JPH02102150A - Production of glass plate excellent in thermal dimensional-stability and flatness - Google Patents
Production of glass plate excellent in thermal dimensional-stability and flatnessInfo
- Publication number
- JPH02102150A JPH02102150A JP63253281A JP25328188A JPH02102150A JP H02102150 A JPH02102150 A JP H02102150A JP 63253281 A JP63253281 A JP 63253281A JP 25328188 A JP25328188 A JP 25328188A JP H02102150 A JPH02102150 A JP H02102150A
- Authority
- JP
- Japan
- Prior art keywords
- glass plate
- glass
- flatness
- heat
- resistant
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011521 glass Substances 0.000 title claims abstract description 83
- 238000004519 manufacturing process Methods 0.000 title claims description 11
- 238000000034 method Methods 0.000 claims abstract description 13
- 239000000835 fiber Substances 0.000 claims abstract description 12
- 239000004745 nonwoven fabric Substances 0.000 claims abstract description 12
- 239000002759 woven fabric Substances 0.000 claims abstract description 12
- 239000000919 ceramic Substances 0.000 claims abstract description 11
- 238000010438 heat treatment Methods 0.000 claims abstract description 11
- 239000012784 inorganic fiber Substances 0.000 claims abstract description 11
- 239000003779 heat-resistant material Substances 0.000 claims abstract description 4
- 239000003365 glass fiber Substances 0.000 claims abstract description 3
- 239000000758 substrate Substances 0.000 claims description 14
- 238000001816 cooling Methods 0.000 abstract description 3
- 239000000463 material Substances 0.000 abstract description 3
- 238000011282 treatment Methods 0.000 abstract description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 abstract 2
- 229910052593 corundum Inorganic materials 0.000 abstract 2
- 229910001845 yogo sapphire Inorganic materials 0.000 abstract 2
- 229910052581 Si3N4 Inorganic materials 0.000 abstract 1
- 239000004744 fabric Substances 0.000 abstract 1
- 238000010583 slow cooling Methods 0.000 abstract 1
- 239000010409 thin film Substances 0.000 description 7
- 239000010408 film Substances 0.000 description 4
- 239000004973 liquid crystal related substance Substances 0.000 description 4
- 239000002241 glass-ceramic Substances 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 229910005091 Si3N Inorganic materials 0.000 description 1
- 239000005388 borosilicate glass Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
- Joining Of Glass To Other Materials (AREA)
- Woven Fabrics (AREA)
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野］
本発明は、熱的寸法安定性及び平坦性に優れ、且つガラ
ス表面の傷が非常に少ないガラス板の製造方法に関し、
特に電子機器用途の基板に適したガラス板の製造方法に
関するものである。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a method for manufacturing a glass plate that has excellent thermal dimensional stability and flatness, and has very few scratches on the glass surface.
In particular, the present invention relates to a method of manufacturing a glass plate suitable for use as a substrate for electronic equipment.
［従来技術］
近年、電子機器産業の発達に伴い各種の電子機器、とり
わけ液晶やエレクトロルミネセンス、プラズマデイスプ
レィといった表示装置あるいはイメージセンサ等の基板
ガラスとして肉厚０．０３〜１゜５Ｈの薄板ガラスが多
量に用いられるようになつてきている。[Prior art] In recent years, with the development of the electronic equipment industry, thin sheets with a wall thickness of 0.03 to 1°5H have been used as substrate glass for various electronic equipment, especially display devices such as liquid crystal, electroluminescent, and plasma displays, and image sensors. Glass is being used in large quantities.
