JPH01282893A - Manufacture of multilayer printed wiring board - Google Patents
Manufacture of multilayer printed wiring boardInfo
- Publication number
- JPH01282893A JPH01282893A JP11220088A JP11220088A JPH01282893A JP H01282893 A JPH01282893 A JP H01282893A JP 11220088 A JP11220088 A JP 11220088A JP 11220088 A JP11220088 A JP 11220088A JP H01282893 A JPH01282893 A JP H01282893A
- Authority
- JP
- Japan
- Prior art keywords
- cutting
- blade
- printed wiring
- wiring board
- multilayer printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 10
- 238000005520 cutting process Methods 0.000 claims abstract description 70
- 238000000034 method Methods 0.000 claims description 13
- 239000000919 ceramic Substances 0.000 claims description 9
- 238000001514 detection method Methods 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 11
- 239000011889 copper foil Substances 0.000 abstract description 11
- 239000011888 foil Substances 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 229910010293 ceramic material Inorganic materials 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 229910010272 inorganic material Inorganic materials 0.000 description 2
- 239000011147 inorganic material Substances 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 101100008044 Caenorhabditis elegans cut-1 gene Proteins 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Description
【発明の詳細な説明】
［発明の目的］
〈産業上の利用分野）
本発明は、導体と絶縁体が交互に複数の層をなしている
多層プリント配線板における内層回路の基準位置表示マ
ークを、切削具を用いて露出させる多層プリント配線板
の製造に関する。[Detailed Description of the Invention] [Object of the Invention] (Industrial Application Field) The present invention provides a reference position indicating mark for an inner layer circuit in a multilayer printed wiring board in which a plurality of layers of conductors and insulators are alternately formed. , relates to the production of multilayer printed wiring boards that are exposed using a cutting tool.
（従来の技術）
従来、内層回路の基準位置表示マークを座ぐり露出する
方法は、ボール盤に市販の切削具を取り付け、作業者の
感覚と手先の技能を顆りに行っていたので誤って基準位
置表示マークを削り収ってしまい、不良にする場合がし
ばしば発生した。(Prior art) Conventionally, the method of counterboring and exposing the reference position display mark of the inner layer circuit involved attaching a commercially available cutting tool to a drilling machine and testing the operator's senses and manual skills, which resulted in incorrect reference position markings. There were many cases where the position display mark was scratched off, resulting in a defect.
そこで座ぐり深さのストッパーを設は座ぐり深さを一定
にすることが行われたが、多層プリント配線板の板厚の
バラツキや各層間の厚さの違いなどにより、前記感覚に
よる作業と同様に不良が発生することは避けられなかっ
た。 これらを改良したものとして、切削刃物を回転軸
方向に２分割してその中間を絶縁し、２分割した切１’
ｉＱ刃物をｔｉとしてスリップリングを介して電気接点
を設け、その先端が！ｉＩＩ箔の基準位置表示マークに
達したときの導通を検出する方法が提案された（特公昭
６２−４８８０号公報）、シかし、この切削刃物におけ
る刃先が特殊な構造となっているため、刃先の再研磨が
大変しにくく、切削が不安定であるなどの欠点があった
。 そこでわれわれは切削刃物の絶縁層配置を工夫する
ことによって、正確な座ぐりと、容易に再研磨できる方
法を提案したく特願昭６３−５５６４号）。 しかしな
がら、接着剤からなる絶縁層は、切削刃物の先端部が加
熱されると一部炭化し、内環刃と外環刃が導通し、座ぐ
り作業に支障を期すことがあった。Therefore, a counterbore depth stopper was installed to make the counterbore depth constant, but due to variations in the thickness of multilayer printed wiring boards and differences in the thickness between each layer, it was difficult to do the work by feeling. Similarly, it was inevitable that defects would occur. As an improvement on these, the cutting tool is divided into two in the direction of the rotation axis, the middle is insulated, and the cut 1'
An electrical contact is provided via a slip ring using the iQ knife as ti, and the tip is! A method of detecting conduction when the reference position indicator mark of the iII foil is reached has been proposed (Japanese Patent Publication No. 62-4880). However, because the cutting edge of this cutting tool has a special structure, The disadvantages were that it was very difficult to resharpen the cutting edge and the cutting was unstable. Therefore, we would like to propose a method that allows accurate counterbore and easy re-sharpening by devising the arrangement of the insulating layer of the cutting blade (Japanese Patent Application No. 5564/1983). However, when the tip of the cutting blade is heated, the insulating layer made of adhesive partially carbonizes, causing electrical conduction between the inner ring blade and the outer ring blade, which may impede spot boring work.
