JPH02116477A - Grinding material and manufacture thereof - Google Patents
Grinding material and manufacture thereofInfo
- Publication number
- JPH02116477A JPH02116477A JP27126288A JP27126288A JPH02116477A JP H02116477 A JPH02116477 A JP H02116477A JP 27126288 A JP27126288 A JP 27126288A JP 27126288 A JP27126288 A JP 27126288A JP H02116477 A JPH02116477 A JP H02116477A
- Authority
- JP
- Japan
- Prior art keywords
- grinding
- resin
- bis
- abrasive grains
- abrasive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000227 grinding Methods 0.000 title claims abstract description 77
- 239000000463 material Substances 0.000 title claims abstract description 35
- 238000004519 manufacturing process Methods 0.000 title claims description 13
- 229920005989 resin Polymers 0.000 claims abstract description 59
- 239000011347 resin Substances 0.000 claims abstract description 59
- 239000006061 abrasive grain Substances 0.000 claims abstract description 30
- 239000012779 reinforcing material Substances 0.000 claims abstract description 18
- 239000002131 composite material Substances 0.000 claims abstract description 16
- 239000011159 matrix material Substances 0.000 claims abstract description 15
- 239000000835 fiber Substances 0.000 claims abstract description 11
- 239000003082 abrasive agent Substances 0.000 claims description 23
- 230000002787 reinforcement Effects 0.000 claims description 11
- 239000004677 Nylon Substances 0.000 abstract description 7
- 229920001778 nylon Polymers 0.000 abstract description 7
- 230000002093 peripheral effect Effects 0.000 abstract 2
- 230000008018 melting Effects 0.000 abstract 1
- 238000002844 melting Methods 0.000 abstract 1
- 230000003014 reinforcing effect Effects 0.000 abstract 1
- 238000009987 spinning Methods 0.000 abstract 1
- 229920001721 polyimide Polymers 0.000 description 17
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 16
- 238000000034 method Methods 0.000 description 14
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 description 11
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 10
- 150000002989 phenols Chemical class 0.000 description 10
- 239000009719 polyimide resin Substances 0.000 description 10
- -1 N,N'-oxy( Di-p-phenylene) Chemical class 0.000 description 9
- 239000003822 epoxy resin Substances 0.000 description 8
- 229920000647 polyepoxide Polymers 0.000 description 8
- 239000004642 Polyimide Substances 0.000 description 7
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 6
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 6
- 239000007809 chemical reaction catalyst Substances 0.000 description 6
- 229920003192 poly(bis maleimide) Polymers 0.000 description 6
- 229910001220 stainless steel Inorganic materials 0.000 description 6
- 239000010935 stainless steel Substances 0.000 description 6
- 229910000831 Steel Inorganic materials 0.000 description 5
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 5
- 239000007788 liquid Substances 0.000 description 5
- 239000000203 mixture Substances 0.000 description 5
- 239000010959 steel Substances 0.000 description 5
- HXDOZKJGKXYMEW-UHFFFAOYSA-N 4-ethylphenol Chemical compound CCC1=CC=C(O)C=C1 HXDOZKJGKXYMEW-UHFFFAOYSA-N 0.000 description 4
- 150000001335 aliphatic alkanes Chemical class 0.000 description 4
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 4
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 4
- 239000003365 glass fiber Substances 0.000 description 4
- 239000000047 product Substances 0.000 description 4
- 239000007787 solid Substances 0.000 description 4
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 4
- 125000004203 4-hydroxyphenyl group Chemical group [H]OC1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 3
- 150000004984 aromatic diamines Chemical class 0.000 description 3
- 125000003118 aryl group Chemical group 0.000 description 3
- 238000005422 blasting Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 3
- 238000013035 low temperature curing Methods 0.000 description 3
- 229920001187 thermosetting polymer Polymers 0.000 description 3
- HCNHNBLSNVSJTJ-UHFFFAOYSA-N 1,1-Bis(4-hydroxyphenyl)ethane Chemical compound C=1C=C(O)C=CC=1C(C)C1=CC=C(O)C=C1 HCNHNBLSNVSJTJ-UHFFFAOYSA-N 0.000 description 2
- 125000001140 1,4-phenylene group Chemical group [H]C1=C([H])C([*:2])=C([H])C([H])=C1[*:1] 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- OTMSDBZUPAUEDD-UHFFFAOYSA-N Ethane Chemical compound CC OTMSDBZUPAUEDD-UHFFFAOYSA-N 0.000 description 2
- HTZCNXWZYVXIMZ-UHFFFAOYSA-M benzyl(triethyl)azanium;chloride Chemical compound [Cl-].CC[N+](CC)(CC)CC1=CC=CC=C1 HTZCNXWZYVXIMZ-UHFFFAOYSA-M 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 239000011162 core material Substances 0.000 description 2
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 2
- 229920005992 thermoplastic resin Polymers 0.000 description 2
- 125000001781 1,3,4-oxadiazolyl group Chemical group 0.000 description 1
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical compound NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 description 1
- CBCKQZAAMUWICA-UHFFFAOYSA-N 1,4-phenylenediamine Chemical compound NC1=CC=C(N)C=C1 CBCKQZAAMUWICA-UHFFFAOYSA-N 0.000 description 1
- IPJGAEWUPXWFPL-UHFFFAOYSA-N 1-[3-(2,5-dioxopyrrol-1-yl)phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1=CC=CC(N2C(C=CC2=O)=O)=C1 IPJGAEWUPXWFPL-UHFFFAOYSA-N 0.000 description 1
- AQGZJQNZNONGKY-UHFFFAOYSA-N 1-[4-(2,5-dioxopyrrol-1-yl)phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1=CC=C(N2C(C=CC2=O)=O)C=C1 AQGZJQNZNONGKY-UHFFFAOYSA-N 0.000 description 1
- MXHYIKIAEPOZHM-UHFFFAOYSA-N 2-(2,5-dioxopyrrol-3-yl)acetonitrile Chemical compound O=C1NC(=O)C(CC#N)=C1 MXHYIKIAEPOZHM-UHFFFAOYSA-N 0.000 description 1
- YCWRFIYBUQBHJI-UHFFFAOYSA-N 2-(4-aminophenyl)acetonitrile Chemical group NC1=CC=C(CC#N)C=C1 YCWRFIYBUQBHJI-UHFFFAOYSA-N 0.000 description 1
