JPH01274447A - Wafer transporting case - Google Patents
Wafer transporting caseInfo
- Publication number
- JPH01274447A JPH01274447A JP63103473A JP10347388A JPH01274447A JP H01274447 A JPH01274447 A JP H01274447A JP 63103473 A JP63103473 A JP 63103473A JP 10347388 A JP10347388 A JP 10347388A JP H01274447 A JPH01274447 A JP H01274447A
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- wafers
- lid
- case
- basket
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 235000012431 wafers Nutrition 0.000 claims abstract description 54
- 230000007246 mechanism Effects 0.000 claims abstract description 13
- 230000000694 effects Effects 0.000 abstract description 5
- 238000011109 contamination Methods 0.000 abstract description 4
- 230000015556 catabolic process Effects 0.000 abstract 1
- 239000002689 soil Substances 0.000 description 4
- 240000005343 Azadirachta indica Species 0.000 description 3
- 235000013500 Melia azadirachta Nutrition 0.000 description 3
- 229910000831 Steel Inorganic materials 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
Landscapes
- Packaging Frangible Articles (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、半導体ウェーハを輸送する際に損壊および汚
染から保護するウェーハ輸送用ケースに関するものであ
る。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a wafer transport case that protects semiconductor wafers from damage and contamination during transport.
半導体ウェーハは、片面が鏡面研磨された状態でケース
に収納されて輸送される。輸送用ケースは、輸送中の振
動等によってウェーハが損壊されない構造でなければな
らない。また、ウェーハの鏡面がケースに接触すると、
ケースを構成しているプラスチック材料の摩耗粉（パー
ティクル）等により汚染されるので、無接触の状態で保
持されなければならない。Semiconductor wafers are transported in a case with one side mirror-polished. The transport case must have a structure that will not damage the wafer due to vibrations during transport. Also, when the mirror surface of the wafer comes into contact with the case,
The case must be maintained in a non-contact state as it will be contaminated by abrasion powder (particles) from the plastic material that makes up the case.
従来のウェーハ輸送用ケースとして、多数枚のウェーハ
を平行に立てた状態でかごに収容し、該がこを箱に収容
して蓋をする形式のものが使用されている。かごの側壁
の両内面には複数の隔置リブが対向して設けられていて
、各ウェーハが位置決めされ、蓋の内面にはウェーハ押
さえが設けられていて、蓋をした状態で、各ウェーハが
上下左右に遊動しないように、また隔置リブに接触しな
いように支持される。A conventional wafer transport case is one in which a large number of wafers are housed in a parallel standing state in a basket, and the basket is housed in a box and covered with a lid. A plurality of spacing ribs are provided facing each other on both inner surfaces of the side walls of the basket to position each wafer, and a wafer retainer is provided on the inner surface of the lid so that each wafer can be placed in a position with the lid closed. It is supported so that it does not move vertically and horizontally, and so that it does not come into contact with the spacing ribs.
ウェーハ押さえには、多数のウェーハを同時に支持する
鋸状の連続式のものと、個々に押える櫛状の非連続式の
ものがある。連続式のものを使用した場合、ウェーハの
収納枚数が少ないときは、押さえが各ウェーハに均一に
かからなくて、輸送中の振動等によりウェーハが遊動し
て損壊されたり、鏡面が汚染されたりするおそれがある
のに対し、非連続式の場合は、個々に押さえが働くので
うニームの押さえ効果が優れている。There are two types of wafer presses: a saw-shaped continuous type that supports a large number of wafers at the same time, and a comb-shaped non-continuous type that holds wafers individually. When using a continuous type, when the number of wafers stored is small, the presser may not be applied evenly to each wafer, and the wafers may move and be damaged due to vibrations during transportation, or the mirror surface may become contaminated. On the other hand, in the case of a discontinuous type, the pressure is applied individually, so the effect of holding the neem is excellent.
従来のウェーハ輸送用ケースにおいて、蓋の内面に非連
続式のウェーハ押さえを設けた場合、蓋をするときの位
置決めの問題等により、ウェーハがウェーハ押さえの間
隙に挟まって、支持効果が得られないという問題がある
。In conventional wafer transport cases, when discontinuous wafer holders are provided on the inner surface of the lid, the wafers get caught in the gap between the wafer holders due to positioning problems when closing the lid, resulting in no support effect. There is a problem.
本発明は、ウェーハ輸送用ケースにおいて、つニームを
ケース内に確実に支持させることにより、輸送中のウェ
ーハを汚染および損壊から保護することを目的とする。SUMMARY OF THE INVENTION The object of the present invention is to protect wafers from contamination and damage during transport by ensuring that the neem is supported within the case in a wafer transport case.
