JPH01294012A - Impregnation of base material with varnish - Google Patents
Impregnation of base material with varnishInfo
- Publication number
- JPH01294012A JPH01294012A JP12645888A JP12645888A JPH01294012A JP H01294012 A JPH01294012 A JP H01294012A JP 12645888 A JP12645888 A JP 12645888A JP 12645888 A JP12645888 A JP 12645888A JP H01294012 A JPH01294012 A JP H01294012A
- Authority
- JP
- Japan
- Prior art keywords
- base material
- varnish
- impregnated
- resin
- impregnation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 title claims abstract description 41
- 239000002966 varnish Substances 0.000 title claims abstract description 20
- 238000005470 impregnation Methods 0.000 title abstract description 8
- 238000001035 drying Methods 0.000 claims abstract description 6
- 238000010438 heat treatment Methods 0.000 claims abstract description 6
- 238000000034 method Methods 0.000 claims description 8
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 229920000742 Cotton Polymers 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- 241001125046 Sardina pilchardus Species 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000010425 asbestos Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000012784 inorganic fiber Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
- 239000000123 paper Substances 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- -1 polybutylene terephthalate Polymers 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
- 235000019512 sardine Nutrition 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000012209 synthetic fiber Substances 0.000 description 1
- 229920002994 synthetic fiber Polymers 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
- 239000002759 woven fabric Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
Landscapes
- Reinforced Plastic Materials (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は化粧板用基材、積層板用木材、多層配鰻板用基
オ浄へのワニス含浸方法に１関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for impregnating varnish into base materials for decorative laminates, wood for laminates, and substrates for multilayered boards.
従来、紙、布、ガラス俄布等の化粧横用基材。 Conventional base materials for makeup such as paper, cloth, and glass cloth.
槓１ｆｉ”ｄｉ用基材、多ｉ−配線板用基材ｔこワニス
を含浸、乾燥してプ１１プレグを、＃造する場合、ワニ
ス入り含１引こ基材を導き基材ｌこワニスを一含浸させ
てＡるが、基材中Ｉこ内Ｉする空気を現金したままの含
浸にな＾でおり、この対策として１次含浸、２次含浸と
いう２段含浸法を採用することが広く行なわれている。Base material for 1fi"di, base material for multi-I wiring board. When impregnating with varnish and drying to make preg, the base material containing varnish is introduced and the base material is varnished. However, as a countermeasure to this problem, a two-stage impregnation method of primary impregnation and secondary impregnation can be adopted. It is widely practiced.
従来の技術で述べたように、現在広く用すられて論る２
段含浸法を採用しても、基材中に内観する電気を光合に
追込出し、気泡のなＶｔａ脂含浸基材を得ることはでき
なかった。本発明は従来の技術における上述の間組点に
鑑みてなされたもので、その目的とするところは、気泡
のない樹脂含浸基材を傅ることのできる基材へのワニス
含浸方法を提供することにある。As mentioned in the conventional technique, currently widely used and discussed 2
Even if the step impregnation method was adopted, it was not possible to obtain a Vta fat-impregnated base material without air bubbles because the electricity present in the base material was forced into the optical fiber. The present invention has been made in view of the above-mentioned problems in the prior art, and its purpose is to provide a method for impregnating a base material with varnish, which can produce a resin-impregnated base material without air bubbles. It is in.
本発明は基材にワニスを含浸後、加温してから乾燥及び
又は硬化させることを特徴とする基材へのワニス含浸方
法のため、基材中に内蔵する空気をワニスの粘度低下と
、空気の体噴影侵にょって追し１出すことができ、気泡
のな１．／−ｈ切詣含浸基材を得ることができたもので
、以下本発明を件・１ｆｆＪ ｌこ説明する。The present invention is a method for impregnating a base material with varnish, which is characterized by impregnating the base material with varnish, heating it, and then drying and/or curing it. It is possible to eject air by ejecting air into the air, creating bubbles. The present invention will be explained below based on the results of obtaining a base material impregnated with a 1/-h cut.