- VEORPZCZECFIRK-UHFFFAOYSA-N 3,3',5,5'-tetrabromobisphenol A Chemical compound C=1C(Br)=C(O)C(Br)=CC=1C(C)(C)C1=CC(Br)=C(O)C(Br)=C1 VEORPZCZECFIRK-UHFFFAOYSA-N 0.000 description 1
- LUMIUTGJALTAOY-UHFFFAOYSA-N 3-[5-(3-aminophenyl)-[1,3]thiazolo[4,5-d][1,3]thiazol-2-yl]aniline Chemical compound NC1=CC=CC(C=2SC=3SC(=NC=3N=2)C=2C=C(N)C=CC=2)=C1 LUMIUTGJALTAOY-UHFFFAOYSA-N 0.000 description 1
- OJFAUFIUKJGVOF-UHFFFAOYSA-N 3-chloropyrrole-2,5-dione Chemical compound ClC1=CC(=O)NC1=O OJFAUFIUKJGVOF-UHFFFAOYSA-N 0.000 description 1
- OOEGFIPVEPCUOI-UHFFFAOYSA-N 3-methyl-1-[2-[2-(3-methyl-2,5-dioxopyrrol-1-yl)phenyl]sulfanylphenyl]pyrrole-2,5-dione Chemical compound O=C1C(C)=CC(=O)N1C1=CC=CC=C1SC1=CC=CC=C1N1C(=O)C(C)=CC1=O OOEGFIPVEPCUOI-UHFFFAOYSA-N 0.000 description 1
- ICNFHJVPAJKPHW-UHFFFAOYSA-N 4,4'-Thiodianiline Chemical compound C1=CC(N)=CC=C1SC1=CC=C(N)C=C1 ICNFHJVPAJKPHW-UHFFFAOYSA-N 0.000 description 1
- KQIKKETXZQDHGE-FOCLMDBBSA-N 4,4'-diaminoazobenzene Chemical compound C1=CC(N)=CC=C1\N=N\C1=CC=C(N)C=C1 KQIKKETXZQDHGE-FOCLMDBBSA-N 0.000 description 1
- YBRVSVVVWCFQMG-UHFFFAOYSA-N 4,4'-diaminodiphenylmethane Chemical compound C1=CC(N)=CC=C1CC1=CC=C(N)C=C1 YBRVSVVVWCFQMG-UHFFFAOYSA-N 0.000 description 1
- BGNGWHSBYQYVRX-UHFFFAOYSA-N 4-(dimethylamino)benzaldehyde Chemical compound CN(C)C1=CC=C(C=O)C=C1 BGNGWHSBYQYVRX-UHFFFAOYSA-N 0.000 description 1
- HLBLWEWZXPIGSM-UHFFFAOYSA-N 4-Aminophenyl ether Chemical compound C1=CC(N)=CC=C1OC1=CC=C(N)C=C1 HLBLWEWZXPIGSM-UHFFFAOYSA-N 0.000 description 1
- XECVXFWNYNXCBN-UHFFFAOYSA-N 4-[(4-aminophenyl)-phenylmethyl]aniline Chemical compound C1=CC(N)=CC=C1C(C=1C=CC(N)=CC=1)C1=CC=CC=C1 XECVXFWNYNXCBN-UHFFFAOYSA-N 0.000 description 1
- KTZLSMUPEJXXBO-UHFFFAOYSA-N 4-[(4-aminophenyl)-phenylphosphoryl]aniline Chemical compound C1=CC(N)=CC=C1P(=O)(C=1C=CC(N)=CC=1)C1=CC=CC=C1 KTZLSMUPEJXXBO-UHFFFAOYSA-N 0.000 description 1
- ZSQIQUAKDNTQOI-UHFFFAOYSA-N 4-[1-(4-aminophenyl)cyclohexyl]aniline Chemical compound C1=CC(N)=CC=C1C1(C=2C=CC(N)=CC=2)CCCCC1 ZSQIQUAKDNTQOI-UHFFFAOYSA-N 0.000 description 1
- ZYEDGEXYGKWJPB-UHFFFAOYSA-N 4-[2-(4-aminophenyl)propan-2-yl]aniline Chemical compound C=1C=C(N)C=CC=1C(C)(C)C1=CC=C(N)C=C1 ZYEDGEXYGKWJPB-UHFFFAOYSA-N 0.000 description 1
- KJMCEKOUOWKFIV-UHFFFAOYSA-N 4-[3-(1,3-thiazol-2-yl)phenyl]aniline Chemical compound NC1=CC=C(C=C1)C1=CC(=CC=C1)C1=NC=CS1 KJMCEKOUOWKFIV-UHFFFAOYSA-N 0.000 description 1
- ITKSJWDXNHOFBV-UHFFFAOYSA-N 4-[amino-(4-aminophenyl)methyl]aniline Chemical compound C=1C=C(N)C=CC=1C(N)C1=CC=C(N)C=C1 ITKSJWDXNHOFBV-UHFFFAOYSA-N 0.000 description 1
- XPAQFJJCWGSXGJ-UHFFFAOYSA-N 4-amino-n-(4-aminophenyl)benzamide Chemical compound C1=CC(N)=CC=C1NC(=O)C1=CC=C(N)C=C1 XPAQFJJCWGSXGJ-UHFFFAOYSA-N 0.000 description 1
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 1
- MQJKPEGWNLWLTK-UHFFFAOYSA-N Dapsone Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=C1 MQJKPEGWNLWLTK-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- 229920002430 Fibre-reinforced plastic Polymers 0.000 description 1
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 1
- HEHUZGFZNPSQMW-UHFFFAOYSA-N NC1=CC=C(C=C1)C(C1=CC=C(C=C1)N)[PH2]=O Chemical compound NC1=CC=C(C=C1)C(C1=CC=C(C=C1)N)[PH2]=O HEHUZGFZNPSQMW-UHFFFAOYSA-N 0.000 description 1
- 125000002252 acyl group Chemical group 0.000 description 1
- 238000012644 addition polymerization Methods 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- HFACYLZERDEVSX-UHFFFAOYSA-N benzidine Chemical compound C1=CC(N)=CC=C1C1=CC=C(N)C=C1 HFACYLZERDEVSX-UHFFFAOYSA-N 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- ZLSMCQSGRWNEGX-UHFFFAOYSA-N bis(4-aminophenyl)methanone Chemical compound C1=CC(N)=CC=C1C(=O)C1=CC=C(N)C=C1 ZLSMCQSGRWNEGX-UHFFFAOYSA-N 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000001723 curing Methods 0.000 description 1
- 125000000753 cycloalkyl group Chemical group 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000011151 fibre-reinforced plastic Substances 0.000 description 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 125000004464 hydroxyphenyl group Chemical group 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 229940018564 m-phenylenediamine Drugs 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 125000000962 organic group Chemical group 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 239000013034 phenoxy resin Substances 0.000 description 1
- 229920006287 phenoxy resin Polymers 0.000 description 1
- 150000003003 phosphines Chemical class 0.000 description 1
- 150000004714 phosphonium salts Chemical group 0.000 description 1
- SFLGSKRGOWRGBR-UHFFFAOYSA-N phthalane Chemical compound C1=CC=C2COCC2=C1 SFLGSKRGOWRGBR-UHFFFAOYSA-N 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 229920005668 polycarbonate resin Polymers 0.000 description 1
- 239000004431 polycarbonate resin Substances 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 150000003242 quaternary ammonium salts Chemical class 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- HWCKGOZZJDHMNC-UHFFFAOYSA-M tetraethylammonium bromide Chemical compound [Br-].CC[N+](CC)(CC)CC HWCKGOZZJDHMNC-UHFFFAOYSA-M 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 230000004580 weight loss Effects 0.000 description 1
Landscapes
- Polishing Bodies And Polishing Tools (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は高強度複合材料からなる研削材料およびその製
造方法、特にステンレス鋼や一般の鋼材等の錆落し、あ
るいは表面研削等に適した研削砥粒含有高強度複合材料
からなる研削材料およびその製造方法に関するものであ
る。[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to a grinding material made of a high-strength composite material and a method for manufacturing the same, particularly a grinding material suitable for removing rust from stainless steel or general steel, or for surface grinding. The present invention relates to a grinding material made of a high-strength composite material containing abrasive grains and a method for manufacturing the same.
