JPH01290778A - After-treatment of plated steel sheet - Google Patents
After-treatment of plated steel sheetInfo
- Publication number
- JPH01290778A JPH01290778A JP12070288A JP12070288A JPH01290778A JP H01290778 A JPH01290778 A JP H01290778A JP 12070288 A JP12070288 A JP 12070288A JP 12070288 A JP12070288 A JP 12070288A JP H01290778 A JPH01290778 A JP H01290778A
- Authority
- JP
- Japan
- Prior art keywords
- water
- fatty acids
- soluble
- dispersible
- plated steel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910000831 Steel Inorganic materials 0.000 title claims abstract description 19
- 239000010959 steel Substances 0.000 title claims abstract description 19
- 238000011282 treatment Methods 0.000 title claims description 23
- -1 amine salts Chemical class 0.000 claims abstract description 20
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 claims abstract description 8
- 150000001412 amines Chemical class 0.000 claims abstract description 8
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims abstract description 7
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 claims abstract description 6
- 238000005476 soldering Methods 0.000 claims abstract description 6
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 claims abstract description 5
- 150000002500 ions Chemical class 0.000 claims abstract description 5
- 239000000344 soap Substances 0.000 claims abstract description 5
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 claims abstract description 4
- 150000003839 salts Chemical class 0.000 claims abstract description 4
- BTXXTMOWISPQSJ-UHFFFAOYSA-N 4,4,4-trifluorobutan-2-one Chemical compound CC(=O)CC(F)(F)F BTXXTMOWISPQSJ-UHFFFAOYSA-N 0.000 claims abstract description 3
- BQACOLQNOUYJCE-FYZZASKESA-N Abietic acid Natural products CC(C)C1=CC2=CC[C@]3(C)[C@](C)(CCC[C@@]3(C)C(=O)O)[C@H]2CC1 BQACOLQNOUYJCE-FYZZASKESA-N 0.000 claims abstract description 3
- 239000005711 Benzoic acid Substances 0.000 claims abstract description 3
- 235000010233 benzoic acid Nutrition 0.000 claims abstract description 3
- 150000003863 ammonium salts Chemical class 0.000 claims abstract 2
- 239000002184 metal Substances 0.000 claims abstract 2
- 229910052751 metal Inorganic materials 0.000 claims abstract 2
- 235000014113 dietary fatty acids Nutrition 0.000 claims description 17
- 229930195729 fatty acid Natural products 0.000 claims description 17
- 239000000194 fatty acid Substances 0.000 claims description 17
- 229920001223 polyethylene glycol Polymers 0.000 claims description 13
- 239000002202 Polyethylene glycol Substances 0.000 claims description 12
- 150000004665 fatty acids Chemical class 0.000 claims description 9
- 229910000679 solder Inorganic materials 0.000 claims description 7
- 239000004166 Lanolin Substances 0.000 claims description 6
- 235000019388 lanolin Nutrition 0.000 claims description 6
- 229940039717 lanolin Drugs 0.000 claims description 6
- 150000003973 alkyl amines Chemical class 0.000 claims description 4
- 125000003827 glycol group Chemical group 0.000 claims description 4
- 238000000034 method Methods 0.000 claims description 4
- 229930006000 Sucrose Natural products 0.000 claims description 3
- 125000001931 aliphatic group Chemical group 0.000 claims description 3
- 235000011187 glycerol Nutrition 0.000 claims description 3
- 229920001451 polypropylene glycol Chemical group 0.000 claims description 3
- 239000005720 sucrose Substances 0.000 claims description 3
- JNYAEWCLZODPBN-JGWLITMVSA-N (2r,3r,4s)-2-[(1r)-1,2-dihydroxyethyl]oxolane-3,4-diol Chemical group OC[C@@H](O)[C@H]1OC[C@H](O)[C@H]1O JNYAEWCLZODPBN-JGWLITMVSA-N 0.000 claims description 2
- 229910019142 PO4 Inorganic materials 0.000 claims description 2
- CZMRCDWAGMRECN-UGDNZRGBSA-N Sucrose Chemical compound O[C@H]1[C@H](O)[C@@H](CO)O[C@@]1(CO)O[C@@H]1[C@H](O)[C@@H](O)[C@H](O)[C@@H](CO)O1 CZMRCDWAGMRECN-UGDNZRGBSA-N 0.000 claims description 2
- 150000001298 alcohols Chemical class 0.000 claims description 2
- 150000002009 diols Chemical class 0.000 claims description 2
- 125000001165 hydrophobic group Chemical group 0.000 claims description 2
- 239000000203 mixture Substances 0.000 claims description 2
- 239000012188 paraffin wax Substances 0.000 claims description 2
- 235000019809 paraffin wax Nutrition 0.000 claims description 2
- 235000019271 petrolatum Nutrition 0.000 claims description 2
- 239000010452 phosphate Substances 0.000 claims description 2
- 235000003441 saturated fatty acids Nutrition 0.000 claims description 2
- 150000004670 unsaturated fatty acids Chemical class 0.000 claims description 2
- 235000021122 unsaturated fatty acids Nutrition 0.000 claims description 2
- 229910001335 Galvanized steel Inorganic materials 0.000 claims 1