〈発明が解決しようとする課題）
本発明は、上記の欠点を解消するためになされたもので
、所定構造の切削刃物を用いて、内層回路の基準位置表
示マークを露出するまで正確な座ぐりができ、かつ切削
刃物の再研磨も極めて容易にできる多層プリント配線板
の製造方法、切削装置および切削具を提供しようとする
ものである。(Problems to be Solved by the Invention) The present invention has been made in order to eliminate the above-mentioned drawbacks, and uses a cutting blade with a predetermined structure to accurately counterbore until the reference position indicating mark of the inner layer circuit is exposed. It is an object of the present invention to provide a method for manufacturing a multilayer printed wiring board, a cutting device, and a cutting tool that allow the cutting tool to be resharpened very easily.
［発明の構成］
〈課題を解決するための手段）
本発明者らは、上記の目的を達成しようと鋭、低研究を
重ねた結果、切削刃物の絶縁層配置を工夫すると同時に
、その絶縁を完全に行うことによって、上記目的を達成
し得ることを見いだし、本発明を完成したものである。[Structure of the Invention] <Means for Solving the Problems> As a result of intensive and intensive research in an attempt to achieve the above object, the present inventors devised the arrangement of the insulating layer of the cutting blade and at the same time improved the insulation. The present invention has been completed by discovering that the above object can be achieved by carrying out the method perfectly.
すなわち、本発明は、多層プリント配線板を回転する
切削具で切削し内層回路の基準位置表示マークを露出す
る多層プリント配線板の製造方法において、切削具の刃
先を、回転軸に対して偏心した筒状のセラミック又は無
機質の薄い絶縁層を設けて外環刃と内環刃とが電気的に
絶縁されるように分割し、刃先が内層回路の基準位置表
示マークに達した時に、外環刃と内環刃とを通じて起こ
る電気的導通を検知して切削を停止し、内層回路の基準
位置表示マークを露出することを特徴とする多層プリン
ト配線板の製造方法である。 そして、上記製造方法に
使用される基準位置表示マークを露出する切削装置およ
び切削具である。That is, the present invention provides a method for manufacturing a multilayer printed wiring board in which a multilayer printed wiring board is cut with a rotating cutting tool to expose a reference position indicating mark of an inner layer circuit. A cylindrical ceramic or inorganic thin insulating layer is provided to separate the outer ring blade and the inner ring blade so that they are electrically insulated, and when the cutting edge reaches the reference position indicator mark of the inner layer circuit, the outer ring blade This method of manufacturing a multilayer printed wiring board is characterized in that electrical conduction occurring between the inner ring blade and the inner ring blade is detected, cutting is stopped, and a reference position indicating mark of the inner layer circuit is exposed. The present invention also provides a cutting device and a cutting tool for exposing the reference position display mark used in the above manufacturing method.
（作用）
本発明の多層プリント配線板の！！！遣方法に用いる基
準位置表示マーク露出用の切削具は、回転軸に対して偏
心した筒状のセラミック又は無機質の薄い絶縁層を設け
て、その筒状の絶縁層によって２分割された外環刃と内
環刃とが電気的に絶縁される。(Function) The multilayer printed wiring board of the present invention! ! ! The cutting tool for exposing the reference position display mark used in this method has a cylindrical ceramic or inorganic thin insulating layer eccentric to the rotation axis, and an outer ring blade that is divided into two by the cylindrical insulating layer. and the inner ring blade are electrically insulated.
その結果、内環刃は刃先にのみ露出して切削具側面に露
出せず、外環刃と内環刃とは多層プリント配線板の銅箔
が切削側面に接触しても導通しないから、刃先の外周を
回転軸に対して偏心させる必要はなく、安定した切削を
することができる。As a result, the inner ring blade is exposed only at the cutting edge and not on the side surface of the cutting tool, and the outer ring blade and inner ring blade do not have electrical conductivity even when the copper foil of the multilayer printed wiring board comes into contact with the cutting side. There is no need to make the outer periphery eccentric with respect to the rotation axis, and stable cutting can be performed.