ステンレス鋼や一般の鋼材等の金属の錆落し、あるいは
表面研削等を行う方法としては、例えばショツトブラス
ト法、ベルト式研削法、回転ロール式研削方法等がある
。このうちショツトブラスト法は装置が大がかりであり
、コスト高になるという欠点がある。ベルト式研削法は
研削能力は高いものの目づまり等により寿命が極めて短
いという欠点がある。Examples of methods for removing rust from metals such as stainless steel and general steel, or for surface grinding include shot blasting, belt grinding, and rotating roll grinding. Among these methods, the shot blasting method requires a large-scale apparatus and has the disadvantage of being expensive. Although the belt type grinding method has high grinding ability, it has the disadvantage of extremely short service life due to clogging, etc.
回転ロール式研削方法は従来から良く知られている方法
で、研削材料を備えたロール状ブラシを回転させること
により研削するものであり、例えばナイロンをマトリッ
クス樹脂とじＳｉＣ砥粒を含有する複合材料からなる研
削材料を備えたロール状ブラシが実用化されている。The rotating roll grinding method is a conventionally well-known method in which grinding is performed by rotating a rolled brush equipped with an abrasive material. Rolled brushes equipped with abrasive materials have been put into practical use.
この方法は、ショツトブラスト法等の大がかりなショッ
ト砂、水、研削物の回収装置が不要であリ、装置費用が
安価である。しかしナイロンをマトリックス樹脂とする
複合材料からなる研削材料は応力や衝撃に対する強度等
の機械的強度が劣り、疲労により折れたり変形しやすく
、このため耐久性が悪く、研削性も悪い。またマトリッ
クス樹脂に使用しているナイロン等は溶融時の粘度が高
いため、研削性能を左右する砥粒を大量に添加できず、
また成形法も押出成形に限定されるという問題点がある
。This method does not require large-scale shot sand, water, or grinding material recovery equipment such as shot blasting, and the cost of the equipment is low. However, grinding materials made of composite materials using nylon as a matrix resin have poor mechanical strength such as strength against stress and impact, and are easily broken or deformed due to fatigue, resulting in poor durability and poor grindability. In addition, the nylon used in the matrix resin has a high viscosity when melted, so it is not possible to add large amounts of abrasive grains that affect grinding performance.
Further, there is a problem that the molding method is limited to extrusion molding.
一方、基部から軸状に突出する芯材の周囲に研磨材を一
体化した研削材料を、組紐状の支持条を介してディスク
の周囲に取付けたロールブラシが開示されているが（特
公昭６１−２４９３１号）、研削材料は芯材の周囲に研
磨材が一体化しているため、単位面積あたりの有効研削
材料が少なく、研削効率が悪いという問題点がある。On the other hand, a roll brush has been disclosed in which an abrasive material in which an abrasive material is integrated around a core material protruding shaft-like from the base is attached around a disk via a braided support strip (Japanese Patent Publication No. 61 Since the abrasive material is integrated around the core material, there is a problem that the effective abrasive material per unit area is small and the grinding efficiency is poor.
本発明の目的は、上記問題点を解決するため、大量の研
削砥粒を含有させることができ、耐久性および研削性能
に優れた安価な研削材料を提案することである。SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, an object of the present invention is to propose an inexpensive abrasive material that can contain a large amount of abrasive grains and has excellent durability and grinding performance.
本発明の研削材料は、マトリックス樹脂、研削砥粒およ
び繊維状強化材の複合材料からなることを特徴とする研
削材料である。The grinding material of the present invention is a grinding material characterized by being made of a composite material of a matrix resin, grinding abrasive grains, and fibrous reinforcement.
本発明の研削材料の製造方法は、研削砥粒を含む樹脂シ
ートの両側に、繊維状強化材を含む樹脂シートを配置し
、それぞれの両側から、対向する凹部を有する成形型を
閉じて樹脂を硬化させることを特徴とする研削材料の製
造方法である。The method for producing an abrasive material of the present invention includes placing resin sheets containing fibrous reinforcement on both sides of a resin sheet containing abrasive grains, and closing molds having opposing recesses from both sides to infuse the resin. This is a method for producing an abrasive material characterized by hardening it.
本発明において使用するマトリックス樹脂は、研削砥粒
および繊維状強化材を複合材料中に固定して保持するバ
インダとしての作用を有する樹脂であり、熱硬化性樹脂
、熱可塑性樹脂のいずれも使用できる。このような樹脂
としてはポリイミド樹脂、エポキシ樹脂、フェノール樹
脂、フェノキシ樹脂、ポリエステル樹脂、ポリアミド樹
脂（ナイロン）等があげられるが、その内ポリイミド樹
脂、エポキシ樹脂等の熱硬化性樹脂が好ましく、特にポ
リイミド樹脂、エポキシ樹脂が好ましい。The matrix resin used in the present invention is a resin that acts as a binder to fix and hold the abrasive grains and fibrous reinforcement in the composite material, and either thermosetting resin or thermoplastic resin can be used. . Examples of such resins include polyimide resins, epoxy resins, phenol resins, phenoxy resins, polyester resins, and polyamide resins (nylon), among which thermosetting resins such as polyimide resins and epoxy resins are preferred, and polyimide resins are particularly preferred. Resins and epoxy resins are preferred.
ポリイミド樹脂としては、縮合型ポリイミドや付加重合
型ポリイミドがあげられる。縮合型ポリイミドとしては
、例えば一般式（１）
香族基である。）
一般式〔■〕
を有するポリイミドが例示され、デュポン社のＶｅｓｐ
ｅｌ（商品名）などがある。また付加重合型ポリイミド
としてはポリアミノビスマレイミド樹脂があげられる。Examples of the polyimide resin include condensation type polyimide and addition polymerization type polyimide. An example of the condensed polyimide is an aromatic group represented by general formula (1). ) Polyimide having the general formula [■] is exemplified, and DuPont's Vesp
There are el (product name), etc. Examples of addition polymerizable polyimides include polyamino bismaleimide resins.
（１）ポリアミノビスマレイミド樹脂
一般式（ｎ）で表わされるビスマレイミドと一般式（Ｉ
Ｉ［］で表わされる芳香族ジアミンとを反応させること
によって得られる反応生成物である。(1) Polyamino bismaleimide resin Bismaleimide represented by general formula (n) and general formula (I
It is a reaction product obtained by reacting with an aromatic diamine represented by I[].
