion of the peripheral curved surface portion and extending to a side of the base opposite to the first support surface; a second supporting surface defining a plurality of straight grooves that are fitted to respective orientation flat portions of a plurality of wafers that are in the state and whose orientation flats are oriented in the desired direction; a second arm extending to a side of the base opposite to a support surface of the first arm and the second arm;
a second arm extending on the same trajectory line and arranged such that the first support surface and the second support surface face each other; the first arm and the second arm; and a driving means for reciprocating the wafers on the same trajectory line, and the tip of the first arm is connected to a first opening provided on the opposite side of the first opening for loading and unloading the wafer in the moving storage section. 1 passage means and the first opening, and the tip of the second arm is located on the opposite side of the second opening through which the wafer is taken in and taken out in the processing container. This is achieved by a device characterized in that it is configured to pass through a second passage means provided and said second opening.
［作 用］
本発明の＠置はウェーハを移載する際には第１の開口部
と第２の間口部とが対面するように配置された移動用収
容部と処理用収容部とに対して、第１の支持面が第１の
通過手段および第１の間口部、を介して第２の間口部に
対面し、且つ第２の支持面が第２の通過手段および第２
の間口部を介して第１の開口部に対面するように配置さ
れる。[Function] When the wafer is transferred, the @ placement of the present invention is effective against the moving storage section and the processing storage section, which are arranged so that the first opening and the second opening face each other. The first support surface faces the second frontage via the first passage means and the first frontage, and the second support surface faces the second frontage through the second passage means and the second frontage.
The first opening is arranged to face the first opening through the frontage.
本発明のｇ置は前述のごとくに構成されているが故に、
移動用収容部に収容されており移動収容部の移動や移載
装置へのセットの際の揺動・振動によりオリフラが所望
の方向に対して不完全にそろって第１の開口部の側に向
いている多数のウェーハを処理用収容部に移載する場合
には、本発明のＶｉ買を順を追って以下のイ）〜ト）に
示すごとくに動作させる。Since the g position of the present invention is configured as described above,
The orientation flat, which is housed in the movable accommodating part, may be imperfectly aligned in the desired direction due to rocking and vibration when the movable accommodating part is moved or set on the transfer device, and it may be placed on the side of the first opening. When transferring a large number of wafers facing each other to the processing storage section, the Vi converter of the present invention is operated in sequence as shown in (a) to (g) below.
イ） 駆動手段により第１のアームを第１のアームの先
端方向へ移動させて、第１の支持面を第１の通過手段を
介して移動用収容部の内側へと通過させ、ウェーハの第
１の通過手段の側の周側部を湾曲した溝に嵌合させ、更
にウェーハが第１の開口部から落下しない程度につＩ−
八を第１の開口部の側へ押す。b) The first arm is moved toward the tip of the first arm by the driving means, and the first support surface is passed through the first passage means into the moving housing part, and the first arm of the wafer is moved toward the distal end of the first arm. The circumferential side on the side of the first passage means is fitted into the curved groove, and the I-
Push the 8 toward the first opening.
Ｏ） 駆動手段により第１のアームを第１のアームの根
元方向へ移動させて、第１の支持面を第１の通過手段を
介して移動用収容部の外側へと通過させる。O) The first arm is moved in the direction of the base of the first arm by the drive means, and the first support surface is passed through the first passage means to the outside of the moving accommodation part.
ハ） 駆動手段により第２のアームを第２のアームの先
端方向へ移動させて、第２の支持面を第２の通過手段お
よび第２の開口部を通過させ、第１ハ
の開口部へと至らせ、更にウェー珠の第１の開口部の側
にあるオリフラ部に真直ぐな溝を嵌合さゼるべく、ウェ
ーハを回転させながら第１の通過手段の側へ押す。C) Moving the second arm toward the tip of the second arm by the driving means, causing the second support surface to pass through the second passing means and the second opening, and enter the opening of the first C. Then, the wafer is rotated and pushed toward the first passage means in order to fit the straight groove into the orientation flat portion on the side of the first opening of the wafer.
