JPH0199861A - Thermal head - Google Patents
Thermal headInfo
- Publication number
- JPH0199861A JPH0199861A JP25676587A JP25676587A JPH0199861A JP H0199861 A JPH0199861 A JP H0199861A JP 25676587 A JP25676587 A JP 25676587A JP 25676587 A JP25676587 A JP 25676587A JP H0199861 A JPH0199861 A JP H0199861A
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- film
- electrode layer
- layer
- resistive film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 7
- 238000009413 insulation Methods 0.000 abstract description 8
- 238000013459 approach Methods 0.000 abstract description 3
- 230000007423 decrease Effects 0.000 abstract description 2
- 238000000151 deposition Methods 0.000 abstract 1
- 230000004927 fusion Effects 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 47
- 238000010438 heat treatment Methods 0.000 description 9
- 239000011521 glass Substances 0.000 description 5
- 230000008018 melting Effects 0.000 description 5
- 238000002844 melting Methods 0.000 description 5
- 230000003647 oxidation Effects 0.000 description 4
- 238000007254 oxidation reaction Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 2
- 108010010803 Gelatin Proteins 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229920000159 gelatin Polymers 0.000 description 1
- 239000008273 gelatin Substances 0.000 description 1
- 235000019322 gelatine Nutrition 0.000 description 1
- 235000011852 gelatine desserts Nutrition 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
Landscapes
- Electronic Switches (AREA)
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野］
この発明は、サーマルプリンタに用いられるサーマルヘ
ッドに関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a thermal head used in a thermal printer.
［従来技術］
第５図は従来のサーマルヘッドの構成を示す断面図であ
る。この図において、ｌは酸化アルミニウム製の基板で
あり、同基板ｌの上面には熱絶縁のためのガラスゲレー
ス層２が積層されている。[Prior Art] FIG. 5 is a sectional view showing the structure of a conventional thermal head. In this figure, l is a substrate made of aluminum oxide, and a glass gelase layer 2 for thermal insulation is laminated on the upper surface of the substrate l.
ガラスゲレース層２の上面には抵抗膜による発熱抵抗体
３が形成されており、発熱抵抗体３の上面には所定の距
離を隔てて電極４ａ、４ｂが形成されている。発熱抵抗
体３の電極４ａ、４ｂとの間に露出した面が発熱部３ｈ
となる。また、電極４ａ、４ｂのうち一方が共通電極に
接続され、他方が図示しない給電制御部（発熱抵抗体３
に電流を流す機能を有する）の出力端に接続されている
。５は耐酸化膜であり、電極４ａ、４ｂおよび発熱部３
ｈを覆うように形成されている。また、耐酸化膜５の上
面には耐摩耗膜６が形成されている。耐酸化膜５と耐摩
耗膜６は保護膜を構成する。そして以上説明したサーマ
ルヘッドがプラテン１０に対向して配置され、これらの
サーマルヘッドおよびプラテン１０の間に、インク８の
付着したインクフィルム７と被転写用紙９が配置される
。A heating resistor 3 made of a resistive film is formed on the top surface of the glass gelatin layer 2, and electrodes 4a and 4b are formed on the top surface of the heating resistor 3 at a predetermined distance apart. The surface of the heating resistor 3 exposed between the electrodes 4a and 4b is the heating part 3h.
becomes. Further, one of the electrodes 4a and 4b is connected to a common electrode, and the other is connected to a power supply control unit (not shown) (heating resistor 3
connected to the output end of the 5 is an oxidation-resistant film, which covers the electrodes 4a, 4b and the heat generating part 3.
It is formed to cover h. Furthermore, a wear-resistant film 6 is formed on the upper surface of the oxidation-resistant film 5 . The oxidation-resistant film 5 and the wear-resistant film 6 constitute a protective film. The thermal head described above is placed facing the platen 10, and between the thermal head and the platen 10, the ink film 7 to which the ink 8 is attached and the transfer paper 9 are placed.
