JPH0210790A - Flexible printed wiring board and parts mounting method - Google Patents
Flexible printed wiring board and parts mounting methodInfo
- Publication number
- JPH0210790A JPH0210790A JP15939688A JP15939688A JPH0210790A JP H0210790 A JPH0210790 A JP H0210790A JP 15939688 A JP15939688 A JP 15939688A JP 15939688 A JP15939688 A JP 15939688A JP H0210790 A JPH0210790 A JP H0210790A
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- wiring
- mounting
- components
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims description 15
- 239000000463 material Substances 0.000 claims description 7
- 239000002985 plastic film Substances 0.000 claims description 2
- 229920006255 plastic film Polymers 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000004886 process control Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000003908 quality control method Methods 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
Landscapes
- Structure Of Printed Boards (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、薄型の電子機器、例えばカード電卓、メモリ
カード等の部品実装並びに組立に適したフレキシブルプ
リント配線板と、部品実装方法に関するものである。Detailed Description of the Invention (Field of Industrial Application) The present invention relates to a flexible printed wiring board suitable for mounting and assembling parts of thin electronic devices such as card calculators and memory cards, and a method for mounting parts. be.
（従来の技術）
フレキシブルプリント配線板はその優れた屈曲性から各
種電子機器の可動部分の配線、あるいはカメラ等の小型
の機器の微小空間内の多面上の配線に多用されている。(Prior Art) Due to its excellent flexibility, flexible printed wiring boards are often used for wiring of movable parts of various electronic devices or for wiring on multiple surfaces in micro spaces of small devices such as cameras.
前者の場合はほとんどフラットケーブルと同じ機能と形
態であり、後者の場合が本来の配線板としての使われ方
である。この後者と同様な場合で、さらに厚さの制約が
強くなったとき、大抵は表面実装用の部品を使用するが
、一部のものについては配線板自身の厚みを削減するた
めに、配線板に実装する部品外周よりやや大きい形状の
穴（デバイスホール）をあけ、裏側で配線板と接続する
方法がとられている。In the former case, it has almost the same function and form as a flat cable, and in the latter case, it is originally used as a wiring board. In cases similar to the latter, when thickness constraints become even stronger, surface mount components are usually used, but in some cases, wiring boards are used to reduce the thickness of the wiring board itself. The method used is to make a hole (device hole) that is slightly larger than the outer circumference of the component to be mounted on the device and connect it to the wiring board on the back side.
従来、このような場合にはまず表側に大部分の部品を実
装し、デバイスホールを通して裏面で接続する必要のあ
るものについては後から人手で実装している。これでは
人手による半田付は工数もさることながら、工程が増え
工程管理も煩雑になる上に、品質管理の面でも問題が生
じ易い。Conventionally, in such cases, most components are first mounted on the front side, and those that need to be connected on the back side through device holes are then manually mounted. In this case, manual soldering not only requires more man-hours, but also increases the number of steps, complicates process control, and tends to cause problems in terms of quality control.
また、こうして得られた部品実装配線板が組立てられる
際に、デバイスホールを使用したものについては接続部
が裏側に出っ張るため、それを収容する対策が必要とな
り、厚さに対する制約が強い場合はこれも大きな問題と
なる。さらには、デバイスホールを使用した部品とそう
でない部品とを同時に実装すると、デバイスホールを使
用した部品本体の大部分は配線板の裏側にあるため、カ
ード電卓あるいはメモリカードのように限られた隙間に
組み込む場合、配線板に大きな歪みが生ずる上に、デバ
イスホールを使用した部品が実装されている部分とそう
でない部品が実装されている部分との間に相当広い非実
装領域を設ける必要があり、高密度実装ができない欠点
があった。In addition, when the component mounting wiring board obtained in this way is assembled, the connection part protrudes on the back side of the board using device holes, so a measure to accommodate it is required, and if there are strong restrictions on the thickness, this is also a big problem. Furthermore, if components that use device holes and components that do not are mounted at the same time, most of the components that use device holes are on the back side of the wiring board, so it may be difficult to mount parts that use device holes or other components that do not have a limited gap, such as a card calculator or memory card. In addition to causing large distortions on the wiring board, it is necessary to provide a fairly large non-mounting area between the part where components using device holes are mounted and the part where components that do not use device holes are mounted. However, there was a drawback that high-density mounting was not possible.