- 125000003354 benzotriazolyl group Chemical class N1N=NC2=C1C=CC=C2* 0.000 claims 1
- 239000008397 galvanized steel Substances 0.000 claims 1
- 150000004812 organic fluorine compounds Chemical class 0.000 claims 1
- 150000004671 saturated fatty acids Chemical class 0.000 claims 1
- 230000007797 corrosion Effects 0.000 abstract description 16
- 238000005260 corrosion Methods 0.000 abstract description 16
- 238000000576 coating method Methods 0.000 abstract description 6
- 239000011248 coating agent Substances 0.000 abstract description 5
- 230000032683 aging Effects 0.000 abstract description 4
- 229910052725 zinc Inorganic materials 0.000 abstract description 2
- 230000002542 deteriorative effect Effects 0.000 abstract 1
- 150000002148 esters Chemical class 0.000 abstract 1
- 229910052745 lead Inorganic materials 0.000 abstract 1
- 238000004381 surface treatment Methods 0.000 abstract 1
- 229910052718 tin Inorganic materials 0.000 abstract 1
- 238000007747 plating Methods 0.000 description 10
- 230000000052 comparative effect Effects 0.000 description 8
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 6
- 238000002845 discoloration Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- 239000007788 liquid Substances 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- 235000019441 ethanol Nutrition 0.000 description 5
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 5
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 5
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 3
- ZCDOYSPFYFSLEW-UHFFFAOYSA-N chromate(2-) Chemical compound [O-][Cr]([O-])(=O)=O ZCDOYSPFYFSLEW-UHFFFAOYSA-N 0.000 description 3
- 229910052731 fluorine Inorganic materials 0.000 description 3
- 239000011737 fluorine Substances 0.000 description 3
- 150000002894 organic compounds Chemical class 0.000 description 3
- 102100020895 Ammonium transporter Rh type A Human genes 0.000 description 2
- 101100301844 Arabidopsis thaliana RH50 gene Proteins 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 2
- 101150107345 Rhag gene Proteins 0.000 description 2
- WGLPBDUCMAPZCE-UHFFFAOYSA-N Trioxochromium Chemical group O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 description 2
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 2
- 125000000217 alkyl group Chemical group 0.000 description 2
- 230000006378 damage Effects 0.000 description 2
- 238000007598 dipping method Methods 0.000 description 2
- POULHZVOKOAJMA-UHFFFAOYSA-N dodecanoic acid Chemical compound CCCCCCCCCCCC(O)=O POULHZVOKOAJMA-UHFFFAOYSA-N 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 229910052736 halogen Inorganic materials 0.000 description 2
- IPCSVZSSVZVIGE-UHFFFAOYSA-N hexadecanoic acid Chemical compound CCCCCCCCCCCCCCCC(O)=O IPCSVZSSVZVIGE-UHFFFAOYSA-N 0.000 description 2
- JVTAAEKCZFNVCJ-UHFFFAOYSA-N lactic acid Chemical compound CC(O)C(O)=O JVTAAEKCZFNVCJ-UHFFFAOYSA-N 0.000 description 2
- 125000005010 perfluoroalkyl group Chemical group 0.000 description 2
- 150000003014 phosphoric acid esters Chemical class 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000011701 zinc Substances 0.000 description 2
- WRIDQFICGBMAFQ-UHFFFAOYSA-N (E)-8-Octadecenoic acid Natural products CCCCCCCCCC=CCCCCCCC(O)=O WRIDQFICGBMAFQ-UHFFFAOYSA-N 0.000 description 1
- GWYSWOQRJGLJPA-UHFFFAOYSA-N 1,1,2,2-tetrafluoropropyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC(F)(F)C(C)(F)F GWYSWOQRJGLJPA-UHFFFAOYSA-N 0.000 description 1
- LQJBNNIYVWPHFW-UHFFFAOYSA-N 20:1omega9c fatty acid Natural products CCCCCCCCCCC=CCCCCCCCC(O)=O LQJBNNIYVWPHFW-UHFFFAOYSA-N 0.000 description 1
- PVYDEHNXZGHVEU-UHFFFAOYSA-N 2H-benzotriazol-4-yl(phenyl)methanone Chemical compound C(C1=CC=CC=C1)(=O)C1=CC=CC=2NN=NC21 PVYDEHNXZGHVEU-UHFFFAOYSA-N 0.000 description 1
- QSBYPNXLFMSGKH-UHFFFAOYSA-N 9-Heptadecensaeure Natural products CCCCCCCC=CCCCCCCCC(O)=O QSBYPNXLFMSGKH-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- 239000005639 Lauric acid Substances 0.000 description 1
- 239000005642 Oleic acid Substances 0.000 description 1
- ZQPPMHVWECSIRJ-UHFFFAOYSA-N Oleic acid Natural products CCCCCCCCC=CCCCCCCCC(O)=O ZQPPMHVWECSIRJ-UHFFFAOYSA-N 0.000 description 1
- 235000021314 Palmitic acid Nutrition 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- 235000021355 Stearic acid Nutrition 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 238000010306 acid treatment Methods 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 150000001447 alkali salts Chemical class 0.000 description 1
- 150000005215 alkyl ethers Chemical class 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 230000003666 anti-fingerprint Effects 0.000 description 1
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 1
