JPH01275777A - Apparatus for continuously plating metallic sheet - Google Patents
Apparatus for continuously plating metallic sheetInfo
- Publication number
- JPH01275777A JPH01275777A JP10457788A JP10457788A JPH01275777A JP H01275777 A JPH01275777 A JP H01275777A JP 10457788 A JP10457788 A JP 10457788A JP 10457788 A JP10457788 A JP 10457788A JP H01275777 A JPH01275777 A JP H01275777A
- Authority
- JP
- Japan
- Prior art keywords
- plating
- plated
- metal
- plated metal
- metal material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007747 plating Methods 0.000 title claims abstract description 115
- 239000007769 metal material Substances 0.000 claims abstract description 68
- 239000002184 metal Substances 0.000 claims description 79
- 229910052751 metal Inorganic materials 0.000 claims description 79
- 230000008018 melting Effects 0.000 claims description 25
- 238000002844 melting Methods 0.000 claims description 25
- 238000010438 heat treatment Methods 0.000 claims description 15
- 239000000155 melt Substances 0.000 claims description 6
- 229910000831 Steel Inorganic materials 0.000 abstract description 41
- 239000010959 steel Substances 0.000 abstract description 41
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 239000000463 material Substances 0.000 abstract description 4
- 238000000034 method Methods 0.000 description 23
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 17
- 229910052802 copper Inorganic materials 0.000 description 17
- 239000010949 copper Substances 0.000 description 17
- 230000003750 conditioning effect Effects 0.000 description 6
- 239000007787 solid Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 238000005246 galvanizing Methods 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 3
- 239000011701 zinc Substances 0.000 description 3
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 238000007599 discharging Methods 0.000 description 2
- 230000003628 erosive effect Effects 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 238000005275 alloying Methods 0.000 description 1
- 239000011449 brick Substances 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000002203 pretreatment Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 238000007712 rapid solidification Methods 0.000 description 1
- 239000007790 solid phase Substances 0.000 description 1
- 239000011573 trace mineral Substances 0.000 description 1
- 235000013619 trace mineral Nutrition 0.000 description 1
Landscapes
- Coating With Molten Metal (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、溶融金属浴を用いることなく金属板の表面に
めっきを施すことができる装置に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an apparatus capable of plating the surface of a metal plate without using a molten metal bath.
従来、鋼帯表面にめっき皮膜を形成させる方法として、
予め溶融させためっき金属中に鋼帯を浸漬させる、溶融
めっき法が広く行われている。Conventionally, as a method for forming a plating film on the surface of steel strip,
Hot-dip plating is a widely used method in which a steel strip is immersed in pre-molten plated metal.
この種のめっき法の代表例である連続溶融亜鉛めっきで
は、鋼帯は前処理炉で熱処理及び表面清浄化処理された
後、溶融亜鉛浴中に浸漬されてめっき皮膜が形成され、
浴から引き出された鋼帯には気体絞りによるめっき付着
量調整、ガルバニール等の表面調整が施される。In continuous hot-dip galvanizing, which is a typical example of this type of plating method, the steel strip is heat-treated and surface-cleaned in a pre-treatment furnace, and then immersed in a hot-dip zinc bath to form a plating film.
The steel strip pulled out from the bath is subjected to plating coating amount adjustment by gas throttling and surface conditioning such as galvanealing.
このようにして得られた溶融めっき鋼板は表面が比較的
美麗で、しかも財食性も優れているため、広く実用に供
されている。The hot-dip plated steel sheets obtained in this way have a relatively beautiful surface and are also excellent in edibility, so they are widely used in practical applications.
しかし、従来の溶融亜鉛めっき方法は、めっき浴を使用
することに伴う種々の問題を有している。特に最近では
、めっき鋼帯には家電、自動車の外板用途等を中心にし
て従来に増して表面の均一さ、平滑さ、美麗さが求めら
れ、また品種的にも差厚めつき、片面めっき等の新規製
品の需要も高く、このため従来の溶融めっき法によるめ
っき鋼帯の品質やめっきプロセス自体に対する問題点が
顕在化してきた。そのような問題点のいくつかを以下に
述べる。However, conventional hot dip galvanizing methods have various problems associated with the use of plating baths. Particularly recently, plated steel strips are required to have a more uniform, smooth, and beautiful surface than ever before, mainly for use in home appliances, automobile exterior panels, etc. There is also a high demand for new products such as, and as a result, problems with the quality of plated steel strips and the plating process itself using conventional hot-dip plating methods have become apparent. Some of such problems are discussed below.