上記用途に用いられる基板ガラスは、その上に薄膜電気
回路を形成するので、成膜熱処理、バターニング等の処
理を受ける。これらの処理は基板ガラスを高温度下に曝
す場合があり、そのため基板ガラスには熱的寸法安定性
の良いことが要求される。例えばＴ Ｎ （Ｔｗｉｓｔ
ｅｄ Ｎｅｍａｔｉｃ）及び５ＴＮ（Ｓｕｐｅｒ Ｔｗ
ｉｓｔｅｄ Ｎｅｍａｔｉｃ）モードの液晶デイスプレ
ィにおける透明導電膜回路、ａ−５ｉＴ Ｆ Ｔ （Ａ
ｍｏｒｐｂｏｕｓ−Ｓｉ Ｔｈ１ｎ Ｆｉｌｍ Ｔｒａ
ｎｓｉｓｔｏｒ） 、ｐ−５ｉＴＦＴ（Ｐｏｌｙ−Ｓｉ
Ｔｈ１ｎ Ｆｉｌｍ Ｔｒａｎｓｉｓｔｏｒ）やその
他の各種金属膜、絶縁膜等の組み合わせによって形成さ
れた液晶デイスプレィの薄膜電気回路、イメージセンサ
の薄膜電気回路、エレクトロルミネセンスの薄膜電気回
路等の製造工程において、基板ガラスが高温度の熱処理
を受けるとガラスの寸法が変化して所定寸法を維持でき
なくなったり、更には回路パターンが所定の設計よりず
れたりする。この回路パターンのずれは、電気的な性能
を維持できなくなる致命的な不良原因になり、用途によ
っては１００ｎ＋＋ｓ当たり１μｍ以下の寸法変化も許
されないことがある。The substrate glass used for the above purpose is subjected to treatments such as film-forming heat treatment and buttering because a thin film electric circuit is formed thereon. These treatments may expose the substrate glass to high temperatures, and therefore the substrate glass is required to have good thermal dimensional stability. For example, T N (Twist
ed Nematic) and 5TN (Super Tw
Transparent conductive film circuit in a liquid crystal display in a-5iT FT (A
morpbous-Si Th1n Film Tra
nsistor), p-5iTFT (Poly-Si
In the manufacturing process of thin film electrical circuits for liquid crystal displays, thin film electrical circuits for image sensors, thin film electrical circuits for electroluminescence, etc., which are formed by combining thin film transistors and other various metal films and insulating films, the substrate glass is When subjected to high-temperature heat treatment, the dimensions of the glass change, making it impossible to maintain predetermined dimensions, or even causing the circuit pattern to deviate from the predetermined design. This deviation of the circuit pattern causes a fatal failure that makes it impossible to maintain electrical performance, and depending on the application, a dimensional change of 1 μm or less per 100 n++s may not be allowed.
一方このような用途の基板ガラスは反りやうねりといっ
たガラス表面の平坦性が良いことも要求される。すなわ
ち基板ガラスの平坦性が悪いと露光距離が設計どおりに
ならなくなったり、液晶の２枚のガラス板間のギャップ
にむらが生じて表示性能を損なうという本質的な問題か
ら、自動化された製造工程での機械的操作に適合しない
という付随的な問題までさまざまな問題を引きおこし、
用途によっては基板ガラス全面に亙って数μｍ〜数十μ
ｍの平坦性が要求される。On the other hand, substrate glass for such uses is also required to have a good glass surface flatness to avoid warping or waviness. In other words, if the flatness of the substrate glass is poor, the exposure distance will not be as designed, and the gap between the two glass plates of the liquid crystal will become uneven, impairing display performance. causing a variety of problems, including the attendant problem of not being compatible with mechanical operation in
Depending on the application, the thickness may vary from several μm to several tens of μm over the entire surface of the substrate glass.
Flatness of m is required.
しかしながら公知の工学的な成形法で製造されたガラス
板では良好な熱的寸法安定性及び平坦性は得られず、そ
のため成形後ガラスの歪点付近から軟化点付近の温度ま
で昇温し、一定時間保持した後、徐冷するといった熱処
理を施す方法が一般に行われている７この熱処理によっ
てガラス板の寸法変化があらかじめ飽和値近くまで進行
し、ガラス板の熱的寸法安定性が改善されると共にガラ
スの表面が軟化変形することによって平坦性が改善され
る。However, glass plates manufactured using known engineering forming methods cannot achieve good thermal dimensional stability and flatness, and therefore, after forming, the temperature of the glass is raised from around the strain point to around the softening point, and the temperature remains constant. A commonly used method is to heat-treat the glass plate by holding it for a certain period of time and then slowly cooling it.7 This heat treatment allows the dimensional change of the glass plate to advance to near the saturation value in advance, improving the thermal dimensional stability of the glass plate. Flatness is improved by softening and deforming the glass surface.
この熱処理工程は具体的には耐熱材料からなる平坦性に
優れた不基盤の上に熱的寸法安定性又は平坦性の悪いガ
ラス板を単数枚あるいは複数枚積層して載値し、場合に
よってはガラス板の上に荷重体を載置することによって
上方から下方に向かって圧力が加わるようにした後、バ
ッチ式の炉あるいはトンネル炉に投入して所定の条件で
熱処理するのが一般的である。Specifically, this heat treatment process involves laminating one or more glass plates with poor thermal dimensional stability or flatness on a substrate made of heat-resistant material with excellent flatness. Generally, a load is placed on the glass plate to apply pressure from above to below, and then the glass plate is placed in a batch furnace or tunnel furnace and heat treated under predetermined conditions. .