二） 駆動手段により第１のアームを第１のアームの先
端方向へ移動させて第１の支持面を第１の通過手段を介
して移動用収容部の内側へと通過させ、ウェーハの第１
の通過手段の側の周側部を湾曲した溝に嵌合させ、ウェ
ーハを第１の支持面と第２の支持面との間に挟み、オリ
フラ部の真直ぐな溝への嵌合を完成させる。2) The driving means moves the first arm in the direction of the tip of the first arm so that the first support surface passes through the first passage means into the moving housing part, and the first arm of the wafer is
The circumferential side portion on the side of the passage means is fitted into the curved groove, the wafer is sandwiched between the first support surface and the second support surface, and the orientation flat portion is completely fitted into the straight groove. .
ホ） 移動用収容部を下げてウェーハを移動用収容部の
積載面から浮かせ、ウェーハを第１の支持面と第２の支
持面とにより支持する。(e) The moving storage section is lowered to lift the wafer off the loading surface of the moving storage section, and the wafer is supported by the first support surface and the second support surface.
へ） 駆動手段により、ウェーハを第１の支持面と第２
の支持面とにより支持したまま第１のアームと第２のア
ームとを第１のアームの先端方向へ移動させて、ウェー
ハを処理用収容部に移動させる。) The driving means moves the wafer between the first support surface and the second support surface.
The first arm and the second arm are moved toward the distal end of the first arm while being supported by the support surface of the wafer, and the wafer is moved to the processing storage section.
ト） 処理用収容部を上げてウェーハを処理用収容部の
積載面に載せる。g) Raise the processing container and place the wafer on the loading surface of the processing container.
チ） 駆動手段により、第１のアームと第２のアームと
を夫々の根元方向へ夫々移動させて、イ）の動作の前の
元の位置に戻す。h) The driving means moves the first arm and the second arm toward their respective roots and returns them to their original positions before the operation of a).
以上のイ）〜ト）に示すごとくに動作させるが故にウェ
ーハの移載を確実に行ない得ると共にオリフラが実質的
に所望の方向に完全にそろった状態で多数のウェーハを
処理用収容部に収容して移載を完了し得る。Since the operations are performed as shown in A) to G) above, wafers can be transferred reliably, and a large number of wafers can be accommodated in the processing storage section with the orientation flats substantially completely aligned in the desired direction. The transfer can then be completed.
又、処理用収容部に収容されており、オリフラが実質的
に所望の方向に完全にそろっている多数のウェーハを移
動用収容部に移載する場合にｔよ、前述のホ）、へ）、
ｌ−）、およびチ）の動作を逆に行なった後に、駆動手
段により第１のアームと第２のアームとを夫々の根元方
向へ夫々移動させて元の位置に戻して移載を完了させれ
ば、移載を確実に行ない得ると共にオリフラが実質的に
所望の方向に完全にそろった状態で多数のウェーハを移
動用収容部に収容して移載を完了し得る。Also, when transferring a large number of wafers housed in the processing housing and whose orientation flats are substantially completely aligned in a desired direction to the moving housing, the above-mentioned steps t, e), and ,
After performing the operations l-) and h) in reverse, the first arm and the second arm are moved toward their respective bases by the driving means and returned to their original positions to complete the transfer. If so, the transfer can be carried out reliably, and the transfer can be completed by storing a large number of wafers in the moving storage section with the orientation flats substantially completely aligned in the desired direction.
又、本発明の装置は、第１のアームを処理用収容部の側
に、第２のアームを移動用収容部の側に配置して、移動
用収容部に収容されておりオリフラがそろえられるべき
所望の方向が第１の通過手段に正対する方向である多数
のつＩ−ハを処理用収容部に移載する場合に使用しても
同様に作用し得る。Further, the device of the present invention is housed in the moving housing section with the first arm disposed on the side of the processing housing section and the second arm on the side of the moving housing section, so that the orientation flats can be aligned. The same effect can be achieved even if the present invention is used when a large number of I-Has, whose desired direction is directly opposite the first passage means, are transferred to the processing storage section.
本発明の装置にかかる処理用収容部としては溝を有する
支柱の４本からなり第２の通過手段が支柱のうち隣接す
る２本の間に存在する空間であるものが好ましい。It is preferable that the processing housing according to the apparatus of the present invention is made up of four pillars having grooves, and the second passage means is a space between two adjacent pillars.