第６図は、上述したサーマルヘッドの平面図であり、こ
の図に示すように発熱抵抗体３の発熱部３ｈは方形状と
なっている。FIG. 6 is a plan view of the above-mentioned thermal head, and as shown in this figure, the heating portion 3h of the heating resistor 3 has a rectangular shape.
このように構成されたサーマルヘッドにおいて、発熱抵
抗体３に電流が流れると、同抵抗体３の全熱部全面が均
一に発熱する。これにより、サーマルヘッドの上に置か
れたインクフィルムの前記発熱部に面した部分が加熱さ
れ、インクが溶融する。In the thermal head configured in this manner, when a current flows through the heating resistor 3, the entire heated portion of the resistor 3 uniformly generates heat. As a result, the portion of the ink film placed on the thermal head facing the heat generating portion is heated, and the ink is melted.
この結果、被転写用紙には、第６図に破線りで示す形状
のドツト印刷が行なわれる。As a result, dots having the shape shown by broken lines in FIG. 6 are printed on the transfer paper.
［発明が解決しようとする問題点］
ところで、サーマルプリンタにおける画像の濃度階調を
表現するためには、印刷されろドツトの大きさを制御す
ることが望ましいが、上述したように従来のサーマルヘ
ッドにあっては、発熱抵抗体の発熱部の形状に基づいた
形状でしかドツト印刷を行なうことができず、ドツトの
大きさを制御する事ができない。[Problems to be Solved by the Invention] Incidentally, in order to express the density gradation of an image in a thermal printer, it is desirable to control the size of the printed dots, but as mentioned above, the conventional thermal head In this case, it is only possible to print dots in a shape based on the shape of the heat generating part of the heating resistor, and the size of the dots cannot be controlled.
この発明は上述した事情に鑑みてなされたもので、印刷
されるドツトの大きさを制御することができるサーマル
ヘッドを提供することを目的としている。The present invention has been made in view of the above-mentioned circumstances, and an object of the present invention is to provide a thermal head that can control the size of printed dots.
［問題点を解決するための手段］
上記問題点を解決するためこの発明は、基板表面に熱絶
縁層を形成し、その上に第１電極層と絶縁層を順次積層
し、この絶縁層に導通穴を形成して前記第１７ｕ極層を
一部露出させ、前記絶縁層と前記第１電極層の露出部を
覆って抵抗膜を積層し、前記抵抗膜上の前記導通穴から
所定の距離を隔てて囲った領域の外側に、前記領域を囲
うように第２７ｔｔ極層を積層した事を特徴としている
。[Means for Solving the Problems] In order to solve the above problems, the present invention forms a thermal insulation layer on the surface of the substrate, sequentially stacks a first electrode layer and an insulation layer thereon, and forms a heat insulation layer on the insulation layer. A conductive hole is formed to expose a portion of the 17U electrode layer, a resistive film is laminated covering the exposed portions of the insulating layer and the first electrode layer, and a predetermined distance from the conductive hole on the resistive film is formed. It is characterized in that a 27th tt pole layer is laminated on the outside of the area surrounded by , so as to surround the area.
［作用］
上記構成によれば、第１電極から抵抗膜を介して第２７
ｒｉ極に電流を流した場合、抵抗膜において第１電極と
の接触部近傍の電流密度が最ら大きく、発熱量も最大と
なる。そして第１電極を離れてその周囲に設けられた第
２電極に近づくに従い電流密度が疎になり、発熱量も小
さくなる。従って、抵抗膜に流す電流の通電時間あるい
はその波高値が小の場合は、抵抗膜の第１電極との接触
部近傍のインク面のインクのみが溶融し、抵抗膜に流す
電流の通電時間あるいはその波高値を大にすると、抵抗
膜の第１電極層との接触部の周囲の部分の電流密度も大
きくなるので発熱量も大となり、インクの溶融範囲を大
きくする事ができる。従って、抵抗膜に流す電流の通電
時間あるいはその波高値を制御すれば、インクの溶融範
囲を制御でき、印刷されるドツトの大きさを制御するこ
とが可能となる。[Function] According to the above configuration, the 27th electrode is connected from the first electrode through the resistive film.
