JPH0143878Y2 - - Google Patents
Info
- Publication number
- JPH0143878Y2 JPH0143878Y2 JP4161084U JP4161084U JPH0143878Y2 JP H0143878 Y2 JPH0143878 Y2 JP H0143878Y2 JP 4161084 U JP4161084 U JP 4161084U JP 4161084 U JP4161084 U JP 4161084U JP H0143878 Y2 JPH0143878 Y2 JP H0143878Y2
- Authority
- JP
- Japan
- Prior art keywords
- case
- circuit device
- electronic circuit
- holding member
- side surfaces
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229920003002 synthetic resin Polymers 0.000 claims description 4
- 239000000057 synthetic resin Substances 0.000 claims description 4
- 238000007789 sealing Methods 0.000 claims description 2
- 239000000758 substrate Substances 0.000 description 24
- 125000006850 spacer group Chemical group 0.000 description 6
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 1
- 230000005489 elastic deformation Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
Landscapes
- Casings For Electric Apparatus (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Description
【考案の詳細な説明】
技術分野
本考案は、シールド等のためのケースを有する
電子回路装置に関し、更に詳しくは、ケースに対
して電子回路装置を安定的且つ容易に収納するこ
とが出来る装置に関する。[Detailed Description of the Invention] Technical Field The present invention relates to an electronic circuit device having a case for shielding, etc., and more specifically, to a device that can stably and easily store an electronic circuit device in a case. .
従来技術
シールドケースに対する送受信回路等の電子回
路装置の固定は、従来、ネジ又は合成樹脂等によ
つて行われている。従つて、ケースと回路装置と
を一体化するための作業性が悪かつた。また、修
理等のために、ケースから回路装置を離脱するた
めの作業性も悪かつた。Prior Art Conventionally, electronic circuit devices such as transmitting/receiving circuits are fixed to a shield case using screws, synthetic resin, or the like. Therefore, the workability for integrating the case and the circuit device was poor. Further, the workability for removing the circuit device from the case for repair or the like was poor.
考案の目的
そこで、本考案の目的は、ケースに対して電子
回路装置を容易且つ安定的に収納することが出来
る装置を提供することにある。Purpose of the Invention Therefore, an object of the present invention is to provide a device that can easily and stably store an electronic circuit device in a case.
考案の構成
上記目的を達成するための本考案は、理解を容
易にするために実施例を示す図面の符号を参照し
て説明すると、剛性を有する箱型ケース１と、こ
のケース１に収容された電子回路装置３と、この
電子回路装置３を前記ケース１の中に保持するた
めの保持部材４と、前記ケース１の内に前記電子
回路装置３と前記保持部材４とを封じ込めるため
の蓋２とから成り、前記ケース１が四角型の底部
５とこの底部５に対して直角方向に延びている４
つの側面部６，７，８，９とを有し、前記電子回
路装置３はその一面１９ｄが前記ケース１の底部
５の内壁に対向するように前記ケース１に収容さ
れ、前記電子回路装置の前記一面１９ｄに平行な
他面１５ｂの一方向の長さがこの他面１５ｂの両
端と前記ケース１との間に前記保持部材４の後記
の板状側面部４ｂ，４ｃをそれぞれ介在させるこ
とが可能な値に決定され、前記保持部材４は、前
記電子回路装置３の前記他面１５ｂの一方向の長
さよりも幾らか短い長さを有する板状中央部４ａ
とこの中央部４ａの両端に連設されている一対の
板状側面部４ｂ，４ｃとから成り、前記一対の板
状側面部４ｂ，４ｃの外側面の少なくとも一部が
前記ケース１の一対の側面部６，７の内壁に当接
し、前記電子回路装置３の前記他面１５ｂの前記
一方向における両端が前記一対の板状側面部４
ｂ，４ｃの内側で保持されていることを特徴とす
るケースを有する電子回路装置に係わるものであ
る。Structure of the Invention The present invention to achieve the above object will be described with reference to the reference numerals in the drawings showing the embodiments for ease of understanding. an electronic circuit device 3; a holding member 4 for holding the electronic circuit device 3 in the case 1; and a lid for sealing the electronic circuit device 3 and the holding member 4 in the case 1. 2, the case 1 has a rectangular bottom part 5 and a part 4 extending in a direction perpendicular to the bottom part 5.
