JPH0154859B2 - - Google Patents
Info
- Publication number
- JPH0154859B2 JPH0154859B2 JP58148934A JP14893483A JPH0154859B2 JP H0154859 B2 JPH0154859 B2 JP H0154859B2 JP 58148934 A JP58148934 A JP 58148934A JP 14893483 A JP14893483 A JP 14893483A JP H0154859 B2 JPH0154859 B2 JP H0154859B2
- Authority
- JP
- Japan
- Prior art keywords
- voltage
- discharge
- wire
- power supply
- ball
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000010586 diagram Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85009—Pre-treatment of the connector or the bonding area
- H01L2224/8503—Reshaping, e.g. forming the ball or the wedge of the wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19043—Component type being a resistor
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Description
【発明の詳細な説明】
（発明の利用分野）
本発明は放電によつてワイヤの先端にボールを
形成するワイヤボンダ用ボール形成装置に関す
る。DETAILED DESCRIPTION OF THE INVENTION (Field of Application of the Invention) The present invention relates to a ball forming device for a wire bonder that forms a ball at the tip of a wire by electric discharge.
（発明の背景）
LSI、IC等の半導体集積回路は、集積度の増加
に伴い、チツプ上のパツドは小さくなつている。
このため、ボールボンデイングにおいては、いか
に小さなボールをワイヤの先端に形成させるかが
問題になる。(Background of the Invention) As the degree of integration of semiconductor integrated circuits such as LSIs and ICs increases, the pads on the chips are becoming smaller.
Therefore, in ball bonding, the problem is how small a ball can be formed at the tip of the wire.
ところで、従来のボール形成装置は、実開昭57
−80841号公報に示すように、高電圧を印加する
のみで電圧及び電流が放電途中で可変できないの
で、小さなボールを形成するには電圧、電流及び
時間を少なくしなければならない。しかしなが
ら、この方法ではボールは小さくなるが丸くなら
ず、楕円になつてしまい、ボールの安定性及びボ
ンデイングの安定性が悪くなる。 By the way, the conventional ball forming device was developed in 1983.
As shown in Japanese Patent No. 80841, only a high voltage is applied and the voltage and current cannot be varied during discharge, so in order to form small balls, the voltage, current and time must be reduced. However, although this method makes the ball smaller, it is not round but becomes oval, resulting in poor ball stability and poor bonding stability.
これに対して特開昭57−40947号公報に示す装
置は、電圧及び電流が放電途中で可変できるの
で、前記従来例に比べボールの安定性は若干改良
される。しかしながら、この方法は電圧及び電流
を１段階から２段階目に切換える時にスパークが
一時的に中断する回路よりなるので、放電の安定
性が悪く、小さなボールを形成することは困難で
ある。 On the other hand, in the device disclosed in Japanese Patent Application Laid-Open No. 57-40947, the voltage and current can be varied during discharge, so the stability of the ball is slightly improved compared to the conventional example. However, since this method consists of a circuit in which the spark is temporarily interrupted when switching the voltage and current from the first stage to the second stage, the stability of the discharge is poor and it is difficult to form small balls.
（発明の目的）
本発明の目的は、ワイヤの先端に小さなボール
を安定性をもつて形成させることができるワイヤ
ボンダ用ボール形成装置を提供することにある。(Object of the Invention) An object of the present invention is to provide a ball forming device for a wire bonder that can stably form a small ball at the tip of a wire.
（発明の実施例）
以下、本発明の一実施例を第１図により説明す
る。ボール形成時には、クランパ１でワイヤ２を
クランプし、キヤピラリ３の挿通されたワイヤ２
の先端と所定の間隔を保つようにワイヤ２の先端
下方に放電電極４が移動させられる。そして、ワ
イヤ２の先端と放電電極４間にボール形成装置に
より電圧が印加され、ワイヤ２の先端にボールが
形成される。(Embodiment of the Invention) An embodiment of the present invention will be described below with reference to FIG. When forming a ball, the wire 2 is clamped by the clamper 1, and the wire 2 inserted through the capillary 3 is
The discharge electrode 4 is moved below the tip of the wire 2 so as to maintain a predetermined distance from the tip of the wire. Then, a voltage is applied between the tip of the wire 2 and the discharge electrode 4 by the ball forming device, and a ball is formed at the tip of the wire 2.
