JPH0142333Y2 - - Google Patents
Info
- Publication number
- JPH0142333Y2 JPH0142333Y2 JP8939580U JP8939580U JPH0142333Y2 JP H0142333 Y2 JPH0142333 Y2 JP H0142333Y2 JP 8939580 U JP8939580 U JP 8939580U JP 8939580 U JP8939580 U JP 8939580U JP H0142333 Y2 JPH0142333 Y2 JP H0142333Y2
- Authority
- JP
- Japan
- Prior art keywords
- ceramic
- ceramic base
- hole
- chip
- capacitor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000919 ceramic Substances 0.000 claims description 19
- 239000003990 capacitor Substances 0.000 claims description 14
- 239000004020 conductor Substances 0.000 claims description 4
- 239000002131 composite material Substances 0.000 description 7
- 239000000758 substrate Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 2
- 238000010304 firing Methods 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 229910010413 TiO 2 Inorganic materials 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Description
【考案の詳細な説明】
本考案はコンデンサ機能を内蔵したセラミツク
ベースを基本とし、ダイオード、コイル、他のコ
ンデンサ等を取付ける手段を有する固体複合回路
部品に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a solid state composite circuit component based on a ceramic base with a built-in capacitor function and having means for attaching diodes, coils, other capacitors, etc.
従来のプリント配線基板は絶縁体基板に導体パ
ターンをプリントしたものから成り、各種素子は
一々所定個所へ固定し半田づけしなければならな
い。本考案はプリント基板へまとまつたユニツト
回路機能を有する単位として簡単に半田づけでき
るコンデンサ機能内蔵の固体複合回路部品を提供
することを目的とする。本考案の回路部品は表面
及び（又は）裏面のスペースを利用して配線を施
こし、さらに各種素子を焼付け或いは取付け、ま
た内部にコンデンサ機能を内蔵するセラミツク基
板より成る。かかるセラミツク基板に配線導体を
プリントして小型電子素子を取付けるには電子素
子を導体の適正部分に位置づけて半田づけを行う
必要があるが、小型のチツプ形部品を正しく位置
決めするのは困難である。 A conventional printed wiring board consists of an insulating substrate with a conductive pattern printed on it, and various elements must be fixed and soldered to predetermined locations one by one. The object of the present invention is to provide a solid-state composite circuit component with a built-in capacitor function that can be easily soldered to a printed circuit board as a unit having a unit circuit function. The circuit component of the present invention is made of a ceramic substrate on which wiring is carried out using space on the front and/or back surfaces, various elements are baked or attached, and a capacitor function is built inside. In order to print wiring conductors on such ceramic substrates and attach small electronic devices, it is necessary to position and solder the electronic devices to appropriate parts of the conductor, but it is difficult to correctly position small chip-shaped components. .
従つて、本考案の目的はチツプ型電子素子特
に、チツプ型ダイオードの取付けに便利な取付け
手段を有するコンデンサ機能内蔵複合電子部品を
提供することにある。 SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide a composite electronic component with a built-in capacitor function, which has mounting means convenient for mounting chip-type electronic elements, particularly chip-type diodes.
簡単に述べると、本考案はコンデンサ内蔵のセ
ラミツク基板の表面の一部にチツプ形電子部品の
外形に合わせた嵌合孔を形成し、ここに電子部品
を嵌着することにより、チツプ型電子部品の位置
ぎめを正確にし、組立てを容易にし、また半田づ
けまたは電路接続を容易にする。 Briefly stated, the present invention forms a fitting hole in a part of the surface of a ceramic substrate with a built-in capacitor that matches the external shape of a chip-type electronic component, and by fitting the electronic component into the hole, the chip-type electronic component Accurate positioning, ease of assembly, and ease of soldering or electrical connection.
以下、図示の実施例に関連して本考案を詳細に
説明する。 The invention will now be described in detail with reference to the illustrated embodiments.