一般式（ＩＩ）
（ただし、式中Ｒは２価の有機基、好ましくは芳（ただ
し、式中ＺはＣＨ２，０、Ｓ、 ＳＯまたはＳＯ２，Ｒ
１、Ｒ２は水素原子、低級アルキル基、アリール基、シ
クロアルキル基または低級アシル基である。）一般式（
ＩＩ）で示されるビスマレイミドの具体例としては、例
えばＮ、Ｎ’−ｍ−フェニレンジマレイミド、 Ｎ、Ｎ
’−ｐ−フェニレンジマレイミド、Ｎ、Ｎ’−オキシ（
ジ−ｐ−フェニレン）シマレイミド、Ｎ、Ｎ’−メチレ
ン（ジーＰ−フェニレン）シマレイミド、Ｎ、Ｎ’−エ
チレン（ジーＰ−）二二しン）シマレイミド、 Ｎ、Ｎ
’−スルホ（ジ−ｐ−フェニレン）シマレイミド、Ｎ、
Ｎ’−ａ−フェニレンビス（ｐ−オキシフェニレン）シ
マレイミド、Ｎ、Ｎ’−メチレン（ジー１．４−シクロ
ヘキシレン）シマレイミド、Ｎ、Ｎ’−イソプロピリデ
ン（ジー１，４−シクロヘキシレン）シマレイミド、
２，６−キシリレンシマレイミド、２，５−オキサジア
ゾリレンシマレイミド、Ｎ、Ｎ’−ｐ−フェニレン（ジ
メチレン）シマレイミド、Ｎ。General formula (II) (wherein R is a divalent organic group, preferably aromatic (however, Z is CH2,0, S, SO or SO2, R
1. R2 is a hydrogen atom, a lower alkyl group, an aryl group, a cycloalkyl group or a lower acyl group. ) General formula (
Specific examples of bismaleimide represented by II) include N,N'-m-phenylene dimaleimide, N,N
'-p-phenylene dimaleimide, N,N'-oxy(
Di-p-phenylene) simaleimide, N, N'-methylene (p-phenylene) simaleimide, N, N'-ethylene (p-phenylene) simaleimide, N, N
'-sulfo(di-p-phenylene) simaleimide, N,
N'-a-phenylenebis(p-oxyphenylene) simaleimide, N,N'-methylene(di-1,4-cyclohexylene) simaleimide, N,N'-isopropylidene(di-1,4-cyclohexylene) simaleimide,
2,6-xylylene cymaleimide, 2,5-oxadiazorylene simaleimide, N, N'-p-phenylene (dimethylene) simaleimide, N.
Ｎ′−２−メチル−ｐ−トルイレンシマレイミド、Ｎ、
Ｎ’−チオ（ジフェニレン）ジシトラコンイミド、Ｎ、
Ｎ’−メチレン（ジ−ｐ−フェニレン）ビス（クロルマ
レイミド）、Ｎ、Ｎ’−へキサメチレンビス（シアノメ
チルマレイミド）などがあげられる。N'-2-methyl-p-toluylene cymaleimide, N,
N'-thio(diphenylene)dicitraconimide, N,
Examples include N'-methylene (di-p-phenylene) bis (chlormaleimide) and N,N'-hexamethylene bis (cyanomethylmaleimide).
一般式（ｍ）の芳香族ジアミンの具体例としては、例え
ば４，４′−ジアミノジフェニルスルホン、３゜３′−
ジアミノジフェニルスルホン、４，４′−ジアミノジフ
ェニルメタン、４，４′−ジアミノジフェニルエーテル
、ｍ−フェニレンジアミン、ｐ−フェニレンジアミン、
２，２−ビス（４−アミノフェニル）プロパン、ベンジ
ジン、 ４．４’−ジアミノジフェニルスルフィド、
ビス（４−アミノフェニル）メチルホスフィンオキシド
、ビス（４−アミノフェニル）フェニルホスフィンオキ
シト、ビス（４−アミノフェニル）メチルアミン、■、
５−ジアミノナフタリン、１．ｌ−ビス（Ｐ−アミノフ
ェニル）フタラン、４，４′−ジアミノベンゾフェノン
、４，４′−ジアミノアゾベンゼン、ビス（４−アミノ
フェニル）フェニルメタン、１．１−ビス（４−アミノ
フェニル）シクロヘキサン、１．１−ビス（４−アミノ
−３−メチルフェニル）シクロヘキサン、２，５−ビス
（ｎ＋−アミノフェニル）−１，３，４−オキサジアゾ
ール、２゜５−ビス（Ｐ−アミノフェニル−１，３，４
−オキサジアゾール、２，５−ビス（ｍ−アミノフェニ
ル）チアゾロ（４，５−ｄ）チアゾール、５，５′−ジ
（ｍ−アミノフェニル）−２，２’−ビス（１，３，４
−オキサジアゾリル）、 ４．４’−ビス（ｐ−アミ
ノフェニル）−２，２’−ジチアゾール、ｍ−ビス（４
−ｐ−アミノフェニル−２−チアゾリルベンゼン、２．
２’−ビス（ｍ−アミノフェニル）−５，５’−ジベン
ズイミダゾール、 ４．４’−ジアミノベンズアニリド
、４，４′−ジアミノフェニルベンゾエート、Ｎ、Ｎ’
−ビス（４−アミノベンジル）−Ｐ−フェニレンジアミ
ン、３，５−ビス（ｆｆｌ−アミノフェニル）−４−フ
ェニル−１，２，４−トリアゾールおよびこれらの無機
酸塩などがあげられる。Specific examples of the aromatic diamine of general formula (m) include 4,4'-diaminodiphenylsulfone, 3゜3'-
Diaminodiphenylsulfone, 4,4'-diaminodiphenylmethane, 4,4'-diaminodiphenyl ether, m-phenylenediamine, p-phenylenediamine,
2,2-bis(4-aminophenyl)propane, benzidine, 4,4'-diaminodiphenyl sulfide,
Bis(4-aminophenyl)methylphosphine oxide, bis(4-aminophenyl)phenylphosphine oxide, bis(4-aminophenyl)methylamine,
5-diaminonaphthalene, 1. l-bis(P-aminophenyl)phthalane, 4,4'-diaminobenzophenone, 4,4'-diaminoazobenzene, bis(4-aminophenyl)phenylmethane, 1,1-bis(4-aminophenyl)cyclohexane, 1.1-bis(4-amino-3-methylphenyl)cyclohexane, 2,5-bis(n+-aminophenyl)-1,3,4-oxadiazole, 2゜5-bis(P-aminophenyl- 1, 3, 4
-oxadiazole, 2,5-bis(m-aminophenyl)thiazolo(4,5-d)thiazole, 5,5'-di(m-aminophenyl)-2,2'-bis(1,3, 4
-oxadiazolyl), 4,4'-bis(p-aminophenyl)-2,2'-dithiazole, m-bis(4
-p-aminophenyl-2-thiazolylbenzene, 2.
2'-bis(m-aminophenyl)-5,5'-dibenzimidazole, 4,4'-diaminobenzanilide, 4,4'-diaminophenylbenzoate, N, N'
Examples include -bis(4-aminobenzyl)-P-phenylenediamine, 3,5-bis(ffl-aminophenyl)-4-phenyl-1,2,4-triazole, and inorganic acid salts thereof.
本発明に用いられるポリアミノビスマレイミド樹脂は、
前記したビスマレイミドと芳香族ジアミンとを公知の方
法によって反応させたものを用いるが、その分子量とし
ては４００〜１５００程度のものが好ましく、またこれ
に未反応モノマーを多量に含有するものであってもよい
。The polyamino bismaleimide resin used in the present invention is
The above-described bismaleimide and aromatic diamine are reacted by a known method, and the molecular weight thereof is preferably about 400 to 1,500, and it contains a large amount of unreacted monomer. Good too.
またポリイミド樹脂として上記ポリイミドと反応性希釈
剤とによる低温硬化型にした液状ポリイミドも使用でき
る。Furthermore, as the polyimide resin, a liquid polyimide made of a low temperature curing type made of the above polyimide and a reactive diluent can also be used.