又、本発明の装置に第１の支持面と第２の支持面との間
の距離を感知する感知手段を設けることにより、オリフ
ラ部が完全には又は全く第２の溝に嵌合せずにずれてい
る（該距離が大きくなる）のを感知して非常を示し、支
持および移載の失敗を未然に防ぐことも出来る。Further, by providing the device of the present invention with a sensing means for sensing the distance between the first support surface and the second support surface, it is possible to prevent the orientation flat portion from completely or completely fitting into the second groove. It is also possible to sense the shift (the distance increases) and indicate an emergency to prevent support and transfer failures.
［具体例］
本発明の具体例による＠置を図面を参照しながら以下に
説明する。[Specific Example] An @ arrangement according to a specific example of the present invention will be described below with reference to the drawings.
第１図において、ウェーハキャリア１は図示しない多数
のウェーハを所定の間隔で上下に積み重ねた状態で収容
する為に夫々のつＩ−への周縁部を載せる積載面を含む
面が規定する溝２を所定の間隔で有しており、キャリア
１は、ウェーハを処理する為に収容するウェーハボート
３に対して、ウェーハを出し入れする為の開口部４がボ
ート３の開口部５に対面するように配置されており、ボ
ート３は４本のボート支柱６からなり、夫々の支柱６は
、溝２と同様の間隔で、夫々のウェーハの周縁部を載せ
る積載面を含む面が規定する満７を有している。In FIG. 1, a wafer carrier 1 has a groove 2 defined by a surface including a loading surface on which the peripheral edge of each I- is placed in order to accommodate a large number of wafers (not shown) stacked vertically at predetermined intervals. at a predetermined interval, and the carrier 1 is arranged so that the opening 4 for loading and unloading wafers faces the opening 5 of the wafer boat 3 that accommodates the wafers for processing. The boat 3 consists of four boat struts 6, and each of the struts 6 is spaced at the same intervals as the grooves 2, and has a width of 7. have.
本発明の具体例による装置は、第１のアーム８が、支持
面９がキャリア１の通過口１０および開口部４を介して
間口部５に対面し、且つ第２のアーム１１が、支持面１
２がボート３の通過口１３および開口部５を介して開口
部４に対面するように配置される。アーム８とアーム１
１とは図示しない駆動手段により夫々矢印１４および矢
印１５の方向に往復運動し、支持面９は″ｉ！１過口１
０および間口部４を介して開口部５まで移動し得、支持
面１２は通過口１３および開口部５を介して開口部４ま
で移動し得るように構成されている。In the device according to the embodiment of the invention, the first arm 8 has a support surface 9 facing the frontage 5 through the passage opening 10 and the opening 4 of the carrier 1, and the second arm 11 has the support surface 1
2 is arranged so as to face the opening 4 through the passage port 13 of the boat 3 and the opening 5. arm 8 and arm 1
1 and 1 are reciprocated in the directions of arrows 14 and 15, respectively, by driving means (not shown), and the supporting surface 9 is
0 and the opening 4 to the opening 5, and the support surface 12 is configured to be movable to the opening 4 via the passage 13 and the opening 5.
支持面９にはウェーハの周縁の曲面部の一部と嵌合する
湾曲した溝１６を溝２と同様の間隔で有しており、支持
面１２にはウェーハの周縁のオリフラ部と嵌合する真直
ぐな満１７を？１１１２と同様の間隔で有している。The support surface 9 has curved grooves 16 at the same spacing as the grooves 2, which fit with a part of the curved surface on the periphery of the wafer, and the support surface 12 has curved grooves 16 that fit with a part of the curved surface on the periphery of the wafer. Straight man 17? 1112 at the same intervals.