（発明が解決しようとする課題）
本発明は、フレキシブルプリント配線板の部品実装にお
けるこのような問題点に鑑み、部品実装の際にデバイス
ホールを使用する部品も一方の面（表面）で同時に接続
できると共に、デバイスホールを使用する部品とそうで
ないものとを実装密度を極端に下げないで同時に実装で
き、また、組立の際も接続部分が比較的容易に収容の対
策がとれ、且つ部品実装した配線板を限られた隙間に組
み込んでも配線板に歪みを発生させないフレキシブルプ
リント配線板とその実装方法を提供しようとするもので
ある。(Problems to be Solved by the Invention) In view of these problems in mounting components on flexible printed wiring boards, the present invention aims to connect components that use device holes at the same time on one side (front surface) when mounting components. In addition, it is possible to simultaneously mount components that use device holes and those that do not, without drastically lowering the packaging density. Also, during assembly, measures can be taken to accommodate the connecting parts relatively easily, and components can be mounted easily. The object of the present invention is to provide a flexible printed wiring board that does not cause distortion in the wiring board even when the wiring board is installed in a limited gap, and a method for mounting the same.
（課題を解決するための手段）
即ち本発明は、プラスチックフィルムを基材とするフレ
キシブルプリント配線板の部品実装部につながる配線を
、該部品実装部の外周をとり囲むように蛇行させて配置
せしめ、蛇行した配線の側傍のプリント配線板基材に断
続的な切断部を形成したことを特徴とするフレキシブル
プリント配線板、およびその部品実装部に部品を配設し
、プリント配線板に電気的に接続した後、プリント配線
板基材の断続的な切断部を完全に切り離して、部品を遊
動状態にすることを特徴とする部品実装方法である。(Means for Solving the Problems) That is, the present invention arranges wiring connected to a component mounting portion of a flexible printed wiring board based on a plastic film in a meandering manner so as to surround the outer periphery of the component mounting portion. , a flexible printed wiring board characterized in that intermittent cutting parts are formed in the printed wiring board base material on the side of the meandering wiring, and components are arranged in the component mounting part, and electrical connections are made to the printed wiring board. This component mounting method is characterized by completely cutting off the intermittent cut portions of the printed wiring board base material after connecting the component to the printed wiring board base material, and leaving the component in a floating state.
以下、図面により本発明の一実施例となるフレキシブル
プリント配線板と、それを用いた部品実装方法について
詳細に説明する。DESCRIPTION OF THE PREFERRED EMBODIMENTS A flexible printed wiring board according to an embodiment of the present invention and a component mounting method using the same will be described in detail below with reference to the drawings.
第１図は本発明による配線板の一例を示すもので部品を
実装した状態の平面図である。また、第２図は本発明に
よる配線板に部品を実装し、機器に組み込む様子を示し
た図である。FIG. 1 shows an example of a wiring board according to the present invention, and is a plan view of a state in which components are mounted. Further, FIG. 2 is a diagram showing how parts are mounted on a wiring board according to the present invention and assembled into a device.
第１図に示したように、デバイスホール（３）に実装さ
れたミニモールド部品（１）と電気的に接続するための
配線（６）は、部品実装部、この例では、デバイスホー
ル（３）の外周をとり囲むように蛇行させて配置されて
おり、蛇行した各配線の側傍には、プリント配線板基材
にミシン目状等の断続的な切断部（４）が形成されてい
る。切断部（４）は破線で示した全部が完全に切断する
のではなく、部品実装に耐えられる程度に部分的につな
がった状態にしておく、こうすることにより、全ての部
品を同時に実装することが可能となる。As shown in FIG. 1, the wiring (6) for electrically connecting the mini-mold component (1) mounted in the device hole (3) is connected to the component mounting part, in this example, the device hole (3). ) are arranged in a meandering manner so as to surround the outer periphery of the wiring, and intermittent cut portions (4) such as perforations are formed in the printed wiring board base material on the side of each meandering wiring. . The cutting section (4) is not completely cut off as indicated by the broken line, but is left partially connected to the extent that it can withstand component mounting.By doing this, all components can be mounted at the same time. becomes possible.
