JPH02114104A - Apparatus for inspecting lead terminal of ic package - Google Patents
Apparatus for inspecting lead terminal of ic packageInfo
- Publication number
- JPH02114104A JPH02114104A JP26707788A JP26707788A JPH02114104A JP H02114104 A JPH02114104 A JP H02114104A JP 26707788 A JP26707788 A JP 26707788A JP 26707788 A JP26707788 A JP 26707788A JP H02114104 A JPH02114104 A JP H02114104A
- Authority
- JP
- Japan
- Prior art keywords
- lead terminal
- image
- illumination
- lgt
- coordinate values
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005286 illumination Methods 0.000 claims abstract description 38
- 238000007689 inspection Methods 0.000 claims abstract description 20
- 101100282340 Arabidopsis thaliana GAUT2 gene Proteins 0.000 claims description 16
- 101150096231 lgt2 gene Proteins 0.000 claims description 16
- 238000003384 imaging method Methods 0.000 claims description 7
- 101100282339 Arabidopsis thaliana GAUT1 gene Proteins 0.000 claims description 5
- 101150044896 HXT4 gene Proteins 0.000 claims description 5
- 101150035024 lgt1 gene Proteins 0.000 claims description 5
- 238000005339 levitation Methods 0.000 abstract 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 18
- 238000007667 floating Methods 0.000 description 7
- 238000005452 bending Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
Landscapes
- Length Measuring Devices By Optical Means (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
Description
【発明の詳細な説明】
〔１既 要〕
ＩＣパッケージのリード端子の検査装置に関し、リード
端子の投影像の識別の難しさを解消し検査の信軌性の向
上を図ることを目的とし、ＩＣパッケージのリード端子
検査装置であって、リード端子の投影像を異なる方向か
ら得るため一方を真上から照明し他方を所定の傾きで照
明する第１及び第２の照明部と、前記第１及び第２の照
明部による第１及び第２の投影像を順次に撮影する撮像
部と、前記第１及び第２の照明部の照明を切り換えるシ
ャッタ機構部と、前記撮像部による第１及び第２の撮像
の座標値を求めこれらの座標値からリード端子の縦方向
の浮きを算出し基準値と比較する画像処理部と、前記シ
ャッタ機構部及び画像処理部の動作を制御する制御部と
により構成される。[Detailed Description of the Invention] [1 Remarks] Regarding an inspection device for lead terminals of an IC package, the purpose of this invention is to solve the difficulty of identifying projected images of lead terminals and improve the reliability of inspection. The package lead terminal inspection apparatus includes first and second illumination sections that illuminate one from directly above and the other at a predetermined tilt in order to obtain projected images of the lead terminal from different directions; an imaging unit that sequentially photographs first and second projected images by a second illumination unit; a shutter mechanism unit that switches illumination of the first and second illumination units; an image processing section that calculates the coordinate values of the imaging of the image, calculates the vertical lift of the lead terminal from these coordinate values, and compares it with a reference value, and a control section that controls the operation of the shutter mechanism section and the image processing section. be done.
本発明はＩＣパッケージのリード端子の検査、特にリー
ド端子の浮きの検査装置に関する。The present invention relates to inspection of lead terminals of IC packages, and particularly to an apparatus for inspecting floating lead terminals.
情報機器には種々のｔＣパッケージが使用されている。Various tC packages are used in information equipment.
ＩＣパッケージには非常の多くの足（リード端子）があ
るが、これらのリード端子は、ソケットとの位置関係か
ら出来るだけ浮き等の変形をなくし一列に並んでいるこ
とが望ましい。そのため製造メーカの出荷時には厳しい
検査がなされるが、昨今の需要増大に伴い検査の効率向
上と信顛性の向上が要望されている。An IC package has a large number of legs (lead terminals), and it is desirable that these lead terminals are lined up in a line to avoid deformation such as floating as much as possible in view of their positional relationship with the socket. For this reason, strict inspections are carried out by manufacturers before shipment, but with the recent increase in demand, improvements in inspection efficiency and reliability are desired.