第１図から第３図は複合回路部品における積層
コンデンサ内蔵セラミツクベース部分の製法と構
造を示す。第１図に示すように、BaTiO3，TiO2
又は他のセラミツク粉末ベーストを延ばしたシー
ト１（未焼成シート）の上に、Ag−Pd，Pd等の
金属粉末のペーストを印刷してコンデンサ用電極
C1，C2を形成する。これらの電極は設計に応じ
た数及び面積のものにしうるが、説明の都合上２
個に限定した。次にこの上に第２図に示すように
第２のセラミツクシート２（上記シート１と同じ
材料）を重畳し、その上に電極層C1′，C2′を印刷
する。電極層C1，C2はシート１の下辺に露出し、
また電極層C1′，C2′はC1，C2上に重畳すると共に
積層体の上辺に露出するように設計されているこ
とに注意すべきである。以下第１〜２図の工程を
必要回数反覆すると所定の容量値を有する２つの
コンデンサが構成できる。最後に第３図のように
第１層と同様なセラミツク層３を積層してベース
部Ａを得る。この層３は積層コンデンサの電極引
出部がダイオードの引出し端子と干渉しないよう
にするのに必要である。 1 to 3 show the manufacturing method and structure of a ceramic base portion with a built-in multilayer capacitor in a composite circuit component. As shown in Figure 1, BaTiO 3 , TiO 2
Alternatively, a paste of metal powder such as Ag-Pd or Pd is printed on sheet 1 (unfired sheet) made of another ceramic powder base to form capacitor electrodes.
Forms C 1 and C 2 . These electrodes can have a number and area depending on the design, but for convenience of explanation, two
Limited to individuals. Next, as shown in FIG. 2, a second ceramic sheet 2 (made of the same material as the sheet 1) is superimposed on this, and electrode layers C 1 ' and C 2 ' are printed thereon. The electrode layers C 1 and C 2 are exposed on the lower side of the sheet 1,
It should also be noted that the electrode layers C 1 ′ and C 2 ′ are designed to overlap with C 1 and C 2 and to be exposed on the upper side of the stack. By repeating the steps shown in FIGS. 1 and 2 a necessary number of times, two capacitors having predetermined capacitance values can be constructed. Finally, as shown in FIG. 3, a ceramic layer 3 similar to the first layer is laminated to obtain a base portion A. This layer 3 is necessary to prevent the electrode lead-out portion of the multilayer capacitor from interfering with the lead-out terminal of the diode.
次に第４図は第３図に示すベース部分Ａに重畳
させる第２のベース部Ｂの構造を示す。ベース部
Ｂはベース部Ａに用いたと同一又は他のセラミツ
ク材料を用いたセラミツクシート４（未焼成のも
の）から成り、面部分に長方形の貫通孔５を有す
る。セラミツクシート４はチツプ型電子部品の厚
さと同程度またはそれより薄い厚さを有し、孔５
はパンチングによつて作られ、その輪郭はチツプ
型電子部品（後述）の外形にほぼ合致させる。貫
通孔５はベース部Ａのコンデンサーと容量的に干
渉しないようにそれらの両側に形成する。 Next, FIG. 4 shows the structure of a second base part B which is superimposed on the base part A shown in FIG. The base part B is made of a ceramic sheet 4 (unfired) made of the same or different ceramic material used for the base part A, and has a rectangular through hole 5 in its surface. The ceramic sheet 4 has a thickness comparable to or thinner than that of the chip-type electronic component, and has holes 5.
is made by punching, and its outline is made to approximately match the external shape of a chip-type electronic component (described later). The through holes 5 are formed on both sides of the capacitor of the base portion A so as not to interfere with the capacitor in terms of capacitance.
次に、第１のベース部Ａと第２のベース部Ｂと
を第５図のように上下に整列して積重ね、合体に
必要な最小限度の圧力を加える。次にこの重畳体
を焼成炉に入れて所定の高温度で焼成して一体的
な焼結体とする。焼成が終つたら、第６図に示す
ように必要なプリント、例えば導体パターン６〜
９、端子電極１０，１１，１１′，１２，１２′，
及び抵抗層R1，R2のプリント及び焼付けを行う。 Next, the first base part A and the second base part B are aligned and stacked vertically as shown in FIG. 5, and the minimum pressure required for joining is applied. Next, this superimposed body is placed in a firing furnace and fired at a predetermined high temperature to form an integral sintered body. After the firing is completed, the necessary prints, such as conductor patterns 6 to 6, are printed as shown in Figure 6.
9, terminal electrodes 10, 11, 11', 12, 12',
Then, print and bake the resistive layers R 1 and R 2 .
