JPH02110368U - - Google Patents
Info
- Publication number
- JPH02110368U JPH02110368U JP1903389U JP1903389U JPH02110368U JP H02110368 U JPH02110368 U JP H02110368U JP 1903389 U JP1903389 U JP 1903389U JP 1903389 U JP1903389 U JP 1903389U JP H02110368 U JPH02110368 U JP H02110368U
- Authority
- JP
- Japan
- Prior art keywords
- mounting
- component
- terminal pad
- integrated circuit
- hybrid integrated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims description 2
- 238000000926 separation method Methods 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Description
第１図は本考案に係る混成集積回路の一実施例
を示す要部平面図、第２図は従来の混成集積回路
の要部平面図である。
１……絶縁基板、２……導体配線、３，４……
半田パターンシヨート部、５，１０……部品搭載
用端子パターン、１１……電子部品、１２……分
離部、Ｒ……抵抗素子。
FIG. 1 is a plan view of an essential part of an embodiment of a hybrid integrated circuit according to the present invention, and FIG. 2 is a plan view of an essential part of a conventional hybrid integrated circuit. 1... Insulated substrate, 2... Conductor wiring, 3, 4...
Solder pattern short part, 5, 10... Terminal pattern for mounting components, 11... Electronic component, 12... Separation part, R... Resistance element.
Claims (1)
体配線を印刷形成してなり、この部品搭載用端子
パツドは略中央部にて分離され、半田パターンシ
ヨート部を兼用することを特徴とする混成集積回
路。 A hybrid integrated circuit formed by printing a conductor wiring having a terminal pad for mounting a component on an insulating substrate, and the terminal pad for mounting a component is separated approximately at the center and also serves as a solder pattern short section. circuit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1903389U JPH02110368U (en) | 1989-02-21 | 1989-02-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1903389U JPH02110368U (en) | 1989-02-21 | 1989-02-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02110368U true JPH02110368U (en) | 1990-09-04 |
Family
ID=31234191
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1903389U Pending JPH02110368U (en) | 1989-02-21 | 1989-02-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02110368U (en) |
-
1989
- 1989-02-21 JP JP1903389U patent/JPH02110368U/ja active Pending