JPH01901A - Light-shielding screen structure - Google Patents
Light-shielding screen structureInfo
- Publication number
- JPH01901A JPH01901A JP62-155511A JP15551187A JPH01901A JP H01901 A JPH01901 A JP H01901A JP 15551187 A JP15551187 A JP 15551187A JP H01901 A JPH01901 A JP H01901A
- Authority
- JP
- Japan
- Prior art keywords
- light
- shielding screen
- adhesive
- photosensitive resin
- resin composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005192 partition Methods 0.000 claims description 51
- 239000000853 adhesive Substances 0.000 claims description 47
- 230000001070 adhesive effect Effects 0.000 claims description 47
- 239000011342 resin composition Substances 0.000 claims description 38
- 239000000758 substrate Substances 0.000 claims description 36
- 239000012790 adhesive layer Substances 0.000 claims description 25
- 238000000016 photochemical curing Methods 0.000 claims description 9
- 150000001875 compounds Chemical class 0.000 description 38
- -1 polypropylene Polymers 0.000 description 30
- 238000006243 chemical reaction Methods 0.000 description 17
- 125000000524 functional group Chemical group 0.000 description 17
- 239000010410 layer Substances 0.000 description 15
- 238000007259 addition reaction Methods 0.000 description 14
- 229920000642 polymer Polymers 0.000 description 13
- 239000004743 Polypropylene Substances 0.000 description 9
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 9
- 238000000034 method Methods 0.000 description 9
- 239000000203 mixture Substances 0.000 description 9
- 229920001155 polypropylene Polymers 0.000 description 9
- 238000002834 transmittance Methods 0.000 description 9
- 229920001577 copolymer Polymers 0.000 description 8
- 229920001971 elastomer Polymers 0.000 description 8
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 8
- 229920000139 polyethylene terephthalate Polymers 0.000 description 8
- 239000005020 polyethylene terephthalate Substances 0.000 description 8
- 229920005989 resin Polymers 0.000 description 8
- 239000011347 resin Substances 0.000 description 8
- 239000005060 rubber Substances 0.000 description 8
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 7
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 7
- 239000000975 dye Substances 0.000 description 7
- 229910052739 hydrogen Inorganic materials 0.000 description 7
- 239000001257 hydrogen Substances 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 7
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 6
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 6
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 6
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 6
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 6
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 6
- 125000000217 alkyl group Chemical group 0.000 description 6
- 230000007423 decrease Effects 0.000 description 6
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 239000000047 product Substances 0.000 description 6
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 5
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 5
- 239000005062 Polybutadiene Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 150000002148 esters Chemical class 0.000 description 5
- 239000011521 glass Substances 0.000 description 5
- 239000003112 inhibitor Substances 0.000 description 5
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 5
- 229910052753 mercury Inorganic materials 0.000 description 5
- 229920002857 polybutadiene Polymers 0.000 description 5
- 229920001228 polyisocyanate Polymers 0.000 description 5
- 239000005056 polyisocyanate Substances 0.000 description 5
- 229920005862 polyol Polymers 0.000 description 5
- 150000003077 polyols Chemical class 0.000 description 5
- 150000005846 sugar alcohols Polymers 0.000 description 5
- 238000012719 thermal polymerization Methods 0.000 description 5
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 5
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 4
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 4
- XXROGKLTLUQVRX-UHFFFAOYSA-N allyl alcohol Chemical compound OCC=C XXROGKLTLUQVRX-UHFFFAOYSA-N 0.000 description 4
- 230000018109 developmental process Effects 0.000 description 4
- 239000000986 disperse dye Substances 0.000 description 4
- 238000001035 drying Methods 0.000 description 4
- FQPSGWSUVKBHSU-UHFFFAOYSA-N methacrylamide Chemical compound CC(=C)C(N)=O FQPSGWSUVKBHSU-UHFFFAOYSA-N 0.000 description 4
- 239000000178 monomer Substances 0.000 description 4
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 4
- 239000002985 plastic film Substances 0.000 description 4
- 239000004814 polyurethane Substances 0.000 description 4
- 229920002635 polyurethane Polymers 0.000 description 4
- 238000004080 punching Methods 0.000 description 4
- 238000007788 roughening Methods 0.000 description 4
- AZQWKYJCGOJGHM-UHFFFAOYSA-N 1,4-benzoquinone Chemical compound O=C1C=CC(=O)C=C1 AZQWKYJCGOJGHM-UHFFFAOYSA-N 0.000 description 3
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 3
- 229920000459 Nitrile rubber Polymers 0.000 description 3
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 3
- 150000008065 acid anhydrides Chemical class 0.000 description 3
- 239000002998 adhesive polymer Substances 0.000 description 3
- 239000001361 adipic acid Substances 0.000 description 3
- 235000011037 adipic acid Nutrition 0.000 description 3
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical compound C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 3
- NTXGQCSETZTARF-UHFFFAOYSA-N buta-1,3-diene;prop-2-enenitrile Chemical compound C=CC=C.C=CC#N NTXGQCSETZTARF-UHFFFAOYSA-N 0.000 description 3
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000001530 fumaric acid Substances 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 3
- 239000006224 matting agent Substances 0.000 description 3
- 150000002734 metacrylic acid derivatives Chemical class 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 3
- 239000000049 pigment Substances 0.000 description 3
- 229920003023 plastic Polymers 0.000 description 3
- 239000004417 polycarbonate Substances 0.000 description 3
- 229920000515 polycarbonate Polymers 0.000 description 3
- 229920000728 polyester Polymers 0.000 description 3
- 229920005906 polyester polyol Polymers 0.000 description 3
- 239000000377 silicon dioxide Substances 0.000 description 3
- 229920006305 unsaturated polyester Polymers 0.000 description 3
- JOYRKODLDBILNP-UHFFFAOYSA-N urethane group Chemical group NC(=O)OCC JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- MYRTYDVEIRVNKP-UHFFFAOYSA-N 1,2-Divinylbenzene Chemical compound C=CC1=CC=CC=C1C=C MYRTYDVEIRVNKP-UHFFFAOYSA-N 0.000 description 2
- DKEGCUDAFWNSSO-UHFFFAOYSA-N 1,8-dibromooctane Chemical compound BrCCCCCCCCBr DKEGCUDAFWNSSO-UHFFFAOYSA-N 0.000 description 2
- KWVGIHKZDCUPEU-UHFFFAOYSA-N 2,2-dimethoxy-2-phenylacetophenone Chemical compound C=1C=CC=CC=1C(OC)(OC)C(=O)C1=CC=CC=C1 KWVGIHKZDCUPEU-UHFFFAOYSA-N 0.000 description 2
- XFCMNSHQOZQILR-UHFFFAOYSA-N 2-[2-(2-methylprop-2-enoyloxy)ethoxy]ethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCOCCOC(=O)C(C)=C XFCMNSHQOZQILR-UHFFFAOYSA-N 0.000 description 2
- KMNCBSZOIQAUFX-UHFFFAOYSA-N 2-ethoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OCC)C(=O)C1=CC=CC=C1 KMNCBSZOIQAUFX-UHFFFAOYSA-N 0.000 description 2
- VVBLNCFGVYUYGU-UHFFFAOYSA-N 4,4'-Bis(dimethylamino)benzophenone Chemical compound C1=CC(N(C)C)=CC=C1C(=O)C1=CC=C(N(C)C)C=C1 VVBLNCFGVYUYGU-UHFFFAOYSA-N 0.000 description 2
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 2
- 239000004372 Polyvinyl alcohol Substances 0.000 description 2
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 2
- QQONPFPTGQHPMA-UHFFFAOYSA-N Propene Chemical group CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 2
- 244000028419 Styrax benzoin Species 0.000 description 2
- 235000000126 Styrax benzoin Nutrition 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 235000008411 Sumatra benzointree Nutrition 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 239000002390 adhesive tape Substances 0.000 description 2
- 125000004183 alkoxy alkyl group Chemical group 0.000 description 2
- 125000003277 amino group Chemical group 0.000 description 2
- 229960002130 benzoin Drugs 0.000 description 2
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 2
- 239000007795 chemical reaction product Substances 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- 235000014113 dietary fatty acids Nutrition 0.000 description 2
- 150000002009 diols Chemical class 0.000 description 2
- 125000003700 epoxy group Chemical group 0.000 description 2
- 239000000194 fatty acid Substances 0.000 description 2
- 229930195729 fatty acid Natural products 0.000 description 2
- 150000004665 fatty acids Chemical class 0.000 description 2
- 235000011187 glycerol Nutrition 0.000 description 2
- 235000019382 gum benzoic Nutrition 0.000 description 2
- 125000002768 hydroxyalkyl group Chemical group 0.000 description 2
- 239000003999 initiator Substances 0.000 description 2
- 239000012948 isocyanate Substances 0.000 description 2
- 150000002513 isocyanates Chemical group 0.000 description 2
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 2
- 239000011976 maleic acid Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229920002601 oligoester Polymers 0.000 description 2
- RPQRDASANLAFCM-UHFFFAOYSA-N oxiran-2-ylmethyl prop-2-enoate Chemical class C=CC(=O)OCC1CO1 RPQRDASANLAFCM-UHFFFAOYSA-N 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 239000003504 photosensitizing agent Substances 0.000 description 2
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 2
- 229920002589 poly(vinylethylene) polymer Polymers 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- 229920000570 polyether Polymers 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 239000004926 polymethyl methacrylate Substances 0.000 description 2
- 150000007519 polyprotic acids Polymers 0.000 description 2
- 229920006295 polythiol Polymers 0.000 description 2
- 229920002451 polyvinyl alcohol Polymers 0.000 description 2
- 229920006395 saturated elastomer Polymers 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 2
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 2
- ARCGXLSVLAOJQL-UHFFFAOYSA-N trimellitic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 ARCGXLSVLAOJQL-UHFFFAOYSA-N 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- 229910052724 xenon Inorganic materials 0.000 description 2
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 2
- MYWOJODOMFBVCB-UHFFFAOYSA-N 1,2,6-trimethylphenanthrene Chemical compound CC1=CC=C2C3=CC(C)=CC=C3C=CC2=C1C MYWOJODOMFBVCB-UHFFFAOYSA-N 0.000 description 1
- MSAHTMIQULFMRG-UHFFFAOYSA-N 1,2-diphenyl-2-propan-2-yloxyethanone Chemical compound C=1C=CC=CC=1C(OC(C)C)C(=O)C1=CC=CC=C1 MSAHTMIQULFMRG-UHFFFAOYSA-N 0.000 description 1
- SKHBJDDIGYYYMJ-UHFFFAOYSA-N 2,6-ditert-butyl-6-methylcyclohexa-1,3-dien-1-ol Chemical compound CC(C)(C)C1=C(O)C(C)(C(C)(C)C)CC=C1 SKHBJDDIGYYYMJ-UHFFFAOYSA-N 0.000 description 1
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 1
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 description 1
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 description 1
- GTELLNMUWNJXMQ-UHFFFAOYSA-N 2-ethyl-2-(hydroxymethyl)propane-1,3-diol;prop-2-enoic acid Chemical class OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.CCC(CO)(CO)CO GTELLNMUWNJXMQ-UHFFFAOYSA-N 0.000 description 1
- SJEBAWHUJDUKQK-UHFFFAOYSA-N 2-ethylanthraquinone Chemical compound C1=CC=C2C(=O)C3=CC(CC)=CC=C3C(=O)C2=C1 SJEBAWHUJDUKQK-UHFFFAOYSA-N 0.000 description 1
- VHSHLMUCYSAUQU-UHFFFAOYSA-N 2-hydroxypropyl methacrylate Chemical compound CC(O)COC(=O)C(C)=C VHSHLMUCYSAUQU-UHFFFAOYSA-N 0.000 description 1
- HFVPDKWVDPEQCO-UHFFFAOYSA-N 2-methylideneoctanamide Chemical compound CCCCCCC(=C)C(N)=O HFVPDKWVDPEQCO-UHFFFAOYSA-N 0.000 description 1
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 1
- XOJWAAUYNWGQAU-UHFFFAOYSA-N 4-(2-methylprop-2-enoyloxy)butyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCCCOC(=O)C(C)=C XOJWAAUYNWGQAU-UHFFFAOYSA-N 0.000 description 1
- WSSSPWUEQFSQQG-UHFFFAOYSA-N 4-methyl-1-pentene Chemical compound CC(C)CC=C WSSSPWUEQFSQQG-UHFFFAOYSA-N 0.000 description 1
- 229940076442 9,10-anthraquinone Drugs 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- 229910002012 Aerosil® Inorganic materials 0.000 description 1
- NLZUEZXRPGMBCV-UHFFFAOYSA-N Butylhydroxytoluene Chemical compound CC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 NLZUEZXRPGMBCV-UHFFFAOYSA-N 0.000 description 1