第７図（ａ）、（ハ）は従来のＩＣパッケージのリード
端子の浮き検査を行うための検査装置の要部配置図であ
る。第７図（ａ）は検査装置を上方から見た図、（ｂ）
は側面から見た図である。図において、ｆＣＰはＩＣパ
ッケージ、ＬＴはリード端子、ＬＧＴ１、ＬＧＴ２は照
明装置、ＣＭＲはカメラである２台の照明装置ＬＧＴ１
、ＬＧＴ２によってリード端子の正面から同時に照明を
当て、リード端子からの反射光をカメラＣＭＨにより撮
像する。FIGS. 7(a) and 7(c) are layout diagrams of main parts of a conventional inspection device for inspecting floating lead terminals of an IC package. Figure 7 (a) is a view of the inspection device viewed from above, (b)
is a side view. In the figure, fCP is an IC package, LT is a lead terminal, LGT1 and LGT2 are lighting devices, and CMR is a camera. Two lighting devices LGT1
, LGT2 simultaneously illuminate the lead terminals from the front, and the camera CMH images the reflected light from the lead terminals.
リード端子の先端部■の像である。浮きの検査は各機■
のＹ軸方向の座標値を求め、その平均値を重心座標値Ｃ
とし、この重心座標値と各機■の差を求め基準値と比較
することにより行う。This is an image of the tip part (■) of the lead terminal. Each machine inspects the float■
Find the coordinate value in the Y-axis direction of
This is done by finding the difference between this center of gravity coordinate value and each machine (2) and comparing it with the standard value.
第９図は従来の実際の描像を示す図である。斜線部はり
−Ｆ端子の実際の撮像である。第７図（ｂ）に示すよう
に、この場合、カメラは先端部■の像に焦点を合わせる
が■の像の他に、立下がり部■の像と折り曲げ部■の像
を同時に撮像することになる。リート端子の折り曲げ部
の長さｄが短いタイプでは焦点が接近しているため反射
光が混合され、図示のようにこれらの像の識別が不明瞭
となり正確な重心座標値を得ることが困難であり検査に
支障を来している。FIG. 9 is a diagram showing a conventional actual image. The shaded area is an actual image of the beam-F terminal. As shown in FIG. 7(b), in this case, the camera focuses on the image of the tip part ■, but in addition to the image of ■, it simultaneously captures the image of the falling part ■ and the image of the bending part ■. become. In the type where the length d of the bent portion of the REIT terminal is short, the reflected light is mixed because the focal points are close together, and as shown in the figure, the identification of these images becomes unclear and it is difficult to obtain accurate barycenter coordinate values. Yes, it is interfering with inspection.
本発明の目的は、リード端子の投影像の識別の難しさを
解消し検査の信顛性の向上を図ることが可能なリード端
子検査装置を提供することにある。SUMMARY OF THE INVENTION An object of the present invention is to provide a lead terminal inspection device that can solve the difficulty of identifying projected images of lead terminals and improve the reliability of inspection.
本発明は、第３図に基本構成図を示すように、ｔＣパッ
ケージのリード端子検査装置であって、リード端子の投
影像を異なる方向から得るため一方を真上から照明し他
方を所定の傾きで照明する第１及び第２の照明部（ＬＧ
Ｔｌ、ＬＧＴ２）と、前記第１及び第２の照明部による
第１及び第２の投影像を順次に撮影する礒像部（ＣＭＲ
）と、前記第１及び第２の照明部の照明を切り換えるシ
ャッタ機構部（３）と、前記撮像部による第１及び第２
の撮像の座標値を求めこれらの座標値からリード端子の
縦方向の浮きを算出し基準値と比較する画像処理部（４
）と、前記シャッタ機構部及び画像処理部の動作を制御
する制御部（５）とを具備することを特徴とする。As shown in the basic configuration diagram in FIG. 3, the present invention is a tC package lead terminal inspection device, in which one side is illuminated from directly above and the other side is illuminated at a predetermined inclination in order to obtain projected images of the lead terminals from different directions. The first and second lighting sections (LG
Tl, LGT2), and a imaging unit (CMR) that sequentially photographs first and second projected images by the first and second illumination units.
), a shutter mechanism section (3) that switches the illumination of the first and second illumination sections, and a shutter mechanism section (3) that switches the illumination of the first and second illumination sections;
An image processing unit (4) calculates the vertical lift of the lead terminal from these coordinate values and compares it with a reference value.
), and a control section (5) that controls the operations of the shutter mechanism section and the image processing section.
〔作 用］ 第１図（ａ）、 （ｂ）は本発明の要部配置図である。[For production] FIGS. 1(a) and 1(b) are layout diagrams of main parts of the present invention.