■）めっき浴中に鋼帯表面からのＦｅが溶出したり、め
っき金属が酸化されることによる所謂ドロスの発生が多
く、これを汲み上げ除去しなければならないために、鋼
帯に付着する以外のめっき金属の損失が生ずる。■) Fe from the surface of the steel strip is eluted during the plating bath, and so-called dross is often generated due to oxidation of the plating metal, and since this must be pumped up and removed, it is necessary to A loss of plated metal occurs.
２）めっき浴中でドロスが発生したり、ポットを構成す
る煉瓦の屑が浴中に混入する等、めっき浴に不純物が混
じりやすく、これらが鋼帯に付着して、その外観を低下
させる。2) Impurities are likely to be mixed into the plating bath, such as dross being generated in the plating bath or debris from the bricks that make up the pot being mixed into the bath, and these impurities adhere to the steel strip and deteriorate its appearance.
３）浴中に投入するめっき金属地金成分と、鋼帯に付着
する成分及びドロス等の副生物として浴外に排出される
成分中の微量元素が異なるため、目標通りの必要元素を
含有するめっき浴成分に調整制御するのが困難である。3) Since the components of the plating metal ingot put into the bath are different from the trace elements in the components that adhere to the steel strip and the components that are discharged outside the bath as by-products such as dross, the necessary elements are contained as per the target. It is difficult to adjust and control the plating bath components.
このため、めっき密着性不良や、ガルバニール材の合金
化不良等、各種のめっき欠陥が発生する。As a result, various plating defects occur, such as poor plating adhesion and poor alloying of the galvanic material.
４）高温、高浸食性のめっき金属浴中に、鋼帯通板用の
ロールや、ロール支持アーム、軸受等、鋼製の機械部品
を浸漬する必要がある。4) It is necessary to immerse steel mechanical parts such as rolls for threading the steel strip, roll support arms, bearings, etc. in a high temperature, highly corrosive plating metal bath.
このため、これら部材の浸食や、これに伴うドロスの発
生、さらには浴中ロール表面の浸食によるめっき表面外
観の低下等の問題が生ずる。This causes problems such as erosion of these members, generation of dross accompanying this, and deterioration of the appearance of the plating surface due to erosion of the surface of the roll in the bath.
更には、これらの機械部品の浸食または損傷部を定期的
に修理、交換するための操業停止時間が必要であり、設
備の生産能力を有効、最大限に生かすことができない。Furthermore, operation downtime is required to periodically repair or replace eroded or damaged parts of these mechanical parts, making it impossible to effectively and maximally utilize the production capacity of the equipment.
５）めっき浴中に通板ロールを使用することにより、め
っき表面にロールのグループ溝が転写しやすく、外観の
悪化を招く。5) By using a passing roll in the plating bath, the group grooves of the roll are likely to be transferred to the plating surface, resulting in deterioration of the appearance.
６）浴下部に堆積するボトムドロスの排出作業、浴面に
堆積するトップドロスの排出作業、浴中への銅帯の初期
通板作業、めっき浴中でのロールの手入れ作業等、高温
で且つ多量のめっき浴近傍での作業は、作業者の大きな
負担となり、且つ危険である。6) Discharging bottom dross that accumulates at the bottom of the bath, discharging top dross that accumulates on the bath surface, initial threading of copper strips into the bath, maintenance of rolls in the plating bath, etc. at high temperatures and in large quantities. Working near the plating bath places a heavy burden on the worker and is dangerous.
７）ポット−基当り、一種のめっきしかできないため、
各種の異種めっきを行う際には、浴の汲み出しによる俗
習えを行うか、または異種のめっき金属を溶解したポッ
トを予め準備し、ポットの移動を行う等の作業が必要で
ある。7) Pot - Since only one type of plating can be done per group,
When performing various types of dissimilar plating, it is necessary to carry out routine practice by pumping out a bath, or to prepare in advance a pot in which dissimilar plating metals are melted, and to move the pot.
８）両面めっき材と片面めっき材を単一の設備で生産す
る場合、ポット部のめっき設備の変更が必要となり、そ
のための設備負担に加え、切替のために多くの時間と労
力が必要となる。8) When producing double-sided plated materials and single-sided plated materials in a single facility, it is necessary to change the plating equipment for the pot section, which requires a lot of time and effort in addition to the equipment burden. .
９）両面異種めっき、多層めっき、両面差厚めつき等の
特殊なめっきを行なうことが難しい。9) It is difficult to perform special plating such as double-sided dissimilar plating, multilayer plating, and double-sided differential thickness plating.
このように、従来の溶融めっき方法は種々の問題を有し
ているものである。As described above, conventional hot-dip plating methods have various problems.