The electronic circuit device 3 is housed in the case 1 so that one side 19d thereof faces the inner wall of the bottom 5 of the case 1, and The length of the other surface 15b in one direction parallel to the one surface 19d allows plate-shaped side portions 4b and 4c, which will be described later, of the holding member 4 to be interposed between both ends of the other surface 15b and the case 1, respectively. The holding member 4 has a plate-shaped central portion 4a having a length that is somewhat shorter than the length in one direction of the other surface 15b of the electronic circuit device 3.
and a pair of plate-shaped side surfaces 4b, 4c connected to both ends of the central portion 4a, and at least a part of the outer surface of the pair of plate-shaped side surfaces 4b, 4c is connected to the pair of case 1. The pair of plate-shaped side surfaces 4 contact the inner walls of the side surfaces 6 and 7, and both ends of the other surface 15b of the electronic circuit device 3 in the one direction
This relates to an electronic circuit device having a case characterized in that it is held inside the case.b, 4c.
考案の作用効果
上記考案によれば、保持部材４の一対の側面部
４ｂ，４ｃの内側面によつて電子回路装置３を保
持し、外側面によつてケース１に係合するので、
ケース１に対する電子回路装置３の安定した収納
状態を容易に得ることが出来る。Effects of the invention According to the above invention, the electronic circuit device 3 is held by the inner surfaces of the pair of side surfaces 4b and 4c of the holding member 4, and the electronic circuit device 3 is engaged with the case 1 by the outer surfaces.
A stable storage state of the electronic circuit device 3 in the case 1 can be easily obtained.
実施例
次に、第１図〜第６図を参照して本考案の実施
例に係わるケースを有する電子回路装置について
述べる。Embodiment Next, an electronic circuit device having a case according to an embodiment of the present invention will be described with reference to FIGS. 1 to 6.
この装置は、第１図から明らかな如く、シール
ドケース１と、この蓋２と、電子回路装置３と、
保持部材４とから成る。 As is clear from FIG. 1, this device includes a shield case 1, a lid 2, an electronic circuit device 3,
It consists of a holding member 4.
シールドケース１は金属板によつて横約４cm、
縦約３cm、高さ約1.8cmの箱型に形成され、底部
５と、第２図に示す如く４つの側面部６，７，
８，９とから成り、剛性を有する。なお、４つの
側面部６〜９は、いずれも底部５に対して直角方
向に延びている。また、対向する一対の側面部
６，７には、蓋２を係合させるための突起１０，
１１が設けられている。 Shield case 1 is approximately 4cm wide due to the metal plate.
It is formed into a box shape with a length of about 3 cm and a height of about 1.8 cm, and has a bottom part 5 and four side parts 6, 7, as shown in FIG.
8 and 9, and has rigidity. In addition, all four side parts 6-9 extend in the right angle direction with respect to the bottom part 5. Further, a pair of opposing side surfaces 6 and 7 are provided with protrusions 10 for engaging the lid 2,
11 are provided.
蓋２はシールド効果を得るために、ケース１と
同一の金属板で形成され、主面部２ａと一対の側
面部２ｂ，２ｃとを備えている。蓋２の主面部２
ａはケース１の開口を覆う部分であり、一対の側
面部２ｂ，２ｃはケース１の側面部６，７に係合
する部分である。蓋２は箱型に形成されていない
ので、幾らか弾性変形可能であり、ケース１の突
起１０，１１を乗り越えるように蓋２を嵌着する
ことにより、孔１２，１３に突起１０，１１が入
り込み、両者の係合が成立する。なお、蓋２に
は、リード線挿通孔１４も設けられている。 In order to obtain a shielding effect, the lid 2 is formed of the same metal plate as the case 1, and includes a main surface portion 2a and a pair of side surfaces 2b and 2c. Main surface part 2 of lid 2
A is a part that covers the opening of the case 1, and a pair of side parts 2b and 2c are parts that engage with the side parts 6 and 7 of the case 1. Since the lid 2 is not formed into a box shape, it can be elastically deformed to some extent, and by fitting the lid 2 over the protrusions 10 and 11 of the case 1, the protrusions 10 and 11 are inserted into the holes 12 and 13. They enter, and engagement between the two is established. Note that the lid 2 is also provided with a lead wire insertion hole 14.
