JPH02106259A - Duplex head surface grinding device - Google Patents
Duplex head surface grinding deviceInfo
- Publication number
- JPH02106259A JPH02106259A JP25976688A JP25976688A JPH02106259A JP H02106259 A JPH02106259 A JP H02106259A JP 25976688 A JP25976688 A JP 25976688A JP 25976688 A JP25976688 A JP 25976688A JP H02106259 A JPH02106259 A JP H02106259A
- Authority
- JP
- Japan
- Prior art keywords
- grinding
- workpiece
- grinding wheels
- wheels
- rotating shafts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000227 grinding Methods 0.000 title claims abstract description 91
- 238000006243 chemical reaction Methods 0.000 claims abstract description 12
- 230000005540 biological transmission Effects 0.000 claims abstract description 7
- 238000006073 displacement reaction Methods 0.000 claims abstract description 4
- 230000007246 mechanism Effects 0.000 claims description 20
- 238000005452 bending Methods 0.000 abstract description 3
- 230000002349 favourable effect Effects 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 3
- 230000008602 contraction Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
Landscapes
- Grinding Of Cylindrical And Plane Surfaces (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、回転軸端に対向する研削砥石を設けた両頭ｆ
而り１削装置に関するものである。Detailed Description of the Invention (Industrial Application Field) The present invention provides a double-headed f
This relates to a one-shaving device.
（従来技術及びその問題点）
従来のこの種縦型両頭研削盤では、第４図のように２本
の回転軸１００を軸心が一致するように設け、回転軸１
００の端部に互いに対向する研削砥石１０１を設け、２
枚の研削砥石＋０１の間にワーク１０２を送り込んで、
その平行２面を同時に研削するようになっている。(Prior art and its problems) In a conventional vertical double-head grinding machine of this type, two rotating shafts 100 are provided so that their axes coincide with each other as shown in FIG.
Grinding wheels 101 facing each other are provided at the ends of 00, and 2
The workpiece 102 is sent between the grinding wheels +01,
The two parallel surfaces are ground simultaneously.
しかしながら、ワーク＋０２を挾み付ける反力によって
砥石研削面の変位によって砥石研削面が符号１０４の２
点鎖線で示すように開くことによって平行度か悪くなり
重い研削になるほどこの傾向が大になる。ワーク１０２
は両砥石１０１から矢印Ａ方向で示ず」−径方向外向き
に大きな遠心力を受け、ワーク１０２を保持するのに大
きな力が要る。したがって、ワークキャリヤ１０３にギ
ヤのバックラッシュを無くす為の機構等が必要であった
。However, due to the reaction force that pinches the workpiece +02, the grinding surface of the grinding wheel is displaced, and the grinding surface of the grinding wheel is
As shown by the dotted chain line, the parallelism deteriorates due to opening, and this tendency becomes more severe as the grinding becomes heavier. Work 102
(not shown in the direction of arrow A) from both grindstones 101 - A large centrifugal force is applied outward in the radial direction, and a large force is required to hold the workpiece 102. Therefore, the work carrier 103 needs a mechanism or the like to eliminate gear backlash.
対向２軸を逆方向に回転させるため２基のモ−夕が必要
であった。Two motors were required to rotate the two opposing shafts in opposite directions.
（発明の目的）
本発明は、前項の事情を考慮してなされたもので、砥石
研削面の平行度を研削反力の大小にかかわらず良好に維
持することができ、且つワークに働く遠心力を低減でき
る両頭研削装置を提供することを目的としている。(Object of the Invention) The present invention has been made in consideration of the circumstances described in the previous section, and is capable of maintaining the parallelism of the grinding surface of the grinding wheel well regardless of the magnitude of the grinding reaction force, and that is capable of suppressing the centrifugal force acting on the workpiece. The purpose of this invention is to provide a double-headed grinding device that can reduce the
（発明の構成）
（１）技術的手段
本発明は、回転軸を２本設け、回転軸の端部に互いに対
向するり１削砥石を設けた両頭弔面研削装置において、
２本の回転軸を・Ｐ行に且つ回転軸と直角方向にずらし
て、前記研削砥石の一部が重なり合うような間隔を隔て
て配置し、対向する研削砥石の研削面に研削反力で略同
等に相対的ｉｌＺ行を保った変位が発生するように軸系
のモーメント剛性を略等価に設定し、両研削砥石の重な
り合い部分にワークを送るワークキャリヤ機構を設け、
ワークキャリヤ機構のワーク送り経路を、前記両回転軸
の間隔の略中央部で４つ平面視の両回転軸中心を繋いだ
仮想中心線とを横切るように設定し、両回転軸を同一回
転方向に駆動する１個のモータと２組の動力伝達機構を
設けたことを特徴とする両頭車面研削装置である。(Structure of the Invention) (1) Technical Means The present invention provides a double-headed surface grinding device in which two rotating shafts are provided and one grinding wheel is provided facing each other at the end of the rotating shaft.