このように従来の溶融めっき方法に対し、本発明者等は
上記諸問題を総て解消できる新たなめっき方法を提案し
た。In contrast to the conventional hot-dip plating method, the present inventors have proposed a new plating method that can solve all of the above-mentioned problems.
その方法の一つは、めっき金属の融点以上の温度に加熱
され通板する鋼帯の表面に、めっき金属材を連続的に送
給し、該めっき金属材を鋼帯に接触させることによって
溶融させ、溶融しためっき金属を通板する鋼帯にめっき
皮膜とし°て連続的に付着させるようにする方法である
。One of the methods is to continuously feed a plated metal material onto the surface of a steel strip that is heated to a temperature higher than the melting point of the plated metal, and to bring the plated metal material into contact with the steel strip, thereby melting the plated metal material. In this method, the molten plated metal is continuously deposited as a plating film on the steel strip through which the plate is passed.
また他の方法は、めっき金属材を通板する鋼帯の表面に
向けて連続的に送給し、該めっき金属材の先端側を、鋼
帯に面した加熱溶解装置により鋼帯面直前で順次溶融さ
せ、溶融しためっき金属をめっき皮膜として銅帯表面に
連続的に付着させるようにする方法である。In another method, the plated metal material is continuously fed toward the surface of the steel strip through which the plated metal material is passed, and the tip side of the plated metal material is heated just before the surface of the steel strip using a heating melting device facing the steel strip. This is a method in which the copper strip is sequentially melted and the molten plated metal is continuously adhered to the surface of the copper strip as a plating film.
これらの方法はいずれも、固相のめっき金属材を銅帯方
向に送給して、これを銅帯の顕熱或いは鋼帯に面して設
けられた溶解装置により、銅帯面上またはその近傍でめ
っき目付分だけ溶融させ、この溶融金属をめっき金属と
して付着させるものであり、溶融金属浴を全く必要とし
ないため、めっき浴使用に伴う従来の問題を一挙に解決
することができ、しかも固体のめつき金属材の送給速度
のコントロールにより、めっき付着量のコントロールも
高精度に行うことができる。In all of these methods, a solid-phase plated metal material is fed in the direction of the copper strip, and then it is heated onto the surface of the copper strip or by a melting device installed facing the steel strip. This method melts the amount of plating in the vicinity and deposits this molten metal as plating metal, and since no molten metal bath is required, all the conventional problems associated with the use of plating baths can be solved at once. By controlling the feeding speed of the solid plated metal material, the amount of plating deposited can be controlled with high precision.
しかし、これらのめっき法を実施する上での問題点の一
つに被めっき鋼帯の幅変更への対応性がある。すなわち
、上記めっき法では連続供給される固体のめっき金属材
を被めっき鋼帯の熱或いは加熱溶解装置による加熱によ
り溶融させてめっきを行なうものであるため、めっき金
属材として被めっき鋼帯とほぼ同幅のものを用いる必要
がある。However, one of the problems in implementing these plating methods is the adaptability to changes in the width of the steel strip to be plated. In other words, in the above plating method, plating is performed by melting the continuously supplied solid plating metal material by the heat of the steel strip to be plated or by heating with a heating melting device, so that the plating metal material is approximately the same as the steel strip to be plated. It is necessary to use ones of the same width.
したがって、銅帯幅に合わせてめっき金属材を変える必
要があり、そのために大規模な交換装置が必要になる。Therefore, it is necessary to change the plating metal material according to the width of the copper strip, which requires a large-scale changing device.
また、板幅変更に伴いめっき金属材の切替えに時間がか
かるため、生産能率も低くならざるを得ない。Furthermore, since it takes time to change the plated metal material as the plate width changes, production efficiency inevitably decreases.
本発明はこのような問題に鑑み、被めっき金属板の板幅
変更に迅速に対応してめっきを行なうことができる装置
を提供せんとするものである。SUMMARY OF THE INVENTION In view of these problems, it is an object of the present invention to provide an apparatus that can perform plating while quickly responding to changes in the width of a metal plate to be plated.
このため本願第１の発明は、めっき金属の融点以上の温
度に加熱され通板する金属板の表面にめっき金属材を送
給するためのめっき金属材供給装置を備え、送給された
めっき金属材を金属板に接触させることにより溶融させ
、溶融しためっき金属を通板する金属板にめっき皮膜と
して連続的に付着させるようにした連続めっき装置であ
って、前記めっき金属材供給装置を通板する金属板面と
直交する軸を中心に旋回可能に構成したことをその特徴
とする。For this reason, the first invention of the present application is provided with a plating metal material supplying device for feeding a plating metal material onto the surface of a metal plate heated to a temperature higher than the melting point of the plating metal and passed through, and A continuous plating device that melts a plated metal by bringing it into contact with a metal plate and continuously deposits the molten plated metal as a plating film on the metal plate through which the plated metal is passed, the plated metal supply device Its feature is that it is configured to be able to rotate around an axis perpendicular to the surface of the metal plate.