エポキシ樹脂として最も好ましい樹脂は、 １．１−ビ
ス（４−とドロキシフェニル）低級アルカン型液状エポ
キシ樹脂であり、１．１−ビス（４−ヒドロキシフェニ
ル）低級アルカン型液状エポキシ樹脂、ハイドロキノン
（またはハイドロキノンとそれ以外の２価のフェノール
）および反応触媒よりなる組成物を硬化させて形成され
る。この樹脂は従来使用されていたナイロンよりも剛直
性を有し、応力や衝撃に対する機械的強度が強く、研削
砥粒も大量に混入することができる。The most preferred epoxy resins are 1.1-bis(4- and hydroxyphenyl) lower alkane type liquid epoxy resins, 1.1-bis(4-hydroxyphenyl) lower alkane type liquid epoxy resins, hydroquinone ( or hydroquinone and other divalent phenols) and a reaction catalyst. This resin has more rigidity than conventionally used nylon, has stronger mechanical strength against stress and impact, and can also contain a large amount of abrasive grains.
１．１−ビス（４−ヒドロキシフェニル）低級アルカン
型液状エポキシ樹脂としては、常温（２５℃）で液状で
あって低級アルカン基の炭素数が２〜５のもの。1. The 1-bis(4-hydroxyphenyl) lower alkane type liquid epoxy resin is one that is liquid at room temperature (25°C) and has a lower alkane group having 2 to 5 carbon atoms.
好ましくは１，１−ビス（４−ヒドロキシフェニル）エ
タンのジグリシジルエーテルが用いられる。即ち、１．
１−ビス（４−ヒドロキシフェニル）エタンのジグリシ
ジルエーテルは、それを用いて調製した組成物の注型時
の粘度が低く、得られた樹脂成形品もより強靭なものと
なるので特に好ましい。Preferably, diglycidyl ether of 1,1-bis(4-hydroxyphenyl)ethane is used. That is, 1.
Diglycidyl ether of 1-bis(4-hydroxyphenyl)ethane is particularly preferred because the viscosity of the composition prepared using it is low during casting, and the resulting resin molded product is also stronger.
ハイドロキノンは、２価フェノールとしてそれ単独でも
用いられるが、それ以外の２価のフェノールと併用して
用いるのが好ましい。それ以外の２価フェノールとして
は、例えばレゾルシン、ハイドロキノンなどの単核２価
フェノール、ビス（４−ヒドロキシフェニル）メタン、
２，２−ビス（４−ヒドロキシフェニル）プロパン〔ビ
スフェノールＡ）、■。Although hydroquinone can be used alone as a dihydric phenol, it is preferably used in combination with other dihydric phenols. Examples of other dihydric phenols include mononuclear dihydric phenols such as resorcinol and hydroquinone, bis(4-hydroxyphenyl)methane,
2,2-bis(4-hydroxyphenyl)propane [bisphenol A), ■.
１−ビス（４−ヒドロキシフェニル）エタン、２，２−
ビス（３，５−ジブロム−４−ヒドロキシフェニル）プ
ロパンなどの多核２価フェノールあるいはこれら２価フ
ェノールのジグリシジルエーテルであるエポキシ樹脂の
両末端に２価フェノールを反応させて得られる２価フェ
ノールなどであって、前記液状エポキシ樹脂に溶解する
ものが用いられ、好ましくは１，１−ビス（４−ヒドロ
キシフェニル）エタンが用いられる。1-bis(4-hydroxyphenyl)ethane, 2,2-
Polynuclear dihydric phenols such as bis(3,5-dibromo-4-hydroxyphenyl)propane, or dihydric phenols obtained by reacting dihydric phenols at both ends of an epoxy resin that is diglycidyl ether of these dihydric phenols. A substance that is soluble in the liquid epoxy resin is used, and preferably 1,1-bis(4-hydroxyphenyl)ethane is used.
これらのハイドロキノン以外の２価フェノールは、２価
フェノールが１．１−ビス（４−ヒドロキシフェニル）
エタンの場合、一般にハイドロキノンと２価フェノール
とのモル比が１００１０〜２０１８０の割合で用いられ
る。これより多い割合で１．１−ビス（４−ヒドロキシ
フェニル）エタンが用いられると、急激なアイゾツト衝
撃強度の低下が起り、ポリカーボネート樹脂に対抗する
ようなアイゾツト衝撃値（８０ｋｇ−０１１１７０ｍ以
上）が得られなくなる。These dihydric phenols other than hydroquinone are 1,1-bis(4-hydroxyphenyl).
In the case of ethane, the molar ratio of hydroquinone to dihydric phenol is generally 10,010 to 20,180. If 1.1-bis(4-hydroxyphenyl)ethane is used in a proportion higher than this, the Izot impact strength will drop sharply, and an Izot impact value (more than 80kg-011170m) comparable to that of polycarbonate resin will be obtained. I won't be able to do it.
また１反応触媒としては、例えばベンジルトリエチルア
ンモニウムクロライド、テトラエチルアンモニウムブロ
マイドなどの４級アンモニウム塩、Ｎ、Ｎ−ベンジルジ
メチルアミン、Ｐ−ジメチルアミノベンズアルデヒドな
どの３級アミン、２−エチル−４−メチルイミダゾール
などのイミダゾール類、トリフェニルホスフィンなどの
ホスフィン類、トリフェニルエチルホスホニウムハライ
ドなどの４級ホスホニウム塩であって、上記液状エポキ
シ樹脂および２価フェノールの混合物に溶解し、これら
の反応触媒として作用するものが用いられる。In addition, examples of the first reaction catalyst include quaternary ammonium salts such as benzyltriethylammonium chloride and tetraethylammonium bromide, tertiary amines such as N,N-benzyldimethylamine and P-dimethylaminobenzaldehyde, and 2-ethyl-4-methylimidazole. imidazoles such as, phosphines such as triphenylphosphine, and quaternary phosphonium salts such as triphenylethylphosphonium halide, which dissolve in the mixture of the liquid epoxy resin and divalent phenol and act as reaction catalysts for these. is used.
以上の各成分から樹脂組成物が調製されるが、液状エポ
キシ樹脂と２価フェノール（ハイドロキノンまたはそれ
と他の２価フェノール）とは、２価フェノールのヒドロ
キシ当量／エポキシ当量の比が約０．８〜１．２の範囲
となるような割合で一般に用いられる。これより小さい
比で用いられると、得られたものの分子量が小さくなり
５強靭な成形品を形成し得ない。一方、これ以上の比で
は２価フェノールの未反応物が多くなり、やはり強靭性
が損われるようになる。また、反応触媒は、エポキシ樹
脂と２価フェノールとの合計量に対し約０．０１〜３重
量％の割合で一般に用いられる。A resin composition is prepared from each of the above components, and the liquid epoxy resin and dihydric phenol (hydroquinone or other dihydric phenol) have a ratio of hydroxy equivalent of dihydric phenol/epoxy equivalent of about 0.8. It is generally used in proportions ranging from 1.2 to 1.2. If a ratio smaller than this is used, the resulting product will have a low molecular weight and will not be able to form a strong molded product. On the other hand, if the ratio is higher than this, there will be a large amount of unreacted dihydric phenol, and the toughness will also be impaired. Further, the reaction catalyst is generally used in a proportion of about 0.01 to 3% by weight based on the total amount of the epoxy resin and dihydric phenol.
