JPH01309219A - Terminal for electric apparatus made of cu alloy - Google Patents
Terminal for electric apparatus made of cu alloyInfo
- Publication number
- JPH01309219A JPH01309219A JP1085326A JP8532689A JPH01309219A JP H01309219 A JPH01309219 A JP H01309219A JP 1085326 A JP1085326 A JP 1085326A JP 8532689 A JP8532689 A JP 8532689A JP H01309219 A JPH01309219 A JP H01309219A
- Authority
- JP
- Japan
- Prior art keywords
- component
- terminal
- alloy
- strength
- conductibility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910000881 Cu alloy Inorganic materials 0.000 title claims abstract description 12
- 239000012535 impurity Substances 0.000 claims abstract description 4
- 239000000463 material Substances 0.000 abstract description 7
- 230000000694 effects Effects 0.000 description 7
- 238000010438 heat treatment Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000005096 rolling process Methods 0.000 description 2
- 238000000137 annealing Methods 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 238000005097 cold rolling Methods 0.000 description 1
- 238000009749 continuous casting Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000005098 hot rolling Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は、高強度を有し、かつ導電性および熱クリー
プ特性のすぐれたＣｕ合金製電気機器用端子に関するも
のである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a terminal for electrical equipment made of a Cu alloy that has high strength and excellent conductivity and thermal creep properties.
一般に、各種の電気機器用端子の製造に、重量％で（以
下％は重量％を示す）、
Ｓ ｎ：１．５〜９％、
Ｐ ：０．０３〜０，３５％、
を有し、残りがＣｕと不可避不純物からなる組成を有す
るＣｕ合金が用いられている。Generally, in the production of terminals for various electrical devices, the following is used in weight% (hereinafter % indicates weight%): Sn: 1.5 to 9%, P: 0.03 to 0.35%, A Cu alloy having a composition in which the remainder consists of Cu and unavoidable impurities is used.
しかし、上記の従来Ｃｕ合金製電気機器用端子は、高強
度をもつものの、導電性および熱クリープ特性が十分で
ないために、これを小型化あるいは形状複雑化した場合
、十分その機能を発揮し得ないのが現状である。However, although the above-mentioned conventional Cu alloy terminals for electrical equipment have high strength, they do not have sufficient conductivity and thermal creep properties, so when they are made smaller or have a more complex shape, they cannot fully perform their functions. The current situation is that there is no such thing.
そこで、本発明者等は、上述のような観点から、すぐれ
た導電性と熱クリープ特性を具備した電気機器用端子を
開発すべく研究を行なった結果、電気機器用端子を、
Ｍｇ：０．３〜２％、
Ｐ ：（１，０（１１〜０．１９６、
を含有し、残りがＣｕと不可避不純物からなる組成を有
するＣｕ合金で構成すると、この結果の端子は、高強度
を有し、かつすぐれた導電性と熱クリープ特性を具備す
るようになることから、小型化および形状複雑化に十分
対応でき、すぐれた性能を発揮するようになるという知
見を得たのである。Therefore, from the above-mentioned viewpoints, the present inventors conducted research to develop a terminal for electrical equipment with excellent conductivity and thermal creep characteristics, and as a result, developed a terminal for electrical equipment with Mg: 0. 3-2%, P:(1,0(11-0.196, , as well as excellent conductivity and thermal creep properties, they found that they can fully cope with miniaturization and complex shapes, and exhibit excellent performance.
この発明は、上記知見にもとづいてなされたものであっ
て、以下に成分組成を上記の通りに限定した理由を説明
する。This invention was made based on the above knowledge, and the reason why the component composition was limited as described above will be explained below.
（ａ） Ｍｇ
Ｍｇ成分には、Ｃｕの素地に固溶することによって、主
要成分であるＣｕ自体の具備する高導電性を損なうこと
なく、強度と熱クリープ特性を向上させる作用があるが
、その含有量が０．３％未満では前記作用に所望の効果
が得られず、一方その含有量が２％を越えると、導電性
が損なわれるようになることから、その含有量を０．３
〜２％と定めた。(a) Mg The Mg component has the effect of improving strength and thermal creep properties by being dissolved in the Cu matrix without impairing the high conductivity of Cu itself, which is the main component. If the content is less than 0.3%, the desired effect cannot be obtained, while if the content exceeds 2%, the conductivity will be impaired, so the content should be reduced to 0.3%.
