JPH02102040A - Manufacture of multilayer printed circuit board - Google Patents
Manufacture of multilayer printed circuit boardInfo
- Publication number
- JPH02102040A JPH02102040A JP25536988A JP25536988A JPH02102040A JP H02102040 A JPH02102040 A JP H02102040A JP 25536988 A JP25536988 A JP 25536988A JP 25536988 A JP25536988 A JP 25536988A JP H02102040 A JPH02102040 A JP H02102040A
- Authority
- JP
- Japan
- Prior art keywords
- multilayer printed
- copper foil
- printed wiring
- circuit board
- linear expansion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 41
- 239000011889 copper foil Substances 0.000 claims abstract description 24
- 239000000463 material Substances 0.000 claims abstract description 16
- 239000004020 conductor Substances 0.000 claims abstract description 5
- 238000001035 drying Methods 0.000 claims abstract description 4
- 238000000034 method Methods 0.000 claims description 15
- 238000010438 heat treatment Methods 0.000 claims description 12
- 238000000465 moulding Methods 0.000 claims description 11
- 229920005989 resin Polymers 0.000 claims description 8
- 239000011347 resin Substances 0.000 claims description 8
- 229910052802 copper Inorganic materials 0.000 abstract description 17
- 239000010949 copper Substances 0.000 abstract description 17
- 230000037303 wrinkles Effects 0.000 abstract description 16
- 229910001220 stainless steel Inorganic materials 0.000 abstract description 5
- 239000010935 stainless steel Substances 0.000 abstract description 5
- 239000003795 chemical substances by application Substances 0.000 abstract description 2
- 239000003822 epoxy resin Substances 0.000 abstract description 2
- 239000011521 glass Substances 0.000 abstract description 2
- 229920000647 polyepoxide Polymers 0.000 abstract description 2
- 206010040954 Skin wrinkling Diseases 0.000 description 14
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 238000010030 laminating Methods 0.000 description 3
- 229910000737 Duralumin Inorganic materials 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- 229910000906 Bronze Inorganic materials 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000010425 asbestos Substances 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 210000004709 eyebrow Anatomy 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 239000012784 inorganic fiber Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 239000012209 synthetic fiber Substances 0.000 description 1
- 229920002994 synthetic fiber Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000002759 woven fabric Substances 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、産業機器や電子機器用等に用いられる多層プ
リント配線板の製造方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method of manufacturing a multilayer printed wiring board used for industrial equipment, electronic equipment, etc.
従来より通信機などの電子機器には部品の塔載と、それ
らの部品間の高密度な配線を効率よく行うために多層プ
リント配線板が用いられている。Multilayer printed wiring boards have traditionally been used in electronic devices such as communication devices to efficiently mount components and provide high-density wiring between those components.
この多層プリント配線板は、外層銅箔と予め導体のパタ
ーンを形成した１枚あるいは複数枚の内層回路基板との
各層の間に積層用樹脂を積層用基材に含浸、乾燥したプ
リプレグを所要枚数挟んで積み重ね、金型プレートに挟
んだ積層体を１組の熱盤内に複数枚挟んで加熱、加圧し
て１体化して製造されている。This multilayer printed wiring board uses the required number of prepregs, which are made by impregnating a laminating resin into a laminating base material and drying them, between each layer of an outer copper foil layer and one or more inner layer circuit boards on which a conductor pattern has been formed in advance. It is manufactured by sandwiching and stacking a plurality of laminates sandwiched between mold plates and sandwiching them in a set of heating plates, heating and pressurizing them to form a single body.
内層回路基板を直接プリプレグで挟み成形する方法では
加熱加圧時に内層回Ｎ基板の凹凸による圧力むらが生じ
易く、特に高多層板のように内層回路基板を複数枚挿入
する場合には、この圧力むらは非常に大きくなる。用い
られる金型プレートは、内層回路基板の凹凸による変形
を考慮する必要があるため、弾性率や強度、硬さが高い
材質の金属板が用いられている。このような方法で成形
された多層プリント配線板の表面には、熱盤内のいたる
ところで銅しわが発生し易く、表面平滑な多層プリント
配線板を得ることが非常に困難になっている。そのため
内層回路基板を複数枚使用する場合には外層に予め銅箔
とプリプレグを熱圧成形して作製した片面板を用いる積
層方法が行われているが、工程が複雑になる。In the method of directly sandwiching and molding the inner layer circuit board between prepregs, pressure unevenness is likely to occur due to unevenness of the inner layer circuit board when heating and pressurizing.Especially when inserting multiple inner layer circuit boards such as a high multilayer board, this pressure The unevenness becomes very large. The mold plate used is a metal plate made of a material with high elastic modulus, strength, and hardness because it is necessary to take into account deformation due to unevenness of the inner layer circuit board. On the surface of a multilayer printed wiring board formed by such a method, copper wrinkles are likely to occur everywhere within the heating plate, making it extremely difficult to obtain a multilayer printed wiring board with a smooth surface. For this reason, when a plurality of inner layer circuit boards are used, a lamination method is used in which a single-sided board prepared by hot-pressing copper foil and prepreg is used as the outer layer in advance, but the process becomes complicated.