When a current is passed through the ri electrode, the current density is highest near the contact portion with the first electrode in the resistive film, and the amount of heat generated is also highest. As the electrode leaves the first electrode and approaches the second electrode provided around it, the current density becomes sparser and the amount of heat generated also becomes smaller. Therefore, if the current flow time or the peak value of the current flowing through the resistive film is small, only the ink on the ink surface near the contact portion of the resistive film with the first electrode will melt, and the current flow time or peak value of the current flowing through the resistive film will melt. When the peak value is increased, the current density in the area around the contact portion of the resistive film with the first electrode layer also increases, so the amount of heat generated increases, and the melting range of the ink can be increased. Therefore, by controlling the duration of the current flowing through the resistive film or its peak value, it is possible to control the melting range of the ink and the size of the printed dots.
し実施例］
以下図面を参照してこの発明の実施例につ０て説明子ろ
。Embodiments] Embodiments of the present invention will be described below with reference to the drawings.
第１図はこの発明の一実施例の構成を示す断面図、第２
図は同実施例の平面図である。FIG. 1 is a sectional view showing the configuration of an embodiment of the present invention, and FIG.
The figure is a plan view of the same embodiment.
第１図において１は酸化アルミニウム製の基板であり、
この上面には熱絶縁のためのガラスゲレース層２が積層
されている。ガラスゲレース層２の上には第１電極層６
と絶縁層３が順次積層されており、絶縁層３の一部に導
通穴６ａが空けられ第１電極層６が露出している。そし
て、絶縁層３と第１電極層６の露出部を覆って抵抗膜４
が積層されている。この結果、第１電極層６と抵抗膜４
とが導通穴６ａを介して接触する。また、第２図に示す
ように抵抗膜４の上において導通穴６ａの位置から一定
の距離を隔てた円形の領域の外側を囲むように第２電極
層５が積層されている。そして、抵抗膜４において、電
極層５が積層されて０ない円形状の露出部が発熱部４ｈ
となる。さらに第２電極層５および抵抗膜４の上に、図
示は省略しているが耐酸化膜と耐摩耗膜が順次積層され
、保護層を形成している。なお、第１電極層には図示し
ない給電制御部の出力端が接続され、第２電極層は共通
電極に接続されている。In FIG. 1, 1 is a substrate made of aluminum oxide,
A glass gelase layer 2 for thermal insulation is laminated on this upper surface. A first electrode layer 6 is provided on the glass gelase layer 2.
and an insulating layer 3 are sequentially laminated, and a conductive hole 6a is formed in a part of the insulating layer 3, so that the first electrode layer 6 is exposed. Then, the resistive film 4 covers the exposed portions of the insulating layer 3 and the first electrode layer 6.
are layered. As a result, the first electrode layer 6 and the resistive film 4
are in contact with each other through the conduction hole 6a. Further, as shown in FIG. 2, a second electrode layer 5 is laminated on the resistive film 4 so as to surround the outside of a circular region spaced a certain distance from the position of the conductive hole 6a. In the resistive film 4, a non-zero circular exposed portion where the electrode layer 5 is laminated is a heat generating portion 4h.
becomes. Further, although not shown, an oxidation-resistant film and an abrasion-resistant film are successively laminated on the second electrode layer 5 and the resistive film 4 to form a protective layer. Note that the first electrode layer is connected to an output end of a power supply control section (not shown), and the second electrode layer is connected to a common electrode.
