JPH0184489U - - Google Patents
Info
- Publication number
- JPH0184489U JPH0184489U JP1987181570U JP18157087U JPH0184489U JP H0184489 U JPH0184489 U JP H0184489U JP 1987181570 U JP1987181570 U JP 1987181570U JP 18157087 U JP18157087 U JP 18157087U JP H0184489 U JPH0184489 U JP H0184489U
- Authority
- JP
- Japan
- Prior art keywords
- hollow body
- view
- utility
- electronic component
- scope
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 description 4
Landscapes
- Adhesives Or Adhesive Processes (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第１図と第２図は本考案に係る半導体装置の一
実施例とその動作例を示す斜視図と側面図、第３
図と第４図は本考案に係る半導体装置の他の２つ
の実施例を示す斜視図と側断面図、第５図乃至第
７図は本考案に係る半導体装置の更に他の実施例
を示す側断面図と斜視図と裏面より見た斜視図、
第８図は従来の半導体装置の一具体例を示す斜視
図である。
６，１２ａ，１２ｂ，１７，２４……中空体、
８，２６……接着剤。
1 and 2 are a perspective view and a side view showing an embodiment of a semiconductor device according to the present invention and an example of its operation, and FIG.
4 and 4 are perspective views and side sectional views showing two other embodiments of the semiconductor device according to the present invention, and FIGS. 5 to 7 show still other embodiments of the semiconductor device according to the present invention. Side sectional view, perspective view, and perspective view from the back,
FIG. 8 is a perspective view showing a specific example of a conventional semiconductor device. 6, 12a, 12b, 17, 24... hollow body,
8,26...Adhesive.
Claims (1)
ことを特徴とする電子部品。 An electronic component characterized by having a hollow body containing an adhesive fixed to a mounting surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987181570U JPH0184489U (en) | 1987-11-27 | 1987-11-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987181570U JPH0184489U (en) | 1987-11-27 | 1987-11-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0184489U true JPH0184489U (en) | 1989-06-05 |
Family
ID=31473051
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987181570U Pending JPH0184489U (en) | 1987-11-27 | 1987-11-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0184489U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2016133104A1 (en) * | 2015-02-20 | 2016-08-25 | 学校法人常翔学園 | Core-shell particle mixture, adhesive, reaction product manufacturing method, and laminate manufacturing method |
| JP2019016646A (en) * | 2017-07-04 | 2019-01-31 | Ａｓｔｉ株式会社 | Semiconductor attachment structure and charger |
-
1987
- 1987-11-27 JP JP1987181570U patent/JPH0184489U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2016133104A1 (en) * | 2015-02-20 | 2016-08-25 | 学校法人常翔学園 | Core-shell particle mixture, adhesive, reaction product manufacturing method, and laminate manufacturing method |
| JPWO2016133104A1 (en) * | 2015-02-20 | 2017-11-30 | 学校法人常翔学園 | Core-shell particle mixture, adhesive, method for producing reactant, and method for producing laminate |
| JP2019016646A (en) * | 2017-07-04 | 2019-01-31 | Ａｓｔｉ株式会社 | Semiconductor attachment structure and charger |