図に示すように、先ず、第１の照明装置ＬＧＴＩにより
リード端子ＬＴの真上上方から照明し、その投影像をカ
メラＣＭＲで撮像し像の座標値を求める。次に、第２の
照明装置ＬＧＴ２により同様にリード端子の斜め上方か
ら照明しその撮像の座標値を求める。そして２つの座標
値の三角関数よりリード端子の浮きを算出する。As shown in the figure, first, the lead terminal LT is illuminated from directly above by the first illumination device LGTI, and its projected image is captured by the camera CMR to obtain the coordinate values of the image. Next, the second illumination device LGT2 similarly illuminates the lead terminal from diagonally above, and the coordinate values of the image are determined. Then, the float of the lead terminal is calculated from the trigonometric function of the two coordinate values.
第２図はカメラにより撮像されたリード端子の投影像で
ある。図において、実線は照明装置ＬＧＴＩによる像、
点線は照明装置ＬＧＴ２による像である。FIG. 2 is a projected image of the lead terminal taken by a camera. In the figure, the solid line is the image obtained by the illumination device LGTI,
The dotted line is an image obtained by illumination device LGT2.
Ｓはリード端子の浮きにより生じる投影像のずれ量であ
る。このずれ量からリード端子の浮きを後述するように
画像処理部（４）により算出する。S is the amount of deviation of the projected image caused by floating of the lead terminal. From this amount of deviation, the image processing section (4) calculates the floating of the lead terminal, as will be described later.
第３図は本発明のリード端子検査装置の基本構成ブロッ
ク図である。図において、１は２つの照明部（ＬＧＴＩ
、 ＬＧＴ２）、２は撮像部（カメラ） （ＣＭＲ）
、３はシャッタ機構部、４は画像処理部、５はマイクロ
コンピュータからなる制御部である。 照明部ｌはリー
ド端子の投影像を異なる方向がら得るための第１及び第
２の照明装置を有し、カメラ２は前記第１及び第２の照
明装置による第１及び第２の投影像を順次撮影し、シャ
ッタ機構部３は前記第１及び第２の照明装置の照射光を
断続し、画像処理部４は前記カメラによる第１及び第２
の撮影像の座標値を求めこれらの座標値からリード端子
の縦方向の浮きを算出し基準値と比較する。第４図は第
３図装置の基本処理フローチャートである。先ず、照明
装置ＬＧＴＩによりリード端子に照明しカメラでその撮
像を求め（１）、その撮像の座標値を算出する（２）。FIG. 3 is a basic configuration block diagram of the lead terminal inspection device of the present invention. In the figure, 1 indicates two lighting units (LGTI
, LGT2), 2 is the imaging unit (camera) (CMR)
, 3 is a shutter mechanism section, 4 is an image processing section, and 5 is a control section consisting of a microcomputer. The illumination unit l has first and second illumination devices for obtaining projected images of the lead terminals from different directions, and the camera 2 receives the first and second projected images by the first and second illumination devices. The shutter mechanism section 3 intermittents the illumination light of the first and second illumination devices, and the image processing section 4 sequentially photographs the first and second illumination lights by the camera.
The coordinate values of the captured image are determined, and the vertical lift of the lead terminal is calculated from these coordinate values and compared with a reference value. FIG. 4 is a basic processing flowchart of the apparatus shown in FIG. First, the lead terminal is illuminated by the illumination device LGTI, its image is obtained by a camera (1), and the coordinate values of the image are calculated (2).
次に、照明装置ＬＧＴ２によりリード端子に照明しカメ
ラでその撮像を求め（３）、その撮像の座標値を算出す
る（４）。そして後述する方法によりこれらの座標値の
三角関数からリード端子の浮き量を算出しく５）、基準
値と比較してリード端子浮きの良否を判定する（６）。Next, the lead terminal is illuminated by the illumination device LGT2, its image is obtained by the camera (3), and the coordinate values of the image are calculated (4). Then, the floating amount of the lead terminal is calculated from the trigonometric function of these coordinate values using the method described later (5), and compared with a reference value to determine whether the lead terminal floating is good or bad (6).
第５図は本発明の照明装置とカメラの一実施例配置図で
ある。図において、５１は照明装置の位置を制御するマ
イクロコンピュータによる位置制御装置、５２は照射光
を誘導する光ファイバ、５３は照明装置ＬＧＴ２の角度
を調整する調整装置、５４はＩＣパッケージ（ＩＣＰ）
を吸着するバキュームパッドである。前述のように、照
明装置ＬＧＴＩの投影像と照明装置ＬＧＴ２の投影像を
順次カメラにて撮像し画像処理部にて座標値を求める。FIG. 5 is a layout diagram of an embodiment of the lighting device and camera of the present invention. In the figure, 51 is a microcomputer-based position control device that controls the position of the lighting device, 52 is an optical fiber that guides the irradiation light, 53 is an adjustment device that adjusts the angle of the lighting device LGT2, and 54 is an IC package (ICP).