また本願第２の発明は、通板する金属板に面してめっき
金属材の加熱溶解装置を有し、めっき金属材を金属板方
向に送給するとともに、前記加熱溶解装置によりめっき
金属材の先端側を順次溶融させるめっき金属供給装置を
備え、溶融しためっき金属を通板する金属板にめっき皮
膜として連続的に付着させるようにした連続めっき装置
であって、前記めっき金属供給装置を通板する金属板面
と直交する軸を中心に旋回可能に構成したことをその特
徴とする。Further, the second invention of the present application has a heating melting device for the plated metal material facing the metal plate to be passed, and feeds the plated metal material in the direction of the metal plate, and the heating melting device is used to melt the plated metal material. A continuous plating apparatus is provided with a plated metal supply device that sequentially melts the tip side, and is configured to continuously apply the molten plated metal as a plating film to the metal plate through which the plated metal is passed, the plated metal supply device Its feature is that it is configured to be able to rotate around an axis perpendicular to the surface of the metal plate.
本発明のめっき装置は、めっきすべき金属板の板幅に合
わせてめっき金属材供給装置またはめっき金属供給装置
を通板する金属板面と直交する軸を中心に旋回させるこ
とにより位置調整し、供給されるめっき金属材或いはそ
の溶融金属が被めっき金属板のエツジからはみ出さない
ようにする。そして、上記装置を金属板の幅方向に沿っ
た位置に旋回させた状態が最大幅となる。The plating apparatus of the present invention adjusts the position by rotating the plating metal material supply device or the plating metal supply device around an axis perpendicular to the surface of the metal plate through which the plate is passed, according to the width of the metal plate to be plated, To prevent supplied plating metal material or its molten metal from protruding from the edge of a metal plate to be plated. The maximum width is obtained when the device is rotated to a position along the width direction of the metal plate.
第１図ないし第４図は、めっき金属材を銅帯と接触させ
ることによって溶融させるようにした方式の実施例であ
る。FIGS. 1 to 4 show an embodiment of a method in which a plated metal material is melted by contacting it with a copper strip.
連続めっき装置は、めっき金属の融点以上の温度に加熱
され通板する銅帯面にめっき金属材を送給するめっき金
属材供給装置（５）を有しており、第４図に示すように
送給されためっき金属材（２）を銅帯（１）と接触させ
ることにより溶融させ、溶融しためっき金属を通板する
銅帯表面にめっき皮膜（４）として連続的に付着させる
ようにしている。The continuous plating equipment has a plating metal material supply device (5) that feeds the plating metal material to the surface of the copper strip heated to a temperature higher than the melting point of the plating metal and passed through, as shown in Fig. 4. The supplied plated metal material (2) is melted by contacting with the copper strip (1), and is continuously deposited as a plating film (4) on the surface of the copper strip through which the molten plated metal is passed. There is.
めっき金属材供給装置（５）は、めっき金属材（板体）
を所定の供給速度で鋼帯面方向に送給するための送りロ
ーラ（６）（ピンチローラ）と、めっき金属材の予熱装
置（７）とを備えている。このようなめっき金属材供給
装置（５）は、第２図に示すようにその幅方向中心の鋼
板面と直交する軸を支点（Ｃ）として旋回可能に構成さ
れている。The plated metal material supply device (5) supplies the plated metal material (plate)
It is equipped with a feed roller (6) (pinch roller) for feeding steel strip surface direction at a predetermined feed rate, and a plated metal material preheating device (7). As shown in FIG. 2, such a plated metal material supply device (5) is configured to be able to pivot about an axis (C) that is perpendicular to the steel plate surface at the center in the width direction.
第３図は、装置を旋回させるための具体的構成を示すも
ので、送りローラ（６）及び予熱装置（７）は、門型の
フレーム（８）の内側に取付られている。装置（５）の
外側には、これを外囲するようにガイドレール（９）が
設けられている。このガイドレール（９）は適当な固定
部材（固定フレーム等）に保持されている。そして装置
（５）はそのフレーム（８）の両側に設けられたガイド
ロール（１０）を介して前記ガイドレール（９）に保持
されている。FIG. 3 shows a specific configuration for rotating the device, in which a feed roller (6) and a preheating device (7) are attached to the inside of a gate-shaped frame (8). A guide rail (9) is provided on the outside of the device (5) so as to surround it. This guide rail (9) is held by a suitable fixed member (fixed frame, etc.). The device (5) is held on the guide rail (9) via guide rolls (10) provided on both sides of the frame (8).