電子回路装置３は、第３図及び第４図から最も
明らかな如く、セラミツク基板１５と、この一方
の面１５ａ上に装着されたコンデンサ、抵抗、ト
ランス等の個別回路部品１６と、基板１５の他方
の面１５ｂ上に装着されたチップ状電子部品１７
と、リード線１８とから成る本体部と、基板１５
の一方の表面１５ａ上の電子部品１６を覆うよう
に配置されたカバー１９とから成る。基板１５の
第１図左右方向の長さは、ケース１の一対の側面
部６，７の内壁相互間隔よりも幾分小さく決定さ
れている。一方、基板１５の第４図における左右
方向の長さはケース１の一対の側面部８，９の内
壁の相互間隔にほぼ一致するように決定されてい
る。 As is most obvious from FIGS. 3 and 4, the electronic circuit device 3 includes a ceramic substrate 15, individual circuit components 16 such as capacitors, resistors, and transformers mounted on one surface 15a of the ceramic substrate 15, and the substrate 15. Chip-shaped electronic component 17 mounted on the other surface 15b
and a lead wire 18, and a substrate 15.
A cover 19 is arranged to cover the electronic component 16 on one surface 15a of the electronic component 16. The length of the substrate 15 in the left-right direction in FIG. 1 is determined to be somewhat smaller than the distance between the inner walls of the pair of side surfaces 6 and 7 of the case 1. On the other hand, the length of the substrate 15 in the left-right direction in FIG.
スペーサとしての機能も有するカバー１９は絶
縁性合成樹脂によつて断面コ字状に形成され、底
部１９ａと一対の側面部１９ｂ，１９ｃとを有す
る。第４図から明らかな如く、一対の側面部１９
ｂ，１９ｃの高さは、個別回路部品１６の最も高
さの大きいものよりも大に設定されている。ま
た、カバー１９の一対の側面部１９ｂ，１９ｃの
先端が基板１５の一方の面１５ａに接し、ケース
１の底部５の内面にカバー１９の底部１９ａの外
面１９ｄが接している。カバー１９の一対の側面
部１９ｂ，１９ｃの高さは互いに等しいので、カ
バー１９の底部１９ａの外面１９ｄと基板１５の
一方及び他方の面１５ａ，１５ｂとは平行であ
る。なお、カバー１９は基板１５に対して着脱自
在であり、基板１５の位置を決定するスペーサと
しても機能する。 The cover 19, which also functions as a spacer, is made of insulating synthetic resin and has a U-shaped cross section, and has a bottom portion 19a and a pair of side portions 19b and 19c. As is clear from FIG. 4, a pair of side surfaces 19
The heights of b and 19c are set larger than the highest individual circuit component 16. Furthermore, the tips of the pair of side surfaces 19b and 19c of the cover 19 are in contact with one surface 15a of the substrate 15, and the outer surface 19d of the bottom 19a of the cover 19 is in contact with the inner surface of the bottom 5 of the case 1. Since the heights of the pair of side surfaces 19b and 19c of the cover 19 are equal to each other, the outer surface 19d of the bottom portion 19a of the cover 19 and the one and other surfaces 15a and 15b of the substrate 15 are parallel. Note that the cover 19 is removably attached to the substrate 15 and also functions as a spacer that determines the position of the substrate 15.