It was set at ~2%.
（ｂ） ｐ
Ｐ成分には、脱酸作用があるほか、Ｍｇ成分と共存した
状態で、強度および熱クリープ特性を向上させる作用が
あるが、その含有量がｏ、ｏｏｉ％未満では前記作用に
所望の効果が得られず、一方その含有量が０．１％を越
えると、脆化傾向が現われるようになることから、その
含有量を０．００１〜口、１％と定めた。(b) p In addition to having a deoxidizing effect, the P component also has the effect of improving strength and thermal creep properties when coexisting with the Mg component; however, if its content is less than o, ooi%, the above effect will not be achieved. The desired effect cannot be obtained, and if the content exceeds 0.1%, a tendency towards embrittlement appears, so the content was set at 0.001 to 1%.
つぎに、この発明の電子機器用端子を実施例により具体
的に説明する。Next, the terminal for electronic equipment according to the present invention will be specifically explained with reference to Examples.
通常の低周波溝型誘導炉を用い、それぞれ第１表に示さ
れるＣｕ合金溶湯を調製し、半連続鋳造法にて、厚さ：
１５０ｍｍＸ幅＝４００龍×長さ： １５００ｍｍの寸
法をもった鋳塊に鋳造した後、この鋳塊に、７１０〜８
００℃の範囲内の所定の圧延開始温度にて熱間圧延を施
して厚さ：１１ｍ＋ｅの熱延板とし、ついで水冷後、前
記熱延板の上下両面を０．５ｍｍづつ面側して厚さ：
１ｏｉｎとした状態で、通常の条件にて冷間圧延と焼鈍
とを交互に繰り返し行ない、最終仕上圧延率ニア５％に
て厚さ： ０．２５ｍ＋ｗの冷延板とし、最終的に２５
０〜４００℃の範囲内の所定の温度に３０分間保持の条
件で歪取り焼鈍を施すことによって本発明端子素材１〜
５および従来端子索材１．２をそれぞれ製造した。Molten Cu alloys shown in Table 1 were prepared using an ordinary low-frequency groove induction furnace, and casted by a semi-continuous casting method to a thickness of:
150mm x Width = 400mm x Length: After casting into an ingot with dimensions of 1500mm, 710~8
Hot rolling is performed at a predetermined rolling start temperature within the range of 00°C to obtain a hot rolled sheet with a thickness of 11 m+e, and then after water cooling, the upper and lower surfaces of the hot rolled sheet are side-faced by 0.5 mm each to give a thickness of 11 m+e. difference:
In the state of 1 oin, cold rolling and annealing were repeated alternately under normal conditions, and a cold rolled plate with a thickness of 0.25 m + w was obtained at a final finishing rolling rate of near 5%, and finally
Terminal materials of the present invention 1-
5 and conventional terminal cord material 1.2 were manufactured, respectively.
ついで、この結果得られた本発明端子素材１〜５および
従来端子１．２について、強度を評価する目的で、引張
強さとばね限界値を測定し、また導電性を評価する目的
で、導電率（ＩＡｃｓ％）を測定し、さらに熱クリープ
特性を評価する目的で、応力付加加熱後の応力緩和率を
測定した。Next, for the terminal materials 1 to 5 of the present invention and the conventional terminal 1.2 obtained as a result, the tensile strength and spring limit value were measured for the purpose of evaluating the strength, and the conductivity was measured for the purpose of evaluating the conductivity. (IAcs%), and in order to further evaluate the thermal creep properties, the stress relaxation rate after stress application and heating was measured.
なお、ばね限界値は、ＪＩＳ−Ｈ３１３０のモーメント
式試験により測定し、また応力緩和率は、幅＝１２．７
ｍｍｘ長さ：１２０ｍ１ （以下Ｌｏとする）の寸法を
もった試験片を使用し、この試験片を長さ７１１０ｍ１
ｌＸ深さ：３ｍ＋＋＋の水平縦長溝を有する治具に前記
試験片の中央部が上方に膨出するように彎曲セットしく
この時の試験片の両端部間の距離：１１０ｍｍをＬｌと
する）、この状態で温度：１５０℃に１０００時間保持
し、加熱後、前記治具から取りはずした状態する）を測
定し、計算式：
（Ｌｏ−Ｌ２）／（Ｌｏ−Ｌｌ）Ｘ１００（％）によっ
て算出することにより求めた。これらの結果を第１表に
示した。The spring limit value is measured by the JIS-H3130 moment test, and the stress relaxation rate is width = 12.7.
mm x length: 120 m1 (hereinafter referred to as Lo), use a test piece with a length of 7110 m1.
