JPH0212029A - Structure for semiconductor sensor unit - Google Patents

Abstract

PURPOSE:To simplify the shape of respective parts, to facilitate the processing of the parts and to reduce cost by making the structure of a semiconductor sensor unit the two-body structure of a substrate and a pipe-like member. CONSTITUTION:A sensor chip 1 which is hermetically fixed to a pedestal 3 is made to softly adhere to the substrate 7 and fixed on the substrate 7 by covering the outside of the chip 1 with the pipe-like member 6 after it is electrically connected to the substrate 7 by bonding. Next, the sensor unit is completed by being filled with a gel-like material 4 and a rubber-like material 5 in order to protect the surface of the chip 1. In such a case, the electric conducting between the inside and the outside of the substrate 7 is executed by a through- hole 8. Due to that, if the hole 8 is positioned on the outside of the member 6 even in a state where the hole 8 is to big to keep positioning accuracy, the material 4 can be prevented from flowing out and the occurrence of faulty conducting caused by a disconnection crack which occurs as the result that the hole 8 is too small can be prevented. Therefore, the shape of the parts can be simplified and the working of the parts can be facilitated. Besides, the cost can be reduced.

Description

【発明の詳細な説明】 〔産業上の利用分野１ 本発明は、センサチップを基板に実装した半導体センサ
ユニットの構造に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field 1] The present invention relates to the structure of a semiconductor sensor unit in which a sensor chip is mounted on a substrate.

〔従来の技術］ 従来のセンサユニットは、第２図で示すように、有底状
のパッケージ２６の底部に、台座２３と気密に固着され
たセンサチップ２１を軟接着し、パッケージ２６の段差
部ヘセンサチップ２１よりボンディングすることにより
電気接続し、この部分よりパッケージ２６内部に形成さ
れたスルーホール２８により、裏面の電気接続端子２７
と電気接続される。その後、センサチップ２１の表面を
ゲル状物質２４およびゴム状物質２５で積層に覆うこと
により、センサチップ２１の表面を保護し、センサユニ
ットを形成する。（特開昭６［発明が解決しようとする
課題） しかし、前述の従来技術では、有底状のパッケージを使
用しているため、サイズ的にはかなり小さくなり、時計
等にも装着可となるが、パッケージの外周をパツキンで
締め付けて、センサユニットをケースに固定したり、パ
ッケージ内にスルーホールを形成したりする必要がある
ため。[Prior Art] As shown in FIG. 2, in a conventional sensor unit, a sensor chip 21 that is airtightly fixed to a pedestal 23 is soft-bonded to the bottom of a bottomed package 26, and a stepped portion of the package 26 is attached. An electrical connection is made by bonding from the sensor chip 21 to the rear surface, and a through hole 28 formed inside the package 26 from this part connects the electrical connection terminal 27 on the back side.
electrically connected to. Thereafter, the surface of the sensor chip 21 is covered with a gel-like substance 24 and a rubber-like substance 25 in a laminated manner to protect the surface of the sensor chip 21 and form a sensor unit. (Unexamined Japanese Patent Publication No. 6 [Problem to be Solved by the Invention]) However, since the above-mentioned conventional technology uses a bottomed package, it is quite small in size and can be attached to watches, etc. However, it is necessary to tighten the outer circumference of the package with a gasket to secure the sensor unit to the case, and to form a through hole inside the package.

パッケージ材料がセラミック等の高価なものになってし
まい、また、寸法精度も悪く、二次加工する必要がある
。また、スルーホールから、ゲル状物質が流れ出ないよ
うに、かなり小さな穴にするか、穴をふさぐ処理を行な
わなければならない。The package material is expensive, such as ceramic, and has poor dimensional accuracy, requiring secondary processing. In addition, to prevent gel-like substances from flowing out of the through-holes, the holes must be made quite small or the holes must be sealed.

そこで本発明は、このような不具合点を解決するもので
その目的とするところは、サイズ的にもかなり小さくて
、時計のケース等にも充分装着でき、かつ安価で寸法精
度が高い、センサユニットを提供することにある。The present invention aims to solve these problems and aims to provide a sensor unit that is quite small in size, can be easily attached to a watch case, etc., is inexpensive, and has high dimensional accuracy. Our goal is to provide the following.

［課題を解決するための手段］ 本発明のセンサユニットは、センサチップが実装される
基板と、センサチップの外側に位置するパイプ状部材と
の２体構造よりなり、かつ、基板に形成されたスルーホ
ールは、パイプ状部材の外側に位置し、平面的に重なら
ないことを特徴とする。[Means for Solving the Problems] The sensor unit of the present invention has a two-piece structure including a substrate on which a sensor chip is mounted and a pipe-shaped member located outside the sensor chip, and a pipe-shaped member formed on the substrate. The through holes are located on the outside of the pipe-like member and are characterized in that they do not overlap in plane.

〔実　施　例１ 第１図（ｂ）は、本発明の一実施例を示す、半導体セン
サユニットの断面図である。[Embodiment 1] FIG. 1(b) is a sectional view of a semiconductor sensor unit showing an embodiment of the present invention.

