JPH01274308A - Conductive paste composite - Google Patents
Conductive paste compositeInfo
- Publication number
- JPH01274308A JPH01274308A JP10227288A JP10227288A JPH01274308A JP H01274308 A JPH01274308 A JP H01274308A JP 10227288 A JP10227288 A JP 10227288A JP 10227288 A JP10227288 A JP 10227288A JP H01274308 A JPH01274308 A JP H01274308A
- Authority
- JP
- Japan
- Prior art keywords
- powder
- conductive paste
- printing
- resin
- vehicle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002131 composite material Substances 0.000 title 1
- 239000000843 powder Substances 0.000 claims abstract description 24
- 229910052707 ruthenium Inorganic materials 0.000 claims abstract description 14
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims abstract description 12
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 claims abstract description 12
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 12
- 238000007639 printing Methods 0.000 claims abstract description 11
- 239000004020 conductor Substances 0.000 claims abstract description 7
- 239000000203 mixture Substances 0.000 claims description 44
- 238000010304 firing Methods 0.000 abstract description 11
- 239000011347 resin Substances 0.000 abstract description 9
- 229920005989 resin Polymers 0.000 abstract description 9
- 238000002156 mixing Methods 0.000 abstract description 5
- 239000000020 Nitrocellulose Substances 0.000 abstract description 3
- 229920001220 nitrocellulos Polymers 0.000 abstract description 3
- 239000001856 Ethyl cellulose Substances 0.000 abstract description 2
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 abstract description 2
- WUOACPNHFRMFPN-UHFFFAOYSA-N alpha-terpineol Chemical compound CC1=CCC(C(C)(C)O)CC1 WUOACPNHFRMFPN-UHFFFAOYSA-N 0.000 abstract description 2
- 238000009835 boiling Methods 0.000 abstract description 2
- SQIFACVGCPWBQZ-UHFFFAOYSA-N delta-terpineol Natural products CC(C)(O)C1CCC(=C)CC1 SQIFACVGCPWBQZ-UHFFFAOYSA-N 0.000 abstract description 2
- 229920001249 ethyl cellulose Polymers 0.000 abstract description 2
- 235000019325 ethyl cellulose Nutrition 0.000 abstract description 2
- 239000002904 solvent Substances 0.000 abstract description 2
- 229940116411 terpineol Drugs 0.000 abstract description 2
- -1 for instance Polymers 0.000 abstract 2
- AMQJEAYHLZJPGS-UHFFFAOYSA-N N-Pentanol Chemical compound CCCCCO AMQJEAYHLZJPGS-UHFFFAOYSA-N 0.000 abstract 1
- PGMYKACGEOXYJE-UHFFFAOYSA-N pentyl acetate Chemical compound CCCCCOC(C)=O PGMYKACGEOXYJE-UHFFFAOYSA-N 0.000 abstract 1
- 239000000126 substance Substances 0.000 abstract 1
- 239000000919 ceramic Substances 0.000 description 9
- 239000000758 substrate Substances 0.000 description 9
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Substances [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 6
- 238000007650 screen-printing Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052763 palladium Inorganic materials 0.000 description 3
- 229910052697 platinum Inorganic materials 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- AMWRITDGCCNYAT-UHFFFAOYSA-L hydroxy(oxo)manganese;manganese Chemical compound [Mn].O[Mn]=O.O[Mn]=O AMWRITDGCCNYAT-UHFFFAOYSA-L 0.000 description 2
- 238000004898 kneading Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- OAYXUHPQHDHDDZ-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethanol Chemical compound CCCCOCCOCCO OAYXUHPQHDHDDZ-UHFFFAOYSA-N 0.000 description 1
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 1
- 239000005751 Copper oxide Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910000416 bismuth oxide Inorganic materials 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 229910000431 copper oxide Inorganic materials 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- TYIXMATWDRGMPF-UHFFFAOYSA-N dibismuth;oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Bi+3].[Bi+3] TYIXMATWDRGMPF-UHFFFAOYSA-N 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 210000002966 serum Anatomy 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
Abstract
Description
【発明の詳細な説明】
「産業上の利用分野」
本発明は、スクリーン印刷法などによって基板に印刷さ
れて？Ｉ￥極回路等を形成する厚膜用の導電ペースト組
成物に関するものである。[Detailed Description of the Invention] "Industrial Application Field" The present invention can be printed on a substrate by a screen printing method or the like. This invention relates to a conductive paste composition for thick films forming I-electrode circuits and the like.