前記ボール形成装置は次のように構成されてい
る。２個の第１、第２の電源回路１０，１１を有
し、これらの電源回路１０，１１のそれぞれの一
方の出力線１０ａ，１１ａにはそれぞれトランジ
スタ等のスイツチング素子１２，１３が接続され
ている。前記スイツチング素子１２，１３にはそ
れぞれ放電時間を調整するタイマ１４，１５を介
してタイマ駆動回路１６に接続されている。前記
第１の電源回路１０の他方の出力線１０ｂと前記
スイツチング素子１３の出力線１３ａとは接続さ
れている。またスイツチング素子１２，１３の出
力線１２ａ，１３ａと第１、第２の電源回路１
０，１１の他方の出力線１０ｂ，１１ｂとはそれ
ぞれダイオード１７，１８を介して接続されてい
る。ここで、ダイオード１７，１８は第１、第２
の電源回路１０，１１のそれぞれの出力電圧の相
互干渉を阻止するために設けられている。前記ス
イツチング素子１２の出力線１２ａは放電電流調
整用可変抵抗器１９を介してクランパ１に接続さ
れ、第２の電源回路１１の他方の出力線１１ｂが
放電電極４に直接接続されている。 The ball forming device is constructed as follows. It has two first and second power supply circuits 10 and 11, and switching elements 12 and 13 such as transistors are connected to one output line 10a and 11a of each of these power supply circuits 10 and 11, respectively. There is. The switching elements 12 and 13 are connected to a timer drive circuit 16 via timers 14 and 15 that adjust the discharge time, respectively. The other output line 10b of the first power supply circuit 10 and the output line 13a of the switching element 13 are connected. Furthermore, the output lines 12a and 13a of the switching elements 12 and 13 and the first and second power supply circuits 1
The output lines 10b and 11b are connected to the other output lines 10b and 11b via diodes 17 and 18, respectively. Here, the diodes 17 and 18 are the first and second diodes.
This is provided to prevent mutual interference between the respective output voltages of the power supply circuits 10 and 11. The output line 12a of the switching element 12 is connected to the clamper 1 via a discharge current adjusting variable resistor 19, and the other output line 11b of the second power supply circuit 11 is directly connected to the discharge electrode 4.
次に作用について説明する。今、タイマ１４を
放電時間T1に、タイマ１５を前記放電時間T1よ
り大きい放電維持時間T2にそれぞれ設定する。
放電時にはタイマ駆動回路１６によりタイマ１
４，１５が同時に駆動され、第１の電源回路１０
の電圧はスイツチング素子１２でスイツチングさ
れ、出力電圧E1に、第２の電源回路１１の電圧
はスイツチング素子１３でスイツチングされ、出
力電圧E2となる。ここで、E1≧E2になるように
電源回路１０，１１を予め設定しておく。即ち、
最初は出力電圧E1とE2が同時に出力され、ワイ
ヤ２の先端と放電電極４間には放電電圧E3＝E1
＋E2が印加され、放電が開始される。放電時間
T1後はタイマ１４によつてスイツチング素子１
２がオフとなるので、その後は第２の電源回路１
１の出力電圧E2のみがワイヤ２の先端と放電電
極４間に放電維持電圧として印加される。放電時
間T2後はタイマ１５によつてスイツチング素子
１３がオフとなり、出力電圧E2は零となる。第
２図は上記状態における電圧波形を示す。ここ
で、放電電流は可変抵抗器１９によつて電流をえ
るので、電圧に比例して電流も変化する。本実施
例の場合は、最終放電電圧部に可変抵抗器１９を
設けてなるので、放電電流値が大きい場合は、可
変抵抗器１９の抵抗値は小さくてよく、問題は生
じない。しかしながら、放電電流値が例えば
100mA以下のように小さい場合は、抵抗値が実
用範囲を超えることになるので好ましくない。 Next, the effect will be explained. Now, the timer 14 is set to a discharge time T1 , and the timer 15 is set to a discharge sustaining time T2 which is longer than the discharge time T1 .