［発明が解決しようとする問題点］
しかしながら先記したガラス板の製造方法の場合、不基
盤の上にガラス板を単数枚あるいは複数枚積層して載置
する際やガラス板に荷重体を載置する際、及び熱処理後
にガラス板を解除する際にガラス板同士あるいはガラス
板と不基盤又は荷重体とが互いにこすれあってガラス板
の表面に多数の傷が付きやすいという問題が生じる。[Problems to be Solved by the Invention] However, in the case of the above-mentioned glass plate manufacturing method, it is difficult to place a single glass plate or a plurality of glass plates stacked on a base or to place a load on the glass plate. When the glass plates are placed, and when the glass plates are released after heat treatment, the glass plates rub against each other, or the glass plates and the base plate or the load object rub against each other, resulting in a problem in that the surface of the glass plates is likely to have many scratches.
電子機器用の基板ガラスの場合、表面の傷は単に外観的
に透明性が損なわれるといった問題のみならず、薄膜電
気回路が傷のなめに設計どおりに形成されず所望の電気
特性が得られなかったり、断線したりするといった致命
的な不良を引きおこし、特に微細な薄膜電気回路の場合
、わずが数μｍの長さの傷ですら問題となる。In the case of substrate glass for electronic devices, scratches on the surface not only cause problems such as a loss of transparency in appearance, but also cause thin film electrical circuits to be formed as designed due to the scratches, making it impossible to obtain the desired electrical characteristics. In particular, in the case of minute thin-film electrical circuits, even a flaw just a few μm in length can cause fatal defects such as breakage or disconnection.
またこのような傷はガラス表面を研磨することによって
除去することができるが、研磨コストがガラス板の価格
を上昇させるため、現状ではガラス板を成形した後のい
わゆる火づくり面そのままで利用する低価格の未研磨ガ
ラス板を利用しようとする動きの方が活発である。In addition, such scratches can be removed by polishing the glass surface, but since the polishing cost increases the price of the glass plate, currently there is a low-cost method that uses the so-called fire making surface as it is after forming the glass plate. There is a growing movement toward using unpolished glass sheets at low prices.
本発明の目的は、ガラス板表面の傷を防止することがで
きる熱的寸法安定性及び平坦性に優れたガラス板の製造
方法を提供することを目的とするものである。An object of the present invention is to provide a method for manufacturing a glass plate with excellent thermal dimensional stability and flatness that can prevent scratches on the surface of the glass plate.
［問題点を解決するための手段］
本発明の熱的寸法安定性及び平坦性に優れたガラス板の
製造方法は耐熱性材料からなり不基盤の上に熱的寸法安
定性又は平坦性の悪いガラス板を単数枚あるいは複数枚
積層するように載置して、ガラス板の歪点付近から軟化
点付近の温度まで昇温し、一定時間保持した後、徐冷す
る方法において、下基盤とガラス板あるいはガラス板同
士の間に耐熱性無機繊維織布あるいは不織布を挟むこと
を特徴とする。[Means for Solving the Problems] The method of manufacturing a glass plate having excellent thermal dimensional stability and flatness according to the present invention is to produce a glass plate made of a heat-resistant material and having poor thermal dimensional stability or flatness on an unsubstrate. A method in which a single glass plate or a plurality of glass plates are placed in a stack, the temperature is raised from around the strain point of the glass plate to around the softening point, the temperature is maintained for a certain period of time, and then the glass plate is slowly cooled. It is characterized by sandwiching a heat-resistant inorganic fiber woven fabric or non-woven fabric between the plates or glass plates.
また本発明においては、ガラス板の上に荷重体を載置す
る場合、ガラス板と荷重体との間に耐熱性無機繊維織布
あるいは不織布を挟むことを特徴とする。荷重体を置く
ことによって特にガラス板の平坦性を良好にする効果が
大になる。Further, the present invention is characterized in that when a load body is placed on a glass plate, a heat-resistant inorganic fiber woven fabric or non-woven fabric is sandwiched between the glass plate and the load body. Placing a load body is particularly effective in improving the flatness of the glass plate.