マトリックス樹脂を形成するための液状エポキシ樹脂組
成物の調製は、まず液状エポキシ樹脂に２価フェノール
を一般に約５０〜１８０℃、好ましくは約８０〜１５０
℃に加熱して溶解させ、次いでそこに反応触媒を添加す
ることにより行われる。なお、この組成物中には１本発
明の目的を逸脱しない範囲内において、他のエポキシ樹
脂、例えば芳香族ジカルボン酸のジグリシジルエステル
や他の多価フェノール、例えば３価フェノールなどを添
加することもできる。To prepare a liquid epoxy resin composition for forming a matrix resin, first, dihydric phenol is added to a liquid epoxy resin at a temperature of generally about 50 to 180°C, preferably about 80 to 150°C.
This is carried out by heating to ℃ to dissolve, and then adding a reaction catalyst thereto. In addition, other epoxy resins, such as diglycidyl esters of aromatic dicarboxylic acids, and other polyhydric phenols, such as trihydric phenol, may be added to this composition without departing from the purpose of the present invention. You can also do it.
上記マトリックス樹脂に混入する研削砥粒としては、５
ｉＣ１ＡＩ２２０．、ＣＢＮ、ダイヤモンド、その他の
従来より研削砥粒（研磨砥粒を含む）として用いられて
きたものが使用できるが、ＳｉＣが好ましい。The grinding abrasive grains mixed in the matrix resin are 5
iC1AI220. , CBN, diamond, and other conventionally used grinding abrasive grains (including polishing abrasive grains) can be used, but SiC is preferred.
これらの研削砥粒の粒径は用途によって異なるが、一般
には０．０１〜５ＩＩＩｌｆｉ、好ましくは０．１〜ｌ
ｌ１ｆｆｉ程度である。The particle size of these grinding abrasive grains varies depending on the use, but is generally 0.01 to 5IIIlfi, preferably 0.1 to 5lfi.
It is about l1ffi.
繊維状強化材としては、ガラス繊維、炭素繊維など、従
来より繊維強化プラスチックの強化材として用いられて
いるものが使用可能である。これらの繊維状強化材は短
繊維、長繊維いずれでもよく、クロスその他任意の形態
のものが使用できるが、長繊維を一方向に引揃えた一方
向繊維が好ましい。As the fibrous reinforcing material, those conventionally used as reinforcing materials for fiber-reinforced plastics, such as glass fiber and carbon fiber, can be used. These fibrous reinforcing materials may be either short fibers or long fibers, and may be in any form such as a cloth, but unidirectional fibers in which long fibers are aligned in one direction are preferred.
上記の研削砥粒はマトリックス樹脂中に均一に混入され
ているのが好ましいが、繊維状強化材は複合材料の周辺
部に、長手方向に配向させて配置されているのが好まし
い。The above-mentioned grinding abrasive grains are preferably mixed uniformly into the matrix resin, but the fibrous reinforcing material is preferably arranged in a longitudinally oriented manner around the composite material.
上記各成分の配合割合は、マトリックス樹脂３０〜９０
重量％、好ましくは３５〜８３重量％、研削砥粒５〜７
０重量％、好ましくは１０〜５０重量％、繊維状強化材
５〜３０重量％、好ましくは７〜２５重量％である。The blending ratio of each component above is 30 to 90% of the matrix resin.
% by weight, preferably 35-83% by weight, grinding abrasive grains 5-7
0% by weight, preferably 10-50% by weight, 5-30% by weight of fibrous reinforcement, preferably 7-25% by weight.
本発明の研削材料は、上記各成分を混合した状態でマト
リックス樹脂を硬化させて複合材料を形成し、研削材料
とするにのとき熱硬化性樹脂は液状または半固形状のも
のを用いて硬化させ、熱可塑性樹脂は固形のものを加熱
溶融後冷却して硬化させる。The abrasive material of the present invention is produced by curing the matrix resin in a state in which the above components are mixed to form a composite material, and when preparing the abrasive material, the thermosetting resin is cured using a liquid or semi-solid type. The thermoplastic resin is solid, heated and melted, and then cooled and hardened.
本発明の研削材料の好ましい製造方法は、ポリイミド樹
脂をＮ−メチルピロリドン、ジメチルホルムアミド等の
溶媒に溶解させた後、研削砥粒を調整した組成物をプリ
プレグにしたもの、および上記組成物と繊維強化材をプ
リプレグにしだものそれぞれを１３０〜１６０℃、好ま
しくは１４０〜１５０℃のオーブンにて脱溶媒する。そ
の後上記シートを１００〜１８０℃、好ましくは１４０
〜１６０℃の加熱オーブンにて加熱処理することにより
、半固形状樹脂シートおよび繊維強化材を含む樹脂シー
トとする。その後この研削砥粒を含む樹脂シートの両側
に繊維状強化材を含む樹脂シートを配置し、それぞれの
両側からあらかじめ１８０〜２５０℃、好ましくは２０
０〜２２０℃に加熱された対向する凹部を有する成形型
を閉じて樹脂を硬化させることにより複合材料を形成し
、研削材料とする。A preferred method for producing the abrasive material of the present invention is to prepare a prepreg prepared by dissolving a polyimide resin in a solvent such as N-methylpyrrolidone or dimethylformamide, and then preparing abrasive grains, and to prepare a prepreg using the above composition and fibers. The reinforcing material is prepared as a prepreg and each of the raw materials is desolvated in an oven at 130 to 160°C, preferably 140 to 150°C. Thereafter, the sheet is heated to 100 to 180°C, preferably 140°C.
By heat treating in a heating oven at ~160°C, a semi-solid resin sheet and a resin sheet containing fiber reinforcement are obtained. Thereafter, a resin sheet containing a fibrous reinforcing material is placed on both sides of the resin sheet containing the grinding abrasive grains, and the temperature is 180 to 250°C, preferably 200°C, from both sides in advance.
A mold having opposing recesses heated to 0 to 220° C. is closed and the resin is cured to form a composite material, which is used as a grinding material.
次に低温硬化型液状ポリイミド樹脂および前記液状エポ
キシ樹脂による研削材料を作成する場合は、それぞれの
樹脂に研削砥粒を配合して樹脂シート状および繊維強化
材を含む樹脂シート状にした後、７０〜１２０℃、好ま
しくは８０〜１００℃のオーブンでの加熱処理により半
固形状の樹脂シートおよび繊維強化材を含む樹脂シート
とする。このシートを１００〜１６０℃、好ましくは１
１０〜１４０℃に加熱した対向する凹部を有する成形型
を閉じて樹脂を硬化させることにより研削材料とする。Next, when creating an abrasive material using a low-temperature curing liquid polyimide resin and the liquid epoxy resin, grinding abrasive grains are blended with each resin to form a resin sheet and a resin sheet containing fiber reinforcement, and then Heat treatment in an oven at ~120°C, preferably 80~100°C produces a semi-solid resin sheet and a resin sheet containing fiber reinforcement. This sheet is heated to 100 to 160℃, preferably 1
A mold having opposing recesses heated to 10 to 140° C. is closed and the resin is cured to obtain a grinding material.
本発明の研削材料は支持体等を介してドラムに植付け、
ブラシロールを形成し、ステンレス鋼、その他の鋼材等
の表面研削に使用される。使用状態では、研削材料は繊
維状強化材により強化されているため、優れた機械強度
を有し、このため研磨性、耐久性に優れ、応力や衝撃に
より折れることはなく、寿命も長い。The abrasive material of the present invention is planted on a drum via a support etc.