本発明に用１ｈるワニスとしては、フェノール哨脂、ｘ
ボキシ衝脂、不嘲和ポリエステル可η旨、メラミン樹脂
、ポリイミド樹脂、ポリスルフォン、ポリブタジェン、
弗化樹脂、ポリブチレンテレフタレート、ポリエーテル
エーテルケトン等の単独又は変性物又は混合物等に必要
に応じて水、メチルアルコール、アセトン、シクロヘキ
サノン、スチレン等の溶媒を添加したワニスで、基材と
してはガラス、アスベスト等の無機繊維やポリエステル
、ポリアミド、ポリビニルアルコール、アクリル等の有
機合成繊維や木綿等の天然繊維からなる織；１５、不織
布又は紙、マ噌ト等の基材で、該基材に上記ワニスを含
浸させた後、加温することによりて基材中に内航する空
気は、ワニスの粘度低下と空気の体積膨脂とによって基
材外に退論出され、基桐芯部迄街脂の含浸した樹脂含浸
基材を得ることができるものである。加温は好（シ＜は
４０〜６０゛Ｃで行なうことが含浸性、安全性の点でよ
く望まし論ことである。７１］温後のワニスカイ含浸さ
れた基材の乾燥及び又は硬化、巻取り、切断等は通常の
樹脂金＝＆基材や積層板の製造で用いられる条件を用い
ることができる。The 1 hour varnish used in the present invention includes phenol oil, x
Boxy resin, non-abrasive polyester resin, melamine resin, polyimide resin, polysulfone, polybutadiene,
A varnish made by adding solvents such as water, methyl alcohol, acetone, cyclohexanone, styrene, etc. as necessary to fluorinated resin, polybutylene terephthalate, polyether ether ketone, etc. alone or as a modified product or mixture.The base material is glass. , woven fabrics made of inorganic fibers such as asbestos, organic synthetic fibers such as polyester, polyamide, polyvinyl alcohol, acrylic, and natural fibers such as cotton; 15. A base material such as non-woven fabric, paper, matte, etc. After being impregnated with varnish, by heating it, the air flowing inward into the base material is forced out of the base material due to the decrease in viscosity of the varnish and the volumetric expansion of the air, and the air that flows inward into the base material is expelled from the base material to the core of the base material. It is possible to obtain a resin-impregnated base material impregnated with fat. Heating is preferably carried out at a temperature of 40 to 60 °C (from the viewpoint of impregnating properties and safety). For winding, cutting, etc., conditions used in the production of ordinary resin gold base materials and laminates can be used.
以下本発明の一実施例を図面により説明する。 An embodiment of the present invention will be described below with reference to the drawings.
１は基材でワニス２人り含浸槽３に基材ｌを導き、基材
１にワニス２を含浸させてからスクイズロール４を径で
から赤外加熱ヒーター５で５０℃に加温してから乾燥炉
６に移動させ樹脂含浸基材７を得るものである。1 is a base material, and the base material L is introduced into a varnish impregnation tank 3 for two people, and the base material 1 is impregnated with varnish 2, and then a squeeze roll 4 is heated to 50°C with an infrared heating heater 5. A resin-impregnated base material 7 is obtained by moving the base material from the base material to a drying oven 6.
本発明は上述した如く構成されて論る。与許請求の範囲
第１ｇＩに記載した構成を有する基材へのワニス含浸方
法においては、気泡のない樹脂含浸基材を得ることがで
きる効果を有している。The present invention is constructed and discussed as described above. The method for impregnating a base material with varnish having the structure described in Claim 1gI has the effect of making it possible to obtain a resin-impregnated base material without air bubbles.
図面は本発明の方法の一実施例を示す１％ｌｌＩ鰯断面
図である。
ｌは基材、２はワニス、３は含浸槽、４はスクイズロー
ル、５はグＦ外加熱ヒーター、６は乾燥炉、７は樹脂含
浸基材である。The drawing is a cross-sectional view of a 1%llI sardine showing an example of the method of the present invention. 1 is a base material, 2 is a varnish, 3 is an impregnation tank, 4 is a squeeze roll, 5 is an external heater, 6 is a drying oven, and 7 is a resin-impregnated base material.
Claims (1)
は硬化させることを特徴とする基材へのワニス含浸方法
。(1) A method for impregnating a base material with varnish, which comprises impregnating the base material with varnish, heating it, and then drying and/or curing it.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12645888A JPH01294012A (en) | 1988-05-23 | 1988-05-23 | Impregnation of base material with varnish |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12645888A JPH01294012A (en) | 1988-05-23 | 1988-05-23 | Impregnation of base material with varnish |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01294012A true JPH01294012A (en) | 1989-11-28 |
Family
ID=14935721
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12645888A Pending JPH01294012A (en) | 1988-05-23 | 1988-05-23 | Impregnation of base material with varnish |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01294012A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001261862A (en) * | 2000-03-17 | 2001-09-26 | Hitachi Chem Co Ltd | Preparation process of prepreg, prepreg, metal-laminated laminate and printed circuit board |
| JP2010248520A (en) * | 2010-06-01 | 2010-11-04 | Hitachi Chem Co Ltd | Method for producing prepreg, prepreg, metal-clad laminate, and printed wiring board |
-
1988
- 1988-05-23 JP JP12645888A patent/JPH01294012A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001261862A (en) * | 2000-03-17 | 2001-09-26 | Hitachi Chem Co Ltd | Preparation process of prepreg, prepreg, metal-laminated laminate and printed circuit board |
| JP2010248520A (en) * | 2010-06-01 | 2010-11-04 | Hitachi Chem Co Ltd | Method for producing prepreg, prepreg, metal-clad laminate, and printed wiring board |
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