本発明の具体例を図面により説明する。本発明のウェー
ハ輸送用ケースは、第１図に示すように、箱上とかご１
と蓋↓で構成されている。A specific example of the present invention will be explained with reference to the drawings. As shown in FIG.
It consists of a lid and a lid↓.
第１図（ｂｌに示すように、かご１の上面および底面２
１が開放され、対向する一対の側壁２２．２３が底面２
１側で内方に向けて湾曲しており、側壁２２．２３の左
右周端は端壁２４，２５で連結され、側壁２２．２３の
側内面には複数の隔置リブ２６．２７が対向して設けら
れ、側壁２２．２３の底面２１側の終焉部に可撓性支持
機構２８．２９が設けられている。可撓性支持機構２８
．２９は隔置リブ２６．２７の間隙のそれぞれに、互い
に非連続に設けられている。Figure 1 (as shown in bl, the top surface and bottom surface 2 of the car 1
1 is opened, and a pair of opposing side walls 22 and 23 are opened to the bottom surface 2.
The left and right peripheral ends of the side wall 22.23 are connected by end walls 24 and 25, and a plurality of spaced apart ribs 26.27 are arranged on the inner surface of the side wall 22.23. A flexible support mechanism 28.29 is provided at the end of the side wall 22.23 on the side of the bottom surface 21. Flexible support mechanism 28
．． 29 are disposed discontinuously in each of the gaps between the spacing ribs 26 and 27.
ウェーハは、第１図（ｂ）に示すかご１の開放された上
部から、側壁２２．２３の側内面に対向して設けられた
隔置リブ２６，２７の各間隙に挿入され、可撓性支持機
構２８．２９で支持される。なお、かご主の一方の端壁
２５は、ウェーハを自動機あるいは真空ビンセットで取
り出すために開放されており、割り出しバー３０が中間
部に延在している。The wafers are inserted from the open top of the cage 1 shown in FIG. It is supported by support mechanisms 28, 29. Note that one end wall 25 of the car main is open for taking out wafers with an automatic machine or a vacuum bin set, and an indexing bar 30 extends in the middle.
ウェーハを支持したかご叢は、第１図（ａｌに示すガイ
ド１１に誘導されて箱上に装入され、第１図（Ｃ１の葺
土が被せられ、係合凸部４３．４４が係合凹部１２，１
３に係合し、かごＩは、箱上内のガイド１１とＩＩ４内
の押さえ具４１によって固定される。The basket cluster supporting the wafers is guided by the guide 11 shown in FIG. Recessed portion 12,1
3, and the car I is fixed by the guide 11 inside the box and the retainer 41 inside II4.
ウェーハＷを支持したかご叉を箱上に収容し葺土をした
状態を示すと、第２図（第１図ら）のＡ−Ａ視に相当す
る一部断面図）のように、ウェーハＷは、可撓性支持機
構２８．２９ （２９は図示されない）とｌｉＪ内のウ
ェーハ押さえ４２によって上下方向に固定される。When the cage supporting the wafers W is housed in the box and covered with soil, the wafers W are shown as shown in FIG. , are fixed in the vertical direction by flexible support mechanisms 28, 29 (29 is not shown) and a wafer holder 42 in the liJ.
可撓性支持機構２８．２９は側壁２２．２３の底面側の
終焉部に設けられているので、装入されたウェーハＷは
非連続に設けられた各可撓性支持機構２８の間隙に挾ま
ることなく確実に支持される。また、各うニームＷは、
非連続に設けられた各可撓性支持機構２８．２９によっ
て個々に支持されるので、第２図に示すようにウェーハ
Ｗの装入されていない箇所があってもその影響を受けな
い。Since the flexible support mechanisms 28 and 29 are provided at the end of the bottom side of the side walls 22 and 23, the loaded wafers W are sandwiched between the gaps between the flexible support mechanisms 28 that are discontinuously provided. It will be supported without fail. In addition, each neem W is
Since the wafers are individually supported by the discontinuously provided flexible support mechanisms 28 and 29, even if there are locations where wafers W are not loaded, as shown in FIG. 2, the wafers are not affected.