キャリア１とボート３とは夫々図示しない移動手段によ
り上下に移動する。満２および？１！７は夫々例えば２
５段に渡って設けられており、従って夫々２５枚のウェ
ーハを積載することが出来、つＩ−ハの出入りが可能な
ように開口部４および５が設けられている。ボート３は
ウェーハの処理における高温温度に椴えうる例えば石英
ガラス製であり、支柱６と天１１８とからなり、例えば
ＣＶＤ処理を施す縦型炉の中に設置され、ボート３に収
容した多数のウェーハを一括して処理することが出来る
。The carrier 1 and the boat 3 are moved up and down by moving means (not shown). Full 2 and? For example, 1!7 is 2
It is provided in five stages, so that 25 wafers can be loaded on each stage, and openings 4 and 5 are provided to allow I-wafers to enter and exit. The boat 3 is made of, for example, quartz glass and can be used at high temperatures during wafer processing. Wafers can be processed in batches.
次に第２図を参照しながら本発明の具体例の装置による
キャリア１からボート３へのウェーハ１００の移載を順
を追って以下に示す（ａ）から（０）までの動作とこれ
らの動作に対応する図２− （ａ）から（ｇ）と共に説
明する。Next, with reference to FIG. 2, the following operations (a) to (0) and these operations will be described in order to transfer the wafer 100 from the carrier 1 to the boat 3 using the apparatus according to the specific example of the present invention. This will be explained together with FIGS. 2-(a) to (g) corresponding to FIG.
（ａ）第２図−（ａ）ではウェーハ１００は直径が約１
５αであり例えばキャリア１の２５段の溝２に２５枚収
容されており、オリフラ１０１は幅が約５ ｃｔｎであ
りこの場合、開口部４に正対する方向を所望の方向とし
てそろえられている。しかしながら、オリフラ１０１は
、キャリア１の移動の際や移載装置にセットする際の揺
動・振動により所望の方向から多少ずれた方向を向いて
不完全にそろっている。(a) FIG. 2 - In (a) the wafer 100 has a diameter of about 1
5α, for example, 25 sheets are accommodated in 25 stages of grooves 2 of the carrier 1, and the orientation flat 101 has a width of about 5 ctn, and in this case, is aligned with the direction facing the opening 4 as a desired direction. However, the orientation flat 101 faces in a direction slightly deviated from the desired direction and is imperfectly aligned due to rocking and vibration when the carrier 1 is moved or set on a transfer device.
今、アーム８とアーム１１は移載を前にして第２図−（
ａ）の位置にあり、まずアーム８はアーム８の先端方向
へ移動する。Now, arm 8 and arm 11 are shown in Figure 2-(
At the position a), the arm 8 first moves toward the tip of the arm 8.
（ｂ）第２図−（ｂ）ではアーム８はキャリア１の通過
口１０を介して移動を続け、幅が約５ｃＩＩである支持
面９の溝１６がウェーハ１００の通過口１０の側の周縁
曲面部に嵌合する。アーム８は更に移動を続け、ウェー
ハ１００を約１０順押し、移動を停止する。(b) In FIG. 2-(b), the arm 8 continues to move through the passage hole 10 of the carrier 1, and the groove 16 of the support surface 9, which has a width of about 5 cII, is located at the periphery of the wafer 100 on the side of the passage hole 10. Fits into curved surface. The arm 8 continues to move, pushes the wafer 100 about 10 times, and then stops moving.
（ｃ）第２図−（ｃ）では、アーム８はアーム８の根元
方向へ移動し、キャリア１から離れる。アーム１１はア
ーム１１の先端方向へ移動し、通過口１３および開口部
５を介して移動を続け、幅が約５０である支持面１２の
溝１７に、まずオリフラ１０１の支持面１２に最も接近
している片側部１０２が接触する。アーム１１は更に移
動を続け、支持面１２にオリフラ１０１が正対するよう
にウェーハ１００を回転させながら約１０朋押し、移動
を停止する。(c) In FIG. 2-(c), the arm 8 moves toward the base of the arm 8 and separates from the carrier 1. The arm 11 moves toward the distal end of the arm 11, continues to move through the passage port 13 and the opening 5, and first approaches the groove 17 of the support surface 12, which has a width of about 50 mm, closest to the support surface 12 of the orientation flat 101. The two side portions 102 that are in contact with each other. The arm 11 continues to move, rotates and pushes the wafer 100 about 10 degrees so that the orientation flat 101 directly faces the support surface 12, and then stops moving.