- 239000012964 benzotriazole Substances 0.000 description 1
- 150000001565 benzotriazoles Chemical class 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000004202 carbamide Substances 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 150000004649 carbonic acid derivatives Chemical class 0.000 description 1
- 150000001733 carboxylic acid esters Chemical class 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000010960 cold rolled steel Substances 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- JRBPAEWTRLWTQC-UHFFFAOYSA-N dodecylamine Chemical compound CCCCCCCCCCCCN JRBPAEWTRLWTQC-UHFFFAOYSA-N 0.000 description 1
- 239000003995 emulsifying agent Substances 0.000 description 1
- 239000000839 emulsion Substances 0.000 description 1
- 125000000816 ethylene group Chemical group [H]C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000002209 hydrophobic effect Effects 0.000 description 1
- 150000004679 hydroxides Chemical class 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- QXJSBBXBKPUZAA-UHFFFAOYSA-N isooleic acid Natural products CCCCCCCC=CCCCCCCCCC(O)=O QXJSBBXBKPUZAA-UHFFFAOYSA-N 0.000 description 1
- 239000004310 lactic acid Substances 0.000 description 1
- 235000014655 lactic acid Nutrition 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 150000002736 metal compounds Chemical class 0.000 description 1
- 125000001570 methylene group Chemical group [H]C([H])([*:1])[*:2] 0.000 description 1
- WQEPLUUGTLDZJY-UHFFFAOYSA-N n-Pentadecanoic acid Natural products CCCCCCCCCCCCCCC(O)=O WQEPLUUGTLDZJY-UHFFFAOYSA-N 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- ZQPPMHVWECSIRJ-KTKRTIGZSA-N oleic acid Chemical compound CCCCCCCC\C=C/CCCCCCCC(O)=O ZQPPMHVWECSIRJ-KTKRTIGZSA-N 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 235000005985 organic acids Nutrition 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 238000005554 pickling Methods 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000003449 preventive effect Effects 0.000 description 1
- 229930195734 saturated hydrocarbon Natural products 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 239000008117 stearic acid Substances 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 210000004243 sweat Anatomy 0.000 description 1
- 239000003760 tallow Substances 0.000 description 1
- 238000010345 tape casting Methods 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 239000001993 wax Substances 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Landscapes
- Chemical Treatment Of Metals (AREA)
Abstract
Description
【発明の詳細な説明】
本発明において、主成分である（Ａ）には水溶性あるい
は水分散性のハロゲンイオンを含まない半田用フラック
スには有機酸として、アビエチン酸、安息香酸、Ｃ１□
〜Ｃ２４の飽和脂肪酸、およびＣＩ８の不飽和脂肪酸の
ステアリン酸、ラウリン酸、パルミチン酸、オレイン酸
などが含まれる。Detailed Description of the Invention In the present invention, the main component (A) of the solder flux which does not contain water-soluble or water-dispersible halogen ions contains organic acids such as abietic acid, benzoic acid, and C1□.
-C24 saturated fatty acids and CI8 unsaturated fatty acids such as stearic acid, lauric acid, palmitic acid, and oleic acid.
有機アルコールあるいは脂肪酸エステルとしては、グリ
セリン、ジオール、ポリエチレングリコ−ル、脂肪酸グ
リセリンエステルが含まれる。ベンゾトリアゾール誘導
体にはベンゾトリアゾール、アジミドール、ｌ−Ｎベン
ゾイルベンゾトリアゾールなどが含まれる。ワックスと
しては炭素数２０〜３６の直鎖飽和炭化水素を主成分と
する分子量３００〜５００のいわゆるパラフィン系ワッ
クスが含まれる。The organic alcohol or fatty acid ester includes glycerin, diol, polyethylene glycol, and fatty acid glycerin ester. Benzotriazole derivatives include benzotriazole, azimidole, lN benzoylbenzotriazole, and the like. The waxes include so-called paraffin waxes having a molecular weight of 300 to 500, which are mainly composed of linear saturated hydrocarbons having 20 to 36 carbon atoms.
（Ｂ）には水溶性あるいは、水分散性の脂肪族高級アル
コール類、アルキルフェノール類、および脂肪酸類にエ
チレンオキサイド類を縮合せしめたものには、ポリエチ
レングリコールアルキルフェニルエーテル、ポリエチレ
ングリコールアルキルエーテル、ポリエチレングリコー
ル脂肪酸エステルが含まれる。ポリエチレングリコール
・アルキルアミン類には、Ｎ−ポリエチレングリコール
アルキルアミン、ポリエチレングリコールアルキルアミ
ンエーテルが含まれる。ソルビタンと脂肪族のエステル
結合には、ソルビタン脂肪酸エステル、ポリエチレング
リコールソルビタン脂肪酸エステルが含まれる。ポリプ
ロピレングリコール基を疎水基とし、ポリエチレングリ
コール基を親水基とした高分子には、ポリプロピレング
リコールポリエチレングリコールエーテルが含まれる。(B) includes water-soluble or water-dispersible aliphatic higher alcohols, alkylphenols, and fatty acids condensed with ethylene oxide, including polyethylene glycol alkylphenyl ether, polyethylene glycol alkyl ether, and polyethylene glycol. Contains fatty acid esters. Polyethylene glycol alkylamines include N-polyethylene glycol alkylamine and polyethylene glycol alkylamine ether. The ester bond between sorbitan and aliphatic includes sorbitan fatty acid ester and polyethylene glycol sorbitan fatty acid ester. Polymers having a polypropylene glycol group as a hydrophobic group and a polyethylene glycol group as a hydrophilic group include polypropylene glycol polyethylene glycol ether.