この問題を解決するものとしては、特公昭６１−３４３
９４号公報に示されているように、熱器に接触する金型
プレートのみに線膨張係数が銅箔（１６，５Ｘ １０−
６）以上の銅や青銅や真ちゅうやアルミニウムやジュラ
ルミンを用いる銅張積層板の製造方法がある。As a solution to this problem,
As shown in Publication No. 94, copper foil (16.5X 10-
6) There is a method for manufacturing a copper-clad laminate using copper, bronze, brass, aluminum, or duralumin as described above.
しかしながら上記公報に示される方法では、銅箔厚さが
１８μといった薄い銅箔を用いる場合には、低圧成形や
大サイズで多数面取り成形した場合に、銅しわの発生は
熱盤側板の最も熱器に近い面に発生するとは限らす熱器
から遠い内部の板にも発生し根本的な解決策とはならな
い。そのうえ、熱器に接触する金型プレートのみに線膨
張係数の大きなものを使用すると表裏のプレートの熱膨
張差に起因して、そりや寸法変化が大きくなること、銅
や青銅や真ちゅうやアルミニウムやジュラルミンは、や
わらかいためキズがつきやすかったり変形しやすいため
金型プレートとしては不適当といった問題もある。However, in the method disclosed in the above publication, when using a thin copper foil with a copper foil thickness of 18 μm, the occurrence of copper wrinkles is limited to the most heated part of the side plate of the heating plate when forming at low pressure or when forming with multiple chamfers on a large size. It does not necessarily occur on surfaces close to the heater, but it also occurs on internal plates far from the heater, so this is not a fundamental solution. Furthermore, if a mold plate with a large coefficient of linear expansion is used only for the mold plate that comes into contact with the heater, warpage and dimensional changes will increase due to the difference in thermal expansion between the front and back plates. Duralumin also has the problem of being unsuitable for mold plates because it is soft and easily scratched and deformed.
銅しわを防止する方法としては、成形圧力を高（したり
、プリプレグの樹脂分を高くしたりする操作を行うこと
が行われている。しかし、この方法では、多層プリント
配線板のそり、寸法変化、板厚精度が低下するだけで銅
しわの発生を十分に防止できない。As a method to prevent copper wrinkles, operations such as increasing the molding pressure (or increasing the resin content of the prepreg) are carried out. It is not possible to sufficiently prevent the occurrence of copper wrinkles only by reducing the variation and plate thickness accuracy.
本発明は、以上の点に鑑みてなされたもので、銅しわが
なく表面平滑性、そり、寸法安定性にすぐれた多層プリ
ント配線板を効率よく得ることのできる製造方法を提供
することを目的とする。The present invention has been made in view of the above points, and an object of the present invention is to provide a manufacturing method that can efficiently obtain a multilayer printed wiring board that is free from copper wrinkles and has excellent surface smoothness, warpage, and dimensional stability. shall be.
〔課題を解決するための手段］
本発明者らは、上記の目的を達成するために種々検討し
た結果、多層プリント配線板の外層銅箔の線膨張係数以
上の材質からなる金型プレートを用いて成形することに
より、銅しわが発生しない多層プリント配線板を得られ
ることを見い出し、本発明を完成するに至った。[Means for Solving the Problem] As a result of various studies to achieve the above object, the present inventors have developed a method using a mold plate made of a material having a coefficient of linear expansion greater than or equal to the coefficient of linear expansion of the outer layer copper foil of a multilayer printed wiring board. The inventors have discovered that a multilayer printed wiring board without copper wrinkles can be obtained by molding the copper by molding the copper, leading to the completion of the present invention.