（ｄ）第２図−（ｄ）では、アーム８は再びアーム８の
先端方向へ移動する。(d) In FIG. 2-(d), the arm 8 moves again toward the tip of the arm 8.
（ｅ）第２図−（ｅ）では、アーム８は移動を続け、支
持面９の溝１６がウェーハ１００の通過口１ｏの側の周
縁曲面部に嵌合し、ウェーハ１００を支持面９と支持面
１２との間に挟み、オリフラ１０１の溝１７への嵌合を
完成させて、停止する。(e) In FIG. 2-(e), the arm 8 continues to move, and the groove 16 of the support surface 9 fits into the peripheral curved surface of the wafer 100 on the side of the passage port 1o, and the wafer 100 is moved between the support surface 9 and the groove 16 of the support surface 9. The orientation flat 101 is inserted between the support surface 12 and the groove 17, and the orientation flat 101 is completely fitted into the groove 17, and then stopped.
この際、本発明の具体例による装置の一つによれば、支
持面９と支持面１２との間の距離を感知する図示しない
感知手段を設けているが故に、オリフラ１０１が完全に
は又は全く満１７に嵌合せずにずれている場合には、該
距離が正常の場合よりも大きくなることから非常を感知
し、装置の作動を停止することにより、後に続くウェー
ハ１００の支持および移載の失敗を未然に防ぐことが出
来、有利である。このような事態はオリフラ１０１がキ
ャリア１の中で大きくずれている場合に発生し得るが、
通常は本発明の具体例による装置によりオリフラ１０１
を所望の方向にそろえることが可能な程度にオリフラ１
０１が所望の方向に対して不完全にそろっているのが普
通である。At this time, according to one of the apparatuses according to the embodiments of the present invention, since a sensing means (not shown) is provided for sensing the distance between the support surface 9 and the support surface 12, the orientation flat 101 is completely or If the wafer 100 is not fully fitted at all and is misaligned, the distance is larger than normal, so an emergency is sensed, and the operation of the device is stopped, thereby preventing the subsequent support and transfer of the wafer 100. It is advantageous because it can prevent failures. This kind of situation can occur if the orientation flat 101 is largely misaligned within the carrier 1, but
Orientation flat 101 is usually
Orientation flat 1 to the extent that it is possible to align the
01 is usually imperfectly aligned with the desired direction.
次に、キャリア１を図示しない移動手段により数層下げ
、ウェーハ１００をｉＩｙ！２の積載面から浮かせ、支
持面９と支持面１２とによりウェーハ１００を支持する
。Next, the carrier 1 is lowered several layers by a moving means (not shown), and the wafer 100 is moved iiy! The wafer 100 is supported by the support surface 9 and the support surface 12.
（ｆ）第２図−（ｆ）では、支持面９と支持面１２とに
よりウェーハ１００を支持したまま、アーム８とアーム
１１とをアーム８の先端方向へ移動する。従ってウェー
ハ１００は開口部４から出て、間口部５へと入り、既ち
キャリア１からボート３へと移動される。(f) In FIG. 2-(f), while the wafer 100 is supported by the support surfaces 9 and 12, the arms 8 and 11 are moved toward the tips of the arms 8. The wafer 100 thus emerges from the opening 4 and enters the frontage 5, having already been transferred from the carrier 1 to the boat 3.
（（１）第２図−（（１）では、アーム８とアーム１１
とは移動を続け、ウェーハ１００がボート３の収容位置
にくると停止する。この時ウェーハ１００は溝７の槙戟
面から数闇浮いた位置にあり、ボート３を図示しない移
動手段により数闇上昇させ、ウェーハ１００を満７の積
載面に載せる。＠後にアーム８とアーム１１とは夫々の
根元方向へ夫々移動して、第２図−ｆａ）の動作を始め
る前の位置に戻り、つＩ−ハ１００の移載を完了する。((1) Figure 2 - ((1) shows arm 8 and arm 11.
The wafer 100 continues to move and stops when the wafer 100 reaches the accommodation position of the boat 3. At this time, the wafers 100 are at a position a few feet above the concave surface of the groove 7, and the boat 3 is raised a few degrees by a moving means (not shown), and the wafers 100 are placed on the loading surface of the groove 7. Afterwards, the arm 8 and the arm 11 move toward their respective bases and return to the positions before starting the operation shown in FIG. 2-fa), completing the transfer of the I-HA 100.