- QSJXEFYPDANLFS-UHFFFAOYSA-N Diacetyl Chemical group CC(=O)C(C)=O QSJXEFYPDANLFS-UHFFFAOYSA-N 0.000 description 1
- 239000004641 Diallyl-phthalate Substances 0.000 description 1
- 229920002943 EPDM rubber Polymers 0.000 description 1
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 1
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 1
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 1
- WOBHKFSMXKNTIM-UHFFFAOYSA-N Hydroxyethyl methacrylate Chemical compound CC(=C)C(=O)OCCO WOBHKFSMXKNTIM-UHFFFAOYSA-N 0.000 description 1
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Natural products CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 1
- 239000002841 Lewis acid Substances 0.000 description 1
- WHNWPMSKXPGLAX-UHFFFAOYSA-N N-Vinyl-2-pyrrolidone Chemical compound C=CN1CCCC1=O WHNWPMSKXPGLAX-UHFFFAOYSA-N 0.000 description 1
- SJEYSFABYSGQBG-UHFFFAOYSA-M Patent blue Chemical compound [Na+].C1=CC(N(CC)CC)=CC=C1C(C=1C(=CC(=CC=1)S([O-])(=O)=O)S([O-])(=O)=O)=C1C=CC(=[N+](CC)CC)C=C1 SJEYSFABYSGQBG-UHFFFAOYSA-M 0.000 description 1
- 206010034972 Photosensitivity reaction Diseases 0.000 description 1
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 229920001328 Polyvinylidene chloride Polymers 0.000 description 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 1
- BGNXCDMCOKJUMV-UHFFFAOYSA-N Tert-Butylhydroquinone Chemical compound CC(C)(C)C1=CC(O)=CC=C1O BGNXCDMCOKJUMV-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- SMEGJBVQLJJKKX-HOTMZDKISA-N [(2R,3S,4S,5R,6R)-5-acetyloxy-3,4,6-trihydroxyoxan-2-yl]methyl acetate Chemical compound CC(=O)OC[C@@H]1[C@H]([C@@H]([C@H]([C@@H](O1)O)OC(=O)C)O)O SMEGJBVQLJJKKX-HOTMZDKISA-N 0.000 description 1
- QNSQTJHTVQSWFR-UHFFFAOYSA-N [(4-diazonioiminocyclohexa-2,5-dien-1-ylidene)hydrazinylidene]azanide Chemical compound [N-]=[N+]=NC1=CC=C(N=[N+]=[N-])C=C1 QNSQTJHTVQSWFR-UHFFFAOYSA-N 0.000 description 1
- QUWBSOKSBWAQER-UHFFFAOYSA-N [C].O=C=O Chemical compound [C].O=C=O QUWBSOKSBWAQER-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 229940081735 acetylcellulose Drugs 0.000 description 1
- 239000000980 acid dye Substances 0.000 description 1
- 150000003926 acrylamides Chemical class 0.000 description 1
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 239000012670 alkaline solution Substances 0.000 description 1
- 229920000180 alkyd Polymers 0.000 description 1
- 150000001350 alkyl halides Chemical class 0.000 description 1
- 125000002947 alkylene group Chemical group 0.000 description 1
- HXBPYFMVGFDZFT-UHFFFAOYSA-N allyl isocyanate Chemical compound C=CCN=C=O HXBPYFMVGFDZFT-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 125000004103 aminoalkyl group Chemical group 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 238000000149 argon plasma sintering Methods 0.000 description 1
- 235000010290 biphenyl Nutrition 0.000 description 1
- 239000004305 biphenyl Substances 0.000 description 1
- 125000006267 biphenyl group Chemical group 0.000 description 1
- QUDWYFHPNIMBFC-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,2-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=CC=C1C(=O)OCC=C QUDWYFHPNIMBFC-UHFFFAOYSA-N 0.000 description 1
- 229920001400 block copolymer Polymers 0.000 description 1
- 229910021538 borax Inorganic materials 0.000 description 1
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 1
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 description 1
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 1
- 235000010354 butylated hydroxytoluene Nutrition 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 239000011203 carbon fibre reinforced carbon Substances 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- 238000009125 cardiac resynchronization therapy Methods 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 125000002091 cationic group Chemical group 0.000 description 1
- 239000001913 cellulose Substances 0.000 description 1
- 229920002678 cellulose Polymers 0.000 description 1
- 229920002301 cellulose acetate Polymers 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229940114081 cinnamate Drugs 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 239000007859 condensation product Substances 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- 238000001723 curing Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 125000004386 diacrylate group Chemical group 0.000 description 1
- FHIVAFMUCKRCQO-UHFFFAOYSA-N diazinon Chemical class CCOP(=S)(OCC)OC1=CC(C)=NC(C(C)C)=N1 FHIVAFMUCKRCQO-UHFFFAOYSA-N 0.000 description 1
- 125000000664 diazo group Chemical group [N-]=[N+]=[*] 0.000 description 1
- 238000007865 diluting Methods 0.000 description 1
- LTYMSROWYAPPGB-UHFFFAOYSA-N diphenyl sulfide Chemical compound C=1C=CC=CC=1SC1=CC=CC=C1 LTYMSROWYAPPGB-UHFFFAOYSA-N 0.000 description 1
- 239000000982 direct dye Substances 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000004043 dyeing Methods 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- YQGOJNYOYNNSMM-UHFFFAOYSA-N eosin Chemical compound [Na+].OC(=O)C1=CC=CC=C1C1=C2C=C(Br)C(=O)C(Br)=C2OC2=C(Br)C(O)=C(Br)C=C21 YQGOJNYOYNNSMM-UHFFFAOYSA-N 0.000 description 1
- 239000005038 ethylene vinyl acetate Substances 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- VZCYOOQTPOCHFL-OWOJBTEDSA-L fumarate(2-) Chemical class [O-]C(=O)\C=C\C([O-])=O VZCYOOQTPOCHFL-OWOJBTEDSA-L 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- 150000002334 glycols Chemical class 0.000 description 1
- 238000009499 grossing Methods 0.000 description 1
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 1
- 150000002431 hydrogen Chemical class 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000001023 inorganic pigment Substances 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 1
- ZBKFYXZXZJPWNQ-UHFFFAOYSA-N isothiocyanate group Chemical group [N-]=C=S ZBKFYXZXZJPWNQ-UHFFFAOYSA-N 0.000 description 1
- 150000002540 isothiocyanates Chemical class 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 150000007517 lewis acids Chemical class 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- OMNKZBIFPJNNIO-UHFFFAOYSA-N n-(2-methyl-4-oxopentan-2-yl)prop-2-enamide Chemical compound CC(=O)CC(C)(C)NC(=O)C=C OMNKZBIFPJNNIO-UHFFFAOYSA-N 0.000 description 1
- KKFHAJHLJHVUDM-UHFFFAOYSA-N n-vinylcarbazole Chemical compound C1=CC=C2N(C=C)C3=CC=CC=C3C2=C1 KKFHAJHLJHVUDM-UHFFFAOYSA-N 0.000 description 1
- 239000012860 organic pigment Substances 0.000 description 1
- NWVVVBRKAWDGAB-UHFFFAOYSA-N p-methoxyphenol Chemical compound COC1=CC=C(O)C=C1 NWVVVBRKAWDGAB-UHFFFAOYSA-N 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N phenylbenzene Natural products C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 1
- 230000036211 photosensitivity Effects 0.000 description 1
- OXNIZHLAWKMVMX-UHFFFAOYSA-N picric acid Chemical compound OC1=C([N+]([O-])=O)C=C([N+]([O-])=O)C=C1[N+]([O-])=O OXNIZHLAWKMVMX-UHFFFAOYSA-N 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 1
- 229920000058 polyacrylate Chemical class 0.000 description 1
- 229920000768 polyamine Polymers 0.000 description 1
- 238000006068 polycondensation reaction Methods 0.000 description 1
- 150000004291 polyenes Chemical class 0.000 description 1
- 229920000921 polyethylene adipate Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920000193 polymethacrylate Polymers 0.000 description 1
- 150000008442 polyphenolic compounds Chemical class 0.000 description 1
- 235000013824 polyphenols Nutrition 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 239000005033 polyvinylidene chloride Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- HJWLCRVIBGQPNF-UHFFFAOYSA-N prop-2-enylbenzene Chemical compound C=CCC1=CC=CC=C1 HJWLCRVIBGQPNF-UHFFFAOYSA-N 0.000 description 1
- 239000000376 reactant Substances 0.000 description 1
- 239000000985 reactive dye Substances 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 230000007261 regionalization Effects 0.000 description 1
- 238000007142 ring opening reaction Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 150000003384 small molecules Chemical class 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 235000010339 sodium tetraborate Nutrition 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 125000003396 thiol group Chemical group [H]S* 0.000 description 1
- 210000001685 thyroid gland Anatomy 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- WBYWAXJHAXSJNI-VOTSOKGWSA-M trans-cinnamate Chemical compound [O-]C(=O)\C=C\C1=CC=CC=C1 WBYWAXJHAXSJNI-VOTSOKGWSA-M 0.000 description 1
- BSVBQGMMJUBVOD-UHFFFAOYSA-N trisodium borate Chemical compound [Na+].[Na+].[Na+].[O-]B([O-])[O-] BSVBQGMMJUBVOD-UHFFFAOYSA-N 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
［産業上の利用分野］
本発明は自動車内で使用される各種表示器、計器盤およ
びＣＲＴに代表されるテレビジョン受像機その他の画像
表示装置に取付けて、内部からの透過光の角度を制御し
たり、外光反射により透過画像の視認性が低下すること
を防止するために利用される遮光スクリーン構成体に関
するものである。Detailed Description of the Invention [Industrial Application Field] The present invention can be attached to various displays, instrument panels, television receivers such as CRTs, and other image display devices used in automobiles, and The present invention relates to a light-shielding screen structure used to control the angle of transmitted light and to prevent the visibility of transmitted images from decreasing due to reflection of external light.
［従来の技術とその問題点］
従来これらの遮光スクリーンとしては、種々のものが提
案されている０例えば特公昭５５−７５６２号公報には
、プラスチックの透明フィルムないしはシートからなる
光透過層及び光不透過層を、平行かつ交互に多数積層圧
着一体化してなるブロック体から、積層面に対して垂直
に切り出した遮光スクリーンが記載されている。[Prior art and its problems] Various types of light-shielding screens have been proposed in the past.For example, Japanese Patent Publication No. 7562/1983 discloses a light-transmitting layer made of a transparent plastic film or sheet, and a light-transmitting layer made of a transparent plastic film or sheet. A light-shielding screen is described, which is cut out perpendicularly to the laminated surface from a block body formed by laminating a large number of opaque layers in parallel and alternately and press-bonding them together.
しかしこのような遮光スクリーンは、その製造において
光透過層と光不透過層の幅や厚さを精度よくコントロー
ルすることが難しく、また切断面を平滑にする工程が必
要であり、安定的に遮光スクリーンを製造することは困
難である。However, it is difficult to accurately control the width and thickness of the light-transmitting layer and the light-opaque layer in manufacturing such a light-shielding screen, and a process of smoothing the cut surface is required to ensure stable light-shielding. Screens are difficult to manufacture.
これに対して、感光性樹脂組成物を利用した微細構造の
遮光スクリーンについては、特開昭５５−１３９２５０
号公報に記載されている。しかしこの遮光スクリーンで
は、微細隔壁がむき出しになっており、各種用途に使用
される際、器物により突起物の損傷が生じたり、またゴ
ミ・ホコリ等の異物の混入により透過率が低下する問題
がある。On the other hand, regarding a light-shielding screen with a fine structure using a photosensitive resin composition, Japanese Patent Application Laid-Open No. 55-139250
It is stated in the No. However, in this light-shielding screen, the fine partition walls are exposed, and when used for various purposes, the protrusions may be damaged by objects, and the transmittance may decrease due to foreign matter such as dirt and dust. be.
これに対して特開昭５７−８．９７０１号公報、特開昭
５７−１６５８０２号公報、特開昭５８−２１５８８０
号公服、特開閉ＥｉＯ−１２５８８０号公報には、透明
な樹脂で隔壁間隙を埋めたり、また透明シートを接着剤
により接着する方法が記載されている。しかし気泡が入
らないように樹脂で隔壁間隙を埋めることは難しく、ま
た接着剤が少なければ接着力が低く、接着剤が多ければ
隔壁間隙の中に接着剤が入り込み、透過光の散乱及び透
過率の低下の問題がある。On the other hand, JP-A-57-8.9701, JP-A-57-165802, JP-A-58-215880
Japanese Patent Publication No. EiO-125880 describes a method of filling the gap between partition walls with a transparent resin and bonding a transparent sheet with an adhesive. However, it is difficult to fill the gaps between the partition walls with resin to prevent air bubbles from entering, and if there is less adhesive, the adhesive force will be low, and if there is too much adhesive, the adhesive will enter the gaps between the partition walls, causing scattering of transmitted light and transmittance. There is a problem with the decline in
また実願昭［１Ｏ−１００１８６号公報には、遮光性を
有する整光部の周囲に同一厚みの遮光部を設けると共に
、周囲の遮光部のみで第二の透明基板と接着テープ等で
接着する方法が記載されている。しかしこの場合、各種
パターンの表示装置に応じた接着テープを用意しなけれ
ばならず、汎用性のある遮光スクリーン構成体を製造す
ることは困難である。Furthermore, in Jitsugan Sho [100186], a light shielding part of the same thickness is provided around a light adjusting part having a light shielding property, and only the surrounding light shielding part is bonded to a second transparent substrate with adhesive tape or the like. The method is described. However, in this case, it is necessary to prepare adhesive tapes suitable for display devices with various patterns, and it is difficult to manufacture a versatile light-shielding screen structure.