フレーム（８）の上部には、旋回の支点となるべき軸体
（１１）が設けられ、この軸体（１１）が装置外方の固
定部（１２）に回転自在に軸支されている。A shaft (11) that serves as a pivot point is provided at the top of the frame (8), and this shaft (11) is rotatably supported by a fixed part (12) outside the device.
また装置（５）を旋回させるため、前記固定部（１２）
に駆動装置（１３）が設けられ、その駆動によって軸体
（１１）を回転させるようにしている。In addition, in order to rotate the device (5), the fixed part (12)
A drive device (13) is provided in the drive device, and the shaft body (11) is rotated by the drive of the drive device (13).
なお、以上のめっき金属材供給装置（５）には適当な手
段によりめっき金属材（２）が順次装入され、送りロー
ラ（６）に噛み込まれる。そして、このめっき金属材（
２）はめっきに消費される量に見合った量だけ、送りロ
ーラ（６）によって鋼帯表面に送られる。The plated metal materials (2) are sequentially charged into the plated metal material supplying device (5) by an appropriate means, and are bitten by the feed roller (6). Then, this plated metal material (
2) is sent to the surface of the steel strip by a feed roller (6) in an amount commensurate with the amount consumed for plating.
めっき金属材供給装置（５）の下流側には、めっき皮膜
の表面調整装置（１４）が設けられている。A plated film surface conditioning device (14) is provided downstream of the plated metal material supply device (5).
めっき金属材供給装置によって形成されためっき皮膜（
４）は、鋼帯の振動に起因して若干の付着量むらを生じ
る場合があり、このむらを均一化させるため、表面調整
装置（１４）により均一化処理が行なわれる。この表面
調整装置（１４）は、本実施例では超音波振動子（１５
）を備えたもの（所謂、超音波ごて）が用いられる。こ
の装置は緩衝機構を有するシリンダ装置（図示せず）等
により保持され、その振動板がめつき皮膜が形成された
鋼帯表面に軽く接触せしめられ、めっき皮膜に超音波振
動を付加することにより、めっき皮膜厚を均一化する。The plating film formed by the plating metal supply device (
Regarding 4), slight unevenness in the amount of adhesion may occur due to vibration of the steel strip, and in order to equalize this unevenness, an equalization process is performed by the surface conditioning device (14). In this embodiment, the surface conditioning device (14) is an ultrasonic transducer (15).
) (so-called ultrasonic iron) is used. This device is held by a cylinder device (not shown) having a buffer mechanism, and its diaphragm is brought into light contact with the surface of the steel strip on which the plating film is formed, and by applying ultrasonic vibration to the plating film, Make the plating film thickness uniform.
なお、上記予熱装置（７）による予熱はめっき金属材の
溶融を確実にすめために行なわれるもので、必ずしも必
須のものではない。しかし、本発明法によりめっき皮膜
厚を安定して得るには、めっき金属材が鋼帯の持っ顕熱
により溶解して生じた溶融Ｎ（３）の厚みがある程度確
保される必要がある。そして、使用するめっき金属材に
対して鋼帯（１）の顕熱が相対的に低いと、溶融層（３
）の形成が充分ではなく、安定した膜厚の確保が難しく
なるとともに、めっき金属材（２）と鋼帯（１）の固体
接触が著しくなり、金属板破損の原因となる。このよう
な問題を生じる可能性がある場合にめっき金属材（２）
を予熱し、これを鋼帯（１）に対して供給するものであ
り、これによりめっき金属材の溶融を促進させることが
できる。Note that the preheating by the preheating device (7) is performed to ensure melting of the plated metal material, and is not necessarily essential. However, in order to obtain a stable plating film thickness by the method of the present invention, it is necessary to ensure a certain thickness of molten N(3) produced by melting the plated metal material due to the sensible heat of the steel strip. If the sensible heat of the steel strip (1) is relatively low compared to the plating metal material used, the molten layer (3
) is not sufficiently formed, making it difficult to ensure a stable film thickness, and the solid contact between the plated metal material (2) and the steel strip (1) becomes significant, causing damage to the metal plate. Plated metal materials (2) in cases where such problems may occur
is preheated and supplied to the steel strip (1), thereby promoting melting of the plated metal material.