「従来の技術」
電子部品の高性能化に伴って、セラミックス製基板が広
く利用されている。セラミックス製基板を利用した電子
部品としては、例えばセラミックス多層基板や積層チッ
プコンデンサなどがある。"Prior Art" Ceramic substrates are being widely used as electronic components become more sophisticated. Examples of electronic components using ceramic substrates include ceramic multilayer substrates and multilayer chip capacitors.
そしてこれらの電子部品の電極回路等は導電ベーストを
スクリーン印刷することによって形成されている。Electrode circuits and the like of these electronic components are formed by screen printing a conductive base.
このように電極回路等を形成する際に用いる導電ペース
ト組成物としては、従来下記第１表に示すようなものが
提供されている。As conductive paste compositions used for forming electrode circuits and the like in this manner, those shown in Table 1 below have been conventionally provided.
以下余白
第１表
以下余白
「発明が解決しようとする課題」
ところでこれらの導電ペースト組成物は、印刷された後
に焼成されて電極回路とされるが、この導電ペースト組
成物の焼成温度が、セラミックス基板となるグリーンシ
ートの焼成温度と同程度であれば、グリーンシートの焼
成と導電ペースト組成物の焼成を同時に行うことができ
、電子部品の製造コストを低減できる。Margins below Table 1 Margins "Problems to be Solved by the Invention" By the way, these conductive paste compositions are fired after printing to form electrode circuits, but the firing temperature of this conductive paste composition is higher than that of ceramics. If the firing temperature is about the same as that of the green sheet serving as the substrate, the firing of the green sheet and the conductive paste composition can be performed simultaneously, and the manufacturing cost of electronic components can be reduced.
ところがグリーンシートの焼成温度は低温焼結セラミッ
クス製の場合でも約９５０〜１０００℃とかなり高温で
あり、このようなグリーンシートと同時焼成するには金
（Ａｕ）−白金（Ｐ ｔ）系の導電ペースト組成物を利
用せざるを得なかった。However, the firing temperature of the green sheet is quite high at approximately 950 to 1000°C even when it is made of low-temperature sintered ceramics, and in order to simultaneously fire it with such a green sheet, a gold (Au)-platinum (Pt) based conductive material is required. Paste compositions had to be used.
しかしながら、このＡｕ−ＰＬ系の導電ペースト組成物
は、高価な金属を多量に使用しているため価格が高く、
しかも比抵抗が大きいという問題があった。However, this Au-PL-based conductive paste composition is expensive because it uses a large amount of expensive metal.
Moreover, there was a problem that the specific resistance was large.
これに対して、安価で比抵抗の小さな銀（Ａｇ）系の導
電ペースト組成物は焼成温度が低く、グリーンシートと
同時焼成することができない問題が。On the other hand, silver (Ag)-based conductive paste compositions that are inexpensive and have low specific resistance have a low firing temperature and cannot be fired simultaneously with green sheets.
あった。there were.
本発明は前記事情に鑑みてなされたもので、安価で比抵
抗が小さくしかもグリーンシートと同時焼成できる程度
の高い焼成温度を有する導電ペースト組成物を提供する
ことを目的とする。The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a conductive paste composition that is inexpensive, has a low specific resistance, and has a firing temperature high enough to be fired simultaneously with a green sheet.