また筒状の絶縁層を回転軸に対して偏心させて設けるこ
とによって、この点からも通常起こる回転軸の未切削部
分をなくしてきれいに切削することができる。 また筒
状の絶縁層を設けて外環刃と内環刃とに分割したことに
よって、絶縁層が切削具の側表面に現われずまた刃先外
周が回転軸に対してｆｉｌ心していない比較的簡単な構
造であるため、切削具の再研磨が一般の切削具の再研磨
と同様極めて容易に行うことができる。 更に、切削具
の筒状の絶縁層がセラミックや無機質からなっているた
め、切削工程で熱が発生しても劣化や破壊のない完全に
外環刃と内環刃を絶縁することができる。 そのうえ、
絶縁層部に切削具をつけることも可能であり更に安定な
切削具が歩留り良く製造できる。Furthermore, by providing the cylindrical insulating layer eccentrically with respect to the rotating shaft, clean cutting can be achieved by eliminating uncut portions of the rotating shaft that normally occur. In addition, by providing a cylindrical insulating layer and dividing it into an outer ring cutter and an inner ring cutter, the insulating layer does not appear on the side surface of the cutting tool, and the outer periphery of the cutting tool is not filtrated with respect to the rotation axis. Because of this structure, the cutting tool can be re-polished extremely easily in the same way as re-polishing of general cutting tools. Furthermore, since the cylindrical insulating layer of the cutting tool is made of ceramic or inorganic material, the outer ring blade and the inner ring blade can be completely insulated without deterioration or destruction even if heat is generated during the cutting process. Moreover,
It is also possible to attach a cutting tool to the insulating layer portion, and a more stable cutting tool can be manufactured with a high yield.
（実施例） 次に本発明の一実施例を図面を用いて説明する。(Example) Next, one embodiment of the present invention will be described using the drawings.
第１図（ａ ）は、この実施例に用いられる切削具の縦
断面図、第１図（ｂ ）はその下面図である。FIG. 1(a) is a longitudinal sectional view of a cutting tool used in this embodiment, and FIG. 1(b) is a bottom view thereof.
第１図の切削具１においては、回転軸１ａに面心させて
設けた円筒状の絶縁層２が外環刃３と内環刃４とに分割
し、両刃を電気的に絶縁している。In the cutting tool 1 shown in FIG. 1, a cylindrical insulating layer 2 provided face-centered on the rotating shaft 1a is divided into an outer ring blade 3 and an inner ring blade 4, and both blades are electrically insulated. .
ただし、この信心させた絶縁層２は、切削具１の側表面
に露出しないようになっている。 絶縁層２は、機械加
工が容易で薄層が可能なセラミックスやガラス質からな
り、内環刃の側表面上に０．１０〜０．１５ｎｎ厚さに
コーティングし、その後外環刃と合体させ！！機雪質耐
熱性接着材完全に硬化し内環刃と外環刃を固着一体止し
て形成される。 また、絶縁層形成の別の方法は、内環
刃と外環刃を絶縁層２となる間隙厚さが均一になる治具
にセットし、治具にセットしたまま減圧チャンバー内で
滴下含浸してセラミックやカラス質接着材を含浸させた
後、焼結する。 絶縁層２は、切削材用のセラミックス
や無機質を用いた場合には絶縁層２上にそれ自体の刃を
設けることも可能である。 このように円筒状の絶縁層
２が設けられていても通常の切削具とほとんど変るとこ
ろがない、 そのため、切削が安定するとともに切削具
の再研磨は極めて容易に行うことができる。 また、絶
縁＃２の形状は円筒状に限定されることがなく、その横
断面形状が円環形、楕円環形、多角環形などのいずれで
もよい。However, this insulating layer 2 is not exposed to the side surface of the cutting tool 1. The insulating layer 2 is made of ceramic or glass, which is easy to machine and can be formed into a thin layer, and is coated on the side surface of the inner ring blade to a thickness of 0.10 to 0.15 nm, and then combined with the outer ring blade. ! ! It is formed by completely curing the snow-like heat-resistant adhesive and fixing the inner ring blade and outer ring blade together. Another method for forming an insulating layer is to set the inner ring blade and the outer ring blade in a jig that makes the gap thickness uniform for the insulating layer 2, and drip impregnate it in a vacuum chamber while set in the jig. After impregnating with ceramic or glass adhesive material, it is sintered. When the insulating layer 2 is made of ceramic or inorganic material for cutting, it is also possible to provide its own blade on the insulating layer 2. Even if the cylindrical insulating layer 2 is provided in this way, there is almost no difference from a normal cutting tool.Therefore, cutting is stable and the cutting tool can be re-polished extremely easily. Further, the shape of the insulation #2 is not limited to a cylindrical shape, and its cross-sectional shape may be any of a circular ring, an elliptical ring, a polygonal ring, and the like.