なお、第３図に示すように、可撓性支持機構２８．２９
の溝３１を隔置リブ２６，２７の間隙の中心線上からず
らせておくと、蓋↓を装着しない状態で、ウェーハＷを
常に一定の方向に傾斜させることができるので、ウェー
ハＷの出し入れの際にも鏡面が隔置リブ２６，２７と接
触することが防止される。この効果は、ウェーハＷを傾
斜させたい側に隔置リブ２６，２７を傾斜させておくと
、より確実に発揮される。したがって、このような構造
のかご主を使用すると、ウェーハＷを処理する過程にお
いて、Ｍ土を装着しない状態で、あるいはかご１を節上
から取り出した状態で搬送する際にも、ウェーハＷの鏡
面を無接触状態に保持することができる。In addition, as shown in FIG. 3, flexible support mechanisms 28 and 29
If the groove 31 is shifted from the center line of the gap between the spacing ribs 26 and 27, the wafer W can always be tilted in the same direction without the lid ↓ attached, so when loading and unloading the wafer W, Also, the mirror surface is prevented from coming into contact with the spacing ribs 26, 27. This effect can be more reliably achieved by tilting the spacing ribs 26 and 27 toward the side on which the wafer W is desired to be tilted. Therefore, when using a car main structure like this, the mirror surface of the wafers W can be maintained during the process of processing the wafers W, even when the wafers W are transported without M soil attached or when the car 1 is taken out from the top. can be maintained in a non-contact state.
本発明のウェーハ輸送用ケースを使用することにより、
ウェーハ装入の際には各ウェーハが確実かつ容易に支持
機構にセットされ、輸送中にはケース内にウェーハの空
きがあっても、各ウェーハは個々に支持されているので
遊動することなく、損壊および汚染が確実に防止される
。By using the wafer transport case of the present invention,
When loading wafers, each wafer is securely and easily set on the support mechanism, and even if there are empty wafers in the case during transportation, each wafer is individually supported and will not move around. Damage and contamination are reliably prevented.
第１図は本発明ケースの全体構造を示す図、第２図およ
び第３図は本発明ケースの一部断面を示す図である。
土：箱、１１ニガイド、１２，１３：係合凹部、ｉ：か
ご、２１：底面、２２，２３：側壁、２４゜２５：端壁
、２６，２７：隔置リプ、２８，２９：可撓性支持機構
、３０：割り出しバー、３１：溝、土：蓋、４１：押さ
え具、 ４２：ウェーハ押さえ、４３．４４：保合凸部
。
特許出願人 新日本製鐵株弐會社他１名ｉ！１図
箱Ｊ
かご２
（ｂ）
蓋４
グ
ＣＣ）FIG. 1 is a diagram showing the overall structure of the case of the present invention, and FIGS. 2 and 3 are diagrams showing a partial cross section of the case of the present invention. Soil: box, 11 guide, 12, 13: engaging recess, i: basket, 21: bottom, 22, 23: side wall, 24° 25: end wall, 26, 27: spaced lip, 28, 29: flexible 30: index bar, 31: groove, soil: lid, 41: presser, 42: wafer presser, 43.44: retaining convex portion. Patent applicant: Nippon Steel Corporation, Nippon Steel Co., Ltd. and one other person i! Figure 1 Box J Basket 2 (b) Lid 4 Gu CC)
Claims (1)
で構成され、該かごの上面および底面が開放され、対向
する一対の側壁が該底面側で内方に向けて湾曲しており
、該側壁の左右両端は端壁で連結され、該側壁の両内面
には複数の隔置リブが対向して設けられ、該側壁の前記
底面側の終焉部に非連続の可撓性支持機構が設けられて
いることを特徴とするウェーハ輸送用ケース。It consists of a basket for holding wafers, a box for housing the basket, and a lid, the top and bottom surfaces of the basket are open, a pair of opposing side walls are curved inward on the bottom side, and The left and right ends of the side wall are connected by an end wall, a plurality of spacing ribs are provided facing each other on both inner surfaces of the side wall, and a discontinuous flexible support mechanism is provided at the end of the bottom surface side of the side wall. A wafer transport case characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63103473A JPH01274447A (en) | 1988-04-26 | 1988-04-26 | Wafer transporting case |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63103473A JPH01274447A (en) | 1988-04-26 | 1988-04-26 | Wafer transporting case |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01274447A true JPH01274447A (en) | 1989-11-02 |
| JPH0572106B2 JPH0572106B2 (en) | 1993-10-08 |
Family
ID=14354977
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63103473A Granted JPH01274447A (en) | 1988-04-26 | 1988-04-26 | Wafer transporting case |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01274447A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07307381A (en) * | 1989-03-31 | 1995-11-21 | Empak Inc | Package for semiconductor wafer, disk or substrate |
| JP2007227941A (en) * | 1998-07-10 | 2007-09-06 | Entegris Inc | Cushioned wafer container |
-
1988
- 1988-04-26 JP JP63103473A patent/JPH01274447A/en active Granted
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07307381A (en) * | 1989-03-31 | 1995-11-21 | Empak Inc | Package for semiconductor wafer, disk or substrate |
| JP2007227941A (en) * | 1998-07-10 | 2007-09-06 | Entegris Inc | Cushioned wafer container |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0572106B2 (en) | 1993-10-08 |
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