［問題点を解決するための手段及び作用］木発明者はこ
れらの問題点を解決するために鋭意努力した結果、本発
明に至ったものである。[Means and Actions for Solving the Problems] The inventor of the tree has made earnest efforts to solve these problems, and as a result has arrived at the present invention.
本発明は、感光性樹脂組成物を光硬化して得られる多数
の微細縞状または区画状隔壁から成り、かつ隣り合う隔
壁間隔または区画の最短内径が微少である遮光スクリー
ンを、２枚の光透過性基板でサンドイッチ状に挟み、隔
壁先端において接着剤を介して接着した遮光スクリーン
構成体であって、該接着剤に光硬化反応を利用した特殊
な接着剤を使用することにより接着剤層を薄くして通常
フィレットと呼ばれる接着剤の盛上り部を少なく抑え、
かつ接着部の強度を実用レベルに保持したもので、その
結果、透過光の散乱が抑制され、可視角の増大とヘイズ
の増大が防止され、かつ各種表示盤用銘板として使用す
る場合、断裁、打抜き時及び表示盤に装着使用時に剥離
のない遮光スクリーン構成体を提供するものである。The present invention provides a light shielding screen consisting of a large number of fine striped or partitioned partition walls obtained by photocuring a photosensitive resin composition, and in which the distance between adjacent partition walls or the shortest inner diameter of the partitions is minute. A light-shielding screen structure sandwiched between transparent substrates and bonded at the tip of the partition wall with an adhesive.The adhesive layer is formed by using a special adhesive that utilizes a photocuring reaction for the adhesive. By making it thinner and minimizing the raised part of the adhesive, which is usually called a fillet,
In addition, the strength of the adhesive part is maintained at a practical level, and as a result, the scattering of transmitted light is suppressed, and an increase in visible angle and haze is prevented. To provide a light-shielding screen structure that does not peel off when punched out or attached to a display panel.
本発明を図面によりさらに詳細に説明する。The present invention will be explained in more detail with reference to the drawings.
まず第１図に本発明の遮光スクリーン構成体の一例を示
す。第１図において、１は微細区画状隔壁よりなる遮光
スクリーン、２ａ、２ｂは光透過性基板である。First, FIG. 1 shows an example of the light-shielding screen structure of the present invention. In FIG. 1, reference numeral 1 indicates a light-shielding screen made up of partition walls in the form of fine sections, and reference numerals 2a and 2b indicate light-transmitting substrates.
第１図中における遮光スクリーン１は第２図に示すよう
に、そのスクリーン面に対して林立する多数の微細区画
状隔壁からなるものである。そしてこの微細隔壁は、感
光性樹脂組成物にネガを重ねて露光し、所定のパターン
に光硬化させた後、硬化反応を起こしていない部分を現
像液にて溶解除去することにより得られるものである。As shown in FIG. 2, the light-shielding screen 1 in FIG. 1 is composed of a large number of fine partition-like partition walls standing in a forest on the screen surface. These fine partition walls are obtained by overlaying a negative photosensitive resin composition and exposing it to light, photocuring it into a predetermined pattern, and then dissolving and removing the portions that have not undergone a curing reaction with a developer. be.
この微細隔壁の高さは遮光スクリーン１の厚さ、すなわ
ち感光性樹脂組成物層の厚さによって定まる。The height of the fine partition walls is determined by the thickness of the light shielding screen 1, that is, the thickness of the photosensitive resin composition layer.
なお微細隔壁のパターンとしては、公知の如く種々の形
状、例えば縞状、または格子状、円形、楕円形、五角形
、正方形、長方形、菱形、平行四辺形、ハニカム形状等
の区画状が適応できる。また微細隔壁が構成体全面に形
成されていてもよく、または円形、絵柄状に局部的に点
在し１周辺部が微細隔壁と同一厚さの遮光部で構成され
ていてもよい。As the pattern of the fine partition walls, various shapes as known in the art are applicable, for example, striped shapes, lattice shapes, circles, ellipses, pentagons, squares, rectangles, rhombuses, parallelograms, honeycomb shapes, and other partition shapes. Further, the fine partition walls may be formed on the entire surface of the structure, or may be locally scattered in a circular or pattern-like manner, and one peripheral portion may be constituted by a light shielding portion having the same thickness as the fine partition walls.
また隔壁の幅としては、狭すぎると隔壁形成が難しく、
広すぎると光透過率が低くなるため５〜５００ｇ、好ま
しくはｌＯ〜２００ｐが望ましい。また同様に隣り合う
隔壁間隔、または区画の最短内径も２０〜５００ｐ程度
が望ましい。Also, if the width of the partition wall is too narrow, it will be difficult to form the partition wall.
If it is too wide, the light transmittance will be low, so 5 to 500 g, preferably 10 to 200 p is desirable. Similarly, the distance between adjacent partition walls or the shortest inner diameter of the partitions is preferably about 20 to 500 p.
遮光スクリーン構成体の大きさは目的に応じて任意に変
化し得るが通常は５■角以上である。The size of the light-shielding screen structure can be arbitrarily changed depending on the purpose, but is usually 5 square inches or more.
遮光スクリーン構成体の製造においては、光透過性基板
を支持体とする支持体材の遮光スクリーンを使用する場
合と、支持体なしの遮光スクリーンを使用する場合があ
る。In manufacturing a light-shielding screen structure, a light-shielding screen made of a support material having a light-transmitting substrate as a support may be used, and a light-shielding screen without a support may be used.
支持体材の遮光スクリーンを製造する場合には、予め感
光性樹脂組成物と接着し得る接着剤層を塗布された光透
過性基板の表面に所望の厚さの感光性樹脂組成物を塗布
するか、あるいは感光性樹脂組成物よりなるシートを密
着し、次に所定のパターンを有するネガで覆い、ついで
アーク灯、水銀灯、キセノンランプ、紫外線用蛍光灯、
太陽光等の活性光線を用いてパターン形成露光した後、
ネガを取り除いて感光性樹脂組成物層の未露光部の除去
、すなわち現像を行う。When manufacturing a light-shielding screen as a support material, a photosensitive resin composition of a desired thickness is applied to the surface of a light-transmitting substrate that has been previously coated with an adhesive layer capable of adhering to the photosensitive resin composition. Alternatively, a sheet made of a photosensitive resin composition is closely attached and then covered with a negative having a predetermined pattern, and then an arc lamp, mercury lamp, xenon lamp, ultraviolet fluorescent lamp,
After pattern-forming exposure using active light such as sunlight,
The negative is removed and the unexposed areas of the photosensitive resin composition layer are removed, ie, developed.
この際形成されたレリーフすなわち隔壁の先端部分に、
光硬化性成分を残存させることが好ましい。このために
は感光性樹脂組成物の製版の際、露光、現像後、通常隔
壁部の強度を向上させるために行われる後露光を省略し
たり、弱い光線照射量にて後露光すればよい、または予
め感光性樹脂組成物中に染料、顔料等を含有せしめ、感
光特性を若干低下させた組成物を使用しても、隔壁先端
部の光硬化が完全に進行せずに、光硬化性成分の残存す
る遮光スクリーンを得ることが可能である。At this time, the relief formed, that is, the tip of the partition wall,
It is preferable that the photocurable component remains. To this end, during plate making of the photosensitive resin composition, after exposure and development, post-exposure that is usually performed to improve the strength of the partition wall portion may be omitted, or post-exposure may be performed with a weak amount of light irradiation. Alternatively, even if a photosensitive resin composition containing dyes, pigments, etc. in advance and using a composition whose photosensitivity has been slightly reduced, the photocuring of the partition wall tips does not proceed completely and the photocurable component It is possible to obtain a residual light-tight screen.
また隔壁先端部分に光硬化性成分を残存させるために、
感光性樹脂組成物としては、プレポリマーの主鎖中に不
飽和結合成分を含有するものが好ましい。In addition, in order to leave the photocurable component at the tip of the partition wall,
The photosensitive resin composition preferably contains an unsaturated bond component in the main chain of the prepolymer.
また形成されたＷ１ｍ隔壁を光不透過性とし、遮光特性
を付与するためには、後染色するかまたは、前述のよう
に予め感光性樹脂組成物中に染料、顔料を含有せしめる
ことにより可能である。In addition, in order to make the formed W1m partition walls light-opaque and impart light-shielding properties, it is possible to do so by post-dying or by incorporating dyes and pigments into the photosensitive resin composition in advance as described above. be.
ただし、この場合は感光性樹脂組成物の感光特性を著し
く低下させない程度の添加量とする必要がある。However, in this case, the amount added must be such that it does not significantly reduce the photosensitive properties of the photosensitive resin composition.
本発明に用いられる染料としては、カチオン染料、分散
染料、反応染料、酸性染料、直接染料、含金属染料等い
ずれも使用可能である。そしてこれらのう゛ち、分散染
料、含金属染料が耐候性の面から好ましく１．感光性樹
脂組成物との相溶性及び染料の吸収ヰ、ν性より選択す
るのが好ましい、また顔料に関しては、無機顔料、有機
顔料のいずれも使用可能であるが、感光性樹脂組成物中
での分散性の良好なものが好ましい。As the dye used in the present invention, any of cationic dyes, disperse dyes, reactive dyes, acid dyes, direct dyes, metal-containing dyes, etc. can be used. Among these, disperse dyes and metal-containing dyes are preferred from the viewpoint of weather resistance. It is preferable to select the pigment from the viewpoint of compatibility with the photosensitive resin composition and absorption properties of the dye.Although both inorganic pigments and organic pigments can be used, Those with good dispersibility are preferred.
第３図に実施例１における支持体材の遮光スクリーン使
用の場合の工程を示す。FIG. 3 shows the steps in Example 1 in which a light-shielding screen is used as the support material.
第３図（ａ）に示すように、透明なガラス板３上に所定
の図形を付したネガフィルム４、剥離フィルム５ａとし
てのポリプロピレンフィルム、感光性樹脂組成物６を積
層する。これに、あらかじめ作成しておいた光透過性基
板２ａとしてのポリエチレンテレフタレート、接着剤７
ａ、剥離フィルム５ｂとしてのポリプロピレンフィルム
の積層物より剥離フィルム５ｂを剥し、接着剤７ａを感
光性樹脂組成物６に密着させる〔第３図（ｂ） ） 、
次に第３図（ｂ）における透明なガラス板３側から活性
光線を照射して露光して光硬化させる。この光硬化は、
次の現像によって形成される隔壁の少なくとも先端部分
に光硬化成分が残存するように行なわれる０次いで、剥
離フィルム５ａを剥し、現像液にて未露光部分（光硬化
反応していない部分）を溶解除去することにより現像し
て、微細隔壁を形成した後、この微細隔壁を染色し、光
透過性基板２ａと微細隔壁とが接着剤７ａにより結合さ
れた支持体材の遮光スクリーンｌを得る〔第３図（ｄ）
〕。次に、剥離シー）５ｃを剥して、接着剤７ｂ／光透
過性基板２ｂの層構成の積層物を接着剤層７１］が遮光
スクリーンｌの微細隔壁の先端部に接するように圧着し
〔第３図（ｄ）〜（ｅ） ） 、次に活性光線を照射し
て、遮光スクリーンｌの隔壁先端部分と接着剤７ｂとを
接着させることにより遮光スクリーン構成体を得る。As shown in FIG. 3(a), a negative film 4 with a predetermined pattern attached thereto, a polypropylene film as a release film 5a, and a photosensitive resin composition 6 are laminated on a transparent glass plate 3. To this, polyethylene terephthalate as a light-transmissive substrate 2a prepared in advance and an adhesive 7 are added.
a. Peel off the release film 5b from the polypropylene film laminate serving as the release film 5b, and bring the adhesive 7a into close contact with the photosensitive resin composition 6 [FIG. 3(b)].