It is a vacuum pad that absorbs. As described above, the projected image of the illumination device LGTI and the projected image of the illumination device LGT2 are sequentially captured by the camera and the coordinate values are determined by the image processing unit.
第６図（ａ）、 （ｂ）は本発明の投影像を示す図であ
る。FIGS. 6(a) and 6(b) are diagrams showing projected images of the present invention.
（ａ）はり一ト端子の側面から、（ｂ）は上面から見た
浮きを示している。（ａ）において斜線部はリード端子
の先端■像、（ｂ）において実線は照明装置ＬＧＴＩに
よる投影像、点線は照明装置ＬＧＴ２による投影像であ
る。(a) shows the float seen from the side of the beam terminal, and (b) shows the float seen from the top. In (a), the shaded area is an image of the tip of the lead terminal, in (b), the solid line is an image projected by the illumination device LGTI, and the dotted line is an image projected by the illumination device LGT2.
ここで照明装置ＬＧＴＩによる投影像の幅をａ、照明装
置ＬＧＴ２による投影像の幅をａ゛、浮きの高さの任意
の設定値をＸ、ずれ量をＳ、リード端子の板厚をＨ，Ｉ
ｔ（明装置ＬＧＴ２の入射角をθとする。Here, the width of the projected image by the illumination device LGTI is a, the width of the projected image by the illumination device LGT2 is a゛, the arbitrary setting value of the float height is X, the amount of deviation is S, the plate thickness of the lead terminal is H, I
t (The incident angle of the light device LGT2 is assumed to be θ.
このような関係において、照明装置ＬＧＴ２の入射角θ
は、
θ−Ｌａｎ −’（ａ −ａ’ ）／ Ｈ・・・・・１
１）と表せる。In such a relationship, the incident angle θ of the lighting device LGT2
is θ-Lan-'(a-a')/H...1
It can be expressed as 1).
式（１）から明らかなように、ずれ量Ｓは、５＝ｘ−ｔ
ａｎ θ・・・・・・・・・・・（２）と表せるから、
投影像のずれｌｓは浮きＸと関係し、浮きＸを所定の許
容基準値に設定すれば、式（２）からＳの範囲を見るこ
とによりリード端子浮き検査を行うことができる。例え
ば、
Ｓ≦Ｘ・ｔａｎ θを良品と判定し、
Ｓ＞ｘ・ｔａｎ θを不良品と判定する。As is clear from equation (1), the amount of deviation S is 5=x−t
Since it can be expressed as an θ・・・・・・・・・(2),
The deviation ls of the projected image is related to the float X, and if the float X is set to a predetermined allowable reference value, the lead terminal float can be inspected by looking at the range of S from equation (2). For example, S≦X・tan θ is determined to be a good product, and S>x・tan θ is determined to be a defective product.
この場合、前述のように、式（１）、 （２）の算出を
画像処理部４にて行う。In this case, as described above, the image processing unit 4 calculates equations (1) and (2).
以上説明したように、本発明によれば、リード端子の折
り曲げ部の長さに無関係に検査ができ、投影光の識別は
不要となり、かつ照明装置の位置調整も容易となるため
、検査の能率向上と信頼性の向上を図ることができる。As explained above, according to the present invention, inspection can be performed regardless of the length of the bent portion of the lead terminal, there is no need to identify the projected light, and the position of the illumination device can be easily adjusted, thereby increasing inspection efficiency. It is possible to improve performance and reliability.