脂肪酸とジェタノールアミンとのアマイド結合したもの
には、脂肪酸ジェタノールアマイドが含まれる。脂肪酸
とショ糖のエステル結合にはショ糖脂肪酸エステルが含
まれる。ラノリンアルコール、ラノリン脂肪酸のけん化
したものには、ポリオキシエチレンラノリンアルコール
エーテル、ポリオキシエチレンラノリン脂肪酸エステル
が含まれる。Amide-bonded fatty acids and jetanolamines include fatty acid jetanolamide. Sucrose fatty acid ester is included in the ester bond between fatty acid and sucrose. Saponified versions of lanolin alcohol and lanolin fatty acids include polyoxyethylene lanolin alcohol ether and polyoxyethylene lanolin fatty acid ester.
（Ｃ）の水溶性、水分散性のリン酸エステル塩には、１
つまたは２つのアルキル基のついたー塩基性または二塩
基性の酸の形か、あるいは有機アミンとの石けんが含ま
れる。また、アルキル基が大きく、水に不溶なものはア
ルカリ塩とするかエチレンオキサイドなどを付加して、
親木性を高めて用いることができる。The water-soluble and water-dispersible phosphate ester salt (C) contains 1
Includes soaps with one or two alkyl groups in basic or dibasic acid form or with organic amines. In addition, if the alkyl group is large and insoluble in water, it can be made into an alkali salt or added with ethylene oxide, etc.
It can be used with enhanced tree parentness.
濃度は、前述の１種以上の２〜２００ ｇ／、９が好ま
しい。本発明の効果は後処理液のめつき鋼板表面への塗
布量に支配されるので、濃度に限定されるものではない
が、処理液の取扱いには前述の濃度が好ましい。ハロゲ
ンイオンを含む場合は耐食性が著しく低下するので好ま
しくない。The concentration is preferably 2 to 200 g/9 of the above-mentioned one or more. The effects of the present invention are determined by the amount of post-treatment liquid applied to the surface of the plated steel sheet, and are not limited to the concentration, but the above-mentioned concentration is preferable for handling the treatment liquid. If it contains halogen ions, the corrosion resistance will be significantly reduced, which is not preferable.
次に水溶性、および水分散性のふっ素糸の有機化合物に
はパーフロロアルキル基を含み、−数式ＣｎＦｚｎ−＋
Ｒ＋ Ｒ２としたとき、Ｒ１はメチレン基、エチレン
基が含まれ、他の樹脂系でもさしつかえない、Ｒ２は水
溶性、あるいは水分散性を容易にするもので、アクリル
酸エステル、メタアクリル酸エステル、リン酸エステル
、カルボン酸エステル、エチレンオキサイド付加物が含
まれる。Next, the organic compound of the water-soluble and water-dispersible fluorine thread contains a perfluoroalkyl group, and has the formula -CnFzn-+
When R+ R2, R1 includes a methylene group or an ethylene group, and other resin systems may also be used; R2 is a substance that facilitates water solubility or water dispersibility; Includes phosphoric acid esters, carboxylic acid esters, and ethylene oxide adducts.
同じ目的で乳化剤、界面活性剤、有機溶剤を添加しても
さしつかえない、また、パーフロロアルキル基中のＦの
かわりに一部Ｈであってもさしつかえない。ｎは３〜３
０が好ましい、ｎが３以下の場合は耐指紋性が劣り、ｎ
が３０以上になると、半田性が低下する傾向がある。Emulsifiers, surfactants, and organic solvents may be added for the same purpose, and some H may be substituted for F in the perfluoroalkyl group. n is 3-3
0 is preferable; if n is 3 or less, fingerprint resistance is poor; n
When it becomes 30 or more, solderability tends to deteriorate.
ふっ素系有機化合物の濃度は２〜１００ｇ／４２が好ま
しい、２ｇ／ｇ、以下では耐指紋性に効果がみられず、
１００ｇ／ｇ、以上になると半田性が低下する傾向があ
る。The concentration of the fluorine-based organic compound is preferably 2 to 100 g/42; below 2 g/g, no effect on fingerprint resistance is observed;
If it exceeds 100 g/g, solderability tends to decrease.
処理液の安定化のため、あるいは、めっき鋼板の耐食性
、耐振つき性を向上させるために、Ｃｒ６″″イオンあ
るいは有機アミン石けんの単独あるいは混合したものを
添加する。Ｃｒ’″″イオンが３ｇ／ε以上になると半
田性が極端に低下するので好ましくない。有機アミン石
けんにはドデシルアミン、才しオイルイミダシリン、ア
ミノプロピル牛脂アミン、ロジンアミンが含まれ、アミ
ンはカルボン酸などと造塩して使用することができる。In order to stabilize the treatment solution or to improve the corrosion resistance and shaking resistance of the plated steel sheet, Cr6'' ions or organic amine soaps alone or in combination are added. If the amount of Cr''''' ions exceeds 3 g/ε, the solderability will be extremely reduced, which is not preferable. Organic amine soaps include dodecylamine, oil imidacillin, aminopropyl tallow amine, and rosin amine, and amines can be used by forming salts with carboxylic acids.
その濃度が１００ｇ／２以上になると耐食性に対しては
効果がみられるが半田性を悪くするので好ましくない、
そのほかに公知の水溶性あるいは水分散性の防錆剤を
添加することはさしつかえない。しかし、この場合、半
田性を低下させるものがあるので添加量には注意する必
要がある。たとえば、アクリルエマルジョンを添加する
と耐振つき性は向上するが、半田性は低下する。If the concentration exceeds 100 g/2, it is effective for corrosion resistance, but it is not preferable because it impairs solderability.