次に第１図の切削具１を用いる切削装置と多層プリント
配線板の製造方法について第２図を用いて説明する。Next, a cutting device using the cutting tool 1 shown in FIG. 1 and a method for manufacturing a multilayer printed wiring board will be explained using FIG. 2.
内層回路が形成しである内層銅箔１３に基準位置表示マ
ーク１４を形成し、その上下に、絶縁層１１．１２を配
し、更にその上下面に、外層！ｉ４箔１０ａ、１０ｂを
配置してなる多層プリント配線板を用意する。 そして
切削装置に取着した切削具１が上記基準位置表示マーク
１４の真上にくるように移動させてセットする。 次に
、刃送りスタートスイッチ９を押し、刃送り制御装置８
によって回転する切削具１を下降させ、まず多層プリン
ト配線板の外層鋼箔１０ａを切削させる。 その場合第
１層目の外層銅箔１０ａによって外環刃３と内環刃４と
は導通するが、この導通信号はスリップリング５，６を
経由して導通信号制御装置７がカウントし、切削具が外
層銅箔１０ａに達したことを覚えておく、 さらに切削
を続けて内層銅箔１３の基準位置表示マーク１４に達し
たときの導通信号は導通信号制御装置７によって座ぐり
完了信号として処理され、刃送り制御装置８によって座
ぐり作業を停止する。 もし基準位置表示マーク１４が
内層銅箔１３になく、さらに深層の内層銅箔（図示され
ていない）に設けてその基準位置表示マークまで座ぐる
場合は、導通信号制御装置７のカウンターをそのように
設定すれば希望する層の基準位置表示マークまで自動的
に座ぐり露出させることができる。A reference position display mark 14 is formed on the inner layer copper foil 13 on which the inner layer circuit is formed, and insulating layers 11 and 12 are arranged above and below it, and furthermore, an outer layer is formed on the upper and lower surfaces thereof. A multilayer printed wiring board on which i4 foils 10a and 10b are arranged is prepared. Then, the cutting tool 1 attached to the cutting device is moved and set so as to be directly above the reference position display mark 14. Next, press the blade feed start switch 9, and press the blade feed control device 8.
The rotating cutting tool 1 is lowered to first cut the outer layer steel foil 10a of the multilayer printed wiring board. In that case, the outer ring blade 3 and the inner ring blade 4 are electrically connected by the first outer layer copper foil 10a, but this conduction signal is counted by the conduction signal control device 7 via the slip rings 5 and 6, and Remember that the tool has reached the outer layer copper foil 10a, and when the tool continues cutting and reaches the reference position display mark 14 of the inner layer copper foil 13, the conduction signal is processed by the conduction signal control device 7 as a spot boring completion signal. Then, the counterboring operation is stopped by the blade feed control device 8. If the reference position display mark 14 is not on the inner layer copper foil 13, but is provided on a deeper inner layer copper foil (not shown) and the reference position display mark 14 is to be located up to the reference position display mark, the counter of the conductive signal control device 7 should be If set to , it is possible to automatically counterbore and expose up to the reference position display mark of the desired layer.
［発明の効果］
以上の説明から明らかなように、本発明の多層グリント
配線板の製造方法によれば、内層回路基準位置表示マー
クの露出切削が正確にでき、がっ切削刃物の再研磨も極
めて容易にできる、信頼性の高い多層プリント配線板が
製造される。[Effects of the Invention] As is clear from the above description, according to the method for manufacturing a multilayer glint wiring board of the present invention, the exposure cutting of the inner layer circuit reference position display mark can be performed accurately, and the re-sharpening of the cutter is also possible. A highly reliable multilayer printed wiring board is produced which is extremely easy to produce.
４、発明の詳細な説明
第１図（ａ ）及び（ｂ ）はそれぞれ本発明実施例に
使用した切削具の構造を示す縦断面図および下面図、第
２図は本発明方法を実施する装置の概念図である。4. Detailed Description of the Invention Figures 1 (a) and (b) are a vertical sectional view and a bottom view showing the structure of a cutting tool used in an embodiment of the present invention, respectively, and Figure 2 is a device for carrying out the method of the present invention. It is a conceptual diagram.
１・・・切削具、 ２・・・絶縁層、 ３・・・外環刃
、４・・・内環刃、 ５，６・・・スリップリング、
７・・・導通信号制御装置、 ８・・・刃送り制御装置
、 ９・・・刃送りスタートスイッチ、 １０ａ、１
０ｂ・・・外層銅箔、 １１．１２・・・絶縁層、
１３・・・内層ｇ：１箔、 １４・・・基準位置表示
マーク。DESCRIPTION OF SYMBOLS 1... Cutting tool, 2... Insulating layer, 3... Outer ring blade, 4... Inner ring blade, 5, 6... Slip ring,
7... Conductive signal control device, 8... Blade feed control device, 9... Blade feed start switch, 10a, 1
0b... Outer layer copper foil, 11.12... Insulating layer,
13... Inner layer g: 1 foil, 14... Reference position display mark.