すなわち、本発明は予め片面あるいは両面に導体回路パ
ターンを形成した１枚あるいは複数枚の内層回路基板を
、積層板用基材に積層板用樹脂を含浸、乾燥して得られ
るプリプレグを介して所定枚数積層し、更にその片面あ
るいは両面に前記プリプレグを介して銅箔を重ねて得ら
れる積層体を金型プレートに挟み、これを所要数重ねて
熱器に挟んで熱圧成形を行う多層プリント配線板の製造
方法において、熱盤内のすべての金型プレートに線膨張
係数が多層プリント配線盤の外層銅箔の線膨張係数以上
である材料からなる金型プレートを用いることを特徴と
する多層プリント配線板の製造方法を提供するものであ
る。That is, the present invention provides a method for preparing one or more inner layer circuit boards on which a conductor circuit pattern has been formed on one or both sides in advance through a prepreg obtained by impregnating a laminate base material with a laminate resin and drying it. Multilayer printed wiring is formed by laminating a number of sheets, and then placing copper foil on one or both sides of the layer through the prepreg, sandwiching the resulting laminate between mold plates, stacking the required number of sheets, sandwiching them between heating devices, and performing hot pressure molding. A method for manufacturing a board, characterized in that all mold plates in the heating plate are made of a material whose coefficient of linear expansion is greater than or equal to the coefficient of linear expansion of the outer layer copper foil of the multilayer printed wiring board. A method for manufacturing a wiring board is provided.
本発明の方法を詳しく説明する。本発明に使用する積層
板用樹脂は、エポキシ樹脂、フェノール樹脂、ポリエス
テル樹脂、メラミン樹脂、ポリイミド樹脂等の熱硬化性
樹脂全般である。積層板用基材としては、有機合成繊維
やガラス、アスベスト等の無機繊維の織布や不織布であ
る。銅箔は、特に限定しないが一般に厚さ０．０１８〜
０．０７ｍｍのものである。金型プレートとしては、線
膨張係数が銅箔の線膨張係数以上のものが用いられ、通
常！６．７ＸＩＯ−’以上のものが用いられる。また、
硬さがビッカース硬さで２００以上のものが好ましく用
いられる。The method of the present invention will be explained in detail. The resin for the laminate used in the present invention is a general thermosetting resin such as epoxy resin, phenol resin, polyester resin, melamine resin, polyimide resin, etc. The base material for the laminate is a woven or nonwoven fabric made of organic synthetic fiber, glass, or inorganic fiber such as asbestos. Although the copper foil is not particularly limited, it generally has a thickness of 0.018~
It is 0.07 mm. As a mold plate, a material with a linear expansion coefficient higher than that of copper foil is usually used. 6.7XIO-' or more is used. Also,
Those having a Vickers hardness of 200 or more are preferably used.
プレートの材質や厚さ、表面粗さ等については特に限定
しないが、厚さ０．８ ｒｒｒｍ〜４．０印のステンレ
ス板が好ましい。There are no particular limitations on the material, thickness, surface roughness, etc. of the plate, but a stainless steel plate with a thickness of 0.8 rrrm to 4.0 mark is preferred.
このような金型プレートを用いて外層銅箔、プリプレグ
、内層回路基板を所要枚数挾んだ積層体を複数枚積み重
ね、多段プレスで１４０〜１９０°Ｃ１５〜１５０ｋｇ
／ｃＪ、 ４０〜１２０ｍ１ｎで加熱加圧して一体化し
て製造する。多層プリント配線板のそり、寸法変化、板
厚精度を良好にするためにはできるだけ低圧で成形する
ことが好ましい。Using such a mold plate, multiple laminates with the required number of outer layer copper foil, prepreg, and inner layer circuit boards are stacked up and pressed at 140 to 190 degrees Celsius to 15 to 150 kg using a multistage press.
/cJ, heated and pressurized at 40 to 120 m1n to manufacture. In order to improve the warpage, dimensional change, and board thickness accuracy of the multilayer printed wiring board, it is preferable to mold the board at as low a pressure as possible.
このようにして成形することにより、銅しわのない表面
平滑性にすぐれた多層プリント配線板を得ることができ
る。By molding in this manner, a multilayer printed wiring board with no copper wrinkles and excellent surface smoothness can be obtained.
以下、本発明を実施例に基づいて詳細に説明するが、本
発明はこれに限定されるものではない。Hereinafter, the present invention will be explained in detail based on Examples, but the present invention is not limited thereto.
