JPH0180996U - - Google Patents
Info
- Publication number
- JPH0180996U JPH0180996U JP1987177127U JP17712787U JPH0180996U JP H0180996 U JPH0180996 U JP H0180996U JP 1987177127 U JP1987177127 U JP 1987177127U JP 17712787 U JP17712787 U JP 17712787U JP H0180996 U JPH0180996 U JP H0180996U
- Authority
- JP
- Japan
- Prior art keywords
- wiring pattern
- ground
- insulating film
- wiring board
- signal wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 239000003973 paint Substances 0.000 claims 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 1
- 229910052709 silver Inorganic materials 0.000 claims 1
- 239000004332 silver Substances 0.000 claims 1
Landscapes
- Structure Of Printed Boards (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Description
第1図は、この考案に基づく実施例を示すプリ
ント配線板の平面図、第2図は第1図の一部省略
断面図、第3図は他の実施例を示す一部省略断面
図である。第4図は従来例を示す平面図である。
図面中1および4は信号配線パターン、2は集積
回路5のアース配線パターン、3は本考案のアー
ス配線パターン、9は絶縁皮膜、10は金属層、
12はプリント配線板である。
Fig. 1 is a plan view of a printed wiring board showing an embodiment based on this invention, Fig. 2 is a partially omitted sectional view of Fig. 1, and Fig. 3 is a partially omitted sectional view showing another embodiment. be. FIG. 4 is a plan view showing a conventional example.
In the drawings, 1 and 4 are signal wiring patterns, 2 is a ground wiring pattern of an integrated circuit 5, 3 is a ground wiring pattern of the present invention, 9 is an insulating film, 10 is a metal layer,
12 is a printed wiring board.
Claims (1)
の相互に干渉し妨害を与える高周波信号またはデ
ジタル信号配線パターンを有するプリント配線板
であつて、該信号配線パターンの両側または片側
に近接して平行に該信号配線パターンの近接部分
にアース接続されたアース配線パターンを形成し
てなるプリント配線板において、該信号配線パタ
ーン上に電気絶縁塗料からなる絶縁皮膜を形成し
、該絶縁皮膜上およびアース配線パターンにかけ
て銀塗料等からなる金属層を印刷形成すると共に
、該金属層をアースに接続することを特徴とする
プリント配線板。 A printed wiring board having a high frequency signal or digital signal wiring pattern that interferes and disturbs two or more systems separated in direct current or alternating current, which are parallel to each other and close to both sides or one side of the signal wiring pattern. In a printed wiring board formed with a ground wiring pattern connected to the ground near the signal wiring pattern, an insulating film made of an electrically insulating paint is formed on the signal wiring pattern, and an insulating film is formed on the insulating film and the ground wiring pattern. 1. A printed wiring board characterized in that a metal layer made of silver paint or the like is formed by printing over the process, and the metal layer is connected to ground.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987177127U JPH0180996U (en) | 1987-11-20 | 1987-11-20 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987177127U JPH0180996U (en) | 1987-11-20 | 1987-11-20 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0180996U true JPH0180996U (en) | 1989-05-30 |
Family
ID=31468804
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1987177127U Pending JPH0180996U (en) | 1987-11-20 | 1987-11-20 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0180996U (en) |
-
1987
- 1987-11-20 JP JP1987177127U patent/JPH0180996U/ja active Pending
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