In addition, known water-soluble or water-dispersible rust preventive agents may be added. However, in this case, it is necessary to be careful about the amount added because some of them reduce solderability. For example, adding an acrylic emulsion improves shake resistance, but reduces solderability.
処理液のｐＨは３〜ｌＯの範囲が適当である。The pH of the treatment solution is suitably in the range of 3 to 1O.
３以下の場合は処理液の安定性が悪く、１０以上になる
と処理皮膜の乾燥性が悪い。If it is 3 or less, the stability of the treatment liquid is poor, and if it is 10 or more, the drying properties of the treated film are poor.
処理液の温度は特に制限されないが８０℃以上になると
ゲル化し処理液の安定性を悪くするものがあり、通常は
２０〜４０℃が経済的である。The temperature of the treatment liquid is not particularly limited, but if the temperature exceeds 80°C, it may gel and deteriorate the stability of the treatment liquid, so a temperature of 20 to 40°C is usually economical.
塗布方法はロールコート、ナイフコート、浸漬後ロール
絞りあるいはエヤーナイフ絞りなど制限されるものでは
ない。The coating method is not limited to roll coating, knife coating, roll squeezing after dipping, or air knife squeezing.
ｒｉ燥は指触でベタツキがなければ特に問題にならない
が水分が残留すると経時したとき発錆の原因となるので
好ましくない。Ri-drying is not a particular problem as long as it is not sticky to the touch, but if moisture remains, it is undesirable because it can cause rust over time.
後処理皮膜の乾燥厚みは ０．０１〜２μｍが適当であ
る。Ｏ，ＯＩＬＬｍ以下の場合は特性の効果が認められ
ない。２μｍ以上になるに耐食性は向上する傾向がある
が、半田性は飽和し、しかも作業性を悪くするので好ま
しくない。The dry thickness of the post-treated film is suitably 0.01 to 2 μm. If it is less than O, OILLm, no effect of the characteristics is recognized. Corrosion resistance tends to improve as the thickness exceeds 2 μm, but solderability saturates and workability deteriorates, which is not preferable.
本発明の処理液をＳｎめっき、Ｐｂ−３ｎめっき、Ｃｕ
めっき、ＺｎめっきあるいはＺｎ合金めっき鋼板やこれ
らの複層めっき鋼板に塗布すると、半田性の向上のみな
らず耐指紋性および耐食性が著しく向上する結果が得ら
れる。また、めっき鋼板の経時後の半田性および耐食性
も優れている。塗布される鋼板は前述のめっき鋼板に限
定されるものではない。The treatment solution of the present invention can be used for Sn plating, Pb-3n plating, and Cu plating.
When applied to a plated, Zn-plated or Zn alloy-plated steel plate, or a multilayer plated steel plate thereof, not only the solderability but also fingerprint resistance and corrosion resistance are significantly improved. Furthermore, the plated steel sheet has excellent solderability and corrosion resistance after aging. The steel plate to be coated is not limited to the above-mentioned plated steel plate.
このように特性が向上する理由は明らかでないが、めっ
き表面に形成される酸化物、水酸化物および炭酸塩の形
成が、本発明の疎水性である後処理によって抑制され、
しかも、めっき鋼板の経時によって形成されためっき表
面の金属の化合物に対して、半田時の加熱により、本発
明の塗膜がこれらを溶解し、また一部は還元されるため
、半田の濡れ、および拡散が促進され半田性が向上する
ものと考えられる。また、前述の現象によって、本発明
の塗膜がめつき表面を均一に被覆するために耐食性が向
上するものと考えられる。The reason why the properties improve in this way is not clear, but the formation of oxides, hydroxides, and carbonates on the plating surface is suppressed by the hydrophobic post-treatment of the present invention.
In addition, the coating film of the present invention dissolves metal compounds on the plated surface that are formed over time on the plated steel sheet by heating during soldering, and some of them are reduced. It is thought that diffusion is promoted and solderability is improved. Furthermore, it is believed that the coating film of the present invention uniformly covers the plated surface due to the above-mentioned phenomenon, thereby improving corrosion resistance.
本発明は、かかる知見のもとになされたものであり、本
発明の処理液を均一にめっき鋼板表面に被覆することに
より、半田性、耐指紋性および耐食性に優れた半田用め
っき鋼板を連続的に生産できることを特徴としている。The present invention has been made based on this knowledge, and by uniformly coating the surface of a plated steel plate with the treatment liquid of the present invention, it is possible to continuously produce a plated steel plate for soldering that has excellent solderability, anti-fingerprint properties, and corrosion resistance. It is characterized by the fact that it can be produced in a number of ways.
以下、本発明の効果を実施例により説明する。 Hereinafter, the effects of the present invention will be explained using examples.