The two rotating shafts are shifted in the P line and in a direction perpendicular to the rotating shafts, and are arranged at a distance such that the grinding wheels partially overlap, and the grinding surface of the opposing grinding wheel is approximately affected by a grinding reaction force. The moment rigidity of the shaft system is set to be approximately equal so that displacement is generated while maintaining the relative ilZ line, and a work carrier mechanism is provided to send the work to the overlapping part of both grinding wheels.
The workpiece feed path of the workpiece carrier mechanism is set to cross an imaginary center line that connects the centers of the four rotational axes in plan view at approximately the center of the interval between the two rotational axes, and the two rotational axes are aligned in the same rotational direction. This is a double-headed vehicle surface grinding device characterized by being provided with one motor that drives both sides and two sets of power transmission mechanisms.
（２）作用
研削砥石の重なり占い部分はワークを挾み付ける反力に
よっても・１４行を保ちながら変位し、砥石研削面の平
行度を維持するので、ワークの仕上り平行度かよい。(2) Effect The overlapping portion of the grinding wheel is displaced by the reaction force that clamps the work while maintaining the 14 rows, maintaining the parallelism of the grinding surface of the grinding wheel, so the finished parallelism of the work is good.
両研削砥石からワークに働く遠心力は互いに打ち消し合
う向きに働き、ワークを保持する力は小さな力で済む。The centrifugal forces acting on the workpiece from both grinding wheels cancel each other out, so only a small force is needed to hold the workpiece.
ワークに自転力が与えられるので、ワーク仕上り精度が
一層よくなる。Since rotational force is applied to the workpiece, the finishing accuracy of the workpiece is further improved.
（実施例）
本発明を採用した両頭平面研削盤の要部側面図を示す第
１図で、回転軸１０．１１は互いに平行で１１つ間隔り
を隔てている。回転軸１０．１１の端部には円板状の研
削砥石１２．１３を設けてあり、研削砥石１２．１３の
研削面１４．１５には中心線０１．０２の外側部分にド
レスアーム１６を設けである。このドレスアーム１６は
中心線１７を中心に回動自在に軸支してあり、ドレスア
ーム１６の先端部にはドレスツール１８を設けである。(Example) In FIG. 1 showing a side view of essential parts of a double-head surface grinder employing the present invention, rotating shafts 10 and 11 are parallel to each other and spaced apart from each other by 11 points. A disc-shaped grinding wheel 12.13 is provided at the end of the rotating shaft 10.11, and a dressing arm 16 is attached to the grinding surface 14.15 of the grinding wheel 12.13 on the outer side of the center line 01.02. It is a provision. This dressing arm 16 is rotatably supported around a center line 17, and a dressing tool 18 is provided at the tip of the dressing arm 16.
研削砥石１２．１３の研削面１４．１５間にはワーク２
０が挾み付けられており、ワーク２０は研削砥石１２．
１３が上下に重なり合う部分の略中央部、すなわち中心
線０１０２間の略中央部を第１図の紙面に直角ｈ“向に
（０１，０２を結ぶ線を横切る方向に）、詳しくは後述
するワークキャリヤ機構で送られるようになっている。The workpiece 2 is placed between the grinding surfaces 14 and 15 of the grinding wheels 12 and 13.
0 is clamped, and the workpiece 20 is a grinding wheel 12.
13, approximately in the center of the vertically overlapping part, that is, approximately in the center between the center lines 0102, in the direction h" perpendicular to the plane of the paper in FIG. It is designed to be sent by a carrier mechanism.
第１図の■矢視図である第２図で、２１が研削砥石１
２．１３のｍなり合い部分である。この重なり合い部分
２１でワーク２０はワークキャリヤ機構２２に保持され
て矢印Ｂ方向に送り込まれるようになっている。In Fig. 2, which is a view in the direction of the ■ arrow in Fig. 1, 21 is the grinding wheel 1.
This is the m-order part of 2.13. At this overlapping portion 21, the workpiece 20 is held by a workpiece carrier mechanism 22 and fed in the direction of arrow B.