本発明において用いる耐熱性無機繊維織布及び不織布は
熱処理温度に耐えると共にそれ自体がガラス表面に傷を
付けない素材であることが要求され、具体的にはＥガラ
スファイバー、５ｉ０２−Ａｌ□０３ｌ上０３ックファ
イバー、＾Ｉ２Ｏ３系セラミックファイバー、Ｓｉ３Ｎ
４系セラミックファイバー、ＳｉＣ系セラミックファイ
バーが適している。また耐熱性無機繊維織布及び不織布
の厚みは比較的薄く、均一であることが望ましく、機械
的強度及び作業性の点を勘案ずれば厚みは０．１〜０．
５ｍｍ位が適当である。すなわち厚みが０．５ｍａｒよ
り大きい場合は、ガラス板を複数枚積層した場合に荷重
の不均一印加の原因となり、また０、１■より小さい場
合は織布又は不織布を製作する際の作業性が悪くなる。The heat-resistant inorganic fiber woven fabric and non-woven fabric used in the present invention are required to be materials that can withstand heat treatment temperatures and do not damage the glass surface. Specifically, E glass fiber, 5i02-Al□03l 03k fiber, ^I2O3 ceramic fiber, Si3N
4 series ceramic fiber and SiC series ceramic fiber are suitable. Furthermore, it is desirable that the thickness of the heat-resistant inorganic fiber woven fabric and non-woven fabric be relatively thin and uniform, and from the viewpoint of mechanical strength and workability, the thickness should be 0.1-0.
Approximately 5 mm is appropriate. In other words, if the thickness is larger than 0.5mar, it will cause uneven load application when multiple glass plates are laminated, and if it is smaller than 0.1mm, the workability when producing woven or non-woven fabrics will be affected. Deteriorate.
本発明における加熱保持温度は、ガラスの歪点即ちガラ
スの粘度が１０ ｐｏｉｓｅの温度付近から軟化点即
ちガラスの粘度が１０ ｐｏｉｓｅの温度付近までの
範囲である。通常基板用の硼珪酸ガラスの場合、歪点は
約５００〜５５０℃であり、軟化点は約７５０〜８００
℃である。The heating and holding temperature in the present invention ranges from around the strain point of the glass, that is, the temperature at which the viscosity of the glass is 10 Poise, to around the softening point, that is, the temperature at which the viscosity of the glass is 10 Poise. In the case of borosilicate glass for normal substrates, the strain point is about 500-550°C, and the softening point is about 750-800°C.
It is ℃.
［実施例］ 以下本発明を実施例に基づいて説明する。[Example] The present invention will be explained below based on examples.
重量百分率で５ｉ０２ ７１．２％、Ａｌ２Ｏ３５，８
％、Ｂ２Ｏ３１２ｊ％、Ｂａ０２．２％、Ｃａ０ １．
１％、Ｎａ２Ｏ６，３％、に２ｏ １．１％からなり
、歪点が５３０℃、軟化点７７０℃でリドロー法によっ
て成形され表面には問題になるような傷がなく熱的寸法
安定性及び平坦性が悪く、大きさが２００ Ｘ ３００
Ｘ Ｏ，７ｍｍのガラス板をガラスセラミック板から
なる下基盤の上に表１の各耐熱性無機繊維織布あるいは
不織布を挟むようにして１枚載置した試料を作製すると
共に、更に下基盤とガラス板の間及びガラス板同士の間
に表の各織布あるいは不織布を挟むように２０枚積層す
るように載置した試料を作製し、各試料のガラス板上に
重さ１ｋｇのガラスセラミ・ツク板からなる荷重体を載
せた試料を合計１４個作製した。5i02 71.2% by weight percentage, Al2O35,8
%, B2O312j%, Ba02.2%, Ca0 1.
1%, Na2O6, 3%, and 2O 1.1%.The strain point is 530℃ and the softening point is 770℃. Poor flatness, size 200 x 300
A sample was prepared in which a glass plate of 7 mm in diameter was placed on a lower base made of a glass ceramic plate with each of the heat-resistant inorganic fiber woven or non-woven fabrics shown in Table 1 sandwiched therebetween, and further between the lower base and the glass plate. A sample was prepared in which 20 sheets of woven fabric or non-woven fabric were stacked between the glass plates, and a glass-ceramic plate weighing 1 kg was placed on top of each glass plate. A total of 14 samples each carrying a load body were prepared.
表
上記のように作製した各試料を電気炉内で室温から５５
０℃まで３時間で昇温してから５５０℃で１時間保持し
、次いで３００℃まで約り０℃／′時の速度で冷却した
後室温まで放冷した。放冷後、各試料を電気炉から取り
出し、ガラス板を解除して洗浄乾燥した。Each sample prepared as shown above was heated in an electric furnace from room temperature to 55°C.