第５図ないし第８図は、めっき金属材（２）の先端側を
溶解装置により順次溶解させるようにした方法の実施例
である。5 to 8 show an embodiment of a method in which the leading end side of the plated metal material (2) is sequentially melted by a melting device.
連続めっき装置は、装入されためっき金属材を溶解し、
これを通板する銅帯に供給するめっき金属供給装置（５
′）を備えている。このめっき金属供給装置（５′）は
１通板する鋼帯に面した加熱溶解装置（１６）と、めっ
き金属材の予熱装置（１７）と、めっき金属材を所定の
供給速度で銅帯（１）方向に送給するための送りローラ
（６’）（ピンチローラ）を備えている。そして第７図
に示すようにこのめっき金属供給装置（５′）によりめ
っき金属材（２）を鋼帯方向に送給するとともに、前記
加熱溶解装置（１６）によりめっき金属材の先端側を順
次溶融させ、この溶融しためっき金属を通板する銅帯（
１）にめっき皮膜（４）として連続的に付着させるよう
にしている。Continuous plating equipment melts the charged plated metal material,
Plating metal supply device (5
’). This plated metal supply device (5') includes a heating melting device (16) facing the steel strip that passes one sheet, a preheating device (17) for the plated metal material, and a copper strip ( 1) A feed roller (6') (pinch roller) is provided for feeding in the direction. Then, as shown in FIG. 7, the plated metal supply device (5') feeds the plated metal material (2) in the direction of the steel strip, and the heating melting device (16) sequentially melts the tip side of the plated metal material. Copper strip (
1) as a plating film (4).
加熱溶解装置（１６）は、周胴部に加熱体（１８）（加
熱ヒータ等）を有する筒体であって、一端側にノズル（
１９）が形成され、そのノズル口（１９０）を通板する
鋼帯面に近接させるようにして配置されている。予熱装
置（１７）で予熱されためっき金属材（２）は、他端側
の開口から加熱溶解装置（１６）内に送り込まれ、その
先端側から順次溶解せしめられ、これによる溶融金属（
３）はノズル（１９）から鋼帯面に供給され、めっき皮
膜（４）が形成される。The heating melting device (16) is a cylindrical body having a heating body (18) (heater, etc.) on the circumferential body, and a nozzle (18) on one end side.
19) is formed, and the nozzle opening (190) thereof is arranged close to the surface of the steel strip through which the plate is passed. The plated metal material (2) preheated by the preheating device (17) is fed into the heating melting device (16) from the opening on the other end side, and is sequentially melted from the tip side, resulting in molten metal (
3) is supplied from the nozzle (19) to the steel strip surface to form a plating film (4).
このようなめっき金属供給装置（５′）は、その幅方向
中心の鋼帯面と直交する軸を支点として旋回可能に構成
されている。なお、その旋回機構の具体的構成は前記実
施例と同じであるので説明は省略する。Such a plated metal supply device (5') is configured to be able to rotate about an axis that is perpendicular to the steel strip surface at the center in the width direction as a fulcrum. Note that the specific configuration of the turning mechanism is the same as that of the previous embodiment, so a description thereof will be omitted.
また、表面調整装置（１４）、送りローラ（６′）、め
っき金属供給装置（５′）へのめっき金属材の装入手段
等の構成は前記実施例と同様である。Further, the configurations of the surface conditioning device (14), the feed roller (6'), the means for charging the plated metal material into the plated metal supply device (5'), etc. are the same as in the previous embodiment.
なお、本実施例ではめっき金属供給装置（５′）に装入
されるめっき金属材（２）は板状のものであるが、この
めっき金属材は例えば粉体のものであってもよい。In this embodiment, the plated metal material (2) charged into the plated metal supply device (5') is in the form of a plate, but the plated metal material may also be in the form of powder, for example.
また、上記めっき装置によるめっきでは、鋼帯を常温の
ままでめっき処理することもできるが、溶融金属の急激
な凝固による板形状不良の発生等を防止するため、鋼帯
（１）を加熱装置で加熱し、この銅帯にめっきを行なう
ようにすることが好ましい。また、この予熱温度は特に
限定はないが、めっき金属材（２）の融点以上の予熱温
度とすることが特に好ましい。In addition, in plating using the above-mentioned plating equipment, the steel strip can be plated at room temperature, but in order to prevent sheet shape defects due to rapid solidification of molten metal, the steel strip (1) is plated using a heating equipment. Preferably, the copper strip is plated by heating the copper strip. Moreover, although this preheating temperature is not particularly limited, it is particularly preferable that the preheating temperature is higher than the melting point of the plated metal material (2).
