JPH0159327U - - Google Patents
Info
- Publication number
- JPH0159327U JPH0159327U JP15395487U JP15395487U JPH0159327U JP H0159327 U JPH0159327 U JP H0159327U JP 15395487 U JP15395487 U JP 15395487U JP 15395487 U JP15395487 U JP 15395487U JP H0159327 U JPH0159327 U JP H0159327U
- Authority
- JP
- Japan
- Prior art keywords
- chip component
- electrode
- external electrode
- internal
- forming
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims description 2
- 238000005476 soldering Methods 0.000 claims 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Description
第１図は本考案の一実施例のチツプ部品の断面
図、第２図は第１図に示すチツプ部品をプリント
配線板に実装した状態を示す断面図、第３図は従
来のチツプ部品の一例の断面図、第４図は第３図
に示すチツプ部品をプリント配線板に実装した状
態を示す断面図である。
符号の説明、１……チツプ部品、２……圧電基
板、３……内部電極、４，５……接着材層、６，
７……樹脂板、８……外部電極、９……半田、１
０……スパツタ膜、Ｂ……プリント配線板、Ｐ…
…パターン、Ｓ，Ｓ′……半田。
Figure 1 is a sectional view of a chip component according to an embodiment of the present invention, Figure 2 is a sectional view showing the chip component shown in Figure 1 mounted on a printed wiring board, and Figure 3 is a sectional view of a conventional chip component. An example of a sectional view, FIG. 4 is a sectional view showing a state in which the chip component shown in FIG. 3 is mounted on a printed wiring board. Explanation of symbols, 1... Chip component, 2... Piezoelectric substrate, 3... Internal electrode, 4, 5... Adhesive layer, 6,
7... Resin plate, 8... External electrode, 9... Solder, 1
0...Spatter film, B...Printed wiring board, P...
...Pattern, S, S'...Solder.
Claims (1)
極に半田で接続される内部電極とを有するチツプ
部品において、 外部電極から内部電極にかけてスパツタ膜を形
成した後、そのスパツタ膜上に半田層を形成して
、外部電極と内部電極とを半田で接続することを
特徴とするチツプ部品。[Scope of Claim for Utility Model Registration] In a chip component that has an external electrode that is soldered to a substrate and an internal electrode that is connected to the external electrode by soldering, after forming a sputtered film from the external electrode to the internal electrode, A chip component characterized by forming a solder layer on a sputtered film and connecting external electrodes and internal electrodes with solder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15395487U JPH0159327U (en) | 1987-10-07 | 1987-10-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15395487U JPH0159327U (en) | 1987-10-07 | 1987-10-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0159327U true JPH0159327U (en) | 1989-04-13 |
Family
ID=31430249
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15395487U Pending JPH0159327U (en) | 1987-10-07 | 1987-10-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0159327U (en) |
-
1987
- 1987-10-07 JP JP15395487U patent/JPH0159327U/ja active Pending