The temperature was raised to 0°C over 3 hours, held at 550°C for 1 hour, then cooled to 300°C at a rate of about 0°C/'hour, and then allowed to cool to room temperature. After cooling, each sample was taken out of the electric furnace, the glass plate was released, and the sample was washed and dried.
こうしてできた各ガラス板に３００００ルクスのハロゲ
ン光を当てて観察したところ、全てのガラス板の表面の
傷は成形後の水準と同等であることが確認された。また
ガラス板全面の平坦性を調べたところ、反りやうねりが
５０μｍ以内の良好な平面を有しており、さらに３５０
℃、３時間の熱処理に対して１０ｈｍ当たり１μｍ以内
の良好な熱的寸法安定性を有していることが確認された
。When each of the glass plates thus produced was observed under halogen light of 30,000 lux, it was confirmed that the scratches on the surfaces of all the glass plates were the same as after molding. In addition, when we examined the flatness of the entire surface of the glass plate, we found that it had a good flat surface with no warping or waviness within 50 μm, and
It was confirmed that it had good thermal dimensional stability of within 1 μm per 10 hm after heat treatment at ℃ for 3 hours.
［発明の効果］
以上のように本発明の方法によって製造されたガラス板
は、ガラス表面の傷の発生を防止すると同時に熱的寸法
安定性及び平坦性に優れているため各種の電子機器に用
いる基板ガラスとして好適であり、製造コストも安価で
ある。[Effects of the Invention] As described above, the glass plate manufactured by the method of the present invention prevents the occurrence of scratches on the glass surface and has excellent thermal dimensional stability and flatness, so it can be used in various electronic devices. It is suitable as a substrate glass and its manufacturing cost is low.
特許出願人 日本電気硝子株式会社 代表者 岸 １）清 作Patent applicant: Nippon Electric Glass Co., Ltd. Representative Kishi 1) Kiyoshi Saku
Claims (3)
熱的寸法安定性又は平坦性の悪いガラス板を単数枚ある
いは複数枚積層するように載置して、ガラス板の歪点付
近から軟化点付近の温度まで昇温し、一定時間保持した
後、徐冷する方法において、下基盤とガラス板あるいは
ガラス板同志の間に耐熱性無機繊維織布あるいは不織布
を挟むことを特徴とする熱的寸法安定性及び平坦性に優
れたガラス板の製造方法。(1) Place one or more glass plates with poor thermal dimensional stability or flatness on a lower base made of a heat-resistant material and with excellent flatness, and then A method in which the temperature is raised from around the softening point to around the softening point, held for a certain period of time, and then slowly cooled, and is characterized by sandwiching a heat-resistant inorganic fiber woven or non-woven fabric between the lower substrate and the glass plate or between the glass plates. A method for manufacturing a glass plate with excellent thermal dimensional stability and flatness.
体との間に耐熱性無機繊維織布あるいは不織布を挟むこ
とを特徴とする特許請求の範囲第１項記載の熱的寸法安
定性及び平坦性に優れたガラス板の製造方法。(2) Thermal heating according to claim 1, characterized in that a load body is placed on a glass plate, and a heat-resistant inorganic fiber woven fabric or non-woven fabric is sandwiched between the glass plate and the load body. A method for manufacturing a glass plate with excellent dimensional stability and flatness.