When discharging, timer 1 is activated by timer drive circuit 16.
4 and 15 are simultaneously driven, and the first power supply circuit 10
The voltage of the second power supply circuit 11 is switched by the switching element 12 to become the output voltage E1, and the voltage of the second power supply circuit 11 is switched by the switching element 13 to become the output voltage E2 . Here, the power supply circuits 10 and 11 are set in advance so that E 1 ≧E 2 . That is,
Initially, output voltages E 1 and E 2 are output simultaneously, and a discharge voltage E 3 =E 1 is generated between the tip of the wire 2 and the discharge electrode 4.
+E 2 is applied and discharge begins. discharge time
After T 1 , switching element 1 is activated by timer 14.
2 is turned off, after that the second power supply circuit 1
Only one output voltage E2 is applied between the tip of the wire 2 and the discharge electrode 4 as a discharge sustaining voltage. After the discharge time T2, the switching element 13 is turned off by the timer 15, and the output voltage E2 becomes zero. FIG. 2 shows the voltage waveform in the above state. Here, since the discharge current is obtained by the variable resistor 19, the current also changes in proportion to the voltage. In the case of this embodiment, the variable resistor 19 is provided in the final discharge voltage section, so when the discharge current value is large, the resistance value of the variable resistor 19 may be small and no problem will occur. However, if the discharge current value is
If it is as small as 100 mA or less, the resistance value will exceed the practical range, which is not preferable.
このように、放電を開始するための電圧及び電
流と放電を維持するための電圧及び電流とに分け
て設定でき、しかもスパークを一時的に中断する
ことなく前記電圧及び電流を可変できるので、ボ
ールを小さく、安定した制御ができる。一例とし
て、E1＝E2＝800Vで、Ｔ＝150μs、T2＝３〜
20msで実験を行つたところ、非常に良好な結果
が得られた。 In this way, the voltage and current for starting the discharge and the voltage and current for maintaining the discharge can be set separately, and the voltage and current can be varied without temporarily interrupting the spark. can be controlled in a small and stable manner. As an example, E 1 = E 2 = 800V, T = 150 μs, T 2 = 3~
When we conducted an experiment with 20ms, very good results were obtained.
第３図は本発明の他の実施例を示す。本実施例
は、電源回路１０，１１の出力線１０ａ，１１ａ
にそれぞれ放電電流調整用可変抵抗器２０，２１
を設けてなる。従つて、電圧E1、E2の電流値を
それぞれ単独に設定できると共に、放電電流値の
範囲が広くとれ、放電電流が小さい場合も有効と
なる。 FIG. 3 shows another embodiment of the invention. In this embodiment, output lines 10a and 11a of power supply circuits 10 and 11 are
variable resistors 20 and 21 for adjusting discharge current, respectively.
will be established. Therefore, the current values of the voltages E 1 and E 2 can be set independently, and the range of discharge current values can be widened, making it effective even when the discharge current is small.
なお、上記実施例においては、電圧及び電流を
２段階に可変する場合について説明したが、電源
回路を３個以上設け、かつそれぞれの電源回路に
それぞれスイツチング素子とタイマとを接続し、
３段階以上に可変するようにしてもよい。またワ
イヤの材質がアルミニウム、銅等のように酸化し
易い場合は、従来と同様にワイヤの先端を不活性
ガス又は混合ガスの雰囲気中にして放電を行わせ
る。また上記各実施例は、ワイヤ２に対して正電
圧を印加した場合を例示したが、負電圧を印加す
るようにしてもよい。 In the above embodiment, the case where the voltage and current are varied in two stages has been described, but it is also possible to provide three or more power supply circuits, and connect a switching element and a timer to each power supply circuit, respectively.