研削砥石１２．１３は略等価な曲げ剛性に設定してあり
、第１図のＷ方向へ働く研削反力によって略同じ変位量
で研削面１４° １５°のように撓む特性を備えている
。変形後の研削面１４° １５’は！ＩＬ行を維持し、
ワーク２０は良好な平行度で研削加工されるようになっ
ている。The grinding wheels 12 and 13 are set to have approximately equivalent bending rigidity, and have the characteristic that the grinding surfaces are bent at 14° and 15° with approximately the same amount of displacement due to the grinding reaction force acting in the W direction in Fig. 1. . The ground surface after deformation is 14° 15'! maintain IL line,
The workpiece 20 is ground with good parallelism.
ワークキャリヤ機構２２はホルダ２４、ガイド２５、油
圧シリンダ２６等から形成されている。The work carrier mechanism 22 includes a holder 24, a guide 25, a hydraulic cylinder 26, and the like.
ホルダ２４はワーク２０を保持する孔３０をＨし、孔３
０はワーク２０が研削砥石１２．１３による研削力で矢
印Ｃのように自転し得る程度の嵌め合い精度に設定しで
ある。研削砥石１２．１３の近傍にはホルダ２４を案内
するガイド２５が設けられている。ホルダ２４には油圧
シリンダ２６のロッド３１が連結し、油圧シリンダ２６
の伸縮動作によってホルダ２４は摺動自在になっている
。ガイド２５には第３図に示すように、研削後のワーク
２０を矢印り方向へ押出す機構（図示せず）が設けであ
る。The holder 24 has a hole 30 that holds the workpiece 20, and the hole 3
0 is set to a fitting precision that allows the workpiece 20 to rotate in the direction of arrow C by the grinding force of the grinding wheels 12 and 13. A guide 25 for guiding the holder 24 is provided near the grinding wheels 12, 13. A rod 31 of a hydraulic cylinder 26 is connected to the holder 24.
The holder 24 is slidable by the expansion and contraction movement of the holder 24. As shown in FIG. 3, the guide 25 is provided with a mechanism (not shown) for pushing out the workpiece 20 after grinding in the direction of the arrow.
第２図で、３２は回転軸１０．１１を駆動するモータで
あり、モータ３２からの動力は２組の動力伝達用ベルト
３３（動力伝達機構）によって回転軸１ （１，１１を
同一回転ｈ°向へ駆動するように伝達されるようになっ
ている。In FIG. 2, 32 is a motor that drives the rotating shaft 10. It is designed to be transmitted so as to drive it in the ° direction.
次に作用を説明する。ワーク２０が研削砥石１２．１３
の研削面１４．１５間に挾み付けられることによって研
削砥石１２．１３にはＷの研削反力が発生する。この研
削反力で略等価の曲げ剛性を有する研削砥石１２．１３
は研削面１４゜１５°のように略す１シ行を維持した状
態で変位し、ワーク２０を研削する。したがって、ワー
ク２０の仕上り！１乙行度は研削代の多少や研削負荷の
大小に拘らず良好である。Next, the effect will be explained. Work 20 is grinding wheel 12.13
By being sandwiched between the grinding surfaces 14 and 15 of the grinding wheels 12 and 13, a grinding reaction force of W is generated on the grinding wheels 12 and 13. Grinding wheel 12.13 that has approximately equivalent bending rigidity with this grinding reaction force
The workpiece 20 is ground by displacing the grinding surface while maintaining an angle of 14° to 15°. Therefore, work 20 is finished! 1. The straightness is good regardless of the amount of grinding allowance or the size of the grinding load.
回転軸１０．１１は１個のモータ３２と２組の動力伝達
用ベルト３３によって同一回転方向に駆動されるので、
動力の伝達が容易で構造が簡単になり、両頭研削盤の外
形がコンパクトになる。Since the rotating shafts 10.11 are driven in the same rotational direction by one motor 32 and two sets of power transmission belts 33,
Power transmission is easy, the structure is simple, and the external shape of the double-headed grinder is compact.
ワーク２０はワークキャリヤ機構２２の中心線０１．０
２間の略中央部に配置しであるので、研削砥石１２．１
３からワーク２０に働く遠心力は第１図の矢印Ｅ、Ｆの
ように互いに相殺し合うような向きに働き、ワーク２０
には殆んど遠心力が掛らない。したがって、ワーク２０
を保持するワークキャリヤ機構２２に従来のようにバッ
クラッシュを防止する機構を備える必要がなくなり、ワ
ークキャリヤ機構２２の設計が容品になる。The workpiece 20 is located at the center line 01.0 of the workpiece carrier mechanism 22.