従って、本発明の具体例の装置の以上に示した（ａ）か
ら（ｑ）の動作をもって、キャリア１からボート３への
ウェーハ１００の移載を行なうと、オリフラ１０１が実
質的に所望の方向に完全にそろった状態でウェーハ１０
０はボート３に収容され、例えばＣＶＤ処理などの処理
を受ける。本発明の具体例のｖＲｅｌにより移載すると
、ウェーハ１００を従来の移載装置により移載した場合
に発生する第３図（ａ）および（ｂ）に示すごとくのオ
リフラ１０１によるウェーハ１００の溝７からの脱落を
阻止し得、従って特に第３図−（ａ）の場合にウェーハ
１００が落下する事故を阻止し得る。Therefore, when the wafer 100 is transferred from the carrier 1 to the boat 3 by the operations (a) to (q) shown above of the apparatus according to the specific example of the present invention, the orientation flat 101 is substantially moved in the desired direction. Wafer 10 is completely aligned.
0 is accommodated in the boat 3 and undergoes processing such as CVD processing. When the wafer 100 is transferred using the vRel according to the specific example of the present invention, the groove 7 in the wafer 100 caused by the orientation flat 101 as shown in FIGS. Therefore, an accident in which the wafer 100 falls can be prevented, especially in the case of FIG. 3-(a).
又、処理を終えたウェーハ１００をボート３からキャリ
ア１へと再度収容する場合には、ウェーハ１００は先の
移載によりオリフラ１０１が実質的に所望の方向にそろ
った状態でボート３に収容されているので、前述の（ｄ
） 、 ｆｅ） 、 （ｆ） 、 （＋ＩＩ）の動作を
全く逆に行なった後にアーム８とアーム１１とを夫々の
根元方向へ夫々移動させる動作により移載を行なえばオ
リフラ１０１が実質的に所望の方向にそろった状態を維
持したままウェーハ１００をキャリア１に移載し得る。Furthermore, when the wafers 100 that have been processed are again stored in the carrier 1 from the boat 3, the wafers 100 are stored in the boat 3 with the orientation flats 101 substantially aligned in the desired direction due to the previous transfer. Therefore, the above (d
), fe), (f), and (+II) are performed in complete reverse order, and then the orientation flat 101 is substantially moved as desired if the transfer is performed by moving the arms 8 and 11 toward their respective bases. The wafer 100 can be transferred to the carrier 1 while keeping the wafer 100 aligned in the direction.
又、本発明の具体例の装置は、アーム８とアーム１１と
の位置を入れかえ且つキャリア１に収容されるウェーハ
１００のオリフラ１０１の所望の方向を通過口１０の側
に設定すれば、前述の！ａ）から［ｇ）の動作と同様の
動作によりウェーハ１００をキャリア１からボート３へ
とオリフラ１０１を所望の方向へそろえてから、移載し
得る。Further, the apparatus of the specific example of the present invention can achieve the above-mentioned effect by switching the positions of the arms 8 and 11 and setting the desired direction of the orientation flat 101 of the wafer 100 accommodated in the carrier 1 to the passage port 10 side. ! The wafer 100 can be transferred from the carrier 1 to the boat 3 after aligning the orientation flat 101 in a desired direction by operations similar to those in steps a) to [g).
本発明の装置において、第１のアームおよび第２のアー
ムは真直ぐである必要はなく、例えば湾曲したアームで
あり、湾曲した同一軌道線上を往復運動するアームから
なる装置であっても良い。In the device of the present invention, the first arm and the second arm do not need to be straight, but may be curved arms, for example, and may be a device consisting of arms that reciprocate on the same curved trajectory.