保持部材４は、電子回路装置３をケース１内に
安定的に保持するためのものであり、第１図、第
５図、及び第６図から明らかな如く、板状中央部
４ａと一対の板状側面部４ｂ，４ｃとから成り、
絶縁性合成樹脂によつて弾性変形するように形成
されている。第１図から明らかな如く、保持部材
４の中央部４ａの内側の長さは、基板１５の他方
の面１５ｂの一方向（左右方向）の長さよりも幾
分短かく決定されている。第５図及び第６図は保
持部材４をケース１に挿入しない状態を示す。こ
の図から明らかな如く、一対の側面部４ｂ，４ｃ
は中央部４ａから直角よりも幾分大きな角度に折
曲されている。即ち、一対の側面部４ｂ，４ｃは
末広がり状又はハの字状に設けられている。保持
部材４は、第１図の収納状態においては、弾性変
形され、一対の側面部４ｂ，４ｃの外側面がケー
ス１に内壁に圧接されている。また、一対の側面
部４ｂ，４ｃの内側面には基板１５の両端が接し
ている。第５図における４ｄはリード線１８を通
すための穴である。 The holding member 4 is for stably holding the electronic circuit device 3 within the case 1, and as is clear from FIGS. 1, 5, and 6, the holding member 4 has a plate-shaped central portion 4a and Consisting of plate-like side parts 4b and 4c,
It is made of insulating synthetic resin so that it can be elastically deformed. As is clear from FIG. 1, the inner length of the central portion 4a of the holding member 4 is determined to be somewhat shorter than the length of the other surface 15b of the substrate 15 in one direction (left-right direction). 5 and 6 show a state in which the holding member 4 is not inserted into the case 1. FIG. As is clear from this figure, the pair of side parts 4b, 4c
is bent from the center portion 4a at an angle somewhat larger than a right angle. That is, the pair of side portions 4b and 4c are provided in a shape that widens towards the end or in a V-shape. In the stored state shown in FIG. 1, the holding member 4 is elastically deformed, and the outer surfaces of the pair of side surfaces 4b and 4c are pressed against the inner wall of the case 1. Furthermore, both ends of the substrate 15 are in contact with the inner surfaces of the pair of side surfaces 4b and 4c. 4d in FIG. 5 is a hole through which the lead wire 18 is passed.
次に、第１図の装置の組立て方法について述べ
る。部品１６，１７が装着された基板１５を、カ
バー１９と保持部材４で囲んだものを用意し、即
ち、第１図からケース１と蓋２とを除去した状態
のものを用意し、保持部材４の一対の側面部４
ｂ，４ｃの先端の相互間隔をケース１の側面部
６，７の内壁の相互間隔よりも小に弾性変形した
状態で、ケース１の中に挿入し、保持部材４の上
面を押圧する。これにより、保持部材４を介して
基板１５及びカバー１９も押圧され、カバー１９
がケース１の底部５に接する。この時、複数の個
別回路部品１６に高低差があつても、カバー１９
が基板１５とケース１の底部５とのスペーサとし
て働くため、ケース１に対する基板１５及び保持
部材４の平行性が保たれる。保持部材４の一対の
側面部４ｂ，４ｃは第６図に示す元の位置に戻る
力を有するため、その外側面がケース１の内壁に
圧接する状態が得られ、保持部材４及び電子回路
装置３が離脱しない状態が得られる。一方、保持
部材４の一対の側面部４ｂ，４ｃの内側面には基
板１５の両端が接し、側面部４ｂ，４ｃを拡げる
方向の力を与える。このため、保持部材４の中に
基板１５が安定的に保持されると共に、保持部材
４のケース１に対する安定的な係合が成立する。 Next, a method for assembling the device shown in FIG. 1 will be described. A board 15 with parts 16 and 17 mounted thereon is surrounded by a cover 19 and a holding member 4, that is, a board 15 with the case 1 and lid 2 removed from FIG. A pair of side parts 4 of 4
The tips of b and 4c are elastically deformed so that the distance between them is smaller than the distance between the inner walls of the side surfaces 6 and 7 of the case 1, and the holding member 4 is inserted into the case 1 and the upper surface of the holding member 4 is pressed. As a result, the substrate 15 and the cover 19 are also pressed through the holding member 4, and the cover 19
is in contact with the bottom 5 of the case 1. At this time, even if there is a height difference between the plurality of individual circuit components 16, the cover 19
serves as a spacer between the substrate 15 and the bottom 5 of the case 1, so that the parallelism of the substrate 15 and the holding member 4 with respect to the case 1 is maintained. Since the pair of side surfaces 4b and 4c of the holding member 4 have the force to return to the original position shown in FIG. A state is obtained in which 3 does not leave. On the other hand, both ends of the substrate 15 are in contact with the inner surfaces of the pair of side surfaces 4b and 4c of the holding member 4, and a force is applied in a direction to spread the side surfaces 4b and 4c. Therefore, the substrate 15 is stably held within the holding member 4, and the holding member 4 is stably engaged with the case 1.
