JPH01313968A - Lead pin for ceramic package - Google Patents
Lead pin for ceramic packageInfo
- Publication number
- JPH01313968A JPH01313968A JP14502988A JP14502988A JPH01313968A JP H01313968 A JPH01313968 A JP H01313968A JP 14502988 A JP14502988 A JP 14502988A JP 14502988 A JP14502988 A JP 14502988A JP H01313968 A JPH01313968 A JP H01313968A
- Authority
- JP
- Japan
- Prior art keywords
- lead pin
- ceramic package
- active metal
- soldering material
- brazing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 title claims abstract description 25
- 239000002184 metal Substances 0.000 claims abstract description 28
- 229910052751 metal Inorganic materials 0.000 claims abstract description 28
- 239000011248 coating agent Substances 0.000 claims abstract description 13
- 238000000576 coating method Methods 0.000 claims abstract description 13
- 230000001590 oxidative effect Effects 0.000 claims abstract description 8
- 238000005219 brazing Methods 0.000 claims description 27
- 239000000463 material Substances 0.000 abstract description 20
- 239000000758 substrate Substances 0.000 abstract description 7
- 238000004544 sputter deposition Methods 0.000 abstract description 2
- 238000005476 soldering Methods 0.000 abstract 8
- -1 e.g. Substances 0.000 abstract 1
- 239000000945 filler Substances 0.000 description 6
- 229910000679 solder Inorganic materials 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 229910017944 Ag—Cu Inorganic materials 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 1
- 229910015320 MoMn Inorganic materials 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、セラミックパッケージ用リードピンの改良に
関する。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to improvements in lead pins for ceramic packages.
（従来の技術）
従来のセラミックパッケージ用リードピンは、第２図に
示す如＜Ｆｅ−Ｎｉ４２ｗｔ％より成るり一ドピン１の
頭部１ａに、ＢＡｇ ８ （Ａｇ−Ｃｕ２８ｗｔ％）
のろう材２を接合して成るものであったが、セラミック
パッケージの基板とろう付けする際には、基板のリード
ピンｌをろう付けする部分をメタライズしなければろう
付けできないので、工数増、コスト高等の問題があった
。(Prior Art) A conventional lead pin for a ceramic package is made of Fe-Ni42wt%, and BAg8 (Ag-Cu28wt%) is attached to the head 1a of the lead pin 1, as shown in FIG.
However, when brazing to the ceramic package board, the part of the board where the lead pin l is to be brazed must be metalized, which increases man-hours and costs. There was a problem with high school.
このような問題を解決するものとして、Ａｇ−Ｃｕ合金
のろう材に活性金属（Ｔ ｉＳＺ ｒ 、 Ｈを等）を
含有する所謂活性金属ろうを頭部に備えたリードピンが
開発され、使用に供されている。To solve these problems, a lead pin with a so-called active metal brazing head containing an active metal (TiSZr, H, etc.) in an Ag-Cu alloy brazing material has been developed and is now available for use. has been done.
（発明が解決しようとする課題）
然し乍ら、上記の活性金属ろうを頭部に備えたリードピ
ンは、その製作時活性金属ろうがカーボン治具を始め、
殆んどの材質の治具に濡れ易い為、リードピンの頭部に
活性金属ろうを炉中ろう付けした際、治具にも流れて付
着する結果、リードピンの治具からの抜けが悪くて、リ
ードピンの取り出しに手間がかかり、しかも治具が破損
することが多かった。(Problem to be Solved by the Invention) However, the above-mentioned lead pin with the active metal solder on the head is manufactured using a carbon jig,
It easily wets the jig made of most materials, so when active metal solder is brazed to the head of the lead pin in the furnace, it flows and adheres to the jig, making it difficult for the lead pin to come out from the jig. It took a lot of time to remove the jig, and the jig was often damaged.
また上記リードピンは、活性金属ろうの活性金属がリー
ドピン側の界面へ凝集してろうの表面はＡｇ−Ｃｕとな
る。従って、セラミックパッケージの基板にろう付けす
る。と、活性金属の働きが少ない為、セラミックと活性
金属との化合物が少なく、基板とリードピンとの接合強
度が低く、不安定であった。Further, in the lead pin, the active metal of the active metal solder aggregates to the interface on the lead pin side, and the surface of the solder becomes Ag-Cu. Therefore, it is brazed to the substrate of the ceramic package. However, since the active metal had little activity, there was little compound between the ceramic and the active metal, and the bonding strength between the substrate and the lead pin was low and unstable.