Next, active light is irradiated from the side of the transparent glass plate 3 in FIG. 3(b) for exposure and photocuring. This photocuring is
Next, the release film 5a is peeled off, and the unexposed areas (portions that have not undergone photocuring reaction) are dissolved in a developer. After removing and developing to form fine partitions, the fine partitions are dyed to obtain a light-shielding screen l of a support material in which the light-transmitting substrate 2a and the fine partitions are bonded by an adhesive 7a. Figure 3(d)
]. Next, the release sheet 5c is peeled off, and a laminate having a layer structure of adhesive 7b/light-transmitting substrate 2b is pressure-bonded so that the adhesive layer 71 is in contact with the tip of the fine partition wall of the light-shielding screen l. 3(d) to (e)) Next, actinic light is irradiated to bond the partition wall tip portion of the light-shielding screen l to the adhesive 7b, thereby obtaining a light-shielding screen structure.
ここで、光透過性基板２ｄの側について見ると、接着剤
７ａとして光硬化性接着剤を塗布した光透過性基板２ａ
と感光性樹脂組成物が、露光・光硬化の段階で接着され
、現像により未硬化の感光性樹脂が除去される。そのた
め接着剤７ａは遮光スクリーンｌの微細隔壁の間に入り
込むことがない。Here, looking at the side of the light-transmitting substrate 2d, the light-transmitting substrate 2a is coated with a photocurable adhesive as the adhesive 7a.
and a photosensitive resin composition are adhered during exposure and photocuring, and the uncured photosensitive resin is removed by development. Therefore, the adhesive 7a does not enter between the fine partition walls of the light shielding screen l.
また、光透過性基板２ｂの側について見ると、遮光スク
リーン１の微細隔壁の先端部分に、光硬化性成分を残存
せしめてあり、かつ接着剤７ｂとして、特開昭５８−１
７４９４５号公報に記載のイオン的付加反応によって三
次元的に重合し、かつ分子構造中に末端エチレン性不飽
和結合を有する重合体で形成されている。そのため接着
層の厚みを薄くさせ、遮光スクリーン１との圧着におい
て、接着剤の盛上りすなわちフィレットの形成が抑制さ
れると共に、活性光線を照射することにより、微細隔壁
先端と接着層が化学的に結合し、強固な接着力が得られ
る。Looking at the side of the light-transmitting substrate 2b, a photocurable component is left at the tips of the fine partition walls of the light-shielding screen 1, and as an adhesive 7b, a
It is formed from a polymer that is three-dimensionally polymerized by the ionic addition reaction described in Japanese Patent No. 74945 and has a terminal ethylenically unsaturated bond in its molecular structure. Therefore, by reducing the thickness of the adhesive layer and suppressing the buildup of the adhesive, that is, the formation of fillets when bonded to the light-shielding screen 1, and by irradiating the active light, the tips of the fine partition walls and the adhesive layer are chemically bonded. Bonds and provides strong adhesive strength.
支持体なしの遮光スクリーンを製造する場合にも、支持
体付遮光スクリーンの場合と同様な方法が採用されるが
、特開昭ＧＯ−１９５８４９号公報に記載されているよ
うに、支持体上の接着剤層は不要であり、パターン形成
露光された感光性樹脂組成物層のみとして未露光部の除
去を行うことにより、支持体なしの貫通部が独立した区
画状に形成された遮光スクリーンが製造される。なお支
持体なしの遮光スクリーンは、未露光部の除去が簡単で
あり、隔壁の厚みを厚くするのに有効である。In the case of manufacturing a light-shielding screen without a support, the same method as in the case of a light-shielding screen with a support is adopted, but as described in JP-A-195849, There is no need for an adhesive layer, and by removing only the unexposed part of the photosensitive resin composition layer that has been exposed to pattern formation, a light-shielding screen in which penetration parts are formed into independent compartments without a support is produced. be done. Note that the light-shielding screen without a support allows easy removal of unexposed areas, and is effective in increasing the thickness of the partition wall.
このような支持体なしの遮光スクリーンを使用する場合
には、第４図に示すように微細隔壁の両面に接着剤７ａ
、７ｂを介して、光透過性基板２ａ、２ｂを積層し活性
光線を照射して、反応を進め接着させることにより両面
の接着層で形成されるフィレットを抑制し、かつ接着部
での接着力の優れた本発明の遮光スクリーン構成体を得
ることができる。When using such a light shielding screen without a support, adhesive 7a is applied to both sides of the fine partition walls as shown in FIG.
, 7b, the light-transmitting substrates 2a and 2b are laminated and irradiated with actinic rays to advance the reaction and bond them, thereby suppressing the fillet formed by the adhesive layers on both sides and increasing the adhesive strength at the bonded portion. The light-shielding screen structure of the present invention having excellent properties can be obtained.
本発明に用いられる感光性樹脂組成物の代表に、エチレ
ン重合性不飽和基を有するプレポリマーと必要によりエ
チレン性不飽和単量体、光重合増感剤、熱重合禁止剤と
からなる組成物がある。上記プレポリマーとしては、不
飽和ポリエステル、不飽和ポリウレタン、オリゴエステ
ルアクリレート類、不飽和ポリアミド、不飽和ポリイミ
ド、不飽和ポリエーテル、不飽和ポリ（メタ）アクリレ
ート及びこれらの各種変性体、炭素−炭素二重結合を有
する各種ゴム化合物等を例示することができる。これら
のプレポリマーの数平均分子量は実質的に５００以上で
あるものを用いるのが一般的である。A representative example of the photosensitive resin composition used in the present invention is a composition comprising a prepolymer having an ethylenically polymerizable unsaturated group and, if necessary, an ethylenically unsaturated monomer, a photopolymerization sensitizer, and a thermal polymerization inhibitor. There is. Examples of the above prepolymers include unsaturated polyesters, unsaturated polyurethanes, oligoester acrylates, unsaturated polyamides, unsaturated polyimides, unsaturated polyethers, unsaturated poly(meth)acrylates, and various modified products thereof, and carbon-carbon dioxide. Examples include various rubber compounds having multiple bonds. These prepolymers generally have a number average molecular weight of substantially 500 or more.
さらに具体例を示すと、不飽和ポリエステル及びアルキ
ッドとしては例えばマレイン酸、フマル酸、イタコン酸
のような不飽和二塩基醜またはその酸無水物とエチレン
グリコール、プロピレングリコール、ジエチレングリコ
ール、トリエチレングリコール、グリセリン、トリメチ
ロールプロパン、ペンタエリトリット、末端水酸基を有
する１、４−ポリブタジェン、水添または非水添１．２
−ポリブタジエン５、ブタジェン−スチレン共重合体、
ブタジェン−アクリロニトリル共重合体などの多価アル
コールとのポリエステル、前記酸成分の一部をコハク酸
、アジピン酸、フタル酸、イソフタル酸、無水フタル酸
、トリメリット酸などの飽和多塩基酸に置き換えたポリ
エステルあるいは乾性油脂肪酸または半乾性油脂肪酸で
変性したポリエステルなどが、不飽和ポリウレタンとし
ては、すなわち２個以上の末端水酸基を有するポリオー
ルとポリイソシアネートから誘導されたウレタン基を介
して連結した化合物の末端インシアネート基あるいは水
酸基を利用して付加重合性不飽和基を導入したもの１例
えば前記した多価アルコール、ポリエステルポリオール
、ポリエーテルポリオールなどのポリオール末端水酸基
を有する、１，４−ポリブタジェン、水添または非水添
１．２−ポリブタジエン、ブタジェン−スチレン共重合
体、ブタジェン−アクリロニトリル共重合体とトルイレ
ンジインシアネート、ジフェニルメタン−４，４′−ジ
イソシアネート、ヘキサメチレンジイソシアネートなど
のポリイソシアネートとのポリウレタンの末端イソシア
ネートあるいは水酸基の反応性を利用して不飽和基を導
入したもの、すなわち、前記した不飽和カルボン酸また
はそのニスデルのうち水酸基、カルボキシル基、アミノ
基などの活性水素を有する化合物とイソシアネートとの
反応により不飽和基を導入したり、カルボキシル基を有
するものと水酸基との反応により不飽和基を導入した化
合物または前記の不飽和ポリエステルをポリイソシアネ
ートで連結した化合物などが、オリゴエステルアクリレ
ート類としては、すなわち多塩基酸と多価アルコールの
エステル反応系にアクリル酸またはメタクリル酸を共存
させて、共縮合させそれぞれのモル比を調整して分子量
２００〜５，０００程度としたもの、例えばアジピン酸
、フタル酸、イソフタル酸または酸無水物などとエチレ
ングリコール、プロピレングリコール、ジエチレングリ
コール、トリエチレングリコール、グリセリン、トリメ
チロールプロパン、ペンタエリトリットなどの多価アル
コールとのエステル反応系にアクリル酸またはメタクリ
ル酸を共存させて縮合させたもの、エポキシアクリレー
ト類、例えば多価アルコール、多価フェノールまたはポ
リフェノールとエピクロルヒドリンまたはアルキレンオ
キシドとの重縮合反応により得られるエポキシ基を有す
る化合物とアクリル酸またはメタクリル酸とのエスチル
、側鎖に付加重合性炭素−炭素二重結合を有する高分子
化合物、例えばポリビニルアルコール、セルロースのよ
うな水酸基をもつ高分子化合物と不飽和カルボン醜また
はその酸無水物とを反応させて得られる化合物や、アク
リル酸またはメタクリル酸の重合体または共重合体のよ
うなカルボキシル基をもつ高分子化合物に、不飽和アル
コール、グリシジルアクリレートまたはメタクリレート
をエステル結合させたもの、無水マレイン醜を含有する
共重合体とアリルアルコール、ヒドロキシアルキルアク
リレートまたはメタクリレートとの反応物など、グリシ
ジルアクリレートまたはメタクリレートを共重合成分と
して含有する共重合体とアクリル酸またはメタクリル酸
との反応物などを挙げることができる。また、各種ゴム
化合物としては、（Ｉ）１．４−ポリブタジェン、１．
２−ポリブタジェン、ブタジェン−スチレン共重合体、
ブタジェン−アクリロニトリル共重合体、ＥＰＤＭ、（
ＩＩ）上記（Ｉ）の水添化物、インブチレンイソプレン
共重合体、エチレンプロピレン共重合体そして、（１）
に示される各種ゴム以上の化合物に公知の技術によりエ
チレン性不飽和基を導入した不飽和変性ゴム等を例示で
きる。To give more specific examples, examples of unsaturated polyesters and alkyds include unsaturated dibasics such as maleic acid, fumaric acid, and itaconic acid, or their acid anhydrides, and ethylene glycol, propylene glycol, diethylene glycol, triethylene glycol, and glycerin. , trimethylolpropane, pentaerythritol, 1,4-polybutadiene with terminal hydroxyl groups, hydrogenated or non-hydrogenated 1.2
- polybutadiene 5, butadiene-styrene copolymer,
Polyesters with polyhydric alcohols such as butadiene-acrylonitrile copolymer, in which part of the acid component is replaced with saturated polybasic acids such as succinic acid, adipic acid, phthalic acid, isophthalic acid, phthalic anhydride, trimellitic acid, etc. Polyester or polyester modified with drying oil fatty acid or semi-drying oil fatty acid is used as an unsaturated polyurethane, i.e., a polyol having two or more terminal hydroxyl groups and a compound terminal linked via a urethane group derived from polyisocyanate. Polyols with addition-polymerizable unsaturated groups introduced using incyanate groups or hydroxyl groups 1 For example, polyols such as the above-mentioned polyhydric alcohols, polyester polyols, polyether polyols, etc. 1,4-polybutadiene, hydrogenated or Terminal isocyanate of polyurethane with non-hydrogenated 1,2-polybutadiene, butadiene-styrene copolymer, butadiene-acrylonitrile copolymer and polyisocyanate such as tolylene diisocyanate, diphenylmethane-4,4'-diisocyanate, hexamethylene diisocyanate Alternatively, an unsaturated group is introduced by utilizing the reactivity of a hydroxyl group, that is, a reaction between the above-mentioned unsaturated carboxylic acid or its Nisdel compound having an active hydrogen such as a hydroxyl group, a carboxyl group, or an amino group and an isocyanate. Oligoester acrylates include compounds into which an unsaturated group is introduced, or a compound into which an unsaturated group is introduced by reacting a carboxyl group with a hydroxyl group, or a compound in which the above-mentioned unsaturated polyester is linked with a polyisocyanate. Acrylic acid or methacrylic acid coexists in the ester reaction system of polybasic acid and polyhydric alcohol, and co-condensates to adjust the molar ratio of each to a molecular weight of about 200 to 5,000, such as adipic acid and phthalic acid. , by allowing acrylic acid or methacrylic acid to coexist in the ester reaction system of isophthalic acid or acid anhydride, etc., and polyhydric alcohol such as ethylene glycol, propylene glycol, diethylene glycol, triethylene glycol, glycerin, trimethylolpropane, pentaerythritol, etc. Condensation products, epoxy acrylates, such as polyhydric alcohols, polyhydric phenols, or compounds with epoxy groups obtained by polycondensation reaction of polyphenols with epichlorohydrin or alkylene oxide, and esters of acrylic acid or methacrylic acid, in the side chain Compounds obtained by reacting polymeric compounds with addition-polymerizable carbon-carbon double bonds, such as polyvinyl alcohol, polymeric compounds with hydroxyl groups such as cellulose, and unsaturated carboxylic acid or its acid anhydride, acrylic Polymer compounds with carboxyl groups such as acid or methacrylic acid polymers or copolymers with unsaturated alcohols, glycidyl acrylates or methacrylates ester bonded, copolymers containing maleic anhydride and allyl alcohol. , a reaction product with hydroxyalkyl acrylate or methacrylate, and a reaction product between a copolymer containing glycidyl acrylate or methacrylate as a copolymerization component and acrylic acid or methacrylic acid. In addition, various rubber compounds include (I) 1,4-polybutadiene, 1.