本発明では、台座３と気密に固着したセンサチップｌを
基板７に軟接着し、基板７とセンサチップ１をボンディ
ングで電気接続した後、センサチップ１の外側をパイプ
状部材６で覆うようにして、基板７に接着等で固定する
。次に、センサチップｌの表面を保護するために、ゲル
状物質４およびゴム状物質を充填し、センサユニットを
完成させる。この場合、基板の表と裏との電気導通は、
スルーホール８によって行なわれているため、スルーホ
ール８が太き（で、位置精度があまり良くなくても、パ
イプ状部材６の外側に位置していれば、ゲル状物質４が
流れ出したり、スルーホール８が小さすぎるために起き
る断線、クラック等による導通不良の発生をなくすこと
ができる。In the present invention, the sensor chip l, which is airtightly fixed to the pedestal 3, is soft-bonded to the substrate 7, and after the substrate 7 and the sensor chip 1 are electrically connected by bonding, the outside of the sensor chip 1 is covered with the pipe-shaped member 6. Then, it is fixed to the substrate 7 by adhesive or the like. Next, in order to protect the surface of the sensor chip 1, a gel-like substance 4 and a rubber-like substance are filled to complete the sensor unit. In this case, electrical continuity between the front and back of the board is
Because the through hole 8 is thick (and even if the positional accuracy is not very good, if it is located outside the pipe-like member 6, the gel-like substance 4 may flow out or It is possible to eliminate conduction failures due to disconnections, cracks, etc. caused by the holes 8 being too small.

第１図（ａ）は、上面図である。FIG. 1(a) is a top view.

【発明の効果１ 以上述べたように、本発明では、基板とパイプ状部材の
２体構造よりなるセンサユニットであるため、従来のよ
うな有底状のパッケージに比べ、それぞれの部品の形状
を簡単にして、部品加工を容易にし、コストを安くする
ことができる。Effects of the Invention 1 As described above, in the present invention, since the sensor unit has a two-piece structure of a substrate and a pipe-like member, the shape of each component can be reduced compared to a conventional bottomed package. It can be simplified, parts can be easily processed, and costs can be reduced.

また、基板上のスルーホールは、パイプ状部材の外側に
位置しているため、スルーホールを通して、ゲル状物質
が流れ出ることもなく、また、スルーホールを大きくす
ることができるため、導通不良等の発生も少なくなり、
電気接続端子の位置も自由度も太き（なる。In addition, since the through-hole on the board is located outside the pipe-like member, gel-like substances do not flow out through the through-hole, and the through-hole can be made larger, so there is no possibility of poor conduction, etc. Occurrence becomes less,
The position and degree of freedom of the electrical connection terminals are also large.

また、スルーホールがパイプ状部材の外側にあるため、
本体側との電気接続が基板の表、裏のどちらでも可能と
なり、時計のケース等に装着し、た場合の、センサユニ
ットの取り付は位置に制約がなくなり、本体側の設計が
非常に楽になる。Also, since the through hole is on the outside of the pipe-shaped member,
Electrical connection to the main body side can be made on either the front or back side of the board, and when installed in a watch case, etc., there are no restrictions on the mounting position of the sensor unit, making the design of the main body side very easy. Become.

２． ３． ４． ５． ６　・ ７　・　・　・ ８　・　・　・ ９、２７ 接着剤（軟接着用） 台座 ゲル状物質 ゴム状物質 パイプ状部材 基板 スルーホール 電気接続端子 パッケージ 以上2. 3. 4. 5. 6・ 7・・・・ 8・・・・ 9, 27 Adhesive (for soft adhesive) pedestal gel-like substance rubbery substance pipe-shaped member substrate through hole electrical connection terminal package that's all

【図面の簡単な説明】[Brief explanation of the drawing]

第１図（ａ、　）は、本発明の一実施例を示す半導体セ
ンサユニットの上面図。 第１図（ｂ＞は、その断面図。 第２図は、従来の半導体センサユニットの構造断面図を
示す。 出願人　セイコーエプソン株式会社 代理人　弁理士　上　柳　雅　誉（他１名）１．２１・
・・センサチップ ｌ 館、。FIG. 1(a,) is a top view of a semiconductor sensor unit showing one embodiment of the present invention. Fig. 1 (b> is a cross-sectional view thereof. Fig. 2 is a cross-sectional view of the structure of a conventional semiconductor sensor unit. Applicant: Seiko Epson Co., Ltd. Representative Patent attorney: Masayoshi Kamiyanagi (and one other person) 1. 21・
...Sensor chip l building.

Claims (1)

【特許請求の範囲】[Claims] センサチップを実装する基板と、該センサチップの外側
に位置するパイプ状部材との２体構造よりなる半導体セ
ンサユニットの構造において、前記基板に形成したスル
ーホールが、パイプ状部材の外側に位置し、平面的に重
ならないことを特徴とする、半導体センサユニットの構
造。In a structure of a semiconductor sensor unit consisting of a two-piece structure including a substrate on which a sensor chip is mounted and a pipe-shaped member located outside the sensor chip, a through hole formed in the substrate is located outside the pipe-shaped member. , a structure of a semiconductor sensor unit characterized by not overlapping in a plane.