It may be made to vary in three or more stages. If the material of the wire is easily oxidized, such as aluminum or copper, the tip of the wire is placed in an atmosphere of an inert gas or a mixed gas to cause discharge, as in the conventional method. Further, in each of the above embodiments, a positive voltage is applied to the wire 2, but a negative voltage may also be applied.
（発明の効果）
以上の説明から明らかな如く、本発明によれ
ば、電圧及び電流を複数段階に、しかもスパーク
を一時的に中断することなく可変できるので、ボ
ールを小さく、安定した制御ができる。(Effects of the Invention) As is clear from the above description, according to the present invention, the voltage and current can be varied in multiple stages without temporarily interrupting the spark, making it possible to control the ball in a small and stable manner. .
第１図は本発明の一実施例を示す回路図、第２
図は放電電圧波形図、第３図は本発明の他の実施
例を示す回路図である。
２……ワイヤ、４……放電電極、１０，１１…
…電源回路、１２，１３……スイツチング素子、
１４，１５……タイマ。
Figure 1 is a circuit diagram showing one embodiment of the present invention, Figure 2 is a circuit diagram showing an embodiment of the present invention.
The figure is a discharge voltage waveform diagram, and FIG. 3 is a circuit diagram showing another embodiment of the present invention. 2... Wire, 4... Discharge electrode, 10, 11...
...power supply circuit, 12, 13...switching element,
14,15...Timer.
Claims (1)
の先端にボールを形成するワイヤボンダ用ボール
形成装置において、複数の電源回路と、これらの
電源回路に対応してそれぞれ設けられ対応する電
源回路の電圧をスイツチングする複数のスイツチ
ング素子と、これらのスイツチング素子に対応し
てそれぞれ設けられ対応するスイツチング素子の
駆動時間を調整する複数のタイマとを備え、前記
複数のスイツチング素子の出力電圧が加算され前
記ワイヤと前記放電電極間に印加されるように前
記複数のスイツチング素子を接続してなることを
特徴とするワイヤボンダ用ボール形成装置。1. In a ball forming device for a wire bonder that applies a voltage between a wire and a discharge electrode to form a ball at the tip of the wire, there are a plurality of power supply circuits and voltages of the corresponding power supply circuits provided corresponding to these power supply circuits. A plurality of switching elements are provided for switching the switching elements, and a plurality of timers are provided corresponding to the switching elements and adjusting the drive time of the corresponding switching elements, and the output voltages of the plurality of switching elements are added to A ball forming device for a wire bonder, characterized in that the plurality of switching elements are connected so that a voltage is applied between the discharge electrode and the discharge electrode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58148934A JPS6039840A (en) | 1983-08-15 | 1983-08-15 | Ball forming device for wire bonder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58148934A JPS6039840A (en) | 1983-08-15 | 1983-08-15 | Ball forming device for wire bonder |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6039840A JPS6039840A (en) | 1985-03-01 |
| JPH0154859B2 true JPH0154859B2 (en) | 1989-11-21 |
Family
ID=15463923
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58148934A Granted JPS6039840A (en) | 1983-08-15 | 1983-08-15 | Ball forming device for wire bonder |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6039840A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2764664B2 (en) * | 1991-05-22 | 1998-06-11 | 株式会社カイジョー | Ball forming apparatus and method for wire bonder |
| JP2676437B2 (en) * | 1991-07-10 | 1997-11-17 | 株式会社カイジョー | Ball forming device for wire bonder |
-
1983
- 1983-08-15 JP JP58148934A patent/JPS6039840A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6039840A (en) | 1985-03-01 |
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