2-polybutadiene, butadiene-styrene copolymer,
Butadiene-acrylonitrile copolymer, EPDM, (
II) Hydrogenated product of (I) above, inbutylene isoprene copolymer, ethylene propylene copolymer, and (1)
Examples include unsaturated modified rubbers in which ethylenically unsaturated groups are introduced into compounds of the various rubbers shown in (1) and above using known techniques.
（Ｉ）の化合物はそのままでも使用できるが、該不飽和
基を導入するには、末端官能基を有する各種ゴム化合物
を用いるのが便利である。また、１．２−ポリブタジェ
ンセグメントを有するゴム化合物の場合は該化合物に無
水マレイン酸類を付加することにより、該不飽和基を容
易に導入できる。Although the compound (I) can be used as it is, in order to introduce the unsaturated group, it is convenient to use various rubber compounds having a terminal functional group. Further, in the case of a rubber compound having a 1,2-polybutadiene segment, the unsaturated group can be easily introduced by adding maleic anhydride to the compound.
エチレン性不飽和単量体としては、公知の種々の化合物
を使用できるが、このような化合物の例としては、アク
リル酸、メタクリル酸のような不飽和カルボン酸または
そのエステル、例えばアルキル−、シクロアルキル−、
ハロゲン化アルキル−、アルコキシアルキル−、ヒドロ
キシアルキル−、アミノアルキル−、テトラヒドロフル
フリル−、アリル−、グリシジル−、ベンジル−。Various known compounds can be used as the ethylenically unsaturated monomer, and examples of such compounds include unsaturated carboxylic acids such as acrylic acid and methacrylic acid, or esters thereof, such as alkyl-, cyclo-, Alkyl-,
Halogenated alkyl, alkoxyalkyl, hydroxyalkyl, aminoalkyl, tetrahydrofurfuryl, allyl, glycidyl, benzyl.
フェノキシ−７クリレート及びメタクリレート；アルキ
レングリコール、ポリオキシアルキレングリコールのモ
ノまたはジアクリレート及びメタクリレート、トリメチ
ロールプロパントリアクリレート及びメタクリレート、
ペンタエリトリットテトラアクリレート及びメタクリレ
ートなど、アクリルアミド、メタクリルアミドまたはそ
の誘導体、例えばアルキル、ヒドロキシアルキルでＮ−
Ｍ換またはＮ 、Ｎ’−置換したアクリルアミド及びメ
タクリルアミド、ジアセトンアクリルアミド及びメタク
リルアミド、 Ｎ、Ｎ’−アルキレンビスアクリルアミ
ド及びメタクリルアミドなど；アリル化合物、例えばア
リルアルコール、アリルイソシアネート、ジアリルフタ
レート、トリアリルシアヌレートなど；マレイン酸、無
水マレイン酸、フマル酸またはそのエステル、例えばア
ルキル、ハロゲン化アルキル、アルコキシアルキルのモ
ノまたはジマレエート及びフマレートなど；その他の不
飽和化合物、例えばスチレン、ビニルトルエン。Phenoxy-7 acrylates and methacrylates; mono- or diacrylates and methacrylates of alkylene glycols, polyoxyalkylene glycols, trimethylolpropane triacrylates and methacrylates;
Acrylamide, methacrylamide or derivatives thereof, such as pentaerythritol tetraacrylate and methacrylate, such as alkyl, hydroxyalkyl N-
M-substituted or N,N'-substituted acrylamides and methacrylamides, diacetone acrylamides and methacrylamides, N,N'-alkylene bisacrylamides and methacrylamides, etc.; allyl compounds such as allyl alcohol, allyl isocyanate, diallyl phthalate, triaryl such as lucyanurate; maleic acid, maleic anhydride, fumaric acid or esters thereof, such as alkyl, alkyl halide, alkoxyalkyl mono- or dimaleates and fumarates; other unsaturated compounds, such as styrene, vinyltoluene.
ジビニルベンゼン、Ｎ−ビニルカルバゾール、Ｎ−ビニ
ルピロリドンなどを挙げることができる。またこれらの
単量体の一部をアジド系化合物例えば４．４′−ジアジ
ドスチルベン、ｐ−フェニレン−ビスアジド、 ４．４
’−ジアジドベンゾフェノン、 ４．４’−ジアジドフ
ェニルメタン、 ４．４’−ジアジドカルコン、２，６
−ジ（４′−アジドボンザル）−シクロヘキサノン、
４．４’−ジアジドスチルボン−α−カルボン酸、 ４
．４’−ジアジドジフェニル、 ４．４’−ジアジドス
チルベン−２，２′−ジスルホン酸ソーダなどに置きか
えることができる。Examples include divinylbenzene, N-vinylcarbazole, and N-vinylpyrrolidone. In addition, some of these monomers may be converted into azide compounds such as 4.4'-diazidostilbene, p-phenylene-bisazide, 4.4
'-Diazidobenzophenone, 4.4'-diazidophenylmethane, 4.4'-diazidochalcone, 2,6
-di(4'-azidobonzal)-cyclohexanone,
4.4'-Diazidostilbone-α-carboxylic acid, 4
．． It can be replaced with 4'-diazido diphenyl, 4,4'-diazidostilbene-2,2'-sodium disulfonate, and the like.
これらの単量体はプレポリマー１００重量部に対し、０
〜２００重量部の範囲で添加すればよい。These monomers are used in an amount of 0 per 100 parts by weight of the prepolymer.
It may be added in a range of 200 parts by weight.
光重合増感剤としては公知の種々の光増感剤を使用し得
る。このようなものとして、例えばベンゾインやベンゾ
インエチルエーテル、ベンゾイン−ｎ−フロビルエーテ
ル、ベンゾイン−イソプロピルエーテル、ベンゾインイ
ソブチル−エーテルなどのベンゾインアルキルエーテル
類、２，２−ジメトキシ−２−フェニルアセトフェノン
、ペンツフェノン、ベンジル、ジアセチル、ジフェニル
スルフィド、エオシン、チオニンー９．１０−アントラ
キノン、２−エチル−９，１０−アントラキノン、ミヒ
ラーケトンなどがあり、組成物に対して、０．００１−
１０重量％の範囲で使用することができる。As the photopolymerization sensitizer, various known photosensitizers can be used. Examples of such substances include benzoin, benzoin alkyl ethers such as benzoin ethyl ether, benzoin-n-furoyl ether, benzoin-isopropyl ether, benzoin isobutyl-ether, 2,2-dimethoxy-2-phenylacetophenone, pentuphenone, These include benzyl, diacetyl, diphenyl sulfide, eosin, thionine-9,10-anthraquinone, 2-ethyl-9,10-anthraquinone, Michler's ketone, etc.
It can be used in a range of 10% by weight.
９重合禁止剤として、ハイドロキノン、モノ第三ブチル
ハイドロキノン、ベンゾキノン、２．５−ジフェニル−
ｐ−ベンゾキノン、ピクリン酸、ジ−ｐ−フルオロフェ
ニルアミン、ｐ−メトキシフェノール、２，６−ジ第三
ブチル−Ｐ−クレゾールなどをあげることができる。こ
れらの熱重合禁止剤は、熱重合反応（暗反応）を防止す
るものであることが望ましい、したがって、熱重合禁止
剤の添加量は。9 As a polymerization inhibitor, hydroquinone, mono-tert-butylhydroquinone, benzoquinone, 2.5-diphenyl-
Examples include p-benzoquinone, picric acid, di-p-fluorophenylamine, p-methoxyphenol, and 2,6-di-tert-butyl-p-cresol. It is desirable that these thermal polymerization inhibitors prevent thermal polymerization reactions (dark reactions). Therefore, the amount of thermal polymerization inhibitors to be added is as follows.
プレポリマーと架橋剤との総量に対し、０．００５〜５
．０重量％の範囲であることが望ましい、その他特公昭
４６−２９５２５号公報に示されるポリエンとポリチオ
ールと光増感剤より成る組成物も有用である。0.005 to 5 based on the total amount of prepolymer and crosslinking agent
．． Compositions comprising polyenes, polythiols, and photosensitizers as disclosed in Japanese Patent Publication No. 46-29525, which preferably have a content of 0% by weight, are also useful.
その他、ジアゾ系感光性樹脂組成物、例えば、芳香ジア
ゾニウム化合物を主成分とするジアゾレジンや、ジアジ
ド化合物とゴム系化合物との組成物、更にはケイ皮酸エ
ステル系の感光性樹脂組成物、更に特公昭５２−１４２
７７号公報、特公昭５２−１４２７８号公報等に示され
る光によりルイス酸を放出する化合物とオキシラン含有
化合物とよりなる感光性樹脂組成物を挙げることができ
る。In addition, diazo-based photosensitive resin compositions, such as diazoresins containing aromatic diazonium compounds as a main component, compositions of diazide compounds and rubber compounds, and cinnamate-based photosensitive resin compositions, as well as Kosho 52-142
Photosensitive resin compositions comprising a compound that releases a Lewis acid when exposed to light and an oxirane-containing compound are disclosed in Japanese Patent Publication No. 77, Japanese Patent Publication No. 52-14278, and the like.
また、本発明において、隔壁を粗面化し光の反射を防止
することは、例えばゴースト防止、光のもれ防止等に効
果があり、粗面化する方法としては感光性樹脂組成物へ
のつや消し剤を添加することが効果のある方法である。In addition, in the present invention, roughening the partition wall to prevent light reflection is effective in preventing ghosting, light leakage, etc., and a method for roughening the surface is matting the photosensitive resin composition. An effective method is to add an agent.
本発明に用いられるつや消し剤としては、酸化チタン、
雲母、炭酸カルシウム、粉末ガラス、（商品名ニゲラス
パール、粒子径５〜１５ｐ）、微粒子状シリカ（商品名
：サイロイド、エアロジルなどで粒子径０．５〜２０ｇ
）、アルミナ粉、クレー等があり、感光性樹脂組成物へ
の添加量は０．１〜２０重量％、好ましくは０．５〜１
０重量％である。その添加量が０．１重量％以下では、
外光を反射する効果がなく、また２０重量％以上では添
加のわりに表面を粗面化する効果が少なく、感光性樹脂
組成物の透明度も不良となり光の散乱による隔壁の解像
度の低下がある。また、その添加量は作成する隔壁側面
の粗面化の効果で決定され、後記の反射率測定方法によ
り測定した値で反射率２０％以下となるように行われる
。これらつや消し剤のうち、粒子状シリカが、分散性、
光屈折率等の点から好ましいつや消し剤である。The matting agent used in the present invention includes titanium oxide,
Mica, calcium carbonate, powdered glass, (product name: Nigelas Pearl, particle size 5-15p), fine particulate silica (product name: Thyroid, Aerosil, etc., particle size 0.5-20g)
), alumina powder, clay, etc., and the amount added to the photosensitive resin composition is 0.1 to 20% by weight, preferably 0.5 to 1% by weight.
It is 0% by weight. If the amount added is 0.1% by weight or less,
It has no effect of reflecting external light, and if it exceeds 20% by weight, the effect of roughening the surface is small even though it is added, and the transparency of the photosensitive resin composition is also poor, resulting in a decrease in the resolution of the partition walls due to light scattering. Further, the amount of addition thereof is determined by the effect of roughening the side surface of the partition wall to be created, and is carried out so that the reflectance is 20% or less as measured by the reflectance measurement method described later. Among these matting agents, particulate silica has good dispersibility and
It is a preferable matting agent from the viewpoint of optical refractive index and the like.