最後に、蓋２を第１図に示す如くケース１に覆
せる。蓋２の両側面部２ｂ，２ｃは、弾性変形可
能であるので、蓋２をケース１の外周面に沿うよ
うに覆せると、蓋２の両側面部２ｂ，２ｃが拡が
るように変形し、穴１３に突起１１が嵌合し、両
者の係合が成立する。この結果、電子回路装置３
及び保持部材４の完全な収容状態が得られる。 Finally, the lid 2 can be placed over the case 1 as shown in FIG. Both side surfaces 2b and 2c of the lid 2 are elastically deformable, so when the lid 2 is turned over along the outer circumferential surface of the case 1, both side surfaces 2b and 2c of the lid 2 are deformed to expand, and the hole 13 is expanded. The protrusion 11 is fitted into the holder, and the engagement between the two is established. As a result, the electronic circuit device 3
And the holding member 4 can be completely accommodated.
この装置は、上述の方法以外でも組み立てるこ
とが出来る。例えば、ケース１の中に、カバー１
９、部品１６，１７を含む基板１５、保持部材４
の順に個別に挿入してもよい。また、カバー１９
と部品１６，１７を含む基板１５とを一体化した
状態でケース１に挿入し、しかる後、保持部材４
を挿入してもよい。 The device can be assembled in ways other than those described above. For example, in case 1, cover 1
9. Substrate 15 including parts 16 and 17, holding member 4
You may insert them individually in this order. Also, cover 19
and the board 15 including the parts 16 and 17 are inserted into the case 1 in an integrated state, and then the holding member 4 is inserted into the case 1.
may be inserted.
本実施例の装置は次の利点を有する。 The device of this embodiment has the following advantages.
(A) 保持部材４の側面部４ｂ，４ｃの弾性変形に
よつて、側面部４ｂ，４ｃがケース１の内壁に
圧接保持されるので、保持部材４が安定的に接
着される。この際、側面部４ｂ，４ｃの内側が
基板１５の両端で押されるため、基板１５が保
持部材４の中に安定的に保持されるのみでな
く、保持部材４のケース１に対する係合も安定
する。(A) By elastic deformation of the side parts 4b, 4c of the holding member 4, the side parts 4b, 4c are held in pressure contact with the inner wall of the case 1, so that the holding member 4 is stably bonded. At this time, since the insides of the side surfaces 4b and 4c are pressed by both ends of the substrate 15, not only the substrate 15 is stably held in the holding member 4, but also the engagement of the holding member 4 with the case 1 is stable. do.
(B) 保持部材４は絶縁性を有しているので、基板
１５の他方の面１５ｂにチツプ状電子部品１７
及びその回路導体が設けられていても、これ等
を蓋２から絶縁することが出来る。(B) Since the holding member 4 has insulating properties, the chip-shaped electronic component 17 is attached to the other surface 15b of the substrate 15.
Even if circuit conductors thereof are provided, these can be insulated from the lid 2.