第１図（ａ）、 （ｂ）は本発明による第１及び第２の
照明装置とＩＣパッケージとリード端子とカメラの要部
配置図、
第２図は第１図のカメラにより撮像されたり−ト端子の
投影像を示す図、
第：３図は本発明のリード端子検査装置の基本構成ブロ
ック図、
第４図は第３図装置の処理フローチャート、第５図は本
発明の照明装置とカメラの一実施例要部構成図、
第６図（ａ）、 （ｂ）は本発明のリード端子の側面及
び上面から見たリード端子の投影像を示す図、第７図（
ａ）、 （ｂ）は従来のｌＣパッケージのリード端子の
検査の要部配置図、
第８図は従来の先端部の描像を示す図、及び第９図は従
来の実際の撮像明する図である。
（符号の説明）
１ 、 ＬＧＴ１、ＬＧＴ２・・・照明装置、２、ＣＭ
Ｒ・・・カメラ、 ３・・・シャッタ機構部、４
・・・画像処理部、 ５・・・制御部、ＩＣＰ・・
・ＩＣパッケージ、ＬＴ・・・リード端子。
本発明の要部配置図
第１１２Ｉ
第３図装置の処理フローチャート
第
図
カメラ上の投影像を示マ図
’＄２ＦｊＪ
本発明の基本構成ブロック図
）８３図
本発明の一実施例要部構成図
第５図
（ａ）
Ｙ
（ｂ）
本発明［よる投影像を示す図
第
図
しＧＴＩ
（Ｑ）
従来の要部配置図
＃Ｉ７図1(a) and 1(b) are main part layout diagrams of the first and second lighting devices, IC packages, lead terminals, and cameras according to the present invention, and FIG. 2 is an image taken by the camera of FIG. 1. Figure 3 is a basic configuration block diagram of the lead terminal inspection device of the present invention, Figure 4 is a processing flowchart of the device shown in Figure 3, and Figure 5 is the illumination device and camera of the present invention. 6(a) and 6(b) are diagrams showing projected images of the lead terminal of the present invention as seen from the side and top surfaces, and FIG. 7(
a) and (b) are layout diagrams of the main parts of conventional IC package lead terminal inspection, Figure 8 is a diagram showing the conventional depiction of the tip, and Figure 9 is a diagram showing the actual conventional imaging. be. (Explanation of symbols) 1. LGT1, LGT2...Lighting device, 2. CM
R...Camera, 3...Shutter mechanism section, 4
...Image processing unit, 5...Control unit, ICP...
・IC package, LT...lead terminal. Layout of essential parts of the present invention Figure 112I Figure 3 Processing flowchart of the device Figure 2: Diagram showing the projected image on the camera Figure '$2FjJ Basic configuration block diagram of the present invention) Figure 83 Configuration diagram of essential parts of an embodiment of the present invention Figure 5 (a) Y (b) Diagram showing a projected image according to the present invention Figure 5 (Q) Conventional layout diagram of main parts #I7 Figure
Claims (1)
上から照明し他方を所定の傾きで照明する第１及び第２
の照明部（ＬＧＴ１、ＬＧＴ２）と、前記第１及び第２
の照明部による第１及び第２の投影像を順次に撮影する
撮像部（ＣＭＲ）と、前記第１及び第２の照明部の照明
を切り換えるシャッタ機構部（３）と、 前記撮像部による第１及び第２の撮像の座標値を求めこ
れらの座標値からリード端子の縦方向の浮きを算出し基
準値と比較する画像処理部（４）と、前記シャッタ機構
部及び画像処理部の動作を制御する制御部（５）と、 を具備することを特徴とするＩＣパッケージのリード端
子検査装置。[Scope of Claims] 1. A lead terminal inspection device for an IC package, comprising first and second lamps that illuminate one side from directly above and the other at a predetermined inclination in order to obtain projected images of the lead terminals from different directions.
lighting units (LGT1, LGT2), and the first and second illumination units (LGT1, LGT2);
an imaging unit (CMR) that sequentially photographs first and second projection images by the illumination unit; a shutter mechanism unit (3) that switches the illumination of the first and second illumination units; An image processing unit (4) that calculates the coordinate values of the first and second imaging, calculates the vertical lift of the lead terminal from these coordinate values, and compares it with a reference value, and controls the operation of the shutter mechanism unit and the image processing unit. An IC package lead terminal inspection device, comprising: a control section (5) for controlling;
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63267077A JPH0672772B2 (en) | 1988-10-25 | 1988-10-25 | IC package lead terminal inspection device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63267077A JPH0672772B2 (en) | 1988-10-25 | 1988-10-25 | IC package lead terminal inspection device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02114104A true JPH02114104A (en) | 1990-04-26 |
| JPH0672772B2 JPH0672772B2 (en) | 1994-09-14 |
Family
ID=17439709
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63267077A Expired - Lifetime JPH0672772B2 (en) | 1988-10-25 | 1988-10-25 | IC package lead terminal inspection device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0672772B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06160057A (en) * | 1992-11-24 | 1994-06-07 | Just:Kk | Device for inspecting lead shape of electronic part |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6486532A (en) * | 1987-09-28 | 1989-03-31 | Dakku Eng Kk | Two-field image sensing method |
-
1988
- 1988-10-25 JP JP63267077A patent/JPH0672772B2/en not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6486532A (en) * | 1987-09-28 | 1989-03-31 | Dakku Eng Kk | Two-field image sensing method |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06160057A (en) * | 1992-11-24 | 1994-06-07 | Just:Kk | Device for inspecting lead shape of electronic part |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0672772B2 (en) | 1994-09-14 |
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