The test piece is set in a jig having a horizontal longitudinal groove with a depth of 3 m+++ in a curved manner so that the center part of the test piece bulges upward. The distance between both ends of the test piece at this time: 110 mm is defined as Ll), In this state, the temperature is maintained at 150°C for 1000 hours, and after heating, it is removed from the jig) and calculated using the formula: (Lo-L2)/(Lo-Ll) x 100 (%) I asked for it. These results are shown in Table 1.
第１表に示される結果から、本発明端子素材１〜５は、
いずれも従来端子素材１．２と同等の高強度を保持した
状態で、これより一段とすぐれた導電性および熱クリー
プ特性をもつことが明らかである。From the results shown in Table 1, terminal materials 1 to 5 of the present invention are as follows:
It is clear that both of these materials maintain high strength equivalent to that of conventional terminal material 1.2, but have far superior conductivity and thermal creep properties.
上述のように、この発明の電気機器用端子は、高強度を
有し、かつすぐれた導電性と熱クリープ特性を具備した
Ｃｕ合金で構成されているので、これらの小型化および
形状複雑化に十分対応することができ、十分満足する性
能を発揮するばかりでなく、高価なＳｎ成分を含有しな
いＣｕ合金で構成されているので、比較的コストの安い
ものとなるなど工業上有用な特性を有するのである。As mentioned above, the terminal for electrical equipment of the present invention is made of a Cu alloy that has high strength, excellent conductivity, and thermal creep properties, so it is suitable for miniaturization and complicated shapes. Not only does it have sufficient performance, it is made of a Cu alloy that does not contain the expensive Sn component, so it has industrially useful properties such as being relatively inexpensive. It is.
Claims (1)
上重量％）を有するＣｕ合金で構成したことを特徴とす
る高強度を有し、かつ導電性および熱クリープ特性のす
ぐれたＣｕ合金製電気機器用端子。[Claims] Consisting of a Cu alloy containing Mg: 0.3 to 2%, P: 0.001 to 0.1%, and the remainder consisting of Cu and unavoidable impurities (the above weight %) A terminal for electrical equipment made of a Cu alloy, which has high strength and excellent conductivity and thermal creep properties.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1085326A JPH0690887B2 (en) | 1989-04-04 | 1989-04-04 | Cu alloy terminal for electrical equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1085326A JPH0690887B2 (en) | 1989-04-04 | 1989-04-04 | Cu alloy terminal for electrical equipment |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6843786A Division JPS62227051A (en) | 1986-03-28 | 1986-03-28 | Terminal and connector made of cu alloy |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01309219A true JPH01309219A (en) | 1989-12-13 |
| JPH0690887B2 JPH0690887B2 (en) | 1994-11-14 |
Family
ID=13855508
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1085326A Expired - Fee Related JPH0690887B2 (en) | 1989-04-04 | 1989-04-04 | Cu alloy terminal for electrical equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0690887B2 (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20030082704A (en) * | 2002-04-18 | 2003-10-23 | 희성금속 주식회사 | Electronic contact production method of agcu system compound metal |
| JP2009228013A (en) * | 2008-03-19 | 2009-10-08 | Dowa Metaltech Kk | Copper alloy sheet and manufacturing method therefor |
| JP4516154B1 (en) * | 2009-12-23 | 2010-08-04 | 三菱伸銅株式会社 | Cu-Mg-P copper alloy strip and method for producing the same |
| JP4563508B1 (en) * | 2010-02-24 | 2010-10-13 | 三菱伸銅株式会社 | Cu-Mg-P-based copper alloy strip and method for producing the same |
| JP2012007231A (en) * | 2010-06-28 | 2012-01-12 | Mitsubishi Shindoh Co Ltd | Cu-Mg-P-BASED COPPER ALLOY BAR MATERIAL AND MANUFACTURING METHOD THEREFOR |
| CN103890205A (en) * | 2011-11-14 | 2014-06-25 | 三菱综合材料株式会社 | Copper alloy and copper alloy forming material |
| US9587299B2 (en) | 2011-10-28 | 2017-03-07 | Mitsubishi Materials Corporation | Copper alloy for electronic equipment, method for producing copper alloy for electronic equipment, rolled copper alloy material for electronic equipment, and part for electronic equipment |