イバー、ＳｉＯ＿２−Ａｌ＿２Ｏ＿３系セラミックファ
イバー、Ａｌ＿２Ｏ＿３系セラミックファイバー、Ｓｉ
＿３Ｎ＿４系セラミックファイバー、ＳｉＣ系セラミッ
クファイバーからなることを特徴とする特許請求の範囲
第１項記載の熱的寸法安定性及び平坦性に優れたガラス
板の製造方法。(3) Heat-resistant inorganic fiber woven or non-woven fabrics include E glass fiber, SiO_2-Al_2O_3 ceramic fiber, Al_2O_3 ceramic fiber, Si
A method for manufacturing a glass plate having excellent thermal dimensional stability and flatness according to claim 1, characterized in that the glass plate is made of _3N_4 ceramic fibers and SiC ceramic fibers.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63253281A JPH02102150A (en) | 1988-10-06 | 1988-10-06 | Production of glass plate excellent in thermal dimensional-stability and flatness |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63253281A JPH02102150A (en) | 1988-10-06 | 1988-10-06 | Production of glass plate excellent in thermal dimensional-stability and flatness |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02102150A true JPH02102150A (en) | 1990-04-13 |
Family
ID=17249101
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63253281A Pending JPH02102150A (en) | 1988-10-06 | 1988-10-06 | Production of glass plate excellent in thermal dimensional-stability and flatness |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02102150A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04202828A (en) * | 1990-11-29 | 1992-07-23 | Asahi Fiber Glass Co Ltd | Heat-resistant fabric-like material |
| US5492843A (en) * | 1993-07-31 | 1996-02-20 | Semiconductor Energy Laboratory Co., Ltd. | Method of fabricating semiconductor device and method of processing substrate |
| US5674304A (en) * | 1993-10-12 | 1997-10-07 | Semiconductor Energy Laboratory Co., Ltd. | Method of heat-treating a glass substrate |
-
1988
- 1988-10-06 JP JP63253281A patent/JPH02102150A/en active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04202828A (en) * | 1990-11-29 | 1992-07-23 | Asahi Fiber Glass Co Ltd | Heat-resistant fabric-like material |
| US5492843A (en) * | 1993-07-31 | 1996-02-20 | Semiconductor Energy Laboratory Co., Ltd. | Method of fabricating semiconductor device and method of processing substrate |
| US5837619A (en) * | 1993-07-31 | 1998-11-17 | Semiconductor Energy Laboratory Co., Ltd. | Method of fabricating semiconductor device and method of processing substrate |
| US5674304A (en) * | 1993-10-12 | 1997-10-07 | Semiconductor Energy Laboratory Co., Ltd. | Method of heat-treating a glass substrate |
| US5929487A (en) * | 1993-10-12 | 1999-07-27 | Semiconductor Energy Laboratory Co., Ltd. | Glass substrate assembly, semiconductor device and method of heat-treating glass substrate |
| US6268631B1 (en) | 1993-10-12 | 2001-07-31 | Semiconductor Energy Laboratoty Co., Ltd. | Glass substrate assembly, semiconductor device and method of heat-treating glass substrate |
| US6847097B2 (en) | 1993-10-12 | 2005-01-25 | Semiconductor Energy Laboratory Co., Ltd. | Glass substrate assembly, semiconductor device and method of heat-treating glass substrate |
| US7038302B2 (en) | 1993-10-12 | 2006-05-02 | Semiconductor Energy Laboratory Co., Ltd. | Glass substrate assembly, semiconductor device and method of heat-treating glass substrate |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI240840B (en) | A glass product for use in ultra-thin glass display applications | |
| JP3586142B2 (en) | Glass plate manufacturing method, glass plate manufacturing apparatus, and liquid crystal device | |
| US3507737A (en) | Art of sealing thermally crystallizable glass,and thermally crystallizable telescope mirror blank | |
| JP2019514827A (en) | High strength ultra thin glass and method for producing the same | |
| JP2003514758A (en) | Glass substrate processing method and glass substrate for display screen production | |
| CN112876063B (en) | Glass crystallization method, glass plate and isolating powder mixed solution | |
| JP7452582B2 (en) | alkali-free glass | |
| CN110709361A (en) | Tempered glass | |
| JP2006008488A (en) | Setter for heat treatment, method of manufacturing the same and method of heat-treating glass substrate | |
| JP3118789B2 (en) | Slow cooling method for glass plate | |
| CN112424132A (en) | Setter plate and method of ceramifying glass article using the same | |
| JPH02102150A (en) | Production of glass plate excellent in thermal dimensional-stability and flatness | |
| JP3152256B2 (en) | Slow cooling method for glass plate | |
| JPS58115043A (en) | Ion exchange of plate glass | |
| US5147436A (en) | Method for forming flat glass-ceramic articles | |
| RU2444478C1 (en) | Method of bending sheet glass | |
| JP2008254962A (en) | Flattening treatment method for setter | |
| CN112437760A (en) | Glass substrates comprising uniform release agent coating and methods of ceramming thereof | |
| TW202013747A (en) | Substrate for displays and method for producing same | |
| JP2006008486A (en) | Setter for heat treatment, method of manufacturing the same and method of heat-treating glass substrate | |
| JP3698171B2 (en) | Heat treatment method for glass plate for display device | |
| JP2000344544A (en) | Crystallized glass article | |
| CN111499217A (en) | Preparation method of ITO conductive glass | |
| JP3118788B2 (en) | Glass article annealing furnace | |
| JP2014231438A (en) | Strengthened glass and production method thereof |