本発明のポイントとなる切断部（４）の形成方法として
は、フレキシブルプリント配線板の簡易的打抜方法とし
て用いられている、［はがね」の刃を木仮にはめこんだ
切断工具（ビク型）とバックアップ用材料の間に配線板
中間加工物をはさみこみ、平板プレスで圧縮する方法が
ある。切断位置の精度が必要な場合は、木板を金属板に
する等の対応をする。切断部（４）につながった部分を
残す方法としては、前述の刃の残したい部分の刃をつぶ
した状態にすればよい、この「つぶし」の大きさでハー
フカットにする等、つながった部分の強度を加減するこ
とができる。The method for forming the cut portion (4), which is the key point of the present invention, is a cutting tool (Bikku) in which a ``steel'' blade is fitted into a temporary piece of wood, which is used as a simple punching method for flexible printed wiring boards. There is a method in which an intermediate workpiece of the circuit board is sandwiched between the mold and the backup material and compressed using a flat plate press. If precision in cutting position is required, take measures such as replacing the wooden board with a metal one. To leave the part connected to the cutting part (4), you can crush the part of the blade that you want to leave as described above, or make a half cut with the size of this "crushed" part, etc. It is possible to adjust the strength of
次に、このようにして得られたフレキシブルプリント配
線板に部品を実装する方法について述べる。先ず、図示
したように、チップ部品（２）を配線板表面の半田付部
（５）に、また、やや形の大きいミニモールド部品（１
）は、第２図（ａ）のように部品本体は配線板の裏面側
に位置させ、リード線０［Ｄを表面側に出してセットし
半田付は工程にかけることによって、種類の異なる部品
を同時に実装することが出来る。Next, a method for mounting components on the flexible printed wiring board thus obtained will be described. First, as shown in the figure, a chip component (2) is attached to the soldered part (5) on the surface of the wiring board, and a slightly larger mini-mold component (1) is attached.
), as shown in Figure 2(a), the component body is located on the back side of the wiring board, the lead wire 0[D is set on the front side, and the soldering process is performed to separate different types of components. can be implemented simultaneously.
続いて、得られた部品実装配線板を機器に組み込む前に
、切断部（４）に残していたつながった部分を完全に切
り離す、第２図（ｂ）は機器に組み込んだ様子を示すも
ので、切断部（４）が完全に切り離されたことによって
、ミニモールド部品（１）は比較的自由に移動できる遊
動状態になっているので、第２図（ｂ）のように部品（
１）はデバイスホール（３）を通り抜けて配線板の表面
側に出る。これによって、切断されてフリーの状態にな
った蛇行配線部（７）が、緩やかな傾斜を描いて蛇腹状
に開くことにより、配線板に大きな歪みを生ずることな
く全ての部品を配線板の一方の面に寄せることが出来る
等、部品の位置を任意にとることを可能にしており、ま
た、実装密度もあまり低下していないことがわかる。Next, before assembling the obtained component-mounted wiring board into a device, the connected portion left at the cut section (4) is completely separated. Figure 2 (b) shows how it is assembled into a device. , As the cutting part (4) is completely separated, the mini-mold part (1) is in a floating state where it can move relatively freely, so the part (
1) passes through the device hole (3) and exits to the front side of the wiring board. As a result, the meandering wiring section (7), which has been cut and is in a free state, opens in a bellows shape with a gentle slope, and all the components can be moved to one side of the wiring board without causing any major distortion to the wiring board. It can be seen that the parts can be placed in any desired position, such as being able to move them to the same surface, and that the packaging density has not decreased much.
第２図（ｂ）は、このようにして部品を実装したフレキ
シブルプリント配線板を機器のフレームθ１）内に収納
し、フレーム（１１）と配線板を接着剤０りで接着、固
定した状態を示している。Figure 2(b) shows the state in which the flexible printed wiring board with components mounted in this way is housed in the frame θ1) of the device, and the frame (11) and the wiring board are bonded and fixed with zero adhesive. It shows.
尚、第１図に示した例では、部品実装部はデバイスホー
ルになっているが、必ずしもデバイスホールを用いる必
要はなく、部品実装部の周囲に切断部（４）と同様な断
続的な切断部を形成させ、部品を実装した後で完全に切
り離すことによって、実装した部品が自由に移動できる
ようにする方式であっても何ら差しつかえはなく、デバ
イスホールを設ける方式と同様な効果が得られる。In the example shown in Fig. 1, the component mounting area is a device hole, but it is not necessarily necessary to use a device hole. There is no problem with a method in which the mounted parts can be moved freely by forming a part and completely separating the parts after mounting them, and the same effect as the method of providing a device hole can be obtained. It will be done.
