JPH01299829A - Thickener for smc and production of smc - Google Patents
Thickener for smc and production of smcInfo
- Publication number
- JPH01299829A JPH01299829A JP12826788A JP12826788A JPH01299829A JP H01299829 A JPH01299829 A JP H01299829A JP 12826788 A JP12826788 A JP 12826788A JP 12826788 A JP12826788 A JP 12826788A JP H01299829 A JPH01299829 A JP H01299829A
- Authority
- JP
- Japan
- Prior art keywords
- smc
- mgo
- viscosity
- thickener
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002562 thickening agent Substances 0.000 title claims abstract description 21
- 238000004519 manufacturing process Methods 0.000 title claims description 5
- 239000002245 particle Substances 0.000 claims abstract description 47
- 229920005989 resin Polymers 0.000 claims description 29
- 239000011347 resin Substances 0.000 claims description 29
- 239000012783 reinforcing fiber Substances 0.000 claims description 13
- 239000007788 liquid Substances 0.000 claims description 12
- 229920001187 thermosetting polymer Polymers 0.000 claims description 10
- 230000008719 thickening Effects 0.000 abstract description 6
- 230000007423 decrease Effects 0.000 abstract description 4
- 230000003247 decreasing effect Effects 0.000 abstract description 2
- 239000011342 resin composition Substances 0.000 description 21
- 239000010419 fine particle Substances 0.000 description 6
- 239000003795 chemical substances by application Substances 0.000 description 4
- 239000003365 glass fiber Substances 0.000 description 4
- 229920006337 unsaturated polyester resin Polymers 0.000 description 4
- 239000000654 additive Substances 0.000 description 3
- 239000000835 fiber Substances 0.000 description 3
- 239000000945 filler Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 239000006082 mold release agent Substances 0.000 description 3
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- 239000003086 colorant Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005470 impregnation Methods 0.000 description 2
- -1 polyethylene Polymers 0.000 description 2
- CWPKTBMRVATCBL-UHFFFAOYSA-N 3-[1-[1-[(2-methylphenyl)methyl]piperidin-4-yl]piperidin-4-yl]-1h-benzimidazol-2-one Chemical compound CC1=CC=CC=C1CN1CCC(N2CCC(CC2)N2C(NC3=CC=CC=C32)=O)CC1 CWPKTBMRVATCBL-UHFFFAOYSA-N 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 239000003999 initiator Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 231100000989 no adverse effect Toxicity 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- XOOUIPVCVHRTMJ-UHFFFAOYSA-L zinc stearate Chemical compound [Zn+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O XOOUIPVCVHRTMJ-UHFFFAOYSA-L 0.000 description 1
Landscapes
- Reinforced Plastic Materials (AREA)
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野］
本発明はエスエムシー（以下ＳＭＣと称す）用増粘剤並
びにＳＭＣの製造法に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a thickener for SMC (hereinafter referred to as SMC) and a method for producing SMC.
［従来の技術］
補強繊維に、増粘剤を含有する液状の熱硬化性樹脂を含
浸させた後養生し、該樹脂の粘度を増大させたＳＭＣは
、その取扱い、硬化成型か容易であり、＃Ｊ！維補強樹
脂体（ＦＲＰ）の製造迄広く用いられている。[Prior Art] SMC, in which reinforcing fibers are impregnated with a liquid thermosetting resin containing a thickener and then cured to increase the viscosity of the resin, is easy to handle and harden and mold. #J! It is widely used for manufacturing fiber reinforced resin bodies (FRP).
ＳＭＣを製造する際、例えば不飽和ポリエステル樹脂に
ＭｇＯ等の増粘剤を配合した液状樹脂を含浸させる。When producing SMC, for example, an unsaturated polyester resin is impregnated with a liquid resin containing a thickener such as MgO.
液状樹脂には、所定量の増粘剤及び必要に応じて用いら
れる充填剤、着色剤、硬化剤、硬化促進剤、内部離型剤
等を添加混合し、増粘剤を含む樹脂組成物（以下単に樹
脂組成物という）を製造する。A predetermined amount of a thickener and a filler, a colorant, a curing agent, a curing accelerator, an internal mold release agent, etc., which are used as necessary, are added to and mixed with the liquid resin to form a resin composition containing a thickener ( (hereinafter simply referred to as a resin composition).
樹脂組成物を、ポリエチレンのような樹脂フィルムに所
定量塗布し、この上に硝子繊維束切断物のような補強繊
維を所定量散布し、更にその上に所定量の樹脂組成物を
塗布した樹脂フィルムを、樹脂組成物を下向きにして重
ね、好ましくはフィルムに穿孔しつつ一対のロールで挟
圧し、樹脂を補強繊維に含浸させるとともに脱泡を行な
う。A resin in which a predetermined amount of a resin composition is applied to a resin film such as polyethylene, a predetermined amount of reinforcing fibers such as cut glass fiber bundles are sprinkled on the film, and a predetermined amount of the resin composition is further applied on top of the resin film. The films are stacked with the resin composition facing downward, and preferably the films are perforated and pressed between a pair of rolls, thereby impregnating the reinforcing fibers with the resin and defoaming them.
ついてこのようにして得られた、一対のフィルムで被覆
された樹脂組成物を含浸せしめた補強縁ｍ（以下被覆補
強樹脂組成物という）を円筒形の芯体上に巻取り、２０
〜５０°Ｃ程度の所定温度に１〜７日程度保持する「養
生工程」により、樹脂粘度を４〜ｌ ６０ Ｘ １０６
ｃｐｓ程度迄増粘させることによってＳＭＣが製造され
る。The reinforcing edge m impregnated with the resin composition coated with a pair of films thus obtained (hereinafter referred to as the coated reinforced resin composition) was wound onto a cylindrical core, and
The resin viscosity is increased to 4 to 160 x 106 by a "curing process" in which the resin is maintained at a predetermined temperature of about 50°C for about 1 to 7 days.
SMC is produced by increasing the viscosity to about cps.
［発明が解決しようとする課題］
樹脂組成物の含浸は、該組成物の粘度が、８０．０００
ｃｐｓ程度以下、好ましくは６０，０００ｃｐｓ程度
以下の比較的低い間に行なう必要かある。[Problems to be Solved by the Invention] Impregnation with a resin composition is performed until the viscosity of the composition is 80.000.
It is necessary to carry out the process at a relatively low speed of about cps or less, preferably about 60,000 cps or less.
粘度が大きい状態で樹脂組成物を補強繊維に含浸させる
と、含浸が不均一となり易く、均質なＳＭＣを得ること
ができない。If reinforcing fibers are impregnated with a resin composition having a high viscosity, the impregnation tends to be uneven, making it impossible to obtain a homogeneous SMC.
樹脂組成物は増粘剤を含有しているため、調製後次第に
その粘度が大となり可使用時間（ポットライフ）は０．
５ ｈｒ程度と比較的小さく、その都度樹脂組成物を少
量づつ調製する必要があり、作業か煩雑となる。Since the resin composition contains a thickener, its viscosity gradually increases after preparation, resulting in a pot life of 0.
The time required is relatively small, about 5 hr, and the resin composition needs to be prepared in small quantities each time, making the work complicated.
又樹脂組成物は、補強繊維への含浸工程中、その粘度か
次第に増大する為作業条件か変化し、品質のバラツキが
生じ易い。Furthermore, during the process of impregnating the reinforcing fibers with the resin composition, the viscosity of the resin composition gradually increases, so that the working conditions change and the quality tends to vary.
樹脂組成物中に含有せしむべき増粘剤の量を減少させる
ことにより、粘度の上昇速度を小とすることはできるか
、増粘剤の量を減少させると、養生工程の期間を大とし
てもＳＭＣの樹脂粘度を所望値化上昇させることができ
なくなる。Is it possible to reduce the rate of increase in viscosity by reducing the amount of thickener that should be included in the resin composition? Also, it becomes impossible to increase the resin viscosity of SMC to a desired value.
本発明は、前述した従来技術の問題点を解決し、初期の
粘度上昇速度か遅く、従ってポットライフも大きく、し
かも養生期間終了後大きい樹脂粘度が得られるようなＳ
ＭＣ用増粘剤並びにＳＭＣの製造法を提供することを目
的とするものである。The present invention solves the above-mentioned problems of the prior art, and provides S.
The object of the present invention is to provide a thickener for MC and a method for producing SMC.
［課題を解決するための手段］
従来、所望のＳＭＣ粘度（養生期間終了後の粘度、以下
単にＳＭＣ粘度という）は他の条件が一定の場合、増粘
剤の添加量にほぼ比例して増大するものと考えられ、Ｓ
ＭＣを製造する際、液状の熱硬化性樹脂に添加すべき増
粘剤の量は、液状の熱硬化性樹脂及び増粘剤の種類に応
じて、所望のＳＭＣ粘度を勘案して決定されていた。[Means for solving the problem] Conventionally, the desired SMC viscosity (viscosity after the curing period, hereinafter simply referred to as SMC viscosity) increases almost in proportion to the amount of thickener added when other conditions are constant. S
When producing MC, the amount of thickener to be added to the liquid thermosetting resin is determined depending on the type of liquid thermosetting resin and thickener, taking into account the desired SMC viscosity. Ta.
前述したように増粘剤の含有量を減少されることにより
増粘速度を減少されることはできるが、ＳＭＣ粘度は増
粘剤の添加量に比例して減少するため、ＳＭＣ粘度を減
少させることなく、初期の増粘速度を減少させる手段は
知られていなかった。As mentioned above, the thickening rate can be reduced by reducing the content of the thickener, but since the SMC viscosity decreases in proportion to the amount of the thickener added, the SMC viscosity is reduced. No means have been known to reduce the initial viscosity increase rate.
本発明者は、前述した従来技術の問題点を解消すべく、
増粘剤としてＭｇＯを使用した場合につき種々検討を重
ねた結果、ＳＭＣ粘度は主として１ｇＯの添加量、副次
的には）４ｇｏの表面積に支配され、これらを大とする
程大となるが、初期の増粘速度はＭｇＯ中の粒径０．１
ル以下の微粒子の含有量によって大きく支配され、この
ような微粒子の含有量を１０Ｗｔ％以下とすることによ
り、ＳＭＣ粘度を減少させることなく初期増粘速度を大
幅に減少しうろことを見出した。In order to solve the problems of the prior art described above, the present inventors
As a result of various studies on the use of MgO as a thickener, we found that the SMC viscosity is mainly controlled by the amount of 1gO added and secondarily by the surface area of 4go, and the larger these are, the larger it becomes. The initial viscosity increase rate is 0.1 particle size in MgO.
It has been found that by controlling the content of such fine particles to 10 Wt% or less, the initial viscosity increase rate can be significantly reduced without reducing the SMC viscosity.
このような、ＭｇＯの添加量、表面積、ＭｇＯ粒子の粒
径と増粘速度の関係は、如何なるメカニズムによるもの
か充分明らかではないが、およそ次のように考えられる
。The mechanism of the relationship between the amount of MgO added, the surface area, the particle size of MgO particles, and the rate of viscosity increase is not fully clear, but it is thought to be approximately as follows.
ＭｇＯは、液状の熱硬化性樹脂分子の有するカルボキシ
ル基のような官能基と反応して配位結合か形成され、こ
の結果樹脂分子は緩かに架橋され、樹脂分子の動きか拘
束され、粘度が上昇する。この樹脂分子の拘束の程度は
、生成する配位結合の量に比例して増大し、この結合の
量は、ＭｇＯの添加量に比例して増大する。MgO reacts with functional groups such as carboxyl groups of liquid thermosetting resin molecules to form coordination bonds, and as a result, the resin molecules are loosely cross-linked, their movement is restricted, and the viscosity is reduced. rises. The degree of restraint of the resin molecules increases in proportion to the amount of coordinate bonds formed, and the amount of these bonds increases in proportion to the amount of MgO added.
従って樹脂粘度の上昇速度及びＳＭＣ粘度はＭｇＯの量
にほぼ比例して増大する。Therefore, the rate of increase in resin viscosity and SMC viscosity increase approximately in proportion to the amount of MgO.
ＭｇＯと樹脂分子との反応は固液反応であり、しかも樹
脂分子は比較的分子量か大きいので、その反応速度も遅
く、又配位結合はＭｇＯ粒子表面で生じ、増粘が進むに
つれ、樹脂分子の動きが拘束されるため、ＭｇＯ粒子表
面に新しい（未反応の）樹脂分子が到達してＭｇＯと反
応することか困難となる。このためＭｇＯ粒子の粒径が
小さい場合（即表面積の大きい場合）は増粘速度も大き
く又、ＭｇＯ粒子の粒径が大きい場合（即表面積の小さ
い場合）はＭｇＯの反応率が小となり、ＳＭＣ粘度が減
少するものと考えられる。The reaction between MgO and resin molecules is a solid-liquid reaction, and since the resin molecules have a relatively large molecular weight, the reaction rate is slow, and coordination bonds occur on the MgO particle surface, and as the viscosity increases, the resin molecules Since the movement of MgO is restricted, it becomes difficult for new (unreacted) resin molecules to reach the MgO particle surface and react with MgO. Therefore, when the particle size of MgO particles is small (when the immediate surface area is large), the rate of viscosity increase is high, and when the particle size of the MgO particles is large (when the immediate surface area is small), the reaction rate of MgO is small, and SMC It is thought that the viscosity decreases.
更にＭｇＯ粒子には、恐らく格子欠陥に基づくものと推
定される活性の大きい部分が点在し、この部分で樹脂分
子との初期の反応が開始され、初期の反応速度（即初期
の増粘速度）は活性部分の量に左右されるものと思われ
る。このような活性部分はＭｇＯ粒子の粒径が小となる
につれ急速に増大する傾向を有し、粒径０．１ｐ以下の
粒子の割合を減少させることにより初期の増粘速度が減
少するものと考えられる。Furthermore, the MgO particles are dotted with highly active parts, which are presumed to be based on lattice defects, and the initial reaction with resin molecules starts in these parts, leading to the initial reaction rate (immediately the initial viscosity increase rate). ) appears to depend on the amount of active moiety. Such active moieties tend to increase rapidly as the particle size of the MgO particles decreases, and the initial thickening rate can be reduced by decreasing the proportion of particles with a particle size of 0.1p or less. Conceivable.
なお、粒径０．１弘以下の粒子を含まないＭｇＯを使用
しても、はぼ２４ｈｒを経過すると反応速度は、このよ
うな微粒子を含む場合とほぼ同じ個迄上昇するため、Ｓ
ＭＣ粘度、或は養生に必要な期間に悪影響を生ずること
はない。Note that even if MgO is used that does not contain particles with a particle size of 0.1 Hiro or less, the reaction rate will increase to almost the same amount as when such fine particles are included after approximately 24 hours, so the S
There is no adverse effect on MC viscosity or the period required for curing.
本発明は、上記知見に基づいてなされたものであり、上
記目的を達成する為、本発明においては、粒径０．１ｐ
以下の粒子の含有割合か１０Ｗｔ％以下であり、且つ平
均粒径が０．３〜２ＷであるＭｇＯ粒子をＳＭＣの増粘
剤として使用する。又粒径０．Ｉ ＪＬ以下の粒子の含
有割合か１０Ｗｔ％以下てあり、且つ平均粒径が０．３
〜２ＪＬのＭｇＯ粒子を含む液状の熱硬化性樹脂を補強
繊維に含浸させ、ついて養生することによりＳＭＣを製
造する。The present invention has been made based on the above knowledge, and in order to achieve the above object, in the present invention, the particle size is 0.1p.
MgO particles having the following particle content of 10 Wt% or less and an average particle size of 0.3 to 2 W are used as a thickener for SMC. Also, the particle size is 0. The content of particles below I JL is 10 Wt% or less, and the average particle size is 0.3
SMC is manufactured by impregnating reinforcing fibers with a liquid thermosetting resin containing ~2 JL of MgO particles and then curing.
次に本発明を更に具体的に説明する。Next, the present invention will be explained in more detail.
液状の熱硬化性樹脂としては、不飽和ポリエステル樹脂
、エポキシ樹脂等が使用てきるか、不飽和ポリエステル
樹脂を用いるのか実際的である。As the liquid thermosetting resin, it is practical to use unsaturated polyester resin, epoxy resin, etc., or to use unsaturated polyester resin.
増粘剤としては粒径０．１１Ｌ以下の粒子（以下ＭｇＯ
微粒子という）の含有割合が１０Ｗｔ％以下、好ましく
は７Ｗｔ％以下のＭｇＯ粒子（以下水ＭｇＯという）を
使用する。As a thickener, particles with a particle size of 0.11L or less (hereinafter MgO
MgO particles (hereinafter referred to as water MgO) containing 10 wt% or less, preferably 7 wt% or less of fine particles) are used.
ＭｇＯ微粒子の含有割合が上記範囲より大きい場合初期
増粘速度が大となり、本発明の目的を達成することか困
難となる。又ＭｇＯ粒子の平均粒径は０．３〜２ＪＬと
するのが適当である。If the content of MgO fine particles is larger than the above range, the initial viscosity increase rate will be high, making it difficult to achieve the object of the present invention. Further, it is appropriate that the average particle size of the MgO particles is 0.3 to 2 JL.
平均粒径があまり大きいと、必要な養生期間が大となり
、又ＳＭＣ粘度を所望値とするのに必要なＭｇＯ添加量
が大となる。If the average particle size is too large, the required curing period will be long, and the amount of MgO added will be large to bring the SMC viscosity to the desired value.
又平均粒径があまり小さいとＳＭＣの増粘特性にハラつ
きが生じ易い。Furthermore, if the average particle diameter is too small, the thickening properties of SMC tend to be inconsistent.
熱硬化性樹脂に混合すべきＭｇＯの量は樹脂の０．４〜
５Ｗｔ％とするのか適当である。The amount of MgO to be mixed into the thermosetting resin is 0.4~
It is appropriate to set it to 5 Wt%.
液状の熱硬化性樹脂には、ＭｇＯの他、必要に応じ、炭
酸カルシウムのような充填剤、顔料のような着色剤、過
酸化物のような硬化剤、コバルト（金属触媒）のような
硬化促進剤、ステアリン酸亜鉛のような内部離型剤のよ
うな添加剤を加えることがてきる。これらの添加剤の種
類及び添加量は従来技術と異なるところがないので詳細
な説明は省略する。In addition to MgO, liquid thermosetting resins may contain fillers such as calcium carbonate, colorants such as pigments, hardening agents such as peroxide, and hardening agents such as cobalt (metal catalyst). Additives such as accelerators, internal mold release agents such as zinc stearate can be added. Since the types and amounts of these additives are the same as in the prior art, detailed explanations will be omitted.
ＭｇＯ及び所望に応じて加えられる添加剤を混合してな
る、液状熱硬化性樹脂組成物（以下本組成物という）を
常法に従ってガラス繊維束切断物に含浸させ、被覆補強
樹脂組成物を製造し、芯体上に巻取り、養生する。養生
温度及び時間は夫々２０〜５０℃、１〜７日程度である
。A cut glass fiber bundle is impregnated with a liquid thermosetting resin composition (hereinafter referred to as the present composition) prepared by mixing MgO and additives added as desired in a conventional manner to produce a coated reinforced resin composition. Then, it is wound onto a core body and cured. The curing temperature and time are 20 to 50° C. and about 1 to 7 days, respectively.
補強繊維の種類、補強繊維と樹脂配合物の割合に特に限
定はなく、従来技術が使用しつる。There are no particular limitations on the type of reinforcing fibers or the ratio of the reinforcing fibers to the resin compound, and conventional techniques can be used.
例えば補強繊維として太さ８〜１５ｐのガラス繊維をｉ
ｏｏ〜４００本程度集束してなる繊維束を１〜１０ｃｍ
程度に切断したチョツプドストランドをｌｒｎ’当り４
００〜３０００ｇｒ程度散布してマット状となし、この
マット状補強繊維に対し４０〜８０Ｗｔ％程度の樹脂組
成物を含浸させたものを好適に使用しつる。For example, use glass fiber with a thickness of 8 to 15p as a reinforcing fiber.
oo ~ A fiber bundle of about 400 fibers, 1 to 10 cm long.
4 pieces per lrn' of chopped strands
Approximately 0.00 to 3000 gr is dispersed to form a mat-like reinforcing fiber, and this mat-like reinforcing fiber is preferably impregnated with a resin composition of about 40 to 80 wt%.
［作 用］
本）４ｇｏを増粘剤として使用することにより、本組成
物の初期の増粘速度を、従来品の約２０〜５０％に減少
させ、ポットライフを約２〜５倍に増大させる。なおＳ
ＭＣ粘度、必要な養生期間に好ましからざる影響を与え
ることはない。[Function] By using 4go as a thickener, the initial thickening rate of this composition is reduced to about 20-50% of that of conventional products, and the pot life is increased about 2-5 times. let Furthermore, S
There is no undesirable effect on MC viscosity and the required curing period.
［実施例１］
不飽和ポリエステル樹脂５０重量部、低収縮剤５０重量
部、反応開始剤（ＴＢＰＢ） １．５重量部、内部離型
剤（Ｚｎ−Ｓｔ） ４．０重量部、充填剤（ｃａｃｏ：
＋）１８０重量部、平均粒径０．４ ＪＬ、粒径０．１
終息下の微粒子の含有割合７Ｗｔ％のＭｇ０１．５重
量部を混合して得られた樹脂組成物を室温（３０°Ｃ）
に放置した場合の粘度変化は別表の通りであった。[Example 1] 50 parts by weight of unsaturated polyester resin, 50 parts by weight of low shrinkage agent, 1.5 parts by weight of reaction initiator (TBPB), 4.0 parts by weight of internal mold release agent (Zn-St), filler ( caco:
+) 180 parts by weight, average particle size 0.4 JL, particle size 0.1
A resin composition obtained by mixing 1.5 parts by weight of Mg0 with a fine particle content of 7 wt% was heated at room temperature (30°C).
The viscosity change when left for 20 minutes was as shown in the attached table.
［比較例コ
実施例のＭｇＯに代え平均粒径０．４島、粒径０．１島
以下の微粒を２０Ｗｔ％含むＭｇＯを用いて同様な試験
を行った結果を別表に示す。[Comparative Example] The results of a similar test using MgO containing 20 wt % of fine particles with an average particle size of 0.4 islands and 0.1 islands or less in place of the MgO of the example are shown in the attached table.
別表から明らかなように本ＭｇＯを用いた場合。As is clear from the attached table, when this MgO is used.
樹脂組成物の粘度が６０，０００ｃｐｓに達する迄の時
間（ポットライフ）は比較例のほぼ３〜４倍である。The time required for the viscosity of the resin composition to reach 60,000 cps (pot life) is approximately 3 to 4 times that of the comparative example.
又ＳＭＣ粘度を１００９口００ Ｘ Ｉ Ｏ３ｃｐｓに
するための所要養生期に実質的な差はなく、２ ｄａｙ
経過後本ＭｇＯを用いた場合の方か高い粘度を示した。In addition, there is no substantial difference in the curing period required to make the SMC viscosity 1009 x I O3 cps, and 2 days
After the elapsed time, the viscosity was higher when the present MgO was used.
別表
［実施例２コ
実施例１の樹脂組成物を１００重量部、太さ、１３、ｗ
の硝子繊維を２００本集束してなるストランドを２．５
ｃｍの長さに切断したチョップトストランド３０重量
部に含浸させ厚さ２１ｎ１１．３，５００ｇｒ ／ｍｌ
の均質なＳＭＣをうることかてきた。Attached table [Example 2] 100 parts by weight of the resin composition of Example 1, thickness: 13, w
2.5 strands made of 200 glass fibers
Impregnated with 30 parts by weight of chopped strands cut to a length of cm to a thickness of 21n11.3,500gr/ml
It has been possible to obtain a homogeneous SMC.
［発明の効果］
ＳＭＣ粘度、養生期間に悪影響を与えることなく、初期
の増粘速度を低下させ、樹脂組成物のポットライフを増
大させ、均質なＳＭＣをうろことを可能ならしめる。[Effects of the Invention] The initial thickening rate is reduced, the pot life of the resin composition is increased, and homogeneous SMC can be scaled without adversely affecting the SMC viscosity and curing period.
Claims (2)
以下であり、且つ平均粒径が０．３〜２μであるＭｇＯ
粒子よりなることを特徴とするエスエムシー用増粘剤(1) The content of particles with a particle size of 0.1 μ or less is 10 Wt%
MgO having the following properties and an average particle size of 0.3 to 2μ
Thickener for SMC characterized by consisting of particles
以下であり、且つ平均粒径が０．３〜２μのＭｇＯ粒子
を含む液状の熱硬化性樹脂を補強繊維に含浸させ、つい
で養生することを特徴とするエスエムシーの製造法。(2) The content of particles with a particle size of 0.1μ or less is 10Wt%
A method for producing SMC, which comprises impregnating reinforcing fibers with a liquid thermosetting resin containing MgO particles having an average particle size of 0.3 to 2 μm, and then curing the reinforcing fibers.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12826788A JPH01299829A (en) | 1988-05-27 | 1988-05-27 | Thickener for smc and production of smc |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12826788A JPH01299829A (en) | 1988-05-27 | 1988-05-27 | Thickener for smc and production of smc |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01299829A true JPH01299829A (en) | 1989-12-04 |
Family
ID=14980611
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12826788A Pending JPH01299829A (en) | 1988-05-27 | 1988-05-27 | Thickener for smc and production of smc |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01299829A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012020885A (en) * | 2010-07-12 | 2012-02-02 | Kyowa Chem Ind Co Ltd | Thickener |
-
1988
- 1988-05-27 JP JP12826788A patent/JPH01299829A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012020885A (en) * | 2010-07-12 | 2012-02-02 | Kyowa Chem Ind Co Ltd | Thickener |
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