樹脂をガラス基材（厚さ０．１ ｍｍ、坪１１００ｇ／
ＩＴｒ）に含浸、乾燥したプリプレグ５を２枚ずつ挟ん
で積み重ねたものを線膨張係数１７．３Ｘ１０−”ピン
カース硬さ４００、厚さ１．８ ｍｍのステンレス製金
型プレート３ （ＳＵＳ−３０１ＨＴ２、新日本製鉄製
）に挟んだものを１０枚重ねて、クツション材２を有す
る熱器１に挿入し、加熱温度１７０″Ｃ１圧力１０ｋｇ
／ｃ（で成形を行って１０００ｍｍＸ６１００Ｏの多層
プリント配線板を２００枚作製した。この多層プリント
配線板を検査した結果、そりもほとんどなく、しわの発
生率が０％であった。The resin is used as a glass base material (thickness 0.1 mm, tsubo 1100 g/
A stainless steel mold plate 3 (SUS-301HT2, (manufactured by Nippon Steel) were stacked together and inserted into a heating device 1 having a cushion material 2, heating temperature 170''C1 pressure 10kg.
200 multilayer printed wiring boards of 1000 mm x 6100 O were fabricated by molding with /c (200 sheets). When this multilayer printed wiring board was inspected, it was found that there was almost no warpage and the incidence of wrinkles was 0%.
実施例１
第１図は本発明の多層プリント配線板を成形する場合の
積層構成を示す模式的断面図である。第１図における積
層構成において外層銅箔として厚さ０．０１８ｍｍ、線
膨張係数１６．７Ｘ１０−ｂの銅箔４と、予め導体のパ
ターンを形成した１枚の内層回路基板６との眉間に硬化
剤を混合したエポキシ比較例１
実施例１と同じ外層用銅箔を用いた１０００ｍｍＸ１０
０Ｏの積層体を線膨張係数がｌ Ｏ，８Ｘ １０６のス
テンレス製の金型プレート（ＳＵＳ−６３０、日金工製
）に挟んだものを１組の熱器の中に１０枚挿入し、加熱
温度１７０°Ｃ１圧力１０ｋｇ／ｃｆｆｌで成形した。Example 1 FIG. 1 is a schematic cross-sectional view showing a laminated structure when molding a multilayer printed wiring board of the present invention. In the laminated structure shown in FIG. 1, the outer layer copper foil 4 has a thickness of 0.018 mm and a linear expansion coefficient of 16.7×10-b, and one inner layer circuit board 6 on which a conductor pattern has been formed in advance is hardened between the eyebrows. Comparative example 1 of epoxy mixed with agent 1000 mm x 10 using the same copper foil for the outer layer as in Example 1
Ten laminates of 0O sandwiched between stainless steel mold plates (SUS-630, manufactured by Nikkinko) with a linear expansion coefficient of 1O, 8X 106 were inserted into a set of heaters, and the heating temperature was adjusted to Molding was carried out at 170°C and a pressure of 10 kg/cffl.
この多層プリント配線板の表面の銅しわ発生を観察した
結果、銅しわの発生率は４０％であった。As a result of observing the occurrence of copper wrinkles on the surface of this multilayer printed wiring board, the occurrence rate of copper wrinkles was 40%.
比較例２
実施例１と同じ外層用銅箔を用いた１０００ｍｍ×６５
．０１ｕＩ１１の積層体を熱盤側の金型プレートのみ銅
箔より線膨張係数が大きいアルミニウム板を用い、その
他は線膨張係数が銅箔の値より小さいステンレス製金型
プレート（ＳＵＳ−６３０、日金工製）を用い実施例１
と同一条件で成形を行った。Comparative Example 2 1000 mm x 65 using the same outer layer copper foil as Example 1
．． For the laminate of 01uI11, only the mold plate on the heating plate side was made of aluminum plate, which has a coefficient of linear expansion larger than that of copper foil, and the other parts were made of stainless steel mold plates (SUS-630, Nikkin Kogyo Co., Ltd.) whose coefficient of linear expansion was smaller than that of copper foil. Example 1
Molding was carried out under the same conditions.
この多層プリント配線板を検査した結果、銅しわの発生
率は３０％であった。また、熱器に最も近い板のそりが
大きく、アルミニウム板の表面には凹凸が生じた。As a result of inspecting this multilayer printed wiring board, the incidence of copper wrinkles was 30%. In addition, the plate closest to the heater had a large warp, and the surface of the aluminum plate was uneven.