（発明の効果）
本発明によるフレキシブルプリント配線板とその実装方
法を用いることにより、従来の方法では後から実装しな
ければならなかったデバイスホール等を必要とする部品
も、これら以外の部品と同時に実装することが可能とな
り、大幅な工数削減と接続信頬性の向上が可能となる。(Effect of the invention) By using the flexible printed wiring board and its mounting method according to the present invention, components that require device holes, etc., which had to be mounted later using conventional methods, can be mounted simultaneously with other components. This makes it possible to significantly reduce man-hours and improve connection reliability.
さらに、本発明を用いないでデバイスホールだけを形成
したものに全ての部品を同時に実装したものと比べた場
合、本発明を用いた配線板は一方の面（例では裏面）に
部品が出っ張ることがないため、組立が容易になり、な
おかつ、配線板に歪みを生じたり、部品の実装密度をほ
とんど低下させることかなく、特に薄型電子桟器の組立
に極めて好適である。Furthermore, when compared to a board in which only device holes are formed without using the present invention and all components are mounted at the same time, the wiring board using the present invention has components protruding from one side (the back side in the example). Since there are no holes, the assembly is easy, and there is no distortion in the wiring board and almost no reduction in the mounting density of components, making it particularly suitable for assembling thin electronic crosspieces.
第１図Figure 1
第１図は本発明による配線板の一例を示すもので部品を
実装した状態の平面図である。また、第２図は本発明に
よる配線板に部品を実装し、機器に組み込む様子を示し
た図で、（ａｌは部品を実装した状態の断面図、■）は
実装した部品を配線板の一方の面に寄せて機器のフレー
ム内に収納した状態の側面図である。
第２図FIG. 1 shows an example of a wiring board according to the present invention, and is a plan view of a state in which components are mounted. In addition, Fig. 2 is a diagram showing how parts are mounted on a wiring board according to the present invention and assembled into a device. FIG. 3 is a side view of the device when it is housed in the frame of the device. Figure 2
Claims (2)
プリント配線板の部品実装部につながる配線を、該部品
実装部の外周をとり囲むように蛇行させて配置せしめ、
蛇行した配線の側傍のプリント配線板基材に断続的な切
断部を形成したことを特徴とするフレキシブルプリント
配線板。(1) The wiring connected to the component mounting section of a flexible printed wiring board based on a plastic film is arranged in a meandering manner so as to surround the outer periphery of the component mounting section,
A flexible printed wiring board characterized in that intermittent cut portions are formed in a printed wiring board base material beside meandering wiring.
の部品実装部に部品を配設し、プリント配線板に電気的
に接続した後、プリント配線板基材の断続的な切断部を
完全に切り離して、部品を遊動状態にすることを特徴と
する部品実装方法。(2) After placing the components on the component mounting portion of the flexible printed wiring board according to claim (1) and electrically connecting them to the printed wiring board, the intermittent cut portions of the printed wiring board base material are completely removed. A component mounting method characterized by separating the components and leaving them in a floating state.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15939688A JPH0210790A (en) | 1988-06-29 | 1988-06-29 | Flexible printed wiring board and parts mounting method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15939688A JPH0210790A (en) | 1988-06-29 | 1988-06-29 | Flexible printed wiring board and parts mounting method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0210790A true JPH0210790A (en) | 1990-01-16 |
Family
ID=15692866
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15939688A Pending JPH0210790A (en) | 1988-06-29 | 1988-06-29 | Flexible printed wiring board and parts mounting method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0210790A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007073723A (en) * | 2005-09-07 | 2007-03-22 | Nok Corp | Fitting method for led and fitting structure for led |
| US7221128B2 (en) | 2002-05-30 | 2007-05-22 | Sanken Electric Co., Ltd. | Converter with start-up circuit |
-
1988
- 1988-06-29 JP JP15939688A patent/JPH0210790A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7221128B2 (en) | 2002-05-30 | 2007-05-22 | Sanken Electric Co., Ltd. | Converter with start-up circuit |
| JP2007073723A (en) * | 2005-09-07 | 2007-03-22 | Nok Corp | Fitting method for led and fitting structure for led |
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