本考案の回路部品は上記の構成であるから、孔
５の形状に一致する外形のチツプ型電子部品（第
７図）の取付けを容易に行うことができる。すな
わち、第７図のようにチツプ型電子部品は長方形
のダイオードD1，D2の両端に外部端子１６，１
６′を形成したものである。従つて、これらのチ
ツプ型ダイオードD1，D2を第６図のセラミツク
ベースの孔５，５へ嵌合すると、位置ぎめは自動
的に達成できる。さらに、外部端子１６，１６′
は端子電極１１，１１′及び１２，１２′へ近接又
は接触するから、そこに半田または導電樹脂を施
こせば回路が完成する。第８図はこうして得られ
た複合回路部品の回路構成を示す。 Since the circuit component of the present invention has the above-described configuration, a chip-type electronic component (FIG. 7) having an outer shape matching the shape of the hole 5 can be easily attached. That is, as shown in FIG. 7, the chip type electronic component has external terminals 16, 1 at both ends of rectangular diodes D 1 and D 2 .
6'. Therefore, when these chip diodes D 1 , D 2 are fitted into the holes 5, 5 of the ceramic base of FIG. 6, positioning can be achieved automatically. Furthermore, external terminals 16, 16'
Since these are close to or in contact with the terminal electrodes 11, 11' and 12, 12', the circuit is completed by applying solder or conductive resin there. FIG. 8 shows the circuit configuration of the composite circuit component thus obtained.
以上のように本考案によれば種々の面ですぐれ
た複合回路部品が得られる。なおこの回路部品は
そのままプリント基板の所定個所へ取付けられ、
外部の導電パターンや端６〜１０を利用して半田
づけによる接続が行われる。 As described above, according to the present invention, a composite circuit component that is excellent in various aspects can be obtained. Note that this circuit component can be attached to the specified location on the printed circuit board as it is,
Connections are made by soldering using external conductive patterns and edges 6-10.
第１図ないし第３図は本考案の回路部品の第１
のベース部の製造及び構成を示す平面図、第４図
は同第２のベース部の構成を示す平面図、第５図
は積層した２つのベース部を示す斜視図、第６図
は完成した複合回路部品の斜視図、第７図は本考
案の回路部品へ取付けるチツプ型ダイオードの斜
視図、及び第８図は組立てられた複合回路部品の
回路図である。図中主な部分は次の通り。
１，２，３，４：セラミツクシート、５：孔、
Ａ：第１のベース部、Ｂ：第２のベース部、Ｃ：
チツプ型ダイオード。
Figures 1 to 3 show the first circuit components of the present invention.
Fig. 4 is a plan view showing the structure of the second base part, Fig. 5 is a perspective view showing the two laminated base parts, and Fig. 6 is the finished product. FIG. 7 is a perspective view of a chip type diode attached to the circuit component of the present invention, and FIG. 8 is a circuit diagram of the assembled composite circuit component. The main parts in the diagram are as follows. 1, 2, 3, 4: ceramic sheet, 5: hole,
A: first base part, B: second base part, C:
Chip type diode.
Claims (1)
に印刷したセラミツクートを複数積層した積積層
体の表面がセラミツク層で覆われている第１のセ
ラミツクベース部、第１のセラミツクベース部上
に一体に重畳され且つ前記コンデンサー用電極の
両側にダイオード受入れ用の貫通孔を有する第２
のセラミツクベース、前記貫通孔に嵌合されたダ
イオード、第２のセラミツクベース部の表面に形
成された複数の抵抗層、及び第２のセラミツクベ
ース部の表面に形成され且つ前記貫通孔の両端部
及び抵抗の両端部からの引出部を有するプリント
された配線導体よりなることを特徴とする、複合
回路部品。 A first ceramic base portion whose surface is covered with a ceramic layer of a laminate made of a plurality of laminated ceramic sheets each having two or more sets of capacitor electrodes printed approximately in the center thereof, and integrally superimposed on the first ceramic base portion. and has a through hole for receiving a diode on both sides of the capacitor electrode.
a ceramic base, a diode fitted into the through hole, a plurality of resistance layers formed on the surface of the second ceramic base, and both ends of the through hole formed on the surface of the second ceramic base. and a printed wiring conductor having a lead-out portion from both ends of the resistor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8939580U JPH0142333Y2 (en) | 1980-06-27 | 1980-06-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8939580U JPH0142333Y2 (en) | 1980-06-27 | 1980-06-27 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5714429U JPS5714429U (en) | 1982-01-25 |
| JPH0142333Y2 true JPH0142333Y2 (en) | 1989-12-12 |
Family
ID=29451424
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8939580U Expired JPH0142333Y2 (en) | 1980-06-27 | 1980-06-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0142333Y2 (en) |
-
1980
- 1980-06-27 JP JP8939580U patent/JPH0142333Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5714429U (en) | 1982-01-25 |
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