(C) カバー１９も絶縁性を有しているので、基板
１５の一方の面１５ａ上の部品１６及びその配
線導体をケース１から絶縁分離することが出来
る。なお、保持部材４は、第５図から明らかな
如く、カバー１９が覆うことが出来ない部分を
覆うように形成されているので、保持部材４の
側面部４ｂ，４ｃも絶縁分離に寄与する。(C) Since the cover 19 also has insulating properties, the component 16 on one surface 15a of the board 15 and its wiring conductor can be insulated and separated from the case 1. Incidentally, as is clear from FIG. 5, since the holding member 4 is formed so as to cover the portion that cannot be covered by the cover 19, the side portions 4b and 4c of the holding member 4 also contribute to insulation separation.
(D) カバー１９は、個別電子部品１７の最も高い
ものを覆うように形成されているので、高さの
異なる複数の部品１７による凹凸を解消した状
態で電子回路装置３をケース１に収容すること
が出来る。(D) Since the cover 19 is formed to cover the tallest of the individual electronic components 17, the electronic circuit device 3 is accommodated in the case 1 while eliminating the unevenness caused by the plurality of components 17 of different heights. I can do it.
(E) ケース１に対して、保持部材４及び蓋２を嵌
め込み方式で係合させるので、組み立てが容易
であるばかりでなく、分解も容易である。(E) Since the holding member 4 and the lid 2 are fitted into the case 1, it is not only easy to assemble but also easy to disassemble.
変形例
本考案は上述の実施例に限定されるものでな
く、例えば、次の変形例が可能なものである。Modifications The present invention is not limited to the above-described embodiments, and, for example, the following modifications are possible.
(a) チツプ状電子部品１７が無い場合にも適用可
能である。(a) It is also applicable when there is no chip-shaped electronic component 17.
(b) カバー１９を基板１５に固着した構成として
もよい。(b) The cover 19 may be fixed to the substrate 15.
(c) ケース１にシールドが要求されない場合にも
適用可能である。(c) Applicable even when shielding is not required in Case 1.
(d) 保持部材４の側面部４ｂ，４ｃを複数に分割
してもよい。(d) The side parts 4b and 4c of the holding member 4 may be divided into a plurality of parts.
(e) 保持部材４を、ケース１に挿入しない状態
で、側面部４ｂ，４ｃが中央部４ａから略直角
に立上るように形成し、基板１５を側面部４
ｂ，４ｃ間に挿入することによつて、これ等の
先端の対向間隔が広がるようにしてもよい。(e) When the holding member 4 is not inserted into the case 1, the side portions 4b and 4c are formed to stand up from the center portion 4a at a substantially right angle, and the substrate 15 is attached to the side portion 4.
By inserting it between b and 4c, the spacing between these tips may be widened.
第１図は本考案の実施例に係わるシールドケー
スを有する電子回路装置の一部を切断して示す断
面図、第２図は第１図の装置のケースと蓋とを示
す斜視図、第３図は第１図の電子回路装置部分の
斜視図、第４図は第１図の−線に相当する部
分の一部を示す断面図、第５図は第１図のスペー
サとカバーとを示す斜視図、第６図は第１図のス
ペーサの未挿入状態を示す正面図である。
１……ケース、２…蓋、３……電子回路装置、
４……スペーサ、４ａ……中央部、４ｂ，４ｃ…
…側面部、５……底部、６，７，８，９……側面
部、１２，１３……孔、１５……基板、１６……
個別回路部品、１７……チツプ状電子部品、１９
……カバー。
1 is a sectional view showing a part of an electronic circuit device having a shield case according to an embodiment of the present invention; FIG. 2 is a perspective view showing the case and lid of the device shown in FIG. 1; The figure is a perspective view of the electronic circuit device portion of FIG. 1, FIG. 4 is a cross-sectional view of a portion corresponding to the - line in FIG. 1, and FIG. 5 is a spacer and cover of FIG. 1. The perspective view and FIG. 6 are front views showing a state in which the spacer of FIG. 1 is not inserted. 1... Case, 2... Lid, 3... Electronic circuit device,
4... Spacer, 4a... Central part, 4b, 4c...
... Side part, 5... Bottom, 6, 7, 8, 9... Side part, 12, 13... Hole, 15... Substrate, 16...