光透過性基板としては、透明なガラス、ポリメチルメタ
クリレート、ポリスチレン、ポリ塩化ビニル、ポリカー
ボネート、ポリプロピレン、ポリエチレンテレフタレー
ト、アセチルセルロース、ポリ塩化ビこリデン、エチレ
ン−酢酸ビニル共重合体、ポリアミド、ポリビニルアル
コール、ポリ−４−メチルペンテン等が挙げられ、その
厚さは通常１〜１０ｍ層のものであるが、プラスチック
の場合にはその厚さが２０井以上、好ましくは５０井以
上のフィルムまたはシートも用いることができる。Examples of the light-transmitting substrate include transparent glass, polymethyl methacrylate, polystyrene, polyvinyl chloride, polycarbonate, polypropylene, polyethylene terephthalate, acetyl cellulose, polyvinylidene chloride, ethylene-vinyl acetate copolymer, polyamide, polyvinyl alcohol, Examples include poly-4-methylpentene, and the thickness is usually 1 to 10 m, but in the case of plastic, a film or sheet with a thickness of 20 or more, preferably 50 or more is also used. be able to.
これらのうち、ポリメチルメタクリレート、ポリカーボ
ネート、ポリエチレンテレフタレート等が取扱い性の点
で好ましい。Among these, polymethyl methacrylate, polycarbonate, polyethylene terephthalate, etc. are preferred in terms of ease of handling.
光透過性基板の表面には、遮光スクリーンの隔壁先端部
に残存する光硬化性成分と接着し得る接着剤が塗布され
ていなければならない。The surface of the light-transmitting substrate must be coated with an adhesive capable of adhering to the photocurable component remaining at the tip of the partition wall of the light-shielding screen.
遮光スクリーンの微細隔壁先端と光透過性基板を圧着し
接着する際、光透過性基板に均一に塗布された接着剤が
微細隔壁の中にめり込み、通常フィレットと呼ばれる盛
上り部が生ずる。このフィレットの幅を５ル以下にする
必要がある。When the tips of the fine partition walls of the light-shielding screen and the light-transmitting substrate are bonded together by pressure bonding, the adhesive uniformly applied to the light-transmitting substrate sinks into the fine partition walls, creating a raised portion usually called a fillet. The width of this fillet needs to be 5 l or less.
フィレットの幅が５ｐ以上になると各種表示板として使
用する場合、透過光が散乱し、可視角の増大、ヘイズの
増大が生じ、要求機能が充分に満足し得ない、また、フ
ィレットの幅を少なくするために、接着層の厚みを薄く
すると接着面積が狭く、充分な接着力が得られない、接
着力としては、各種表示盤用銘板として使用する場合、
断裁、打抜き加工時及び表示盤に装着使用時に剥離のな
いことが必要であり、＊Ｍ隔壁と光透過性基板との剥離
強度は、少なくとも５０ｇ／ｃｓ＋以上が必要である。If the width of the fillet exceeds 5p, when used as various display boards, transmitted light will be scattered, the visible angle will increase, and the haze will increase, making it impossible to fully satisfy the required functions. Therefore, if the thickness of the adhesive layer is made thin, the adhesive area will be small and sufficient adhesive force will not be obtained.
It is necessary that there is no peeling during cutting, punching, and mounting on a display panel, and the peel strength between the *M partition and the light-transmitting substrate must be at least 50 g/cs+.
なお剥離強度はＪＩＳ Ｋ６８５４に準じて、１８０度
剥離、引張速度５０ｍｍ／ｗｉｎ、で測定する。The peel strength is measured according to JIS K6854 at a 180 degree peel and a tensile speed of 50 mm/win.
このため本発明に使用される接着剤としては。Therefore, as an adhesive used in the present invention.
特開昭５８−１７４９４５号公報に記載のように、イオ
ン的付加反応によって三次元的に重合し、かつ分子構造
中に末端エチレン性不飽和結合を有する重合体で形成さ
れたものが望ましい。As described in JP-A-58-174945, it is desirable to use a polymer that is three-dimensionally polymerized by an ionic addition reaction and has a terminal ethylenically unsaturated bond in its molecular structure.
ここでいうイオン的付加反応とは、低分子量化合物の脱
離なしに求核または求電子的に官能基が互いに結合する
反応をいう、このような反応は、活性水素を有する官能
基とこれによってイオン的に付加されうる官能基との反
応であって、例えばウレタン化反応及びエポキシ開環反
応等を挙げることができる。The ionic addition reaction referred to here refers to a reaction in which functional groups bond to each other nucleophilically or electrophilically without elimination of a low molecular weight compound.Such a reaction is a reaction in which functional groups with active hydrogen and Reactions with functional groups that can be ionically added include, for example, urethanization reactions and epoxy ring-opening reactions.
本発明で用いる、構造中に末端エチレン性不飽和結合を
有する、イオン的付加反応の繰り返しによって三次元的
に重合した重合体は、例えば（Ａ）活性水素をもった官
能基を複数個有する化合物、
（Ｂ）活性水素をもつ官能基によってイオン的に付加さ
れうる官能基を複数個有する化合物、及び（Ｃ）イオン
的付加反応に関与する官能基と末端エチレン性不飽和結
合を同時に有する化合物の３種の化合物を触媒の存在下
または不存在下に反応させることにより得られる。The polymer used in the present invention, which has a terminal ethylenically unsaturated bond in its structure and is three-dimensionally polymerized by repeated ionic addition reactions, is, for example, (A) a compound having a plurality of functional groups having active hydrogen. , (B) a compound having a plurality of functional groups that can be added ionically by a functional group having active hydrogen, and (C) a compound having a functional group that participates in an ionic addition reaction and a terminal ethylenically unsaturated bond at the same time. It is obtained by reacting three types of compounds in the presence or absence of a catalyst.
上記（Ａ）に属する化合物としては、例えばポリオール
、ポリチオール、ポリアミン等を挙げることができ、（
Ｂ）に属する化合物としては、例えば有機多価インシア
ネート、有機多価イソチオシアネート、多価エポキシ化
合物等を挙げることができる。また、（Ｃ）に属する化
合物は、末端エチレン性不飽和結合ＣＨ２−Ｃぐとイオ
ン的付加反応に関与する官能基を分子中に有するもので
１例えばアクリロイル基、メタクリロイル基、アリル基
またはビニロキシ基（ＣＨｚ＝ＣＨ−０−）等の末端エ
チレン性不飽和結合を有する基の少なくとも１個と水酸
基、アミノ基、チオール基、イソシアネート基、イソチ
オシアネート基またはエポキシ基等のイオン的付加反応
に関与する官能基の少なくとも１個を分子中に有するも
のである。そのような化合物としては、例えばトリメチ
ロールプロパンのモノまたはジ−メタクリレートやアク
リレート、ペンタエリスリトールのモノ、ジあるいはト
リーメタクリレートやアクリレート、一般弐〇〇（ＧＨ
２−ＧＨＱ）ｎＨ（式中のＲは水素または炭素数１〜４
のアルキル基で、ｎはＩ Ｎ１０００の整数）で表わさ
れるジオール類のモノメタクリレートやアクリレート、
２−ヒドロキシエチルアミンのメタクリレートやアクリ
レート、Ｎ−７ミノエチルアクリルアミド、Ｎ−アミン
へキシルアクリルアミド等を挙げることができるが、分
子中にイオン的に付加反応に関与する官能基と末端エチ
レン性不飽和結合基をそれぞれ１個以上有する化合物は
実質的にすべて使用できる。Examples of compounds belonging to the above (A) include polyols, polythiols, polyamines, etc.
Examples of compounds belonging to B) include organic polyvalent incyanates, organic polyvalent isothiocyanates, and polyvalent epoxy compounds. Compounds belonging to (C) have a functional group in the molecule that participates in the ionic addition reaction of the terminal ethylenically unsaturated bond CH2-C, such as an acryloyl group, a methacryloyl group, an allyl group, or a vinyloxy group. Participates in an ionic addition reaction between at least one group having a terminal ethylenically unsaturated bond such as (CHz=CH-0-) and a hydroxyl group, an amino group, a thiol group, an isocyanate group, an isothiocyanate group, or an epoxy group. It has at least one functional group in its molecule. Examples of such compounds include mono- or di-methacrylates and acrylates of trimethylolpropane, mono-, di- or tri-methacrylates and acrylates of pentaerythritol, and general 200 (GH
2-GHQ) nH (R in the formula is hydrogen or has 1 to 4 carbon atoms
monomethacrylates and acrylates of diols represented by an alkyl group (n is an integer of IN1000),
Examples include methacrylate and acrylate of 2-hydroxyethylamine, N-7 minoethyl acrylamide, N-amine hexylacrylamide, etc., but they contain functional groups that participate in ionic addition reactions in the molecule and terminal ethylenically unsaturated bonds. Substantially any compound having one or more groups can be used.
本発明における接着剤層を形成させる重合体を製造する
場合、上記（Ａ）、 （１３）及び（Ｃ）の各化合物は
それぞれ１種でもよいし、２種以上を組み合わせて使用
することもできる。その場合、本発明で用いる接着性重
合体は三次元的に重合していることが重要であるから、
使用する化合物の少なくとも１種はイオン的付加反応に
関与する官能基を３個以上有していることが必要である
。また、反応成分において、活性水素をもつ官能基の合
計数と活性水素をもつ官能基によってイオン的に付加さ
れうる官能基の合計数との比は０．５〜２の範囲から通
常選ばれるが、その比が１に近いほど好ましく、三次元
重合体のより大きい分子量及びより優れた接着性の反応
物を得ることができる。When producing the polymer for forming the adhesive layer in the present invention, each of the above compounds (A), (13) and (C) may be used alone or in combination of two or more. . In that case, it is important that the adhesive polymer used in the present invention is three-dimensionally polymerized;
It is necessary that at least one of the compounds used has three or more functional groups that participate in the ionic addition reaction. In addition, in the reaction components, the ratio of the total number of functional groups having active hydrogen to the total number of functional groups that can be ionically added by the functional groups having active hydrogen is usually selected from the range of 0.5 to 2. , the closer the ratio is to 1, the better, and a reactant with a higher molecular weight and better adhesion of the three-dimensional polymer can be obtained.
また、イオン的付加反応に関与する官能基を３個以上有
する化合物は、全体の５ ｍａｉｍ以上用いることが必
要である。５ｍｏＨ未満では十分な三次元重合体が得ら
れないので不都合である。好ましくは３０層ｏ１＄Ｊ！
上が用いられる。Further, it is necessary to use a compound having three or more functional groups involved in an ionic addition reaction in a total of 5 or more. If it is less than 5 moH, a sufficient three-dimensional polymer cannot be obtained, which is disadvantageous. Preferably 30 layers o1$J!
The top is used.
また、必要に応じて、化合物（Ａ）または（Ｂ）の一部
をイオン的付加反応に関与する官能基を１つだけもった
化合物におきかえてもよいが、このような部分置換は２
０％以下に抑えることが好ましい。Furthermore, if necessary, a part of compound (A) or (B) may be replaced with a compound having only one functional group that participates in the ionic addition reaction, but such partial substitution
It is preferable to suppress it to 0% or less.
本発明におけるイオン的付加反応による三次元的重合は
化合物（Ａ）及び（Ｂ）を混合接触状態で。In the three-dimensional polymerization by ionic addition reaction in the present invention, compounds (A) and (B) are mixed in a contact state.
例えば１〜３週間、加温下にエージングすることにより
得られる。（Ｃ）のイオン的付加反応に関与する官能基
の末端エチレン性不飽和結合を同時に分子内に有する化
合物は、イオン的付加反応によって得られる三次元的重
合体の分子構造中に末端エチレン性不飽和結合を導入す
るために使用される。その使用量は通常全体の０．１ｇ
ｏ１％以上、好ましくは２ｍｏｌ＄以上である。For example, it can be obtained by aging under heating for 1 to 3 weeks. (C) Compounds that simultaneously have a terminal ethylenically unsaturated bond in the molecule of the functional group participating in the ionic addition reaction have a terminal ethylenically unsaturated bond in the molecular structure of the three-dimensional polymer obtained by the ionic addition reaction. Used to introduce saturated bonds. The amount used is usually 0.1g of the whole
o1% or more, preferably 2 mol$ or more.
上記の接着剤は、光透過性基板の表面に通常０．５〜１
００ｐの厚さに塗布される。これより薄いと接着力が不
十分となり、厚すざると得られた遮光スクリーン構成体
の透過光の散乱が生じたり。The above adhesive is usually applied to the surface of the light-transmitting substrate by 0.5 to 1
It is applied to a thickness of 00p. If it is thinner than this, the adhesive strength will be insufficient, and if it is thicker, the light transmitted through the resulting light-shielding screen structure will be scattered.
透過率の低下が起こる。実用上好ましい厚さは１〜５０
ＩＬである。A decrease in transmittance occurs. Practically preferred thickness is 1 to 50
It is IL.
また本発明に用いられる接着剤に公知の光重合開始剤を
１例えば０．１−１０重量％含有させてもよい。しかし
光重合開始剤が接着剤中に存在すると、接着力が向上す
る反面、保存中や取扱い中に光を受けると接着剤重合体
の末端エチレン性不飽和結合間で反応し、隔壁との接着
力に悪影響を与えるので、扱いを慎重にしなければなら
ない。Further, the adhesive used in the present invention may contain, for example, 0.1-10% by weight of a known photopolymerization initiator. However, when a photopolymerization initiator is present in the adhesive, it improves adhesive strength, but when exposed to light during storage or handling, it reacts between the terminal ethylenically unsaturated bonds of the adhesive polymer, resulting in poor adhesion to the partition walls. It has a negative effect on power, so it must be handled with care.