実施例１
めっき原板として、０．５ｍｍの板厚の冷延鋼板を常法
の脱脂、酸洗の前処理を行い、水洗後直ちに硫酸浴でめ
っき量が５ ｇ ／ ｍ ”になるように電気亜鉛めっ
きを施し、本願の発明の処理を施した。すなわち、−塩
基性のリン酸エステル（共栄社油脂（株）製）１００ｇ
／Ｉ２、テトラフロロプロピルメタクリレート１０ｇ／
ｉ！、にＣｒＯｓでＣｒＩ！＋１１イオンとして０．０
１ｇ／４２になるように処理液を作成し、処理液の乾燥
厚みが２．０μｍになるように浸漬法で塗布し、６０℃
で乾燥して、試験片を作成した。Example 1 As a plating original plate, a cold-rolled steel plate with a thickness of 0.5 mm was pretreated by conventional degreasing and pickling, and immediately after washing with water, it was electrically heated in a sulfuric acid bath so that the plating amount was 5 g/m''. Zinc plating was applied and the treatment of the invention of the present application was applied.That is, 100 g of basic phosphoric acid ester (manufactured by Kyoeisha Yushi Co., Ltd.)
/I2, tetrafluoropropyl methacrylate 10g/
i! , CrI in CrOs! 0.0 as +11 ion
A treatment solution was prepared at a concentration of 1 g/42, applied by dipping so that the dry thickness of the treatment solution was 2.0 μm, and heated at 60°C.
and dried to prepare a test piece.
実施例２〜ＩＯにおける本願の発明の処理は実施例１に
準じて試験片を作成した。For the treatment of the invention of the present application in Examples 2 to IO, test pieces were prepared in accordance with Example 1.
比較例１
実施例１と同様な方法でめっき原板に前処理を行い、硫
酸浴でめっき量が５ｇ／ｍ”になるように電気亜鉛めっ
きを施し、公知のクロメート処理を施した。すなわち、
無水クロム酸２ｏｇ／ｊ２、硫酸０．０５ｇ／βの浴組
成で、浴温３０℃の中に１秒浸漬して、クロメート量が
Ｃｒとして０．０５ｍｇ／ｄｍ２になるように処理して
比較試料を作成した。Comparative Example 1 A plating original plate was pretreated in the same manner as in Example 1, electrogalvanized in a sulfuric acid bath to a plating amount of 5 g/m'', and then subjected to a known chromate treatment. That is,
A comparative sample was prepared by immersing it in a bath at a bath temperature of 30°C for 1 second with a bath composition of chromic anhydride 2 og/j2 and sulfuric acid 0.05 g/j2, and treating it so that the chromate amount was 0.05 mg/dm2 as Cr. It was created.
比較例２〜１０も公知の方法でめっきを行い、ついで後
処理を施した。Comparative Examples 2 to 10 were also plated by a known method and then subjected to post-treatment.
次に、試験片の作成をまとめて第１表に示し、特性の評
価をまとめて第２表に示した。Next, the preparation of the test pieces is summarized in Table 1, and the evaluation of characteristics is summarized in Table 2.
第２表の実施例１〜１０に示したように、本発明の処理
皮膜は耐食性、半田性、耐指紋性および経時変化におい
て、優れた効果を示した。比較例５は後処理を施さない
もので、比較例１〜４は一般に使用されている化成処理
としてクロメート処理およびりん酸処理を施し、比較例
６〜１０はふっ素系有機化合物を含まない後処理を施し
たものである。比較例１〜６は耐食性に対して効果が認
められるものは半田性で半田の濡れが悪く、劣る傾向を
示した。また、経時することによって、表特性評価
半田の拡がり：２５０℃に保持した半田浴上に５０＋＋
ｖ＋Ｘ ５０ｍｍの試験片を静止し、その上に重量０．
４ｇでハゼ折りしたやに入り半田（Ｊ Ｉ ＳＺ ３
２８３．ＲＨ５０）を置き、５．１０゜１５秒後の半田
拡がり面積を測定し、評価した。As shown in Examples 1 to 10 in Table 2, the treated films of the present invention showed excellent effects in corrosion resistance, solderability, fingerprint resistance, and aging. Comparative Example 5 was not subjected to post-treatment, Comparative Examples 1 to 4 were subjected to chromate treatment and phosphoric acid treatment as commonly used chemical conversion treatments, and Comparative Examples 6 to 10 were post-treated without fluorine-based organic compounds. It has been subjected to In Comparative Examples 1 to 6, those that were found to be effective in terms of corrosion resistance had poor solderability and solder wetting, and showed a tendency to be inferior. In addition, over time, the surface characteristics evaluation solder spread: 50++
A test piece of v+X 50 mm is held still, and a weight of 0.
4g solder in a folded resin (J I SZ 3
283. RH50) was placed, and the solder spreading area was measured and evaluated after 15 seconds at 5.10°.
○：拡がり面積２００１１１１１１２以上 Ｘ：５０＋
＋ｕｎ”以下
半田強度：０．１８ｍｎ＋φの銅細線２０芯を試験片に
置き、半田ゴテにてやに入り半田（ＲＨ５０）を用いて
半田付けを行い、銅線を試験片と逆方向にして、平行に
引張って強制的に破壊を試み、その状態を評価した。○
：破壊なし ×・完全破壊耐食性：ＪＩＳ Ｚ ２
３７１による塩水噴霧試験を２サイクル行い（１サイク
ル二８時間噴霧、１６時間停止）赤錆発生の有無によっ
て評価した。○: Spread area 2001111112 or more X: 50+
Soldering strength: 20 cores of thin copper wire with a diameter of 0.18 mm + φ is placed on the test piece, and soldered with a soldering iron using sticky solder (RH50), with the copper wire in the opposite direction to the test piece. We tried to forcibly break it by pulling it in parallel and evaluated its condition.○
: No destruction ×・Complete destruction corrosion resistance: JIS Z 2
A salt water spray test according to No. 371 was conducted for two cycles (spraying for 28 hours in one cycle, stopped for 16 hours) and evaluated based on the presence or absence of red rust.