このように構成されたサーマルヘッドにおいて、発熱部
に電流を流した場合、電流は前記導通穴６ａからその周
囲の第２電極層５に向って流れるため、発熱部における
電流密度は導通穴６ａ付近が最大でそこから離れて第２
電極層５に近寄る程小さくなってゆく。従って、このサ
ーマルヘッドの上方に置かれたインク面の受ける加熱量
ら、導通穴〇ａ付近が最大でそこから離れて第２電極層
５に近寄る程小さくなってゆく。In the thermal head configured in this way, when a current is passed through the heat generating part, the current flows from the conductive hole 6a toward the second electrode layer 5 around it, so that the current density in the heat generating part is low near the conductive hole 6a. is the largest and the second away from it
The closer it gets to the electrode layer 5, the smaller it becomes. Therefore, the amount of heat received by the ink surface placed above the thermal head is maximum near the conductive hole 0a, and decreases as the distance from the conductive hole ○a approaches the second electrode layer 5.
ところで、サーマルヘッドの上方に置かれたインク面の
インクは、溶融するのに一定の熱エネルギーを必要とす
る。このサーマルヘッドにおいて、発熱部に流す電流の
通電時間あるいはその波高値が小の場合は、導通穴６ａ
近傍の抵抗膜における発熱量のみがこの熱エネルギーに
達するため導通穴６ａの上方のインク面のインクのみが
溶融する。By the way, the ink on the ink surface placed above the thermal head requires a certain amount of thermal energy to melt. In this thermal head, if the current flow time or the peak value of the current flowing through the heat generating part is small, the conduction hole 6a
Since only the amount of heat generated in the nearby resistive film reaches this thermal energy, only the ink on the ink surface above the conductive hole 6a is melted.
そして、発熱部の電流の通電時間あるいは波高値を大き
くすると、導通穴６ａの周囲の抵抗膜における発熱１も
上述のインクを溶融せしめる熱エネルギーに達するので
、インクの溶融範囲が広がる。When the current conduction time or peak value of the current in the heat generating portion is increased, the heat generated in the resistive film around the conductive hole 6a also reaches the thermal energy that melts the ink, thereby widening the melting range of the ink.
従って、第１電極層から抵抗膜を介して第２電極層に電
流を流す場合、抵抗膜に流す電流の通電時間あるいは波
高値を制御する事で、インクの溶融範囲を制御する事が
できる。この結果、被転写用紙に熱転写されるドツトの
形状を第３図（ａ） 、 （ｂ） 。Therefore, when a current is passed from the first electrode layer to the second electrode layer via the resistive film, the melting range of the ink can be controlled by controlling the duration or peak value of the current passed through the resistive film. As a result, the shape of the dots thermally transferred to the transfer paper is shown in FIGS. 3(a) and 3(b).
（ｃ） 、 （ｄ）のように制御する事ができる。It can be controlled as shown in (c) and (d).
第４図はこの発明の第２の実施例の構成を示す平面図で
あるが、抵抗膜４と第１電極層６を接触させろための導
通穴６ａと、第２電極層５に覆われていない抵抗膜４の
露出部分すなわち発熱部が、共に方形状になっている。FIG. 4 is a plan view showing the structure of a second embodiment of the present invention, in which a conductive hole 6a for bringing the resistive film 4 and the first electrode layer 6 into contact and a hole covered by the second electrode layer 5 are shown. The exposed portions of the resistive film 4, that is, the heat generating portions, both have a rectangular shape.
このようにしても、抵抗膜の電流密度は導通穴６ａ近傍
が最も密でそこから離れるに従い疎になるので、第１の
実施例と同様の効果かある。Even in this case, the current density in the resistive film is highest near the conductive hole 6a and becomes sparse as it moves away from there, so that the same effect as in the first embodiment can be obtained.