（発明の目的）
本発明は、上記課題を解決すべくなされたもので、セラ
ミックパッケージの基板と安定確実に、十分な接合強度
でろう付けできるセラミックパッケージ用リードピンを
提供することを目的とするものである。(Object of the Invention) The present invention was made to solve the above problems, and an object of the present invention is to provide a lead pin for a ceramic package that can be stably and reliably brazed with a ceramic package substrate with sufficient bonding strength. It is.
（課題を解決するための手段）
上記課題を解決するための本発明のセラミックパッケー
ジ用リードピンは、リードピンの頭部にろう材が接合さ
れ、そのろう材の表面に活性金属の被膜が形成され、そ
の被膜の表面に非酸化性でろう材に影響の無い被膜が形
成されて成るものである。(Means for Solving the Problems) A lead pin for a ceramic package of the present invention for solving the above problems has a brazing material bonded to the head of the lead pin, an active metal coating being formed on the surface of the brazing material, A non-oxidizing film that does not affect the brazing material is formed on the surface of the film.
（作用）
本発明のセラミックパッケージ用リードピンは、上述の
如く構成されているので、保管中頭部のろう材が酸化す
ることが無く、さらにそのろう付けにおいて活性金属が
ろう材の表面側に有するので、ろう付は時、セラミック
と活性金属の化合物が十分となって、基板とリードピン
の接合強度が高く、安定する。(Function) Since the lead pin for a ceramic package of the present invention is constructed as described above, the brazing material at the head part does not oxidize during storage, and furthermore, during brazing, active metal is present on the surface side of the brazing material. Therefore, when brazing, the compound of ceramic and active metal becomes sufficient, and the bonding strength between the board and lead pin is high and stable.
（実施例）
本発明のセラミックパッケージ用リードピンの実施例を
第１図によって説明すると、１はＦｅ−Ｎ ｉ ４２ｗ
ｔ％より成る高さ１１．６ｍｍ、直径０．４ｍｍのリー
ドピンで、その上端の直径０．６ｍｍ、厚さ０．２ｍｍ
の頭部１ａに、ＢＡｇ−８（Ａｇ−Ｃｕ２８ｗｔ％）の
ろう材２が厚さ０．２ｍｍにオーバル状に接合され、そ
のろう材２の表面に活性金属、本例ではＴｉの被膜３が
スパッタリング法により４μｍ（ろう材２０重量の２％
）形成され、そのＴｉの被膜３の表面に非酸化性でろう
材２に影響の無い金属、本例ではＡｕの被膜４が１μｍ
１ｌｉｉされている。(Example) An example of the lead pin for a ceramic package of the present invention will be described with reference to FIG. 1. 1 is Fe-N i 42w
A lead pin made of t% with a height of 11.6 mm and a diameter of 0.4 mm, and its upper end has a diameter of 0.6 mm and a thickness of 0.2 mm.
A brazing filler metal 2 of BAg-8 (Ag-Cu28wt%) is bonded to the head 1a in an oval shape with a thickness of 0.2 mm, and a coating 3 of an active metal, in this example Ti, is applied to the surface of the brazing filler metal 2. 4 μm (2% of the weight of the brazing filler metal 20% by sputtering method)
) is formed, and on the surface of the Ti coating 3, a non-oxidizing metal that does not affect the brazing filler metal 2, in this example a coating 4 of Au, is 1 μm thick.
1lii has been done.
このように構成された実施例のセラミックパッケージ用
リードピン５と、従来のセラミックパッケージ用リード
ピン、即ちＦ ｅ −Ｎ ｉ ４２ｗｔ％より成る高さ
１１．６ｍｍ、直径０．４ｍ＋ｎのリードピンにおけ゛
る上端の直径０．６ｍｍ、厚さ０．２ｍｍの頭部に、Ａ
ｇ−Ｃｕ２７ｗｔ％−Ｔｉｔ智ｔ％より成るろう材がオ
ーバル状に接合されて成るセラミックパッケージ用リー
ドピンとを、夫々セラミックパッケージのアルミナ基板
のＭｏＭｎを１μｍメタライズした部分に水素雰囲気中
でろう付けし、そのろう付は強度を測定した処、下記の
表に示すような結果を得た。The upper end of the ceramic package lead pin 5 of the embodiment configured as described above and the conventional ceramic package lead pin, that is, a lead pin with a height of 11.6 mm and a diameter of 0.4 m+n made of 42 wt% Fe-Ni. A head with a diameter of 0.6 mm and a thickness of 0.2 mm.
Ceramic package lead pins made of brazing filler metal made of g-Cu27wt%-Tit% are bonded in an oval shape to the 1 μm MoMn metallized portions of the alumina substrates of the ceramic packages in a hydrogen atmosphere, and The brazing strength was measured and the results shown in the table below were obtained.
