JPH02102766U - - Google Patents
Info
- Publication number
- JPH02102766U JPH02102766U JP1091589U JP1091589U JPH02102766U JP H02102766 U JPH02102766 U JP H02102766U JP 1091589 U JP1091589 U JP 1091589U JP 1091589 U JP1091589 U JP 1091589U JP H02102766 U JPH02102766 U JP H02102766U
- Authority
- JP
- Japan
- Prior art keywords
- conductor pattern
- insulating base
- covering
- height
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 6
- 229920002120 photoresistant polymer Polymers 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 description 4
- 239000006071 cream Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図は、本考案に係る回路基板の一実施例の
断面及びスキージとクリーム半田の位置状態を示
す構成図、第２図は、第１図に示される例で導体
パターンにクリーム半田が装填された状態を示す
プリント配線基板の断面図、第３図は、従来技術
に係る回路基板及びマスクスクリーンの断面とス
キージ、クリーム半田の位置状態を示す構成図、
第４図は、第３図に示される例で、導体パターン
にクリーム半田が装填された状態を示す断面図で
ある。
１１……プリント配線基板、１２……スキージ
、１３……クリーム半田、１４……基板、１５ａ
，１５ｂ，１５ｍ……導体パターン、１６……ソ
ルダレジスト層、１８ａ，１８ｂ……刻装部。
FIG. 1 is a cross-sectional view of an embodiment of a circuit board according to the present invention, and a configuration diagram showing the position of the squeegee and cream solder. FIG. 2 is a diagram showing the example shown in FIG. FIG. 3 is a cross-sectional view of the printed wiring board showing the state in which the printed wiring board has been removed, and FIG.
FIG. 4 is a cross-sectional view showing the example shown in FIG. 3 in which the conductor pattern is filled with cream solder. 11... Printed wiring board, 12... Squeegee, 13... Cream solder, 14... Board, 15a
, 15b, 15m...conductor pattern, 16...solder resist layer, 18a, 18b...engraved portion.
Claims (1)
その高さをｌとする結線用の導体パターンと、当
該導体パターンの所定部分及び近傍を除き導体パ
ターンを被装して、前記絶縁基体の表層部に形成
されその高さをｍとするフオトレジスト層とにお
いてｌ＜ｍに形成されることを特徴とする回路基
板。 an insulating base, a conductor pattern for connection formed on the surface of the insulating base and having a height of l, and covering the conductor pattern except for a predetermined portion and the vicinity of the conductor pattern, and covering the surface of the insulating base with the conductor pattern. 1. A circuit board characterized in that the photoresist layer is formed on the top surface and has a height of m such that l<m.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1091589U JPH02102766U (en) | 1989-01-31 | 1989-01-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1091589U JPH02102766U (en) | 1989-01-31 | 1989-01-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02102766U true JPH02102766U (en) | 1990-08-15 |
Family
ID=31219001
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1091589U Pending JPH02102766U (en) | 1989-01-31 | 1989-01-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02102766U (en) |
-
1989
- 1989-01-31 JP JP1091589U patent/JPH02102766U/ja active Pending