Since the grinding wheel 12.1 is located approximately in the center between the two
The centrifugal force acting on the workpiece 20 from 3 acts in directions that cancel each other out, as shown by arrows E and F in FIG.
Almost no centrifugal force is applied to Therefore, work 20
It is no longer necessary to provide the work carrier mechanism 22 that holds the workpiece with a mechanism for preventing backlash as in the past, and the design of the work carrier mechanism 22 can be simplified.
ワーク２０はホルダ２４の孔３０に自転可能に保持しで
あるので、ワーク２０の送りに伴ってワーク２（）は矢
印Ｃ）ｉ向に自転し、ワーク２０は自転によって研削方
向が順次に異なり、研削目が互いに交叉するような所謂
クロス１１研削が可能になり、研削精度が上がる。The workpiece 20 is held in the hole 30 of the holder 24 so that it can rotate, so as the workpiece 20 is fed, the workpiece 2 () rotates in the direction of arrow C) i, and the grinding direction of the workpiece 20 changes sequentially due to the rotation. , so-called cross 11 grinding in which the grinding lines intersect with each other becomes possible, improving grinding accuracy.
ドレスアーム１６は重なり合い部分２１の外側部分で研
削面１４．１５をドレスするので、ドレス作業の為に研
削作業を中断することなく、ワーク２０の研削を重なり
合い部分２１て行いながら、同時にドレス作業が可能で
ある。Since the dressing arm 16 dresses the grinding surface 14.15 with the outer part of the overlapping part 21, the workpiece 20 can be ground at the overlapping part 21 and the dressing work can be done at the same time without interrupting the grinding work for the dressing work. It is possible.
（発明の効果）
以上説明したように本発明による両頭平面研削装置では
、２本の回転軸１０，１１をＩＬ行に且つ回転軸と直角
方向に、すを削砥石１２．１３の一部が重なり合うよう
な間隔を隔てて配置し、２枚の研削砥石１２．１３に研
削反力で略同等の変位か発生するように研削砥石１２．
１３の剛性を略等価に設定したので、研削砥石１２．１
３はワーク２０の研削反力で第１図の研削面１４° １
５゛のように略平行を維持したままで変位し、ワーク２
０の仕上り平行度を向上させることができる。(Effects of the Invention) As explained above, in the double-head surface grinding device according to the present invention, the two rotating shafts 10 and 11 are aligned in the IL row and in a direction perpendicular to the rotating shafts, and a part of the grinding wheels 12 and 13 is The grinding wheels 12. and 13 are arranged at intervals such that they overlap each other, and the two grinding wheels 12.
The rigidity of grinding wheel 12.1 was set to be approximately equal to that of grinding wheel 12.1.
3 is the grinding reaction force of the workpiece 20, which is the grinding surface 14° in Fig. 1.
Workpiece 2 is displaced while maintaining almost parallel as shown in 5゛.
The finished parallelism of 0 can be improved.
回転する砥石による偶力からワークに自転力が付与され
てより一層加工精度がよくなる。Rotation force is applied to the workpiece from the couple of rotating grindstones, further improving machining accuracy.
ワークキャリヤ機構２２のワーク送り経路を、前記両回
転軸１０、〕１の間隔りの略中央部で且つ平面視の両回
転軸中心Ｏ１，０２を繋いだ仮想中心線２３を横切るよ
うに設定したので、研削砥石１２．１３からワーク２０
に働く遠心力は第１図の矢印ＥＳＦのように互いに相殺
し合うような向きに働き、ワーク２０に働く遠心力を大
巾に低減できる。したがって、ワーク２０を保持する前
記ワークキャリヤ機構２２に従来のようにバックラッシ
ュを防■１−する機構を備える必要がなくなり、ワーク
キャリヤ機構２２の設計を容品化できる。The workpiece feed path of the workpiece carrier mechanism 22 was set to be approximately at the center of the distance between the two rotational axes 10, ]1 and to cross an imaginary center line 23 connecting the two rotational axes centers O1, 02 in plan view. Therefore, from grinding wheel 12.13 to workpiece 20
The centrifugal forces acting on the workpiece 20 act in directions that cancel each other out, as indicated by the arrow ESF in FIG. 1, and the centrifugal force acting on the workpiece 20 can be greatly reduced. Therefore, it is no longer necessary to provide the work carrier mechanism 22 that holds the work 20 with a mechanism for preventing backlash as in the past, and the design of the work carrier mechanism 22 can be made more compact.