以上のような本発明の装置では、めっき金属材供給装置
（５）或いはめっき金属供給装置（５′）を被めっき鋼
帯（１）の板幅に合わせて旋回させ。In the apparatus of the present invention as described above, the plated metal material supply device (5) or the plated metal supply device (5') is rotated in accordance with the width of the steel strip to be plated (1).
第２図或いは第６図に示すようにめっき金属材（２）或
いはノズル（１９）を銅帯（１）のエツジからはみ出さ
ないようにその内側に位置させる。めっき金属材（２）
或いはノズル（１９）は、板幅に応じ板幅方向に対する
角度θがＯｏ〈θ＜９０°の範囲で位置調整される。As shown in FIG. 2 or FIG. 6, the plated metal material (2) or the nozzle (19) is positioned inside the edge of the copper strip (1) so as not to protrude therefrom. Plated metal material (2)
Alternatively, the position of the nozzle (19) is adjusted according to the width of the plate so that the angle θ with respect to the width direction of the plate is in the range of Oo<θ<90°.
例えば、１帯に亜鉛めっきを施す場合、めっきすべき銅
帯の幅が６３０〜１２６０ｍ＋、めっき金属材たる亜鉛
板のサイズが３０１ＴＩ１１厚さＸ１２６０ｍｍ幅であ
るとすると、上記θの調整範囲はＯ°〜６０°となり、
この条件でめっき付着：ｆｆｉ：４０〜８０ｇ／ｒｎ’
程度の溶融めっきが可能である。For example, when galvanizing one strip, if the width of the copper strip to be plated is 630 to 1260 m + and the size of the zinc plate that is the plating metal material is 301 TI 11 thickness x 1260 mm width, the adjustment range of the above θ is O° ~60°,
Plating adhesion under these conditions: ffi: 40-80g/rn'
It is possible to perform hot-dip plating to a certain extent.
なお、上記装置（５） （５’ ）の旋回駆動は、邪動
装置（１３）によって行なわれ、装置（５）（５’）は
ガイドレール（９）にガイドされつつ軸体（１１）を中
心に旋回する。The turning drive of the above-mentioned devices (5) (5') is performed by a swinging device (13), and the devices (5) (5') rotate the shaft body (11) while being guided by the guide rail (9). Rotate around the center.
本発明装置によるめっき法は、種々の金属めっきまたは
合金めっき（例えば、Ｚｎめっき、Ｚｎ−Ａｆｉめっき
等）に適用できる。また１本発明装置により鋼帯両面め
っきを行なう場合、その各めっきは必ずしもライン方向
の同じ位置で行なう必要はない。また、本発明では、銅
帯（１）を水平方向以外に走行させて行なうことも可能
であり、例えば垂直方向に走行させる形式とすることが
できる。そして、この垂直ラインの場合、走行方向は上
下いずれの方向でもよい。The plating method using the apparatus of the present invention can be applied to various metal platings or alloy platings (for example, Zn plating, Zn-Afi plating, etc.). Furthermore, when double-sided plating of a steel strip is performed using the apparatus of the present invention, each plating need not necessarily be performed at the same position in the line direction. Furthermore, in the present invention, it is also possible to run the copper strip (1) in a direction other than horizontally, for example, in a vertical direction. In the case of this vertical line, the running direction may be either up or down.
以上述べた本発明によれば、固体のめっき金属材を通板
する金属板の顕熱或いは金属板に面した溶解装置により
、金属板面上またはその近傍でめっき目付分だけ溶融さ
せ、これをめっき皮膜として金属板に付着させるため、
溶融金属浴を全く必要とすることなく金属板の溶融金属
めっきを行なうことができ、溶融金属浴使用に起因した
従来の問題を総て解消することができ、しかも固体のめ
っき金属材の送給速度のコントロールにより、めっき付
着量のコントロールも高精度に行うことができる。加え
て、めっき金属材供給装置或いはめっき金属供給装置を
旋回可能としたので、板幅変更に伴うめっき幅変更を生
産能率を低下させることなく迅速に行なうことができる
。According to the present invention described above, solid plated metal material is melted by the plating area on or near the surface of the metal plate using sensible heat of the metal plate passing through or by a melting device facing the metal plate. In order to attach it to the metal plate as a plating film,
It is possible to perform hot-dip metal plating of metal plates without the need for a molten metal bath at all, eliminating all the conventional problems caused by the use of a molten metal bath, and in addition, it is possible to feed a solid plated metal material. By controlling the speed, the amount of plating deposited can also be controlled with high precision. In addition, since the plated metal material supply device or the plated metal supply device is made rotatable, the plating width can be changed rapidly without reducing production efficiency.