また本発明の接着剤には、公知の熱重合防止剤を含有さ
せることができ、貯蔵中などにおける接着剤重合体の末
端エチレン性不飽和結合の反応による変質を効果的に防
ぐことができる。なお、支持体付遮光スクリーンを得る
ための接着剤も同様なものが使用できる。Furthermore, the adhesive of the present invention can contain a known thermal polymerization inhibitor, and can effectively prevent deterioration due to reaction of terminal ethylenically unsaturated bonds of the adhesive polymer during storage. Note that the same adhesive can be used to obtain the light-shielding screen with a support.
また本発明において、遮光スクリーンの隔壁と光透過性
基板とを圧着させるには、ラミネーターを用いることが
できる。更に両者を均一に密着させるために、ラミネー
ターのロールを４０〜１００℃に加温することが効果的
である。Further, in the present invention, a laminator can be used to pressure-bond the partition wall of the light-shielding screen and the light-transmitting substrate. Furthermore, in order to uniformly adhere the two, it is effective to heat the roll of the laminator to 40 to 100°C.
次に圧着された構成体にアーク灯、水銀灯、キセノンラ
ンプ、紫外線用蛍光灯等の活性光線を照射させることに
より、遮光スクリーンの隔壁先端部分と光透過性基板が
接着される。この場合接着を効率的に行うためには、光
透過性基板側より活性光線を照射することが有効である
。Next, the crimped structure is irradiated with actinic light from an arc lamp, mercury lamp, xenon lamp, ultraviolet fluorescent lamp, etc., thereby bonding the partition wall tip portion of the light-shielding screen and the light-transmitting substrate. In this case, in order to perform adhesion efficiently, it is effective to irradiate actinic light from the light-transmissive substrate side.
この両者の接着性については、通常の接着剤の圧着だけ
でなく、活性光線の照射により、隔壁先端部分に残存す
る光硬化性成分と、ｖｃ着剤とが化学的に結合されるも
のと推測される。その結果通常の接着剤と異なり、はと
んど流動性を示さない固体状の接着剤層としたり、また
薄い接着層としても強固な接着力が得られるようになっ
た。その結果各種の用途に使用する際、断裁、打抜きを
行っても剥離がなく、また接着剤層として固体状や非常
に薄い接着剤層を用いることができるため、隔壁先端部
以外への接着剤のはみ出しもなく、遮光スクリーンとし
ての特性１例えば遮光性、光線透過率、視認性などを損
うことなく、スイッチ類等の各種表示盤に使用する際要
求される機械的特性、および光学的特性を兼ね備えた遮
光スクリーン構成体が得られる。Regarding the adhesion between the two, it is assumed that the photocurable component remaining at the tip of the partition wall and the VC adhesive are chemically bonded by not only the normal pressure bonding of the adhesive but also the irradiation with actinic rays. be done. As a result, unlike ordinary adhesives, it has become possible to create a solid adhesive layer that exhibits almost no fluidity, and it has become possible to obtain strong adhesive strength even as a thin adhesive layer. As a result, when used for various purposes, there is no peeling even when cutting or punching, and a solid or very thin adhesive layer can be used as an adhesive layer. There is no protrusion, and the properties as a light-shielding screen (1) such as light-shielding properties, light transmittance, visibility, etc. are not impaired, and the mechanical properties and optical properties required when used in various display panels such as switches etc. A light-shielding screen structure having both of the following can be obtained.
［実施例］ 次に実施例を挙げて本発明を説明する。なお。[Example] Next, the present invention will be explained with reference to Examples. In addition.
以下の記載において重量部は部と記載する。In the following description, parts by weight are expressed as parts.
実施例１
プロピレングリコール、ジエチレングリコール、アジピ
ン酸、フマール酸、イソフタル酸をモル比０．０８１０
．３４１０．２８１０．１４１０．１６の割合で縮合さ
せて得た不飽和ポリエステル樹脂１００部に２−とドロ
キシエチルメタクリレート１２部、ジアセトンアクリル
アミド６部、ジエチレングリコールジメタクリレート１
２部、テトラメチレングリコールジメタクリレート３０
部、ベンゾインイソブチルエーテル４部、２，６−ジー
ｔ−ブチルクレゾール０．０５部を加えて感光性樹脂組
成物を得、さらにこの組成物に微粉末シリカ５部を加え
てつや消し割合有感光性樹脂組成物を製造した。Example 1 Propylene glycol, diethylene glycol, adipic acid, fumaric acid, and isophthalic acid at a molar ratio of 0.0810
．． 100 parts of unsaturated polyester resin obtained by condensation in the ratio of 3410.2810.1410.16, 12 parts of 2- and droxyethyl methacrylate, 6 parts of diacetone acrylamide, and 1 part of diethylene glycol dimethacrylate.
2 parts, tetramethylene glycol dimethacrylate 30
1 part, 4 parts of benzoin isobutyl ether, and 0.05 part of 2,6-di-t-butyl cresol were added to obtain a photosensitive resin composition, and further, 5 parts of finely powdered silica was added to this composition to obtain a matte percentage photosensitive resin composition. A resin composition was produced.
次に二液性ウレタン系接着剤（ポリエステルポリオール
とポリイソシアネートの混合物）９０．７部、ポリプロ
ピレングリコールモノメタクリレート４部、２．２−ジ
メトキシ−２−フェニルアセトフェノン５部、２，６−
ジーｔ−ブチルクレゾール０．３部をメチルエチルケト
ンにより希釈混合して接着剤組成物を得た後、ナイフコ
ーターにより１７５牌のポリエチレンテレフタレートフ
ィルム上にこの接着剤組成物を塗布し、８０℃で加熱乾
燥した後２０弘のポリプロピレンフィルムを接着剤層上
にラミネートした。これを４０℃で１週間エージングを
行い、ウレタン化反応を完結させて厚さ５ｐの接着層を
有する光透過性基板を得た。Next, 90.7 parts of a two-component urethane adhesive (a mixture of polyester polyol and polyisocyanate), 4 parts of polypropylene glycol monomethacrylate, 5 parts of 2,2-dimethoxy-2-phenylacetophenone, and 2,6-
After diluting and mixing 0.3 parts of di-t-butyl cresol with methyl ethyl ketone to obtain an adhesive composition, this adhesive composition was applied onto 175 tiles of polyethylene terephthalate film using a knife coater and dried by heating at 80°C. After that, a 20-layer polypropylene film was laminated onto the adhesive layer. This was aged at 40° C. for one week to complete the urethane reaction, thereby obtaining a light-transmitting substrate having an adhesive layer with a thickness of 5p.
次に厚さ１０＋ｕｓの透明なガラス板上に、非透明部が
短径１５０ルの正六角形で、隣接する正六角形が各辺に
平行に位置し、それぞれ３０ｐの透明部の間隔を保持し
た図柄を有するネガフィルム及び厚さ２２終のポリプロ
ピレンフィルムを重ね合わせ、その上に前記つや消し割
合有感光性樹脂組成物をドクターナイフを用いて１５０
牌の厚さに塗布した。Next, on a transparent glass plate with a thickness of 10+us, a pattern is created in which the non-transparent part is a regular hexagon with a minor axis of 150 l, the adjacent regular hexagons are located parallel to each side, and the interval between the transparent parts is maintained at 30 p. A negative film with a thickness of 22 mm and a polypropylene film with a thickness of 22 mm are superimposed, and the photosensitive resin composition with a matte ratio of 150 mm is applied thereon using a doctor knife.
It was applied to the thickness of the tiles.
次に前記光透過性基板のポリプロピレンフィルムをΔぎ
取り、接着剤層と感光性樹脂組成物層が接するようにゴ
ムロールを用いて密着ラミネートし、感光性樹脂板を作
成した。この感光性樹脂板をネガフィルムを通して、２
ＫＷの水銀ショートアークランプを用いた平行光線を２
０秒間露光してハニカム形状に光硬化させた。露光終了
後感光性樹脂板よりポリプロピレンフィルムを取除いて
、液温４０℃の弱アルカリ溶液（ホウ酸ソーダ１％水溶
液）をスプレ一方式により吹付けて非露光部の樹脂組成
物の除去、即ち現像を行った。現像後の版を水洗及び乾
燥を行った後、４５℃に加温した１重量％の分散染料（
日本化薬製、商品名：Ｋａｙａｋａｌａｎ Ｂｌｕｅ
Ｂｌａｃｋ ＲＬ ）を含んだ湯浴中に３０分間浸漬し
て染色をし、水洗及び乾燥を行って支持体付の遮光スク
リーンを製造した。Next, the polypropylene film of the light-transmitting substrate was removed by Δ, and the adhesive layer and the photosensitive resin composition layer were closely laminated using a rubber roll so that the adhesive layer and the photosensitive resin composition layer were in contact with each other, thereby producing a photosensitive resin plate. Pass this photosensitive resin plate through a negative film,
2 parallel beams using KW's mercury short arc lamp
It was exposed to light for 0 seconds and photocured into a honeycomb shape. After the exposure, the polypropylene film was removed from the photosensitive resin plate, and a weak alkaline solution (1% aqueous solution of sodium borate) at a temperature of 40°C was sprayed to remove the resin composition in the non-exposed areas, i.e. I developed it. After washing and drying the plate after development, 1% by weight of disperse dye (
Made by Nippon Kayaku, product name: Kayakalan Blue
Black RL) was immersed in a hot water bath for 30 minutes for dyeing, washed with water, and dried to produce a light-shielding screen with a support.
次に前述の光透過性基板と同一のものを光透過性基板と
して用い、ポリプロピレンフィルムを剥ぎ取り、先に製
造した遮光スクリーンとラミネーターを用いて圧着した
。この圧着物に第３図（ｅ）における光透過性基板２ｂ
側より、４ＫＷの超高圧水銀灯を２分間照射して遮光ス
クリーン構成体を得た。この遮光スクリーン構成体の光
透過性基板の接着層により生じたフィレットの幅は２終
未満であり、また剥離強度は１５０ｇ／ａｓであった。Next, using the same light-transmitting substrate as the above-mentioned light-transmitting substrate, the polypropylene film was peeled off, and the light-shielding screen manufactured previously was bonded to the light-shielding screen using a laminator. The light-transmitting substrate 2b in FIG. 3(e) is attached to this crimped object.
A 4KW ultra-high pressure mercury lamp was irradiated from the side for 2 minutes to obtain a light-shielding screen structure. The width of the fillet formed by the adhesive layer of the light-transmitting substrate of this light-shielding screen structure was less than 2 ends, and the peel strength was 150 g/as.
この遮光スクリーン構成体に抜き字印刷を施し、プレス
金型により打抜きを行った後、自動車スイッチ用表示盤
に貼付けて使用した結果、剥れがなく透過光の散乱、透
過率の低下も問題なく、遮光スクリーン構成体としての
機能が満足された。This light-shielding screen structure was printed with letters and punched out using a press die, and when used by pasting it on an automobile switch display panel, there was no peeling, and there was no problem with the scattering of transmitted light or a decrease in transmittance. , the function as a light-shielding screen structure was satisfied.
実施例２
実施例１の感光性樹脂組成物１００部に予め分散染料（
日本化薬製、商品名： Ｋａｙａｋａｌａｎ Ｂｌｕｅ
Ｂｌａｃｋ ＲＬ）を０．４部添加した感光性樹脂組成
物を用い、露光時間を６０秒とし、現像、水洗、乾燥後
に、４ＫＷの超高圧水銀灯を１分間後露光した以外は、
実施例１と全く同様な方法で遮光スクリーン・構成体を
製造した。この遮光スクリーン構成体の光透過性基板の
接着層により生じたフィレットの幅は１終であり、また
剥離強度は１０３ｇ／ＣＭであった。これに抜き字印刷
を施し、プレス金型により打抜きを行ったが剥れがなく
、自動車スイッチ用表示盤に貼付けて使用した結果、透
過光の散乱、透過率の低下も問題なく、支持体付の遮光
スクリーン構成体としての機能が満足された。Example 2 100 parts of the photosensitive resin composition of Example 1 was added with a disperse dye (
Manufactured by Nippon Kayaku, product name: Kayakalan Blue
A photosensitive resin composition to which 0.4 parts of Black RL) was added was used, the exposure time was 60 seconds, and after development, water washing, and drying, a 4KW ultra-high pressure mercury lamp was used for post-exposure for 1 minute.