Forms a brush roll and is used for surface grinding of stainless steel and other steel materials. In use, the abrasive material has excellent mechanical strength because it is reinforced with fibrous reinforcement, and therefore has excellent abrasiveness and durability, does not break due to stress or impact, and has a long life.
以下、本発明の実施例について説明する。 Examples of the present invention will be described below.
第１図は実施例の研削材料を示す断面図、第２図はその
Ａ−Ａ面で切断した斜視図である０図において、１は研
削材料で、マトリックス樹脂２中に研削砥粒３が均一に
分散し、周辺部に長手方向に引揃えらけた繊維状強化材
４が配置された状態で、樹脂２が硬化した棒状の複合材
料からなる。FIG. 1 is a cross-sectional view showing the abrasive material of the example, and FIG. 2 is a perspective view taken along the A-A plane. In FIG. It is made of a rod-shaped composite material in which resin 2 is hardened, with fibrous reinforcing materials 4 uniformly dispersed and aligned in the longitudinal direction arranged around the periphery.
研削材料１は第３図に示すように、小径の支持部５をス
リーブ状のホルダ６に挿入してかしめられ、ホルダ６の
他端にはナイロンの溶融紡糸体からなるばね材７が挿入
されており、ばね材７は扇形の取付治具８の周辺部に植
付けられて研削ユニット９が形成されている。As shown in FIG. 3, the abrasive material 1 is caulked by inserting a small-diameter support portion 5 into a sleeve-shaped holder 6, and a spring material 7 made of fused nylon spun is inserted into the other end of the holder 6. The spring material 7 is planted around the fan-shaped mounting jig 8 to form a grinding unit 9.
研削ユニット９は第４図に示すように、回転体１１の周
囲の円周方向および軸方向に多数取付けられて１円筒状
のブラシロール１０が形成されている。As shown in FIG. 4, a large number of grinding units 9 are attached circumferentially and axially around a rotating body 11 to form a cylindrical brush roll 10.
上記のように構成されたブラシロール１０は、帯板状の
被研削材料１２の上から下方向に圧下した状態で回転さ
せ、被研削材料１２を移動させて研削を行う。第４図に
おいてＸは圧下量、ｙは接触幅である。The brush roll 10 configured as described above is rotated while being pressed down from above the strip-shaped material to be ground 12 to move the material to be ground 12 and perform grinding. In FIG. 4, X is the reduction amount and y is the contact width.
ブラシロール１０の回転により、研削材料１はばね材７
の弾性により被研削材料１２に押付けられて回転し、表
面の錆落し、あるいは表面研削等の研削が行われる。こ
のとき研削材料１の外周部に強化材４が配置されている
ため、研削材料１は応力や衝撃に対する強度が大きく、
折れたり、疲労することなく、長期にわたって研削を行
うことができる。Due to the rotation of the brush roll 10, the abrasive material 1 is turned into the spring material 7.
Due to its elasticity, it is pressed against the material to be ground 12 and rotates, thereby removing rust from the surface or performing grinding such as surface grinding. At this time, since the reinforcing material 4 is placed on the outer periphery of the abrasive material 1, the abrasive material 1 has high strength against stress and impact.
Grinding can be done for a long time without breaking or getting fatigued.
第５図は製造方法を示す斜視図である。この製造方法は
、研削砥粒３を含む２枚の樹脂シート１３の両側に、研
削砥粒３および強化材４を含む樹脂シート１４を配置し
、それぞれの両側から、対向する凹部１５．１６を有す
る成形型１７．１８を閉じて樹脂２を硬化させて複合材
料を形成し、研削材料１を製造する。FIG. 5 is a perspective view showing the manufacturing method. In this manufacturing method, resin sheets 14 containing grinding abrasive grains 3 and reinforcing material 4 are arranged on both sides of two resin sheets 13 containing abrasive grains 3, and opposing recesses 15 and 16 are formed from both sides of each resin sheet. The molds 17 and 18 are closed and the resin 2 is cured to form a composite material and the abrasive material 1 is produced.
樹脂シート１３．１４は前記ポリイミド樹脂または液状
エポキシ樹脂をマトリックス樹脂２とするプリプレグが
使用できる。俊脂シート１４は強化材４を凹部１５．１
６と平行に配向させ、その長手方向に間隔をおいて経糸
４ａで面状に形成した状態で樹脂２と一体化したプリプ
レグが使用される。凹部１５゜１６は研削材料１に対応
した形状となっている。As the resin sheets 13 and 14, a prepreg whose matrix resin 2 is the polyimide resin or liquid epoxy resin can be used. The resin sheet 14 has the reinforcing material 4 in the recess 15.1.
A prepreg is used which is oriented parallel to the resin 2 and formed into a planar shape with the warp threads 4a at intervals in the longitudinal direction and integrated with the resin 2. The recesses 15 and 16 have shapes corresponding to the grinding material 1.
第５図の状態から成形型１７．１８を閉じると、それぞ
れの凸部１９．２０が樹脂シート１３、Ｉ４を押して、
せん断するため、樹脂シート１３の切断片を樹脂シート
１４の切断片が包み込む形状となり、強化材４は複合体
の周辺部に配置される。この状態で加熱、加圧を行うと
樹脂２は硬化して複合材料からなる研削材料１が形成さ
れる。When the molds 17 and 18 are closed from the state shown in FIG. 5, the respective convex portions 19 and 20 push the resin sheets 13 and I4,
In order to shear, the cut pieces of the resin sheet 13 are wrapped in the cut pieces of the resin sheet 14, and the reinforcing material 4 is arranged at the periphery of the composite. When heated and pressurized in this state, the resin 2 is hardened and a grinding material 1 made of a composite material is formed.
実施例１〜３
ポリイミド樹脂（商品名、ケルイミド６０１、ロース・
ブーラン社製）１００重量部をジメチルホルムアミド３
０重量部に溶解させたワニスに研削砥粒３としてＳｉＣ
および強化材として一方面ガラス繊維を混入したプリプ
レグを作る。このプリプレグを１５０℃のオーブンで脱
溶媒させた後、第５図の方法により径５＋ａｍ、長さ２
０ｍｍの研削材料１を製造した。Examples 1 to 3 Polyimide resin (trade name, Kelimide 601, loin
100 parts by weight (manufactured by Boulan) and 3 parts by weight of dimethylformamide
SiC as grinding abrasive grains 3 in varnish dissolved in 0 parts by weight
Then, prepare a prepreg with glass fiber mixed on one side as a reinforcing material. After desolventizing this prepreg in an oven at 150°C, the prepreg was heated to a diameter of 5+am and a length of 2mm using the method shown in Figure 5.
Grinding material 1 of 0 mm was manufactured.
実施例４
低温硬化型液状ポリイミドに研削砥粒３としてＳｉＣ１
強化材として一方面ガラス繊維を混入した樹脂シート１
３．１４を用いて第５図の方法により研削材料１を製造
した。Example 4 SiC1 as grinding abrasive grains 3 in low temperature curing liquid polyimide
Resin sheet 1 mixed with glass fiber on one side as a reinforcing material
Grinding material 1 was manufactured by the method shown in FIG. 5 using 3.14.