１個のモータ３２と２組の動力伝達ベルト３３を設けた
ので、動力の伝達が容易で構造が簡単になり、縦型両頭
研削盤の外形寸法をコンパクトにてきる。Since one motor 32 and two sets of power transmission belts 33 are provided, power transmission is easy, the structure is simple, and the external dimensions of the vertical double-head grinder can be made compact.
砥石１ｉＪｆ削而が全面対向ではなく研削加工中でも、
空間露出部でドレス修正を施すことができ、連続移動が
＋＋Ｊ能となる。Even during the grinding process, the grinding wheel 1iJf is not facing the entire surface,
Dress can be modified in the exposed space, making continuous movement ++J ability.
第１図は本発明を採用した両頭ｔｌＦ削盤の要部側面図
、第２図は第１図の口矢視図、第３図は第２図の■矢現
図、第４図は従来例を示す構造略図である。１０．１１
・・・回転軸、］２．１３・・・研削砥石、１４．１５
・・・研削面、１６・・・ドレスアーム、２０・・・ワ
ーク、２１・・・重なり合い部分、２２・・・ワークキ
ャリヤ機構Fig. 1 is a side view of essential parts of a double-headed tlf milling machine employing the present invention, Fig. 2 is a view taken from the front arrow in Fig. 1, Fig. 3 is a current view shown by the ■ arrow in Fig. 2, and Fig. 4 is a conventional view. 1 is a structural diagram illustrating an example. 10.11
...rotating shaft,]2.13...grinding wheel, 14.15
...Grinding surface, 16...Dress arm, 20...Work, 21...Overlapping portion, 22...Work carrier mechanism
Claims (1)
砥石を設けた両頭平面研削装置において、２本の回転軸
を平行に且つ回転軸と直角方向にずらして、前記研削砥
石の一部が重なり合うような間隔を隔てて配置し、対向
する研削砥石の研削面に研削反力で略同等に相対的平行
を保った変位が発生するように軸系のモーメント剛性を
略等価に設定し、両研削砥石の重なり合い部分にワーク
を送るワークキャリヤ機構を設け、ワークキャリヤ機構
のワーク送り経路を、前記両回転軸の間隔の略中央部で
且つ平面視の両回転軸中心を繋いだ仮想中心線とを横切
るように設定し、両回転軸を同一回転方向に駆動する１
個のモータと２組の動力伝達機構を設けたことを特徴と
する両頭平面研削装置。In a double-head surface grinding device that has two rotating shafts and grinding wheels that face each other at the ends of the rotating shafts, one of the grinding wheels is The moment rigidities of the shaft systems are set to be approximately equal so that the grinding surfaces of the opposing grinding wheels will undergo approximately equal and relatively parallel displacements due to the grinding reaction force. A workpiece carrier mechanism is provided at the overlapping portion of both grinding wheels, and the workpiece feed path of the workpiece carrier mechanism is set at a virtual center approximately at the center of the interval between the two rotational axes and connecting the centers of the two rotational axes in a plan view. Set to cross the line and drive both rotating shafts in the same rotation direction 1
A double-head surface grinding device characterized by having two motors and two sets of power transmission mechanisms.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25976688A JPH02106259A (en) | 1988-10-14 | 1988-10-14 | Duplex head surface grinding device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25976688A JPH02106259A (en) | 1988-10-14 | 1988-10-14 | Duplex head surface grinding device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02106259A true JPH02106259A (en) | 1990-04-18 |
Family
ID=17338667
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP25976688A Pending JPH02106259A (en) | 1988-10-14 | 1988-10-14 | Duplex head surface grinding device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02106259A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010283371A (en) * | 2001-08-30 | 2010-12-16 | Siltronic Ag | Method for producing semiconductor wafer, and semiconductor wafer |
| JP2017518197A (en) * | 2014-06-18 | 2017-07-06 | 藍思科技股▲ふん▼有限公司 | Copper disk for sapphire polishing and repair method for two copper disks |
| JP2019181608A (en) * | 2018-04-06 | 2019-10-24 | トヨタ自動車株式会社 | Grinding method |
-
1988
- 1988-10-14 JP JP25976688A patent/JPH02106259A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010283371A (en) * | 2001-08-30 | 2010-12-16 | Siltronic Ag | Method for producing semiconductor wafer, and semiconductor wafer |
| JP2017518197A (en) * | 2014-06-18 | 2017-07-06 | 藍思科技股▲ふん▼有限公司 | Copper disk for sapphire polishing and repair method for two copper disks |
| JP2019181608A (en) * | 2018-04-06 | 2019-10-24 | トヨタ自動車株式会社 | Grinding method |
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