JPH02110325U - - Google Patents

Info

Publication number
JPH02110325U
JPH02110325U JP1799789U JP1799789U JPH02110325U JP H02110325 U JPH02110325 U JP H02110325U JP 1799789 U JP1799789 U JP 1799789U JP 1799789 U JP1799789 U JP 1799789U JP H02110325 U JPH02110325 U JP H02110325U
Authority
JP
Japan
Prior art keywords
lead frame
chip
electronic component
type electronic
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1799789U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1799789U priority Critical patent/JPH02110325U/ja
Publication of JPH02110325U publication Critical patent/JPH02110325U/ja
Pending legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案の一実施例を示す外観斜視図（
一部透視）。第２図は従来の例を示す外観斜視図
（一部透視）。 １……リードフレーム、２……フレーム突起、
３……からげ部、４……巻線上がりコア、５……
コア保持台、６……リード線、７……コア載せ用
フレーム部、８……端子部。 FIG. 1 is an external perspective view showing an embodiment of the present invention (
(partly transparent). FIG. 2 is an external perspective view (partially transparent) showing a conventional example. 1...Lead frame, 2...Frame protrusion,
3...Tangled part, 4...Winding core, 5...
Core holding stand, 6... Lead wire, 7... Core mounting frame part, 8... Terminal part.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 電子機器等のプリント配線基板に表面実装が可
能なリード端子配列を持つリードフレームで、こ
れに巻線上がりコア等を組み付け、封止成形して
チツプ型電子部品を形成するリードフレームにお
いて、リードフレームの一部に樹脂で形成したコ
ア保持部を有することを特徴とするチツプ型電子
部品用リードフレーム。 A lead frame with a lead terminal arrangement that can be surface-mounted on a printed wiring board of electronic equipment, etc. A lead frame is used to assemble a wound core, etc. to this lead frame, and seal it to form a chip-type electronic component. A lead frame for a chip-type electronic component, characterized in that a part of the lead frame has a core holding part formed of resin.
JP1799789U 1989-02-17 1989-02-17 Pending JPH02110325U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1799789U JPH02110325U (en) 1989-02-17 1989-02-17

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1799789U JPH02110325U (en) 1989-02-17 1989-02-17

Publications (1)

Publication Number Publication Date
JPH02110325U true JPH02110325U (en) 1990-09-04

Family

ID=31232250

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1799789U Pending JPH02110325U (en) 1989-02-17 1989-02-17

Country Status (1)

Country Link
JP (1) JPH02110325U (en)

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