本発明により製造された多層プリント配線板は銅しわの
発生がほとんどなく、従来銅しわ発生が非常に多いため
片面板を用いて製造していた高多層プリント配線板でも
銅箔を挿入するだけで太きいサイズでも容易に積層する
ことができるため生産性の向上が望める。このようにし
て得られた多層プリント配線板は、所定の寸法に切断さ
れてそれぞれの用途に合わせて用いられるが、従来のよ
うに銅しわを防止するために高圧成形してプリプレグの
樹脂を多量に流すことを行う必要がなくなり、その結果
、そり、ねじれ、寸法変化が少なく板厚精度、表面平滑
性にすぐれた多層プリント配線板を安定して効率よく製
造することが可能となる。The multilayer printed wiring board manufactured according to the present invention has almost no copper wrinkles. Conventionally, copper wrinkles were extremely common, so even high multilayer printed wiring boards manufactured using single-sided boards can be easily removed by simply inserting copper foil. Since even large sizes can be easily stacked, productivity can be improved. The multilayer printed wiring boards obtained in this way are cut into predetermined dimensions and used for each purpose, but unlike conventional methods, they are molded under high pressure and coated with a large amount of prepreg resin to prevent copper wrinkles. As a result, it becomes possible to stably and efficiently manufacture a multilayer printed wiring board with less warpage, twisting, and dimensional changes and excellent board thickness accuracy and surface smoothness.
第１図は、本発明の方法により多層プリント配線板を成
形する場合の積層構成を示す模式的断面図である。
１ 熱板
３ 金型プレート
５ プリプレグ
符号の説明
２ クツション材
４ 銅箔
６ 内層回路基板
多層プリント配線板FIG. 1 is a schematic cross-sectional view showing a laminated structure when a multilayer printed wiring board is formed by the method of the present invention. 1 Heat plate 3 Mold plate 5 Prepreg code explanation 2 Cushion material 4 Copper foil 6 Inner layer circuit board multilayer printed wiring board
Claims (1)
た１枚あるいは複数枚の内層回路基板を、積層板用基材
に積層板用樹脂を含浸、乾燥して得られるプリプレグを
介して所定枚数積層し、更にその片面あるいは両面に前
記プリプレグを介して銅箔を重ねて得られる積層体を金
型プレートに挟み、これを所要数重ねて熱盤に挟んで熱
圧成形を行う多層プリント配線板の製造方法において、
熱盤内のすべての金型プレートに線膨張係数が多層プリ
ント配線盤の外層銅箔の線膨張係数以上である材料から
なる金型プレートを用いることを特徴とする多層プリン
ト配線板の製造方法。1. A predetermined number of inner layer circuit boards, each having a conductor circuit pattern formed on one or both sides in advance, are laminated via a prepreg obtained by impregnating a laminate base material with a laminate resin and drying. A method for manufacturing a multilayer printed wiring board, in which a laminate obtained by stacking copper foil on one or both sides of the prepreg via the prepreg is sandwiched between mold plates, and the required number of laminates are stacked and sandwiched between hot platens to perform hot pressure molding. ,
A method for manufacturing a multilayer printed wiring board, characterized in that all mold plates in a heating plate are made of a material whose linear expansion coefficient is greater than or equal to that of the outer layer copper foil of the multilayer printed wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25536988A JPH02102040A (en) | 1988-10-11 | 1988-10-11 | Manufacture of multilayer printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25536988A JPH02102040A (en) | 1988-10-11 | 1988-10-11 | Manufacture of multilayer printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02102040A true JPH02102040A (en) | 1990-04-13 |
Family
ID=17277814
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP25536988A Pending JPH02102040A (en) | 1988-10-11 | 1988-10-11 | Manufacture of multilayer printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02102040A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007129273A (en) * | 2007-02-23 | 2007-05-24 | Matsushita Electric Works Ltd | Method for manufacturing led display apparatus |
-
1988
- 1988-10-11 JP JP25536988A patent/JPH02102040A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007129273A (en) * | 2007-02-23 | 2007-05-24 | Matsushita Electric Works Ltd | Method for manufacturing led display apparatus |
| JP4609441B2 (en) * | 2007-02-23 | 2011-01-12 | パナソニック電工株式会社 | Manufacturing method of LED display device |
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