［発明の効果］
以上説明したようにこの発明によれば、基板表面に熱絶
縁層を形成し、その上に第１電極層と絶縁層を順次積層
し、この絶縁層に導通穴を形成して前記第１７［ｉ極層
を一部露出させ、前記絶縁層と前記第１電極層の露出部
を覆って抵抗膜を積層し、前記抵抗膜上の前記導通穴か
ら所定の距離を隔てて囲った領域の外側に、前記領域を
囲うように第２電極層を積層したので、第１７ｔｔ極層
から抵抗膜を介して第２電極に流す電流の通電時間ある
いは波高値を制御する事により、インクの溶融範囲を制
御する事ができ、従って、印刷されるドツトの大きさを
制御する事が可能である。[Effects of the Invention] As explained above, according to the present invention, a thermal insulating layer is formed on the surface of a substrate, a first electrode layer and an insulating layer are sequentially laminated thereon, and a conductive hole is formed in this insulating layer. the 17th [i-pole layer is partially exposed, a resistive film is laminated covering the exposed portions of the insulating layer and the first electrode layer, and a resistive film is stacked at a predetermined distance from the conductive hole on the resistive film. Since the second electrode layer was laminated outside the enclosed area so as to surround the area, by controlling the conduction time or peak value of the current flowing from the 17th tt pole layer to the second electrode via the resistive film, It is possible to control the melting range of the ink and therefore the size of the printed dots.
第１図はこの発明の一実施例の構成を示す断面図、第２
図は同実施例の平面図、第３図はこの発明のサーマルヘ
ッドにおいて熱転写されるドツトの形状を示す図、第４
図はこの発明の第２の実施例の構成を示す平面図、第５
図は従来のサーマルヘッドを示す断面図、第６図は同ザ
ーマルヘッドを示す平面図である。
■・・・・・・基板、２・・・・・・ガラスゲレース層
（熱絶縁層）、３・・・・・・絶縁層、４・・・・・・
抵抗膜、５・・・・・・第２電極層、６・・・・・第１
電極層。FIG. 1 is a sectional view showing the configuration of an embodiment of the present invention, and FIG.
The figure is a plan view of the same embodiment, FIG. 3 is a diagram showing the shape of dots thermally transferred in the thermal head of the present invention, and FIG.
The figure is a plan view showing the configuration of the second embodiment of the present invention.
The figure is a sectional view showing a conventional thermal head, and FIG. 6 is a plan view showing the same thermal head. ■... Substrate, 2... Glass gelase layer (thermal insulation layer), 3... Insulating layer, 4...
Resistive film, 5...second electrode layer, 6...first
electrode layer.
Claims (1)
縁層を順次積層し、この絶縁層に導通穴を形成して前記
第１電極層を一部露出させ、前記絶縁層と前記第１電極
層の露出部を覆って抵抗膜を積層し、前記抵抗膜上の前
記導通穴から所定の距離を隔てて囲った領域の外側に、
前記領域を囲うように第２電極層を積層した事を特徴と
するサーマルヘッド。A thermal insulating layer is formed on the surface of the substrate, a first electrode layer and an insulating layer are sequentially laminated thereon, a conductive hole is formed in the insulating layer to partially expose the first electrode layer, and a first electrode layer and an insulating layer are sequentially laminated thereon. A resistive film is laminated to cover the exposed portion of the first electrode layer, and outside an area surrounded by a predetermined distance from the conductive hole on the resistive film,
A thermal head characterized in that a second electrode layer is laminated to surround the area.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25676587A JPH0199861A (en) | 1987-10-12 | 1987-10-12 | Thermal head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25676587A JPH0199861A (en) | 1987-10-12 | 1987-10-12 | Thermal head |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0199861A true JPH0199861A (en) | 1989-04-18 |
Family
ID=17297135
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP25676587A Pending JPH0199861A (en) | 1987-10-12 | 1987-10-12 | Thermal head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0199861A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03251465A (en) * | 1990-03-01 | 1991-11-08 | Alps Electric Co Ltd | Thermal head |
| JP2010221616A (en) * | 2009-03-25 | 2010-10-07 | Toshiba Hokuto Electronics Corp | Thermal print head |
-
1987
- 1987-10-12 JP JP25676587A patent/JPH0199861A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03251465A (en) * | 1990-03-01 | 1991-11-08 | Alps Electric Co Ltd | Thermal head |
| JP2010221616A (en) * | 2009-03-25 | 2010-10-07 | Toshiba Hokuto Electronics Corp | Thermal print head |
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