「課題を解決するための手段」
請求項１の導電ペースト組成物では、少なくとも銀粉末
９０〜９５重量％とルテニウム粉末５〜１０重量％とか
らなる導電体粉末と、印刷用ビヒクルとを配合すること
によって、前記目的を達成した。``Means for Solving the Problems'' The conductive paste composition of claim 1 contains a conductor powder consisting of at least 90 to 95% by weight of silver powder and 5 to 10% by weight of ruthenium powder, and a printing vehicle. In this way, the above objective was achieved.
また請求項２の導電ペースト組成物では、少なくとも銀
粉末９５重量％とルテニウム粉末１〜４重量％とパラジ
ウム粉末１〜４重量％とからなる導電体粉末と、印刷用
ビヒクルとを配合することにより、前記目的を達成した
。Further, in the conductive paste composition of claim 2, by blending a conductive powder consisting of at least 95% by weight of silver powder, 1 to 4% by weight of ruthenium powder, and 1 to 4% by weight of palladium powder, and a printing vehicle. , achieved the above objectives.
本発明の導電ペースト組成物に用いる印刷用ビヒクルと
しては各種のものを利用できるが、中でもエチルセルロ
ース樹脂、ニトロセルロース樹脂、アクリル樹脂やブチ
ラール樹脂等の樹脂が、ブチルカルピトール、ブチルカ
ルピトールアセテート、ターピネオール等の高沸点溶剤
に溶解されたものが好適に利用される。Various printing vehicles can be used as the printing vehicle used in the conductive paste composition of the present invention, among which resins such as ethyl cellulose resin, nitrocellulose resin, acrylic resin, and butyral resin are used, but among them, resins such as butyl calpitol, butyl carpitol acetate, and terpineol are used. Those dissolved in high boiling point solvents such as the following are preferably used.
また本発明の導電ペースト組成物には、必要に応じて各
種の成分が配合される。・例えばセラミックス基板に対
する密着力を得るために、酸化マンガン、酸化ビスマス
、酸化銅、酸化亜鉛等の金属酸化物の微粉末やガラスフ
リットやそれらの混合物等からなる接着材が配合される
。Furthermore, various components may be added to the conductive paste composition of the present invention as necessary. - For example, in order to obtain adhesion to a ceramic substrate, an adhesive consisting of fine powder of metal oxide such as manganese oxide, bismuth oxide, copper oxide, zinc oxide, glass frit, or a mixture thereof is blended.
このような本発明の導電ペースト組成物は、通常、まず
粉体成分をＶ型混合機等の粉体混合装置により十分混合
し、ついでこの混合物に適宜なビヒクルを加えてロール
ミルなどの混線機で混練することにより製造される。ま
たこの導電ペースト組成物の焼成には、ベルト炉やバッ
チ炉等を利用することができる。Such a conductive paste composition of the present invention is usually prepared by first thoroughly mixing the powder components using a powder mixing device such as a V-type mixer, then adding an appropriate vehicle to this mixture and mixing the powder components with a mixer such as a roll mill. Manufactured by kneading. Further, a belt furnace, a batch furnace, or the like can be used for firing this conductive paste composition.
「実施例」
下記第２表に示す組成比で銀（Ａ ｇ）、白金（Ｐ Ｌ
）、パラジウム（Ｐｄ）、ルテニウム（Ｒｕ）を配合し
て導電体粉末を各種作成した。これら導電体粉末１００
部に対して接着材としてのガラスフリットをｌ〜７部配
合し、Ｖ型混合機で十分に混合した。次にこのようにし
て得られた混合物にニトロセルロースとブヂルカルビト
ールからなるスクリーン印刷用のビヒクルを配合して３
本ロールで良く混練して各種導電ペースト組成物を得た
。"Example" Silver (A g), platinum (P L
), palladium (Pd), and ruthenium (Ru) to create various conductor powders. These conductor powders 100
1 to 7 parts of glass frit as an adhesive was added to each part, and the mixture was thoroughly mixed using a V-type mixer. Next, a screen printing vehicle consisting of nitrocellulose and butylcarbitol was added to the mixture thus obtained.