上記の表で明らかなように実施例のセラミックパッケー
ジ用リードピンのろう付は強度は、従来例のセラミック
パッケージ用リードピンのろう付は強度よりも高く、ば
らつきが少なくて安定していることが判る。As is clear from the above table, the brazing strength of the ceramic package lead pins of the example is higher than the brazing strength of the conventional ceramic package lead pins, and it can be seen that the strength is stable with little variation.
尚、上記実施例ではろう材２０表面の活性金属の被膜３
がＴｉであるが、Ｚｒ或いはＨｆであっても良いもので
ある。また非酸化性でろう材に影響の無い被膜４がＡｕ
であるが、これに限るものではなくＡｇであっても良い
ものである。さらにリードピン１の材料はＦ ｅ −Ｎ
ｉ ４２ｗｔ％に限るものではなく、ろう材２の材料
もＢＡｇ−８に限るものではない。In the above embodiment, the active metal coating 3 on the surface of the brazing material 20
is Ti, but Zr or Hf may also be used. In addition, the coating 4 that is non-oxidizing and has no effect on the brazing material is Au.
However, the material is not limited to this, and Ag may also be used. Furthermore, the material of lead pin 1 is F e −N
i is not limited to 42 wt%, and the material of the brazing filler metal 2 is not limited to BAg-8 either.
（発明の効果）
以上の説明で判るように本発明のセラミックパッケージ
用リードピンは、ろう材の表面に活性金属被膜が形成さ
れ、その表面に非酸化性でろう材に影響の無い被膜が形
成されているので、セラミックパッケージの基板と、安
定確実にろう付けでき、しかもそのろう付は強度は高く
安定したものとなるという効果がある。(Effects of the Invention) As can be seen from the above explanation, the ceramic package lead pin of the present invention has an active metal film formed on the surface of the brazing material, and a non-oxidizing film that does not affect the brazing material. Therefore, it is possible to braze the ceramic package substrate stably and reliably, and the brazing is strong and stable.
第１図は本発明によるセラミックパッケージ用リードピ
ンの一実施例を示す図、第２図は従来のセラミックパッ
ケージ用リードピンを示す図である。
出願人 田中貴金属工業株式会社
、ＣＩＮｃｑ、Ｓ１ｒ＞FIG. 1 is a diagram showing an embodiment of a lead pin for a ceramic package according to the present invention, and FIG. 2 is a diagram showing a conventional lead pin for a ceramic package. Applicant Tanaka Kikinzoku Kogyo Co., Ltd., CINcq, S1r>
Claims (1)
の表面に活性金属の被膜が形成され、その被膜の表面に
非酸化性でろう材に影響の無い被膜が形成されて成るセ
ラミックパッケージ用リードピン。1. A ceramic package in which a brazing metal is bonded to the head of a lead pin, an active metal coating is formed on the surface of the brazing metal, and a non-oxidizing coating that does not affect the brazing metal is formed on the surface of the coating. lead pin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14502988A JPH01313968A (en) | 1988-06-13 | 1988-06-13 | Lead pin for ceramic package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14502988A JPH01313968A (en) | 1988-06-13 | 1988-06-13 | Lead pin for ceramic package |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01313968A true JPH01313968A (en) | 1989-12-19 |
Family
ID=15375767
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14502988A Pending JPH01313968A (en) | 1988-06-13 | 1988-06-13 | Lead pin for ceramic package |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01313968A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0480038A1 (en) * | 1990-04-16 | 1992-04-15 | Denki Kagaku Kogyo Kabushiki Kaisha | Ceramic circuit board |
| JPH05267529A (en) * | 1992-03-23 | 1993-10-15 | Ngk Insulators Ltd | Terminal for leading to outside used for ceramic package for electronic parts |
-
1988
- 1988-06-13 JP JP14502988A patent/JPH01313968A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0480038A1 (en) * | 1990-04-16 | 1992-04-15 | Denki Kagaku Kogyo Kabushiki Kaisha | Ceramic circuit board |
| US5354415A (en) * | 1990-04-16 | 1994-10-11 | Denki Kagaku Kogyo Kabushiki Kaisha | Method for forming a ceramic circuit board |
| EP0480038B1 (en) * | 1990-04-16 | 1997-07-09 | Denki Kagaku Kogyo Kabushiki Kaisha | Ceramic circuit board |
| JPH05267529A (en) * | 1992-03-23 | 1993-10-15 | Ngk Insulators Ltd | Terminal for leading to outside used for ceramic package for electronic parts |
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