| US10032536B2 (en) | 2010-05-14 | 2018-07-24 | Mitsubishi Materials Corporation | Copper alloy for electronic device, method for producing copper alloy for electronic device, and copper alloy rolled material for electronic device |
| US10153063B2 (en) | 2011-11-07 | 2018-12-11 | Mitsubishi Materials Corporation | Copper alloy for electronic devices, method of manufacturing copper alloy for electronic devices, copper alloy plastic working material for electronic devices, and component for electronic devices |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6454420A (en) * | 1987-08-25 | 1989-03-01 | Matsushita Electric Ind Co Ltd | Liquid crystal display element |
-
1989
- 1989-04-04 JP JP1085326A patent/JPH0690887B2/en not_active Expired - Fee Related
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6454420A (en) * | 1987-08-25 | 1989-03-01 | Matsushita Electric Ind Co Ltd | Liquid crystal display element |
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20030082704A (en) * | 2002-04-18 | 2003-10-23 | 희성금속 주식회사 | Electronic contact production method of agcu system compound metal |
| JP2009228013A (en) * | 2008-03-19 | 2009-10-08 | Dowa Metaltech Kk | Copper alloy sheet and manufacturing method therefor |
| US9255310B2 (en) | 2009-12-23 | 2016-02-09 | Mitsubishi Shindoh Co., Ltd. | Cu—Mg—P based copper alloy material and method of producing the same |
| JP4516154B1 (en) * | 2009-12-23 | 2010-08-04 | 三菱伸銅株式会社 | Cu-Mg-P copper alloy strip and method for producing the same |
| JP2011132564A (en) * | 2009-12-23 | 2011-07-07 | Mitsubishi Shindoh Co Ltd | Cu-Mg-P-BASED COPPER-ALLOY MATERIAL AND METHOD OF PRODUCING THE SAME |
| JP4563508B1 (en) * | 2010-02-24 | 2010-10-13 | 三菱伸銅株式会社 | Cu-Mg-P-based copper alloy strip and method for producing the same |
| JP2011174127A (en) * | 2010-02-24 | 2011-09-08 | Mitsubishi Shindoh Co Ltd | Cu-mg-p-based copper alloy bar stock and method for producing the same |
| WO2011104982A1 (en) * | 2010-02-24 | 2011-09-01 | 三菱伸銅株式会社 | Cu-mg-p-based copper alloy bar and method for producing same |
| US10032536B2 (en) | 2010-05-14 | 2018-07-24 | Mitsubishi Materials Corporation | Copper alloy for electronic device, method for producing copper alloy for electronic device, and copper alloy rolled material for electronic device |
| US10056165B2 (en) | 2010-05-14 | 2018-08-21 | Mitsubishi Materials Corporation | Copper alloy for electronic device, method for producing copper alloy for electronic device, and copper alloy rolled material for electronic device |
| JP2012007231A (en) * | 2010-06-28 | 2012-01-12 | Mitsubishi Shindoh Co Ltd | Cu-Mg-P-BASED COPPER ALLOY BAR MATERIAL AND MANUFACTURING METHOD THEREFOR |
| US9587299B2 (en) | 2011-10-28 | 2017-03-07 | Mitsubishi Materials Corporation | Copper alloy for electronic equipment, method for producing copper alloy for electronic equipment, rolled copper alloy material for electronic equipment, and part for electronic equipment |
| US10153063B2 (en) | 2011-11-07 | 2018-12-11 | Mitsubishi Materials Corporation | Copper alloy for electronic devices, method of manufacturing copper alloy for electronic devices, copper alloy plastic working material for electronic devices, and component for electronic devices |
| CN103890205A (en) * | 2011-11-14 | 2014-06-25 | 三菱综合材料株式会社 | Copper alloy and copper alloy forming material |
| US10458003B2 (en) | 2011-11-14 | 2019-10-29 | Mitsubishi Materials Corporation | Copper alloy and copper alloy forming material |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0690887B2 (en) | 1994-11-14 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |