JPH01297541A - Inspecting device for electronic parts - Google Patents
Inspecting device for electronic partsInfo
- Publication number
- JPH01297541A JPH01297541A JP63127711A JP12771188A JPH01297541A JP H01297541 A JPH01297541 A JP H01297541A JP 63127711 A JP63127711 A JP 63127711A JP 12771188 A JP12771188 A JP 12771188A JP H01297541 A JPH01297541 A JP H01297541A
- Authority
- JP
- Japan
- Prior art keywords
- lead
- electronic component
- silhouette
- leads
- image pickup
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007689 inspection Methods 0.000 claims abstract description 9
- 230000002950 deficient Effects 0.000 claims description 5
- 238000001514 detection method Methods 0.000 claims description 3
- 238000003384 imaging method Methods 0.000 claims description 3
- 210000000078 claw Anatomy 0.000 abstract description 6
- 239000004065 semiconductor Substances 0.000 abstract description 4
- 230000001678 irradiating effect Effects 0.000 abstract description 2
- 238000001179 sorption measurement Methods 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 description 7
- 238000005452 bending Methods 0.000 description 5
- 238000005286 illumination Methods 0.000 description 3
- 230000001105 regulatory effect Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 1
- 230000007717 exclusion Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N21/95684—Patterns showing highly reflecting parts, e.g. metallic elements
Landscapes
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Image Processing (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Image Analysis (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、フラットパックＩＣ等の複数のリードを有す
る電子部品の上下方向のリード曲りを検査する電子部品
検査装置に関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to an electronic component inspection apparatus for inspecting vertical lead bending of an electronic component having a plurality of leads, such as a flat pack IC.
従来の技術
従来この種の電子部品の検査装置は、例えば特開昭６２
−２４５９０６号公報に示されているように、第６図（
ａ）、 （ｂ）のような構成になっていた。2. Description of the Related Art Conventionally, this type of inspection equipment for electronic components has been disclosed, for example, in Japanese Patent Application Laid-Open No.
As shown in Publication No.-245906, Fig. 6 (
The structure was as shown in a) and (b).
すなわち、ノズ／ｌ／１０１で電子部品１０２を吸着し
た状態でＴＶカメラ１０３ａ、 １ｏ３ｂで横方向から
撮像しリード１０４の高さを計測しようとするものであ
る。In other words, the height of the lead 104 is measured by taking an image from the side with the TV cameras 103a and 103b while the electronic component 102 is attracted by the nozzle /l/101.
発明が解決しようとする課題
しかしながら上記のような構成では、その反射で撮像す
るため照明の当て方が大変むずかしく、リード先端の端
面が影になったり、逆に発光したりして正確な高さＱ計
測が困難である。又電子部品の大きさが変わった場合に
は、焦点位置が変わり、それを解決するにはオートフォ
ーカス付レンズを使用しなければならず高価になる。又
、電子部品の位置決めがなされない為電子部品のリード
端面とＴＶ右カメラ平行度が合わない場合には計測が不
可能である。Problems to be Solved by the Invention However, with the above configuration, it is very difficult to apply lighting because the image is captured by reflection, and the end face of the lead tip becomes a shadow or emits light, making it difficult to accurately determine the height. Q measurement is difficult. Furthermore, when the size of the electronic components changes, the focal position changes, and to solve this problem, it is necessary to use an autofocus lens, which becomes expensive. Furthermore, since the electronic component is not positioned, measurement is impossible if the lead end face of the electronic component and the parallelism of the TV right camera do not match.
そこで本発明は、透過照明でシルエットを撮像し、電子
部品の大きさが変わったり、ＸＹ力方向傾きがあっても
センターリングを行ない、電子部品のリードの上下方向
の曲りを正確に計測しようとするものである。Therefore, the present invention aims to image the silhouette using transmitted illumination, perform centering even if the size of the electronic component changes or is tilted in the XY force direction, and accurately measure the vertical bending of the lead of the electronic component. It is something to do.
課題を解決するだめの手段
上記問題点を解決するために、本発明は、電子部品の位
置決めを行なうセンターリング部と、電子部品を横方向
から照射する光源部と、倍率変換及び平行光にするレン
ズ部と、電子部品のリードの横方向のシルエットを撮像
する撮像部と、電子部品の四辺のリードの厚みを測定し
、予め設定された厚みと比較演算し、厚みが大の時は不
良、小の時は良とする計測装置とで構成するものである
。Means for Solving the Problems In order to solve the above-mentioned problems, the present invention provides a centering section for positioning electronic components, a light source section for irradiating electronic components from the lateral direction, and a system that converts the magnification and converts the beam into parallel light. The lens section and the imaging section that captures the horizontal silhouette of the leads of the electronic component measure the thickness of the leads on the four sides of the electronic component, compare and calculate the thickness with a preset thickness, and if the thickness is too large, it is determined to be defective. It consists of a measuring device that is considered good when it is small.
作 用
本発明は上記した構成によって、電子部品の大きさが変
わったり、電子部品が平面のＸＹ力方向傾いて置かれた
場合でもセンターリング機構により正確にＸＹ力方向位
置決めがなされ、位置決めされた電子部品を横方向から
平行光で照明するのでリードの横方向のシルエットとし
てＴＶ右カメラ撮像でき、また電子部品の大きさが変わ
ってもシリンドリカルレンズで広範囲の大きさの電子部
品のリードを撮像できる。Effect: With the above-described configuration, the present invention allows accurate positioning in the XY force direction by the centering mechanism even when the size of the electronic component changes or the electronic component is placed tilted in the XY force direction on a plane. Since the electronic components are illuminated with parallel light from the side, the TV right camera can image the leads as a horizontal silhouette.Also, even if the size of the electronic components changes, the cylindrical lens can image the leads of electronic components of a wide range of sizes. .
このように、電子部品のＸＹ力方向傾きや大きさが変化
してもリードの上下方向の曲りを正確に計測できるので
ある。In this way, even if the inclination or magnitude of the electronic component in the XY force direction changes, the vertical bending of the lead can be accurately measured.
実施例
以下、本発明の一実施例について第１図〜第６図に基づ
いて説明する。EXAMPLE Hereinafter, an example of the present invention will be described based on FIGS. 1 to 6.
電子部品検査装置を示す第１図において、１はセンター
リング機構で、フラットパックＩＣ２のＸＹ力方向位置
決めを行なう。３はセンターリング機構１の開閉を駆動
するエアーシリンダーである。４はフラットパックＩＣ
２のリード上下方向上りを検出する検出器である。６は
リード厚みを計測し比較演算する計測装置である。In FIG. 1 showing the electronic component inspection apparatus, reference numeral 1 denotes a centering mechanism that positions the flat pack IC 2 in the XY force directions. 3 is an air cylinder that drives the centering mechanism 1 to open and close. 4 is flat pack IC
This is a detector that detects the upward movement of the lead No. 2 in the vertical direction. 6 is a measuring device that measures the lead thickness and performs comparison calculations.
次にセンターリング機構１の詳細を第２図に塙づいて説
明する。６ａ、６ｂは規正爪で、フラットパックＩＣ２
のＸ方向の規正を行なう。この規正爪はＸＹ２方向に６
ａ、ｅｂ、６ｃ、ｅａと設けられている。７は吸着ノズ
ルでフラットパックＩＣ２の下面を吸着保持している。Next, details of the centering mechanism 1 will be explained with reference to FIG. 2. 6a and 6b are standard claws, flat pack IC2
Performs correction in the X direction. This regulation claw is 6 in the XY direction.
They are provided as a, eb, 6c, and ea. 7 is a suction nozzle that suctions and holds the bottom surface of the flat pack IC2.
レバーＡ８は揺動可能に配設され、エアシリンダー３と
連結されている。レバーＢ９は揺動可能に配設され、前
記レバー八８の先端に設けられたピン１０で一方向に当
接していると共に、スプリング１１で一方向に付勢され
ている。レバーＣ１２は前縁レバーＢ９と規正爪６ａ、
６ｂと揺動自在に連結されている。The lever A8 is swingably arranged and connected to the air cylinder 3. The lever B9 is arranged to be swingable, abuts in one direction with a pin 10 provided at the tip of the lever B9, and is biased in one direction with a spring 11. The lever C12 includes a front edge lever B9 and a regulating claw 6a,
6b and is swingably connected.
次に検出器４の詳細について第３図（ａ）、 （ｂ）に
基づいて説明する。１３は照明光源の半導体レーザーで
あり、１４はミラー、１６は球面レンズ、１６はシリン
ドリカルレンズ、１７はＣＯＤカメラである。この構成
のものが４系統配設して検出器４は構成されている。Next, details of the detector 4 will be explained based on FIGS. 3(a) and 3(b). 13 is a semiconductor laser as an illumination light source, 14 is a mirror, 16 is a spherical lens, 16 is a cylindrical lens, and 17 is a COD camera. The detector 4 is constructed by arranging four systems of this configuration.
次に、この一実施例の構成における動作について説明す
る。フラットパックＩＣ２は吸着ノズル７上に移載され
た後、エアーシリンダー３が作動し、レバーＡ８が所定
角回転する。それに供なつ”ＣＶレバー９．レバーＣｌ
２４スプリング１１の付勢力で揺動して、規正爪６ａ、
ａｂは等ストローク前進運動を行ない、フラットパック
ＩＣ２のリード２ａ、２ｂに当接した位置で停止し位置
決めを行なう。次に吸着ノズ／Ｌ／７でフラットパンク
ＩＣ２を吸着保持した後、エアーシリンダー３は戻り、
規正爪ｅａ、ｅｂも元の位置に戻る。Next, the operation of the configuration of this embodiment will be explained. After the flat pack IC2 is transferred onto the suction nozzle 7, the air cylinder 3 is activated and the lever A8 is rotated by a predetermined angle. Along with that, CV lever 9. Lever Cl
24 by the biasing force of the spring 11, the regulating claws 6a,
ab performs a uniform stroke forward movement, and stops at the position where it abuts the leads 2a and 2b of the flat pack IC 2 to perform positioning. Next, after sucking and holding the flat puncture IC 2 with the suction nozzle/L/7, the air cylinder 3 returns.
The regulating claws ea and eb also return to their original positions.
続いて、半導体レーザー１３が発光することにヨリ、球
面レンズ１６により平行光として、フラットパックＩＣ
２のリードを横方向から投光する。Next, as the semiconductor laser 13 emits light, it is converted into parallel light by the spherical lens 16, and then the flat pack IC
Light is emitted from the 2nd lead from the side.
続いて、リードのシルエットがシリンドリカルレンズ１
６を通してＣＯＤカメラ１７に撮像される。Next, the lead silhouette is cylindrical lens 1
6 and is imaged by the COD camera 17.
このリードのシルエットは４辺同時に撮像される。The silhouette of this lead is imaged on all four sides at the same time.
この撮像された信号を計測装置６に送られて良否の判定
が行なわれる。ＣＯＤカメラ１７で撮像されたフラット
パンクＩＣ２のリードのシルエットは、良品の場合は第
４図（ａ）のように、基準Ａより、リード厚みのＢ線が
低い。不良の場合は第４図（ｂ）のように基準線Ａより
、リード厚みのＢ線が高い。This imaged signal is sent to the measuring device 6 to determine whether it is good or bad. In the silhouette of the lead of the flat-punk IC 2 photographed by the COD camera 17, in the case of a non-defective product, line B of the lead thickness is lower than the standard A, as shown in FIG. 4(a). In the case of a defect, the lead thickness line B is higher than the reference line A as shown in FIG. 4(b).
このようにして、フラットパックＩＣのリードの上下方
向の曲り検査を行なう。In this way, the vertical bending of the leads of the flat pack IC is inspected.
発明の効果
以上のように本発明は、電子部品の横方向から照射する
光源部と、倍率変換及び平行光にするレンズ部と、電子
部品の横方向のシルエットを撮像する撮像部とを四辺に
配設した検出部と、リード厚みの良否を判定する計測装
置とで構成することにより、電子部品のリードを横方向
から透過照明でシルエットを撮像し、電子部品の大きさ
が変わったり、ＸＹ力方向傾きがあってもセンターリン
グを行なうので電子部品のリードの上下方向向りを正確
に、かつ高速に計測できる電子部品検査装置である。Effects of the Invention As described above, the present invention has a light source section that illuminates the electronic component from the lateral direction, a lens section that converts the magnification and converts the light into parallel light, and an imaging section that images the lateral silhouette of the electronic component on all four sides. By configuring the installed detection unit and a measuring device that determines the acceptability of the lead thickness, it is possible to image the silhouette of the lead of an electronic component from the side using transmitted illumination, and detect changes in the size of the electronic component or detect XY force. This is an electronic component inspection device that can accurately and quickly measure the vertical direction of the leads of electronic components because it performs centering even if there is a directional inclination.
第１図は本発明の一実施例における電子部品検査装置の
斜視図、第２図は同断面図、第３図（ａ）。
Φ）は検出器の構成図及び配置図、第４図（ａ）はＴＶ
右カメラ撮像した良品の場合の画像を示す図、第４申）
は第４図（ａ）の不良品の場合の画像を示す図、第６図
（、）は電子部品フラットパンクＩＣの斜視図、第５図
（ｂ）はフラットパックＩＣのリードの一部が上下方向
に曲がった場合の一例を示す図、第６図（ａ）、 （ｂ
）は従来例の電子部品検査装置のブロック図及び電子部
品の各寸法の説明図である。
１・・・・・・センターリング機構、２・・・・・・フ
ラットパックＩＣ，３・・・・・・エアーシリンダー、
４・・・・・・検出器、６・・・・・・計測装置、７・
・・・・・吸着ノズル、１３・・・・・・半導体レーザ
ー、１６・・・・・・球面レンズ、１６・・・・・・シ
リンドリカルレンズ、１７・・・・・・ＣＣＤカメラ。
代理人の氏名 弁理士 中 尾 敏 男 ほか１名第
２ 図
＼
第 ３ 図
第 ４ 図
Ｂくハ
八くδ
第５図
第 ６ 囚
手続補正書
１事件の表示
昭和６３年特許願第１２７７１１、
発明の名称
電子部品検査装置
３補正をする者
事件との関係 特 許 出 願
人任 所 大阪府門真市大字門真１００６番地名
称 （５８２）松下電器産業株式会社代表者
谷 井 昭 雄
４代理人 〒５７１
住 所 大阪府門真市大字門真１００６番地松下電器
産業株式会社内
ア、補正の内容
明細書第７頁第２０行〜第８頁第１行の「第４（ｂ）は
」を「第４図ｃｂ）は」に補正します。FIG. 1 is a perspective view of an electronic component inspection apparatus according to an embodiment of the present invention, FIG. 2 is a sectional view thereof, and FIG. 3(a). Φ) is the configuration diagram and layout diagram of the detector, and Figure 4 (a) is the TV
Diagram showing an image of a non-defective product captured by the right camera, No. 4)
is a diagram showing an image of the defective product in Figure 4(a), Figure 6(,) is a perspective view of an electronic component flat-punk IC, and Figure 5(b) is a diagram showing a part of the lead of a flat-pack IC. Figures 6(a) and 6(b) showing an example of bending in the vertical direction.
) is a block diagram of a conventional electronic component inspection device and an explanatory diagram of each dimension of the electronic component. 1... Center ring mechanism, 2... Flat pack IC, 3... Air cylinder,
4...Detector, 6...Measuring device, 7.
...Adsorption nozzle, 13 ... Semiconductor laser, 16 ... Spherical lens, 16 ... Cylindrical lens, 17 ... CCD camera. Name of agent: Patent attorney Toshio Nakao and 1 other person
2 Figure ＼ Figure 3 Figure 4 Figure B Exclusions δ Figure 5 Figure 6 Indication of Prison Procedures Amendment 1 Case 1988 Patent Application No. 127711, Title of Invention Electronic Component Inspection Device 3 Amendment Case Relationship Patent Application Person Address 1006 Kadoma, Kadoma City, Osaka Name (582) Representative of Matsushita Electric Industrial Co., Ltd.
Akio Tanii 4 Agent 571 Address Matsushita Electric Industrial Co., Ltd., 1006 Kadoma, Kadoma City, Osaka Prefecture, "4( Correct "b) wa" to "Figure 4 cb) wa".
Claims (1)
る装置であって、前記電子部品を位置決めするセンター
リング部と、前記センターリング部の開閉を駆動する駆
動手段と、位置決めされた電子部品の位置ズレを防止す
るよう電子部品を吸着可能な吸着ノズルと、前記位置決
めされた電子部品を横方向から照射する光源部、倍率変
換及び平行光にするレンズ部及び電子部品のリードの横
方向のシルエットを撮像する撮像部とを四辺に配設した
検出部と、この検出部により電子部品の四辺のリードの
厚みを同時に測定し、予め設定された厚みと比較演算し
、厚みが大きな場合は不良、小さな場合は良とする計測
装置とで構成した電子部品検査装置。A device for detecting the leads of an electronic component having a plurality of leads, the device comprising: a centering section for positioning the electronic component; a driving means for driving opening/closing of the centering section; and a device for detecting a positional deviation of the positioned electronic component. A suction nozzle capable of suctioning electronic components to prevent this, a light source section that irradiates the positioned electronic components from the side, a lens section that converts magnification and converts the light into parallel light, and a horizontal silhouette of the leads of the electronic components are imaged. A detection unit has an imaging unit arranged on the four sides, and this detection unit simultaneously measures the thickness of the leads on the four sides of the electronic component, compares it with a preset thickness, and determines whether the thickness is large or defective. An electronic component inspection device consisting of a measuring device that determines the quality of the product.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63127711A JP2730054B2 (en) | 1988-05-25 | 1988-05-25 | Electronic component inspection equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63127711A JP2730054B2 (en) | 1988-05-25 | 1988-05-25 | Electronic component inspection equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01297541A true JPH01297541A (en) | 1989-11-30 |
| JP2730054B2 JP2730054B2 (en) | 1998-03-25 |
Family
ID=14966818
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63127711A Expired - Fee Related JP2730054B2 (en) | 1988-05-25 | 1988-05-25 | Electronic component inspection equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2730054B2 (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02231514A (en) * | 1989-03-03 | 1990-09-13 | Hokuyo Automatic Co | Inspection device for bending pin of flat package |
| JPH03199947A (en) * | 1989-12-27 | 1991-08-30 | Hitachi Ltd | Inspection of soldered part and apparatus therefor, and inspection of electronic component mounting state |
| JPH0475359A (en) * | 1990-07-17 | 1992-03-10 | Nec Corp | Coplanarity measuring device |
| CN111829948A (en) * | 2019-04-17 | 2020-10-27 | 台达电子工业股份有限公司 | Electronic component detection system and method |
| CN115096218A (en) * | 2022-06-15 | 2022-09-23 | 优普士电子(深圳)有限公司 | Extended semiconductor test platform |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61270052A (en) * | 1985-05-22 | 1986-11-29 | Toshiba Corp | Rotary index table device |
| JPS6262252A (en) * | 1985-09-11 | 1987-03-18 | Nec Corp | Pin position detector |
| JPS631041A (en) * | 1986-06-20 | 1988-01-06 | Seiko Epson Corp | Semiconductor leg curve inspecter |
-
1988
- 1988-05-25 JP JP63127711A patent/JP2730054B2/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61270052A (en) * | 1985-05-22 | 1986-11-29 | Toshiba Corp | Rotary index table device |
| JPS6262252A (en) * | 1985-09-11 | 1987-03-18 | Nec Corp | Pin position detector |
| JPS631041A (en) * | 1986-06-20 | 1988-01-06 | Seiko Epson Corp | Semiconductor leg curve inspecter |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02231514A (en) * | 1989-03-03 | 1990-09-13 | Hokuyo Automatic Co | Inspection device for bending pin of flat package |
| JPH03199947A (en) * | 1989-12-27 | 1991-08-30 | Hitachi Ltd | Inspection of soldered part and apparatus therefor, and inspection of electronic component mounting state |
| JPH0475359A (en) * | 1990-07-17 | 1992-03-10 | Nec Corp | Coplanarity measuring device |
| CN111829948A (en) * | 2019-04-17 | 2020-10-27 | 台达电子工业股份有限公司 | Electronic component detection system and method |
| CN115096218A (en) * | 2022-06-15 | 2022-09-23 | 优普士电子(深圳)有限公司 | Extended semiconductor test platform |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2730054B2 (en) | 1998-03-25 |
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