○：赤錆なし ×：全面赤錆
加工性：エリクセン張出しくＥｒ＝７ｍｍ）、およびデ
ュポン衝！＠ （１／２− ｘ １ ｋｇＸ３０ｃｍ）
を行い、セロテープでめっきの加工密着性を評価した。○: No red rust ×: Full-surface red rust processability: Erichsen overhang Er = 7 mm) and DuPont! @ (1/2- x 1 kgX30cm)
The process adhesion of the plating was evaluated using Sellotape.
○：剥離なし
経時変化：恒温恒温（６０℃、Ｒ８９５％以上）で、１
．０００時間時間後の外観（変色）を観察し、さらに前
述の試験で耐食性、半田性を評価した。○：変色なし
Ｘ：全面変色
耐指紋性：人工汗（尿素１ｇ／Ｉ２、ビロリン酸ナトリ
ウム８ ｇ ／ １２、乳酸４．６ｇ／Ｉ２、酢酸５ｇ
／ｌ、Ｎ ａ ＣＱ ７ ｇ ／ １２、エチルアルコ
ール２０ ｍ Ｑ ／ Ｑ、純水で１２に調整、ｐＨ３
，７５）を０．５ｃｃ指に濡らし、めっき鋼板に押えつ
けて指紋の付着の程度を評価した。○: No peeling Change over time: 1 at constant temperature (60℃, R895% or more)
．． The appearance (discoloration) after 1,000 hours was observed, and the corrosion resistance and solderability were evaluated using the above-mentioned test. ○: No discoloration
X: Full surface discoloration and fingerprint resistance: Artificial sweat (urea 1g/I2, sodium birophosphate 8g/12, lactic acid 4.6g/I2, acetic acid 5g
/l, N a CQ 7 g / 12, ethyl alcohol 20 m Q / Q, adjusted to 12 with pure water, pH 3
, 75) was applied to a finger and pressed against a plated steel plate to evaluate the degree of fingerprint adhesion.
また、指紋をつけためっき鋼板を恒温恒温（６０℃、Ｒ
８９５％以上）で、５００時間時間後の外観を観察し変
色の程度で評価した。○ 指紋の付着はとんどなし。変
色なし △：指紋わずかに付着、わずかに変色 ×：指
紋の付着顕著。全面変色
面の色調は変化し、耐食性も低下する傾向を示した。比
較例６〜１０は耐指紋性が劣る傾向を示した。In addition, the plated steel plate with fingerprints was kept at constant temperature (60℃, R
895% or more), the appearance after 500 hours was observed and evaluated based on the degree of discoloration. ○ There are almost no fingerprints. No discoloration △: Slight fingerprint adhesion, slight discoloration ×: Significant fingerprint adhesion. The color tone of the entire discolored surface changed, and the corrosion resistance also showed a tendency to decrease. Comparative Examples 6 to 10 tended to have poor fingerprint resistance.
［発明の効果］
第１表、第２表の実施例１〜１０に示したように、本発
明の方法によって、耐食性、半田性、耐指紋性、加工性
、経時性に優れためっき鋼板を得ることができた。[Effects of the Invention] As shown in Examples 1 to 10 in Tables 1 and 2, the method of the present invention produced plated steel sheets with excellent corrosion resistance, solderability, fingerprint resistance, workability, and aging resistance. I was able to get it.
Claims (1)
、（Ｂ）、（Ｃ） （Ａ）： 水溶性あるいは水分散性のアビエチン酸、安息香酸、グ
リセリン、Ｃ＿１＿２〜Ｃ＿２＿４の飽和脂肪酸、Ｃ＿
１＿８の不飽和脂肪酸、ジオール、ポリエチレングリコ
ール、脂肪酸グリセリンエステル、ベンゾトリアゾール
誘導体、パラフィン系ワックスと前記の金属塩、アンモ
ニウム塩、アミン塩の１種以上（Ｂ）： 水溶性あるいは水分散性の脂肪族高級アルコール類、ア
ルキルフェノール類、および脂肪酸類にエチレンオキサ
イドを縮合せしめたもの、ポリエチレングリコール・ア
ルキルアミン類、ソルビタンと脂肪酸のエステル結合し
たもの、ポリプロピレングリコール基を疎水基とし、ポ
リエチレングリコール基を親水基としたもの、脂肪酸と
ショ糖のエステル結合したもの、ラノリンアルコール、
ラノリン脂肪酸とけん化したものの１種以上（Ｃ）： 水溶性あるいは水分散性のリン酸エステル塩の１種以上 の１種以上の２〜２００ｇ／ｌに水溶性あるいは水分散
性のふっ素系有機化合物の１種以上を２〜１００ｇ／ｌ
添加し、あるいはさらにＣｒ＾６＾＋イオン０．０１〜
３ｇ／ｌ、有機アミン石けんの１０〜１００ｇ／ｌの単
独あるいは混合したものを添加したｐＨ３〜１０の処理
液を乾燥厚みが０．０１〜２μｍになるように処理する
ことを特徴とする、半田用めっき鋼板の後処理方法。[Claims] In the post-treatment of plated steel sheets for soldering, the following (A)
, (B), (C) (A): Water-soluble or water-dispersible abietic acid, benzoic acid, glycerin, saturated fatty acids C_1_2 to C_2_4, C_
1_8 unsaturated fatty acids, diols, polyethylene glycols, fatty acid glycerin esters, benzotriazole derivatives, paraffin waxes, and one or more of the above metal salts, ammonium salts, and amine salts (B): water-soluble or water-dispersible aliphatic Higher alcohols, alkylphenols, and fatty acids condensed with ethylene oxide, polyethylene glycol/alkylamines, ester bonds of sorbitan and fatty acids, polypropylene glycol groups as hydrophobic groups, and polyethylene glycol groups as hydrophilic groups. ester bonds of fatty acids and sucrose, lanolin alcohol,
One or more types of lanolin fatty acids and saponified ones (C): One or more types of water-soluble or water-dispersible phosphate ester salts at a concentration of 2 to 200 g/l of water-soluble or water-dispersible fluorinated organic compounds 2-100g/l of one or more of
Add or further Cr^6^+ ions from 0.01 to
3 g/l, and 10 to 100 g/l of organic amine soap alone or in a mixture, the solder is treated with a pH 3 to 10 treatment solution to a dry thickness of 0.01 to 2 μm. Post-treatment method for galvanized steel sheets.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12070288A JPH01290778A (en) | 1988-05-19 | 1988-05-19 | After-treatment of plated steel sheet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12070288A JPH01290778A (en) | 1988-05-19 | 1988-05-19 | After-treatment of plated steel sheet |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01290778A true JPH01290778A (en) | 1989-11-22 |