A light-shielding screen/structure was manufactured in exactly the same manner as in Example 1. The width of the fillet formed by the adhesive layer of the light-transmitting substrate of this light-shielding screen structure was 1, and the peel strength was 103 g/CM. This was printed with cut-out characters and punched out using a press mold, but it did not peel off, and when used on an automobile switch display panel, there was no problem with scattering of transmitted light or decrease in transmittance. The function as a light-shielding screen structure was satisfied.
実施例３
ポリエチレンアジペート（ジオール、分子量２．０００
） ２００部にトリレンジイソシアネート３５部、ジ
ブチルラウレー） ０．５部を加えて７０℃で２時間反
応させ、ついでこれにエチレンオキシド、プロピレンオ
キシド共重合体（エチレンオキシド３５重量％含有ブロ
ック共重合体ジオール、分子量２，０００ ） １００
部を加えて反応させ、両末端にインシアネート基を有す
るブロック共重合体を得た。この重合体３００部に２−
シトロキシエチルメタクリレート２５部、ハイドロキノ
ン０．１部を加え、７０℃、２時間反応させてポリマー
を作成した。このポリマー３００部に、２−ヒドロキシ
プロピルメタアクリレート７５部、２−エチルへキシル
アクリレート１５部、ｎ−ブチルアクリレート３０部、
ベンゾインエチルエーテル６部を加え、混合して感光性
樹脂組成物を製造した。Example 3 Polyethylene adipate (diol, molecular weight 2.000
) To 200 parts, 35 parts of tolylene diisocyanate and 0.5 parts of dibutyllaure were added and reacted at 70°C for 2 hours. , molecular weight 2,000) 100
A block copolymer having incyanate groups at both ends was obtained. 2- to 300 parts of this polymer
25 parts of citroxyethyl methacrylate and 0.1 part of hydroquinone were added and reacted at 70°C for 2 hours to prepare a polymer. To 300 parts of this polymer, 75 parts of 2-hydroxypropyl methacrylate, 15 parts of 2-ethylhexyl acrylate, 30 parts of n-butyl acrylate,
6 parts of benzoin ethyl ether was added and mixed to produce a photosensitive resin composition.
この感光性樹脂組成物を使用し、光透過性基板としてポ
リエチレンテレフタレートの代りに、厚さ３００ ｇの
ポリカーボネートを使用した以外は。This photosensitive resin composition was used, except that polycarbonate with a thickness of 300 g was used instead of polyethylene terephthalate as a light-transmissive substrate.
実施例１と全く同様な方法により遮光性スクリーン構成
体を得た。この遮光性スクリーン構成体の光透過性基板
により生じたフィレットの幅は２終未満であり、また剥
離強度は７５ｇ／ａｍであった。これをプレス金型にて
打抜きを行ったが剥れもなく、遮光スクリーン構成体と
して充分に使用に耐えるものであった。A light-shielding screen structure was obtained in exactly the same manner as in Example 1. The width of the fillet formed by the light-transmitting substrate of this light-shielding screen structure was less than 2 ends, and the peel strength was 75 g/am. This was punched out using a press mold, but there was no peeling, and it was sufficiently usable as a light-shielding screen structure.
実施例４
光透過性支持体として、接着剤層のないポリエチレンテ
レフタレートフィルム単体を用いた以外は、実施例３と
同様な方法で感光性樹脂層のパターン露光を行った。露
光終了後ポリプロピレンフィルムと共にポリエチレンテ
レフタレートフィルムを剥し、感光性樹脂層のみとして
未露光部の除去を行って支持体なしの遮光スクリーンを
製造した。その後遮光スクリーンの両面に実施例３と同
様な方法で光透過性基板と接着し、遮光スクリーン構成
体を得た。この遮光スクリーン構成体の光透過性基板の
接着により生じたフィレットの幅は２終であり、また剥
離強度は８３ｇ／ｃｍであった。これをプレス金型にて
打抜きを行ったが剥れもなく、遮光スクリーン構成体と
して充分に使用に耐えるものであった。Example 4 Pattern exposure of a photosensitive resin layer was carried out in the same manner as in Example 3, except that a single polyethylene terephthalate film without an adhesive layer was used as a light-transmissive support. After the exposure, the polyethylene terephthalate film was peeled off along with the polypropylene film, and the unexposed area was removed leaving only the photosensitive resin layer to produce a light-shielding screen without a support. Thereafter, light-transmitting substrates were adhered to both sides of the light-shielding screen in the same manner as in Example 3 to obtain a light-shielding screen structure. The width of the fillet produced by adhesion of the light-transmitting substrate of this light-shielding screen structure was 2 mm, and the peel strength was 83 g/cm. This was punched out using a press mold, but there was no peeling, and it was sufficiently usable as a light-shielding screen structure.
比較例に
液性ポリウレタン系接着剤（ポリエステルポリオールと
ポリイソシアネートの混合物）を溶剤に希釈した後、ナ
イフコーターにより１７５ ｇのポリエチレンテレフタ
レートフィルム上にこの接着剤を塗布し、８０℃で加熱
乾燥し、厚さ５ＪＬの接着層を有する光透過性基板を得
た０次に実施例２と全く同じ方法で遮光スクリーンを得
た。この両者をラミネートしたところ、接着層により生
じたフィレットは５ＩＬ以下となったが、両者は全く接
着しなかった。In a comparative example, a liquid polyurethane adhesive (a mixture of polyester polyol and polyisocyanate) was diluted with a solvent, and then this adhesive was applied onto 175 g of polyethylene terephthalate film using a knife coater, and dried by heating at 80°C. A light-transmitting substrate having an adhesive layer having a thickness of 5 JL was obtained.Next, a light-shielding screen was obtained in exactly the same manner as in Example 2. When these two were laminated, the fillet produced by the adhesive layer was 5 IL or less, but the two did not adhere at all.
比較例２
比較例１において、接着層の厚さを５０μとした以外は
、比較例１と全く同じ方法で遮光スクリーン構成体を得
た。この接着層により生じたフィレットの幅は１５終で
あり、剥離強度は３０ｇ／ｃ＋ｓであった。Comparative Example 2 A light-shielding screen structure was obtained in exactly the same manner as in Comparative Example 1, except that the thickness of the adhesive layer was 50 μm. The width of the fillet produced by this adhesive layer was 15 mm, and the peel strength was 30 g/c+s.
この遮光スクリーン構成体は、透過光の透過率が低下す
ると同時に散乱が生ずるため、ヘイズが約８０％となり
、また可視角が増大し、遮光スクリーンとしての機能が
満足し得なかった。なお打抜き加工時剥離が生じ、接着
力も充分でなかった。In this light-shielding screen structure, since the transmittance of transmitted light was reduced and at the same time scattering occurred, the haze was about 80% and the visible angle increased, so that the function as a light-shielding screen was not satisfactory. In addition, peeling occurred during the punching process, and the adhesive strength was not sufficient.
［発明の効果］
本発明の遮光スクリーン構成体は、遮光性、光線透過率
、視認性に優れ、かつ裁断、打抜き時にも遮光スクリー
ンと光透過性基板との剥離がなく、スイッチ類等の各種
表示盤に使用する際要求される機械的特性および光学的
特性を兼ね備えているので、自動車内で使用される各種
表示器や計器盤およびＣＲ丁に代表されるテレビジボン
受像機その他の画像表示装置に取付ければ、内部からの
透過光の角度を制御したり、外光反射により透過画像の
視認性が低下することを防止でき、工業的意義が大きい
。[Effects of the Invention] The light-shielding screen structure of the present invention has excellent light-shielding properties, light transmittance, and visibility, and there is no separation between the light-shielding screen and the light-transmitting substrate even when cutting or punching, and it can be used for various types of switches, etc. Since it has both the mechanical and optical properties required for use in display panels, it is suitable for various display devices and instrument panels used in automobiles, television receivers such as the CR-1, and other image display devices. If installed, it is possible to control the angle of transmitted light from inside and prevent the visibility of transmitted images from decreasing due to reflection of external light, which is of great industrial significance.
第１図は本発明の遮光スクリーン構成体の一例を示す概
略構成図、第２図は遮光スクリーン構成体に用いられる
遮光スクリーンの斜視図、第３図は本発明に係る遮光ス
クリーン構成体の製法のうち、支持体材の遮光スクリー
ンを使用する場合（実施例１）を示す工程説明図、第４
図は支持体なしの遮光スクリーンを使用する場合を示す
説明図である。第５図は支持体材の遮光スクリーン構成
体のフィレット形成状態を示す説明図、第６図はその拡
大図である。
ｌ・・・遮光スクリーン、
２ａ、２ｂ＝・光透過性基板、
６・・・感光性樹脂組成物、
７ａ、７ｂ・・・接着剤。FIG. 1 is a schematic configuration diagram showing an example of the light-shielding screen structure of the present invention, FIG. 2 is a perspective view of a light-shielding screen used in the light-shielding screen structure, and FIG. 3 is a manufacturing method of the light-shielding screen structure according to the present invention. Of these, the fourth is a process explanatory diagram showing the case (Example 1) in which a light-shielding screen is used as a support material.
The figure is an explanatory diagram showing a case where a light shielding screen without a support is used. FIG. 5 is an explanatory view showing the fillet formation state of the light-shielding screen structure of the support material, and FIG. 6 is an enlarged view thereof. 1...Light-shielding screen, 2a, 2b=-Light transparent substrate, 6... Photosensitive resin composition, 7a, 7b... Adhesive.
Claims (1)
状または区画状隔壁から成り、かつ隣り合う隔壁間隔ま
たは区画の最短内径が微少である遮光スクリーンが、隔
壁先端において光透過性基板と接着剤を介してサンドイ
ッチ状に接着されており、該両隔壁先端において接着剤
層で形成されるフィレットの幅が５μ以下であり、かつ
接着の剥離強度が５０ｇ／ｃｍ以上である遮光スクリー
ン構成体。A light-shielding screen, which is obtained by photocuring a photosensitive resin composition and is composed of a large number of fine striped or partitioned partition walls, and in which the distance between adjacent partition walls or the shortest inner diameter of the partitions is minute, is attached to a light-transmitting substrate at the tip of the partition wall. and a light-shielding screen structure in which the fillet formed by the adhesive layer at the tips of both partition walls has a width of 5 μ or less and a peel strength of the adhesive is 50 g/cm or more. body.
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62-155511A JPH01901A (en) | 1987-06-24 | Light-shielding screen structure | |
| US07/201,467 US4877308A (en) | 1987-06-24 | 1988-06-02 | Light shielding screen structure and a process for producing the same |
| DE3887390T DE3887390T2 (en) | 1987-06-24 | 1988-06-03 | Sunscreen screen structure and process for its manufacture. |
| EP88305053A EP0296727B1 (en) | 1987-06-24 | 1988-06-03 | Light shielding screen structure and a process for producing the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62-155511A JPH01901A (en) | 1987-06-24 | Light-shielding screen structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS64901A JPS64901A (en) | 1989-01-05 |
| JPH01901A true JPH01901A (en) | 1989-01-05 |
Family
ID=
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4877308A (en) | Light shielding screen structure and a process for producing the same | |
| JP4244680B2 (en) | Photosensitive alkali-soluble composition | |
| US4688156A (en) | Light-shielding screen device | |
| US4506953A (en) | Reflection preventive light-shielding screen and a process for producing the same | |
| JP2009008781A (en) | Photosensitive resin composition and layered product thereof | |
| JPH0219449B2 (en) | ||
| JPH01901A (en) | Light-shielding screen structure | |
| JP2008185949A (en) | Photosensitive resin composition and laminate for sandblast | |
| US4820021A (en) | Light-shielding screen and a process for producing the same | |
| JP4519356B2 (en) | Photosensitive resin laminate | |
| JPS58215880A (en) | Light shielding screen preventing external light reflection | |
| KR101071420B1 (en) | Photopolymerizable Resin Composition For Sandblast Resist and dry film photo resist formed thereof | |
| JPS59142501A (en) | Manufacture of external light reflection preventive screen having graphic pattern | |
| JPH0227674B2 (en) | ZUGARAOJUSURUHYOJISOCHOGAIKOHANSHABOSHIBANOYOBISONOSEIZOHOHO | |
| JPS5990802A (en) | Light shielding screen for preventing reflection of external light | |
| JP4668742B2 (en) | Manufacturing method of three-dimensional micro-molded body | |
| JP2006023369A (en) | Photosensitive resin laminate for sand blasting | |
| JPS61120101A (en) | Production of light shield screen with slanting through part | |
| JPH09145916A (en) | Color filter | |
| JPH11188631A (en) | Photosensitive resin composition for sand blast and its use | |
| JP2001117225A (en) | Photosensitive resin composition | |
| JPS62296142A (en) | Multi-layered photosensitive resin plate for printing bar code symbol | |
| JPH09133805A (en) | Color filter | |
| JP2006054069A (en) | Manufacturing method of back plate of plasma display panel | |
| JP2534820Y2 (en) | Contact printer |