実施例５〜８
１．１−ビス（４−ヒドロキシフェニル）エタンのジグ
リシジルエーテル型エポキシ樹脂（エポキシ当量１７３
、粘度３０００ｃｐｓ） １００重量部に、１５０℃で
ハイドロキノン１５．３重量部および１，１−ビス（４
−ヒドロキシフェニル）エタン３０．５重量部を溶解さ
せ、次いで反応触媒であるトリフェニルホスフィン０．
９重量部を溶解させた。Examples 5 to 8 Diglycidyl ether type epoxy resin of 1.1-bis(4-hydroxyphenyl)ethane (epoxy equivalent: 173
, viscosity 3000 cps), 15.3 parts by weight of hydroquinone and 1,1-bis(4
30.5 parts by weight of -hydroxyphenyl)ethane is dissolved, and then 0.5 parts by weight of triphenylphosphine, which is a reaction catalyst, is dissolved.
9 parts by weight were dissolved.
得られた液状エポキシ樹脂に、研削砥粒３としてＳｉＣ
および強化材４として一方面ガラス繊維を混入した樹脂
シート１３．１４を用いて、第５図の方法により径５ｍ
ｍ、長さ２０ＩＩＩＩＩの研削材料１を製造した。SiC is added to the obtained liquid epoxy resin as grinding abrasive grains 3.
Using a resin sheet 13 and 14 mixed with glass fiber on one side as the reinforcing material 4, a diameter of 5 m was obtained by the method shown in Fig. 5.
Grinding material 1 with a length of 20 m and a length of 20 m was produced.
以上の実施例１〜８により得られた研削材料１を径３２
】の円板上に２本づつ８カ所計１６本植付け、１２００
ｒｐｍでステンレス鋼板（ＳＯＳ ４３０）を５分間づ
つ１２カ所研削した。このときの、各成分の配合量。The grinding material 1 obtained in Examples 1 to 8 above was
] Planted 16 plants in 8 locations, 2 each on the disk, 1200
A stainless steel plate (SOS 430) was ground at 12 locations for 5 minutes at rpm. At this time, the amount of each ingredient mixed.
ステンレス鋼の研削量および研削材料の減量から算出し
た寿命を表１に示す。Table 1 shows the lifespan calculated from the amount of grinding of stainless steel and the weight loss of grinding material.
比較例１としてナイロンとＳｉＣからなる従来の研削材
料の結果を併記するが、比較例１における寿命は疲労に
よる折れや変形がないという前提での計算値である。The results of a conventional grinding material made of nylon and SiC are also shown as Comparative Example 1, but the life in Comparative Example 1 is a calculated value on the assumption that there is no bending or deformation due to fatigue.
表１
表２
上記実施例７および比較例１の研削材料を２７００個用
いて構成した第１図ないし第４図に示すブラシロール（
直径３２ｃ＋ａ、長さ１０ｃ＋ａ）を１３５Ｏｒｐｍで
回転し、ステンレス鋼板（Ｃ３鋼およびＮＳ鋼）を３０
ｍ／＋ｉｎで２回通して研削を行ったときの研削量と寿
命を表２に示す。Table 1 Table 2 The brush roll shown in Figs.
A stainless steel plate (C3 steel and NS steel) was rotated at 135 Orpm.
Table 2 shows the amount of grinding and life when grinding was performed twice at m/+in.
本発明の研削材料は、マトリックス樹脂、研削砥粒およ
び繊維状強化材からなるため、機械的強度が大きくて耐
久性に優れ、また大量の砥粒を混入できるため研削性能
が優れ、長期にわたって効率よく研削を行うことができ
る。The grinding material of the present invention is composed of a matrix resin, grinding abrasive grains, and fibrous reinforcing material, so it has high mechanical strength and excellent durability, and since a large amount of abrasive grains can be mixed in, it has excellent grinding performance and is efficient over a long period of time. Can be ground well.
また本発明の製造方法によれば、機械的強度、研削性能
および耐久性に優れた研削材料を効率よく製造すること
ができる。Further, according to the manufacturing method of the present invention, it is possible to efficiently manufacture a grinding material that has excellent mechanical strength, grinding performance, and durability.
第１図は実施例の研削材料を示す断面図、第２図はその
Ａ−Ａ面で切断した斜視図、第３図は研削ユニットの正
面図、第４図は研削装置の斜視図、第５図は製造方法を
示す斜視図である。
各図中、同一符号は同一または相当部分を示し、１は研
削材料、２はマトリックス樹脂、３は研削砥粒、４は繊
維状強化材、９は研削ユニット、１０はブラシロール、
１３．１４は樹脂シート、１５．１６は凹部、１７．１
８は成形型である。
代理人 弁理士 柳 原 成Fig. 1 is a cross-sectional view showing the grinding material of the example, Fig. 2 is a perspective view cut along the A-A plane, Fig. 3 is a front view of the grinding unit, Fig. 4 is a perspective view of the grinding device, and Fig. 4 is a perspective view of the grinding device. FIG. 5 is a perspective view showing the manufacturing method. In each figure, the same reference numerals indicate the same or equivalent parts, 1 is the grinding material, 2 is the matrix resin, 3 is the grinding abrasive grain, 4 is the fibrous reinforcement material, 9 is the grinding unit, 10 is the brush roll,
13.14 is a resin sheet, 15.16 is a recess, 17.1
8 is a mold. Agent Patent Attorney Sei Yanagihara
Claims (4)
の複合材料からなることを特徴とする研削材料。(1) A grinding material comprising a composite material of matrix resin, grinding abrasive grains, and fibrous reinforcement.
載の研削材料。(2) The abrasive material according to claim (1), wherein the fibrous reinforcement is a unidirectional fiber.
求項（１）または（２）記載の研削材料。(3) The abrasive material according to claim (1) or (2), wherein the fibrous reinforcing material is arranged at the periphery of the composite material.
材を含む樹脂シートを配置し、それぞれの両側から、対
向する凹部を有する成形型を閉じて樹脂を硬化させるこ
とを特徴とする研削材料の製造方法。(4) A resin sheet containing a fibrous reinforcing material is placed on both sides of a resin sheet containing grinding abrasive grains, and molds having opposing recesses are closed from each side to harden the resin. Method of manufacturing grinding materials.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27126288A JPH02116477A (en) | 1988-10-27 | 1988-10-27 | Grinding material and manufacture thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27126288A JPH02116477A (en) | 1988-10-27 | 1988-10-27 | Grinding material and manufacture thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02116477A true JPH02116477A (en) | 1990-05-01 |
Family
ID=17497629
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP27126288A Pending JPH02116477A (en) | 1988-10-27 | 1988-10-27 | Grinding material and manufacture thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02116477A (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5347090A (en) * | 1976-10-12 | 1978-04-27 | Asahi Chem Ind Co Ltd | Improved bristles for grinding |
| JPS53134295A (en) * | 1977-04-27 | 1978-11-22 | Youzou Shimizu | Method of manufacturing rotary grinding machine |
-
1988
- 1988-10-27 JP JP27126288A patent/JPH02116477A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5347090A (en) * | 1976-10-12 | 1978-04-27 | Asahi Chem Ind Co Ltd | Improved bristles for grinding |
| JPS53134295A (en) * | 1977-04-27 | 1978-11-22 | Youzou Shimizu | Method of manufacturing rotary grinding machine |
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