Various conductive paste compositions were obtained by thoroughly kneading with this roll.
以上のようにして得られた導電ペースト組成物をスクリ
ーン印刷に適した粘度に調整した後、低温焼結セラミッ
クス製のグリーンシート上にスクリーン印刷して乾燥し
た。つぎにこのものを１２層に重ね合わせて多層化し、
ついでこの多層セラミックス生基板を４００〜４５０℃
で脱脂した後バッチ炉で焼成した。焼成は、７５０℃、
８５０℃、９５０℃の各温度で行った。（なおグリーン
シートの焼成は９５０℃程度で行う必要がある。）この
ようにして得られた各多層基板を分解して導電ペースト
組成物が焼結されているか否かを調べた。焼成されたも
のを０１焼成されていなかったものを×として、結果を
第２表に示す。The conductive paste composition obtained as described above was adjusted to have a viscosity suitable for screen printing, and then screen printed on a green sheet made of low-temperature sintered ceramics and dried. Next, stack this material into 12 layers to make it multi-layered.
Next, this multilayer ceramic raw substrate was heated to 400 to 450°C.
After degreasing, it was fired in a batch furnace. Firing is at 750°C.
The experiments were carried out at temperatures of 850°C and 950°C. (The green sheet must be fired at about 950° C.) Each of the multilayer substrates thus obtained was disassembled to determine whether the conductive paste composition was sintered or not. The results are shown in Table 2, with 0 being fired and 0 being unfired.
また焼成されたもののうち最も高温で焼成されたものに
ついて面積抵抗値を測定した。結果を第２表に示す。さ
らにまたこの面積抵抗値と組成比の関係をＡｇ−Ｐｄ系
、Ａｇ−ＰＬ系、Ａｇ−Ｒｕ系に付いて整理し、第１図
に示ず。またＡｇ−Ｐｄ−Ｒｕ系における血清抵抗値と
組成比の関係を整理して第２図に示す。Furthermore, the area resistance value was measured for the one fired at the highest temperature among the fired ones. The results are shown in Table 2. Furthermore, the relationship between the sheet resistance value and the composition ratio is organized for the Ag-Pd system, Ag-PL system, and Ag-Ru system, and is not shown in FIG. Furthermore, the relationship between the serum resistance value and the composition ratio in the Ag-Pd-Ru system is summarized and shown in FIG.
これらの結果から、Ａｇ−Ｒｕ系およびＡｇ−Ｐｄ−ｌ
１ｕ系の導電ペースト組成物は、７５０°Ｃ〜９５０℃
の広い範囲で焼成可能であるうえ、面積抵抗ら低い値を
示すことか判明した。From these results, it is clear that Ag-Ru and Ag-Pd-l
1u type conductive paste composition is 750°C to 950°C
It has been found that it can be fired over a wide range of temperatures and also exhibits a low sheet resistance value.
ついでＡｇ−Ｒｕ系、Ａｇ−Ｐｄ系、Ａｇ−ＰＬ系の導
電ペースト組成物の価格と組成の関係を調べた。Next, the relationship between the price and composition of Ag-Ru, Ag-Pd, and Ag-PL conductive paste compositions was investigated.
評価に当たっては、銀の価格を１１白金を７０゜パラジ
ウム２０、ルテニウム１０とした。結果を第３図に示す
。この結果から、各種の導電ペースト組成物の中で、ｎ
ｕ（ルテニウム）が配合された導電ペースト組成物かか
なり安価であることが確認された。In the evaluation, the price of silver was 11, platinum, 70, palladium, 20, and ruthenium, 10. The results are shown in Figure 3. From this result, it was found that among various conductive paste compositions, n
It was confirmed that the conductive paste composition containing u (ruthenium) is quite inexpensive.