| JPH0568551B2 JPH0568551B2 (en) | 1993-09-29 |
Family
ID=14792869
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12070288A Granted JPH01290778A (en) | 1988-05-19 | 1988-05-19 | After-treatment of plated steel sheet |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01290778A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1998012362A1 (en) * | 1996-09-20 | 1998-03-26 | Toyo Kohan Co., Ltd. | Post-treating solution of plated steel sheet having improved solderability, post-treated plate and method of production thereof |
| US5997955A (en) * | 1995-12-14 | 1999-12-07 | Sollac | Sheet metal surface treatment method |
| JP2012515267A (en) * | 2009-01-14 | 2012-07-05 | アトテツク・ドイチユラント・ゲゼルシヤフト・ミツト・ベシユレンクテル・ハフツング | Solution and method for increasing solderability and corrosion resistance of metal or metal alloy surfaces |
-
1988
- 1988-05-19 JP JP12070288A patent/JPH01290778A/en active Granted
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5997955A (en) * | 1995-12-14 | 1999-12-07 | Sollac | Sheet metal surface treatment method |
| WO1998012362A1 (en) * | 1996-09-20 | 1998-03-26 | Toyo Kohan Co., Ltd. | Post-treating solution of plated steel sheet having improved solderability, post-treated plate and method of production thereof |
| JP2012515267A (en) * | 2009-01-14 | 2012-07-05 | アトテツク・ドイチユラント・ゲゼルシヤフト・ミツト・ベシユレンクテル・ハフツング | Solution and method for increasing solderability and corrosion resistance of metal or metal alloy surfaces |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0568551B2 (en) | 1993-09-29 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP3199208B2 (en) | Organic rust-resistant copper foil and method for producing the same | |
| KR20020040788A (en) | Process for selective deposition of copper substrates | |
| CN108396325B (en) | Water-soluble weldable nickel protective agent | |
| JP5422558B2 (en) | Solution and method for enhancing solderability and corrosion resistance of metal or metal alloy surface | |
| GB2234194A (en) | Method for post-treatment of electroplated steel sheets for soldering | |
| JP2009530846A (en) | Undercoat composition for organic soldering protection formation | |
| JPH01290778A (en) | After-treatment of plated steel sheet | |
| JPS6388085A (en) | Post-treatment of plated steel sheet | |
| WO1999055935A1 (en) | Method for coating surfaces of copper or of a copper alloy with a tin or tin alloy layer | |
| JPH0525407A (en) | Surface protectant for printed circuit board | |
| EP0490161A2 (en) | A method for protecting surfaces of copper or a copper alloy from corrosion | |
| JPH0645902B2 (en) | Post-treatment method for plated steel sheet | |
| JPH0681159A (en) | Surface treating agent for copper and copper alloy and surface treatment thereof | |
| JPH06268356A (en) | Method for using preflux and manufacture of printed wiring board | |
| JP3873575B2 (en) | Water-soluble preflux, printed circuit board, and metal surface treatment method for printed circuit board | |
| JPH05230674A (en) | Surface treatment of metal | |
| JPH0681158A (en) | Surface treatment of copper and copper alloy | |
| JPH0631444B2 (en) | Multi-layer plated steel sheet for solder | |
| JP2942157B2 (en) | Post-treatment method of Zn plated steel sheet for solder | |
| JPS63115670A (en) | Post treatment of plated steel sheet | |
| JP2917072B2 (en) | Manufacturing method of resin film coated steel sheet with solderability | |
| JP2003342758A (en) | Posttreatment liquid for plated steel sheet improving soldering property, posttreated steel and production method therefor | |
| JPH0220717B2 (en) | ||
| JPH08213727A (en) | Laminated board where different metals subjected to partial rustproof processing coexist and production thereof | |
| US3540943A (en) | Method of making galvannealed ferrous metal of improved solderability |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| LAPS | Cancellation because of no payment of annual fees |