（ｂ） 第１図 第２図(b) Figure 1 Figure 2
Claims (1)
回路の基準位置表示マークを露出する多層プリント配線
板の製造方法において、切削具の刃先を、回転軸に対し
て偏心した筒状のセラミック又は無機質の薄い絶縁層を
設けて外環刃と内環刃とが電気的に絶縁されるように分
割し、刃先が内層回路の基準位置表示マークに達した時
に、外環刃と内環刃とを通じて起こる電気的導通を検知
して切削を停止し、内層回路の基準位置表示マークを露
出することを特徴とする多層プリント配線板の製造方法
。 ２ 多層プリント配線板の内層回路基準位置表示マーク
を露出させる切削具において、切削具の刃先を、回転軸
に対して偏心した筒状のセラミック又は無機質の薄い絶
縁層を設けて外環刃と内環刃とが電気的に絶縁されるよ
うに分割したことを特徴とする多層プリント配線板の内
層回路基準位置表示マーク露出用の切削具。 ３ 多層プリント配線板を回転する切削具で切削し内層
回路の基準位置表示マークを露出する装置において、切
削具の刃先を、回転軸に対して偏心した筒状のセラミッ
ク又は無機質の薄い絶縁層を設けて外環刃と内環刃とが
電気的に絶縁されるように分割し、刃先が内層回路の基
準位置表示マークに達した時に、外環刃と内環刃とを通
じて起こる電気的導通を検知して切削を停止することを
特徴とする多層プリント配線板における内層回路の基準
位置表示マークの露出用切削装置。[Scope of Claims] 1. A method for manufacturing a multilayer printed wiring board in which a multilayer printed wiring board is cut with a rotating cutting tool to expose a reference position indicating mark of an inner layer circuit, in which the cutting tool's cutting edge is eccentric to the rotation axis. A thin cylindrical ceramic or inorganic insulating layer is provided to separate the outer ring blade and the inner ring blade so that they are electrically insulated, and when the cutting edge reaches the reference position mark of the inner layer circuit, the outer ring blade A method for manufacturing a multilayer printed wiring board, characterized by detecting electrical continuity occurring between a blade and an inner ring blade, stopping cutting, and exposing a reference position display mark of an inner layer circuit. 2. In a cutting tool that exposes the inner layer circuit reference position indicator mark of a multilayer printed wiring board, the cutting tool's cutting edge is separated from the outer ring blade by providing a cylindrical ceramic or inorganic thin insulating layer eccentric to the rotation axis. A cutting tool for exposing an inner layer circuit reference position indicator mark of a multilayer printed wiring board, characterized in that the ring blade is divided so as to be electrically insulated. 3. In a device that cuts a multilayer printed wiring board with a rotating cutting tool to expose the reference position mark of the inner layer circuit, the cutting tool's cutting edge is used to cut a cylindrical ceramic or inorganic thin insulating layer eccentric to the rotation axis. The outer ring cutter and the inner ring cutter are separated so that they are electrically insulated, and the electrical conduction that occurs through the outer ring cutter and the inner ring cutter is prevented when the cutting edge reaches the reference position indicator mark of the inner layer circuit. A cutting device for exposing a reference position indicating mark of an inner layer circuit in a multilayer printed wiring board, characterized in that the cutting is stopped upon detection.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11220088A JPH01282893A (en) | 1988-05-09 | 1988-05-09 | Manufacture of multilayer printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11220088A JPH01282893A (en) | 1988-05-09 | 1988-05-09 | Manufacture of multilayer printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01282893A true JPH01282893A (en) | 1989-11-14 |
Family
ID=14580765
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11220088A Pending JPH01282893A (en) | 1988-05-09 | 1988-05-09 | Manufacture of multilayer printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01282893A (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5833896A (en) * | 1981-08-25 | 1983-02-28 | 日立化成工業株式会社 | Method of exposing reference position display mark of multilayer printed circuit board inner layer circuit |
-
1988
- 1988-05-09 JP JP11220088A patent/JPH01282893A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5833896A (en) * | 1981-08-25 | 1983-02-28 | 日立化成工業株式会社 | Method of exposing reference position display mark of multilayer printed circuit board inner layer circuit |
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