第１図ないし第４図は本願第１の発明の一実施例を示す
もので、第１図は模式的な斜視図、第２図はめっき金属
材によるめっき状況を平面的に示す模式図、第３図は具
体的構造を示す斜視図、第４図はめっき原理を示す模式
図である。
第５図ないし第８図は本願第２の発明の一実施例を示す
もので、第５図は模式的な斜視図、第６図はめっき金属
材によるめっき状況を平面的に示す模式図、第７図は具
体的構造を示す斜視図、第８図はめっきＭ理を示す模式
図である。
図において、（５）はめっき金属材供給装置、（５′）
はめっき金属供給装置、 （６）（６’）は送りローラ
、（７）は予熱装置、（９）はガイドレール、（１０）
はガイドロール、（１１）は軸体、（１３）は酩動装置
、（１４）は表面調整装置、（１６）は加熱溶解装置、
（１７）は予熱装置、（１９）はノズルである。
第１図
第２図
第 ４ 図
第 ７ 図
第５図
Φ
需６図Figures 1 to 4 show an embodiment of the first invention of the present application, in which Figure 1 is a schematic perspective view, Figure 2 is a schematic diagram showing a planar state of plating with a plated metal material, FIG. 3 is a perspective view showing a specific structure, and FIG. 4 is a schematic diagram showing the plating principle. 5 to 8 show an embodiment of the second invention of the present application, in which FIG. 5 is a schematic perspective view, and FIG. 6 is a schematic diagram showing a planar state of plating with a plated metal material, FIG. 7 is a perspective view showing a specific structure, and FIG. 8 is a schematic diagram showing the plating process. In the figure, (5) is a plating metal material supply device, (5')
Plating metal supply device, (6) (6') is a feed roller, (7) is a preheating device, (9) is a guide rail, (10)
is a guide roll, (11) is a shaft body, (13) is a driving device, (14) is a surface conditioning device, (16) is a heating melting device,
(17) is a preheating device, and (19) is a nozzle. Figure 1 Figure 2 Figure 4 Figure 7 Figure 5 Φ Demand Figure 6
Claims (2)
金属板の表面にめっき金属材を送給するためのめっき金
属材供給装置を備え、送給されためっき金属材を金属板
に接触させることにより溶融させ、溶融しためっき金属
を通板する金属板にめっき皮膜として連続的に付着させ
るようにした連続めっき装置であって、前記めっき金属
材供給装置を通板する金属板面と直交する軸を中心に旋
回可能に構成してなる金属板の連続めっき装置。(1) Equipped with a plated metal material supply device for feeding the plated metal material onto the surface of the metal plate heated to a temperature higher than the melting point of the plated metal to be passed, and the plated metal material being fed comes into contact with the metal plate. A continuous plating device that melts the molten plated metal by melting and continuously deposits the plated film as a plating film on the metal plate through which the plated metal is passed, the plated metal material supplying device being orthogonal to the surface of the metal plate through which the plated metal is passed. Continuous plating equipment for metal plates that is configured to be able to rotate around an axis.
装置を有し、めっき金属材を金属板方向に送給するとと
もに、前記加熱溶解装置によりめっき金属材の先端側を
順次溶融させるめっき金属供給装置を備え、溶融しため
っき金属を通板する金属板にめっき皮膜として連続的に
付着させるようにした連続めっき装置であって、前記め
っき金属供給装置を通板する金属板面と直交する軸を中
心に旋回可能に構成してなる金属板の連続めっき装置。(2) A heating melting device for plating metal material is provided facing the metal plate to be passed, and the plating metal material is fed toward the metal plate, and the tip side of the plating metal material is sequentially melted by the heating melting device. A continuous plating apparatus is equipped with a plated metal supply device to continuously apply molten plated metal as a plating film to a metal plate through which the plated metal is passed, the plated metal supply device Continuous metal plate plating equipment configured to be able to rotate around orthogonal axes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10457788A JPH01275777A (en) | 1988-04-27 | 1988-04-27 | Apparatus for continuously plating metallic sheet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10457788A JPH01275777A (en) | 1988-04-27 | 1988-04-27 | Apparatus for continuously plating metallic sheet |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01275777A true JPH01275777A (en) | 1989-11-06 |
Family
ID=14384290
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10457788A Pending JPH01275777A (en) | 1988-04-27 | 1988-04-27 | Apparatus for continuously plating metallic sheet |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01275777A (en) |
-
1988
- 1988-04-27 JP JP10457788A patent/JPH01275777A/en active Pending
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