［発明の効果Ｊ
本発明によれば、オリフラを所望の方向にそろえてから
ウェーハを移動用収容部から処理用収容部へと移載する
が故に、オリフラを所望の方向に向けた状態でウェーハ
を処理用収容部へ正規に収容し得、ウェーハ落下の事故
を阻止し冑、従って良好なウェーハの処理を行ないｔ７
、又、アームによる支持の失敗がない。[Effect of the Invention J According to the present invention, since the wafer is transferred from the transfer storage section to the processing storage section after aligning the orientation flat in a desired direction, the wafer can be transferred with the orientation flat oriented in the desired direction. The wafers can be properly stored in the processing storage section, preventing accidents of wafers from falling, and therefore ensuring good wafer processing.
Also, there is no failure of support by the arm.
又、本発明の別の見知によれば、オリフラが所望の方向
から大きく外れた方向を向いており、本発明によりオリ
フラを所望の方向にそろえることが出来ない場合には、
オリフラがずれていることを感知して非常を示すが故に
、アームによる支持の失敗およびウェーハ落下の事故を
未然に防止し得る。According to another finding of the present invention, if the orientation flat is facing in a direction far away from the desired direction and it is not possible to align the orientation flat in the desired direction using the present invention,
Since it senses that the orientation flat is misaligned and indicates an emergency, it is possible to prevent failure of support by the arm and accidents of the wafer falling.
第１図は本発明の具体例の装置を説明する斜視図、
第２図は本発明の具体例の装置の動作の説明図、第３図
は従来の装置により光生ずる事態を示す説明図である。
１・・・・・・ウェーハキャリア、 ２，７，１６．
１７・・・・・・潜、３・・・・・・ウェーハボート、
４．５・・・・・・開口部、６・・・・・・ポート
支柱、 ８・・・・・・第１のアーム、９・・・・・
・第１の支持面、 １０．１３・・・・・・通過口、１
１・・・・・・第２アーム、 １２・・・・・・第２の
支持面。FIG. 1 is a perspective view illustrating a device according to a specific example of the present invention, FIG. 2 is a diagram illustrating the operation of a device according to a specific example of the present invention, and FIG. 3 is a diagram illustrating a situation in which light is generated by a conventional device. be. 1... Wafer carrier, 2, 7, 16.
17...submarine, 3...wafer boat,
4.5...Opening, 6...Port support, 8...First arm, 9...
・First support surface, 10.13... Passage port, 1
1...Second arm, 12...Second support surface.
Claims (3)
れており、オリフラがそろえられるべき所望の方向を有
する多数の半導体ウェーハを移動用収容部と処理用収容
部との間で前記状態を保ちつつ移載する装置であって、 前記状態にあり且つ前記オリフラが前記所望の方向の付
近を向いている多数のウェーハの夫々の周縁曲面部の一
部と嵌合する多数の湾曲した溝を規定する第１の支持面
を先端部に有すると共に前記第１の支持面と反対の根元
の側に伸張する第１のアームと、 前記状態にあり且つ前記オリフラが前記所望の方向を向
いている多数のウェーハの夫々のオリフラ部と嵌合する
多数の真直ぐな溝を規定する第２の支持面を先端部に有
すると共に前記第２の支持面と反対の根元の側に伸張す
る第２のアームであって、前記第１のアームと前記第２
のアームとが同一軌道線上を伸張し且つ前記第１の支持
面と前記第２の支持面とが対面するように配置された第
２のアームと、 前記第１のアームと前記第２のアームとを前記同一軌道
線上において往復運動させる駆動手段とからなり、 前記第１のアームの先端部は、前記移動用収容部におい
て前記ウェーハを出し入れする第１の開口部の反対側に
設けられた第１の通過手段および前記第１の間口部を通
過するように構成され、且つ前記第２のアームの先端部
は、前記処理用収容部において前記ウェーハを出し入れ
する第２の関口部の反対側に設けられた第２の通過手段
および前記第２の開口部を通過するように構成されてい
ることを特徴とする装置。(1) A large number of semiconductor wafers, which are stacked vertically at predetermined intervals and whose orientation flats are to be aligned in a desired direction, are placed in the above-mentioned state between the moving housing section and the processing housing section. A device for transferring the wafers while maintaining the wafers, the wafers having a plurality of curved grooves that fit with a part of the peripheral curved surface of each of the plurality of wafers in the above state and with the orientation flat facing near the desired direction. a first arm having a defined first support surface at its distal end and extending to the side of the base opposite to the first support surface; a second arm having at its tip a second support surface defining a plurality of straight grooves that fit with the orientation flat portions of each of the plurality of wafers, and extending to a side of the base opposite to the second support surface; The first arm and the second arm
a second arm extending on the same trajectory line and arranged such that the first support surface and the second support surface face each other; the first arm and the second arm; and a driving means for reciprocating the wafers on the same trajectory line, and the tip of the first arm is connected to a first opening provided on the opposite side of the first opening for loading and unloading the wafer in the moving storage section. The second arm is configured to pass through the first passage means and the first opening, and the tip of the second arm is located on the opposite side of the second entrance for loading and unloading the wafer in the processing housing. Apparatus, characterized in that it is configured to pass through a second passage means provided and said second opening.