以下余白
「発明の効果」
以上説明したように、少なくとも銀粉末９０〜９５重量
％とルテニウム粉末５〜１０重量％とからなる導電体粉
末が配合された請求項１の導電ペースト組成物、および
少なくとも銀粉末９５重量％とルテニウム粉末１〜４重
量％とパラジウム粉末１〜４重量％とからなる導電体粉
末が配合された請求項２の導電ペースト組成物は、焼成
温度が高く、比抵抗が小さく、しかも安価である。``Effects of the Invention'' As explained above, the conductive paste composition according to claim 1, which contains a conductive powder consisting of at least 90 to 95% by weight of silver powder and 5 to 10% by weight of ruthenium powder, and at least The conductive paste composition according to claim 2, which contains a conductive powder consisting of 95% by weight of silver powder, 1 to 4% by weight of ruthenium powder, and 1 to 4% by weight of palladium powder, has a high firing temperature and a low specific resistance. , and is inexpensive.
従って、本発明の導電ペースト組成物によれば、セラミ
ックス基板の焼成と導電ペースト組成物の焼成を同時に
行って製造工程の簡略化を図ることができるうえ材料比
の低減を図ることができ、電子部品のコスト低減を実現
できる。しかも本発明の導電ペースト組成物によれば抵
抗の小さい電気回路を形成できるので特性の良好な電子
部品を製造することができる。Therefore, according to the conductive paste composition of the present invention, the manufacturing process can be simplified by simultaneously firing the ceramic substrate and the conductive paste composition, and the material ratio can be reduced. It is possible to reduce the cost of parts. In addition, the conductive paste composition of the present invention allows the formation of electrical circuits with low resistance, making it possible to manufacture electronic components with good characteristics.
第１図は導電ペースト組成物をなす導電性金属の組成と
面積抵抗値との関係を示すグラフ、第２図はＡｇ−Ｒｕ
−Ｐｄ系の導電性組成物の組成比と面積抵抗値との関係
を示すグラフ、第３図は導電ペースト組成−物の組成と
価格との関係を示すグラフである。Figure 1 is a graph showing the relationship between the composition of the conductive metal constituting the conductive paste composition and the sheet resistance value, and Figure 2 is a graph showing the relationship between the composition of the conductive metal constituting the conductive paste composition and the sheet resistance value.
FIG. 3 is a graph showing the relationship between the composition ratio and sheet resistance value of a Pd-based conductive composition. FIG. 3 is a graph showing the relationship between the composition and price of a conductive paste composition.
Claims (2)
ウム粉末５〜１０重量％からなる導電体粉末と、印刷用
ビヒクルとを含む導電ペースト組成物。(1) A conductive paste composition comprising a conductor powder consisting of at least 90-95% by weight of silver powder and 5-10% by weight of ruthenium powder, and a printing vehicle.
〜４重量％およびパラジウム粉末１〜４重量％とからな
る導電体粉末と、印刷用ビヒクルとを含む導電ペースト
組成物。(2) At least 95% by weight of silver powder, 1 part of ruthenium powder
A conductive paste composition comprising a conductive powder consisting of ~4% by weight and 1-4% by weight of palladium powder, and a printing vehicle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10227288A JPH01274308A (en) | 1988-04-25 | 1988-04-25 | Conductive paste composite |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10227288A JPH01274308A (en) | 1988-04-25 | 1988-04-25 | Conductive paste composite |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01274308A true JPH01274308A (en) | 1989-11-02 |
Family
ID=14322965
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10227288A Pending JPH01274308A (en) | 1988-04-25 | 1988-04-25 | Conductive paste composite |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01274308A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002197922A (en) * | 2000-12-26 | 2002-07-12 | Kyocera Corp | Conductive paste and method for manufacturing of ceramic circuit board |
-
1988
- 1988-04-25 JP JP10227288A patent/JPH01274308A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002197922A (en) * | 2000-12-26 | 2002-07-12 | Kyocera Corp | Conductive paste and method for manufacturing of ceramic circuit board |
| JP4562282B2 (en) * | 2000-12-26 | 2010-10-13 | 京セラ株式会社 | Manufacturing method of ceramic circuit board |
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