Individual circuit components, 17... Chip-shaped electronic components, 19
……cover.
Claims (1)
に収容された電子回路装置３と、この電子回路
装置３を前記ケース１の中に保持するための保
持部材４と、前記ケース１の内に前記電子回路
装置３と前記保持部材４とを封じ込めるための
蓋２とから成り、 前記ケース１が四角型の底部５とこの底部５
に対して直角方向に延びている４つの側面部
６，７，８，９とを有し、 前記電子回路装置３はその一面１９ｄが前記
ケース１の底部５の内壁に対向するように前記
ケース１に収容され、 前記電子回路装置の前記一面１９ｄに平行な
他面１５ｂの一方向の長さがこの他面１５ｂの
両端と前記ケース１との間に前記保持部材４の
後記の板状側面部４ｂ，４ｃをそれぞれ介在さ
せることが可能な値に決定され、 前記保持部材４は、前記電子回路装置３の前
記他面１５ｂの一方向の長さよりも幾らか短い
長さを有する板状中央部４ａとこの中央部４ａ
の両端に連設されている一対の板状側面部４
ｂ，４ｃとから成り、 前記一対の板状側面部４ｂ，４ｃの外側面の
少なくとも一部が前記ケース１の一対の側面部
６，７の内壁に当接し、 前記電子回路装置３の前記他面１５ｂの前記
一方向における両端が前記一対の板状側面部４
ｂ，４ｃの内側で保持されていることを特徴と
するケースを有する電子回路装置。 (2) 前記保持部材４は、弾性変形可能な合成樹脂
で形成されたものである実用新案登録請求の範
囲第１項記載の電子回路装置。[Scope of claims for utility model registration] (1) Box-shaped case 1 having rigidity and this case 1
an electronic circuit device 3 housed in the case 1; a holding member 4 for holding the electronic circuit device 3 in the case 1; and sealing the electronic circuit device 3 and the holding member 4 in the case 1. The case 1 consists of a square bottom part 5 and a lid 2 for the case 1.
The electronic circuit device 3 has four side surfaces 6, 7, 8, and 9 extending in a direction perpendicular to the case 1, and the electronic circuit device 3 has four side surfaces 6, 7, 8, and 9 extending in a direction perpendicular to the case 1. 1, and the length in one direction of the other surface 15b parallel to the one surface 19d of the electronic circuit device is between both ends of the other surface 15b and the case 1, and the plate-shaped side surface described below of the holding member 4 The holding member 4 has a plate-shaped center having a length somewhat shorter than the length in one direction of the other surface 15b of the electronic circuit device 3. part 4a and this central part 4a
A pair of plate-like side surfaces 4 connected to both ends of the
b, 4c, at least a part of the outer surface of the pair of plate-like side surfaces 4b, 4c abuts against the inner walls of the pair of side surfaces 6, 7 of the case 1, and the other of the electronic circuit device 3 Both ends of the surface 15b in the one direction are connected to the pair of plate-shaped side surfaces 4.
An electronic circuit device having a case characterized in that it is held inside the parts b and 4c. (2) The electronic circuit device according to claim 1, wherein the holding member 4 is made of elastically deformable synthetic resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4161084U JPS60153577U (en) | 1984-03-22 | 1984-03-22 | Electronic circuit device with case |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4161084U JPS60153577U (en) | 1984-03-22 | 1984-03-22 | Electronic circuit device with case |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60153577U JPS60153577U (en) | 1985-10-12 |
| JPH0143878Y2 true JPH0143878Y2 (en) | 1989-12-19 |
Family
ID=30551599
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4161084U Granted JPS60153577U (en) | 1984-03-22 | 1984-03-22 | Electronic circuit device with case |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60153577U (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001339176A (en) * | 2000-05-29 | 2001-12-07 | Alps Electric Co Ltd | Small-sized electric apparatus |
-
1984
- 1984-03-22 JP JP4161084U patent/JPS60153577U/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60153577U (en) | 1985-10-12 |
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