収容部が前記ウェーハの周縁曲面部の一部と嵌合する溝
を有する支柱の４本からなり、前記第２の通過手段が前
記支柱のうちの隣接する２本の間に存在する空間である
装置。(2) The apparatus according to claim 1, wherein the processing accommodating section is comprised of four pillars each having a groove that fits into a part of the peripheral curved surface of the wafer, and the second passage Apparatus in which the means is a space existing between two adjacent of said struts.
前記第１の支持面と前記第２の支持面との間の距離を感
知する感知手段を設けることを特徴とする装置。(3) In the device according to claim 1 or 2,
An apparatus characterized in that it comprises sensing means for sensing the distance between the first support surface and the second support surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63275723A JPH02122541A (en) | 1988-10-31 | 1988-10-31 | Transfer device for semiconductor wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63275723A JPH02122541A (en) | 1988-10-31 | 1988-10-31 | Transfer device for semiconductor wafer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02122541A true JPH02122541A (en) | 1990-05-10 |
Family
ID=17559483
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63275723A Pending JPH02122541A (en) | 1988-10-31 | 1988-10-31 | Transfer device for semiconductor wafer |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02122541A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5382128A (en) * | 1993-03-03 | 1995-01-17 | Takahashi; Kiyoshi | Wafer transfer device |
| US5387067A (en) * | 1993-01-14 | 1995-02-07 | Applied Materials, Inc. | Direct load/unload semiconductor wafer cassette apparatus and transfer system |
| US5404894A (en) * | 1992-05-20 | 1995-04-11 | Tokyo Electron Kabushiki Kaisha | Conveyor apparatus |
| US6309166B1 (en) * | 1997-10-17 | 2001-10-30 | Olympus Optical Co., Ltd. | Wafer transfer device |
| US6652216B1 (en) | 1998-05-05 | 2003-11-25 | Recif, S.A. | Method and device for changing a semiconductor wafer position |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61263533A (en) * | 1985-05-15 | 1986-11-21 | Denkoo:Kk | Semiconductor transfer apparatus |
| JPS62136439A (en) * | 1985-12-04 | 1987-06-19 | Denkoo:Kk | Plate takeout device |
-
1988
- 1988-10-31 JP JP63275723A patent/JPH02122541A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61263533A (en) * | 1985-05-15 | 1986-11-21 | Denkoo:Kk | Semiconductor transfer apparatus |
| JPS62136439A (en) * | 1985-12-04 | 1987-06-19 | Denkoo:Kk | Plate takeout device |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5404894A (en) * | 1992-05-20 | 1995-04-11 | Tokyo Electron Kabushiki Kaisha | Conveyor apparatus |
| US5387067A (en) * | 1993-01-14 | 1995-02-07 | Applied Materials, Inc. | Direct load/unload semiconductor wafer cassette apparatus and transfer system |
| US5382128A (en) * | 1993-03-03 | 1995-01-17 | Takahashi; Kiyoshi | Wafer transfer device |
| US6309166B1 (en) * | 1997-10-17 | 2001-10-30 | Olympus Optical Co., Ltd. | Wafer transfer device |
| US6652216B1 (en) | 1998-05-05 | 2003-11-25 | Recif, S.A. | Method and device for changing a semiconductor wafer position |
| US7108476B2 (en) | 1998-05-05 | 2006-09-19 | Recif Technologies Sas | Method and device for changing a semiconductor wafer position |
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