JPH01272961A - Nondestructive inspecting method for ceramic-joined body - Google Patents
Nondestructive inspecting method for ceramic-joined bodyInfo
- Publication number
- JPH01272961A JPH01272961A JP63101680A JP10168088A JPH01272961A JP H01272961 A JPH01272961 A JP H01272961A JP 63101680 A JP63101680 A JP 63101680A JP 10168088 A JP10168088 A JP 10168088A JP H01272961 A JPH01272961 A JP H01272961A
- Authority
- JP
- Japan
- Prior art keywords
- ceramic
- joined
- bonded body
- ultrasonic
- joint
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims description 13
- 239000000919 ceramic Substances 0.000 claims abstract description 53
- 230000005855 radiation Effects 0.000 claims abstract description 13
- 229910052751 metal Inorganic materials 0.000 claims description 29
- 239000002184 metal Substances 0.000 claims description 29
- 238000009659 non-destructive testing Methods 0.000 claims description 4
- 239000000463 material Substances 0.000 abstract description 13
- 230000007547 defect Effects 0.000 abstract description 8
- 229910052581 Si3N4 Inorganic materials 0.000 abstract description 4
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 abstract description 4
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 abstract description 3
- 229910052750 molybdenum Inorganic materials 0.000 abstract description 3
- 239000011733 molybdenum Substances 0.000 abstract description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 abstract description 2
- 238000005304 joining Methods 0.000 abstract description 2
- 239000010936 titanium Substances 0.000 abstract description 2
- 229910052719 titanium Inorganic materials 0.000 abstract description 2
- 238000005476 soldering Methods 0.000 abstract 1
- 238000002591 computed tomography Methods 0.000 description 17
- 238000005219 brazing Methods 0.000 description 12
- 238000009826 distribution Methods 0.000 description 12
- 239000000945 filler Substances 0.000 description 8
- 238000001514 detection method Methods 0.000 description 5
- 238000007689 inspection Methods 0.000 description 5
- 238000010521 absorption reaction Methods 0.000 description 4
- 230000001066 destructive effect Effects 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000005204 segregation Methods 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- 230000003139 buffering effect Effects 0.000 description 2
- 238000002247 constant time method Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000000523 sample Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 239000010937 tungsten Substances 0.000 description 2
- 238000002835 absorbance Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 229910052681 coesite Inorganic materials 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 229910052906 cristobalite Inorganic materials 0.000 description 1
- 238000009658 destructive testing Methods 0.000 description 1
- 238000002592 echocardiography Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000009828 non-uniform distribution Methods 0.000 description 1
- 238000012958 reprocessing Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 229910052682 stishovite Inorganic materials 0.000 description 1
- 229910052905 tridymite Inorganic materials 0.000 description 1
Landscapes
- Analysing Materials By The Use Of Radiation (AREA)
- Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
- Ultra Sonic Daignosis Equipment (AREA)
Abstract
Description
【発明の詳細な説明】
［発明の］」的］
（産業上の利用分野）
本発明は、セラミックス部材と金属部材あるいはセラミ
ックス部材とセラミックス部材とを接合一体化したセラ
ミックス接合体の接合状態を非破壊で検査する方法に関
する。[Detailed Description of the Invention] [Objective of the Invention] (Industrial Application Field) The present invention is directed to non-destructive bonding of a ceramic bonded body in which a ceramic member and a metal member or a ceramic member and a ceramic member are integrated. Concerning methods of destructive testing.
（従来の技術）
近年、セラミックス部材の耐熱性、耐食性、耐摩耗性等
の各種特性を牛かし、かつセラミックス部材の脆くて信
頼性に欠けるという欠点を補うためにセラミックス部材
に金属部材をたとえば適当なろう材を用いて接合したり
、また同様にセラミックス部材とセラミックス部材とを
接合して利用するということがよく行われている。(Prior Art) In recent years, in order to enhance the various properties of ceramic members such as heat resistance, corrosion resistance, and wear resistance, and to compensate for the drawbacks of ceramic members such as brittleness and lack of reliability, metal members have been added to ceramic members, for example. It is common practice to use a suitable brazing material for joining, or to join ceramic members together.
ところで、このようなセラミックス−金属接合体やセラ
ミックス−セラミックス接合体は、その作製後に接合の
良否を判定するために接合部の非破壊検査が必要とされ
ている。このようなセラミックス接合体の非破壊検査は
、接合体の一端より超音波を送り込み、反対側の端部に
てこの超音波の受信時の出力の差を測定したり、または
反射波の出力時間の差や検出エコーの大きさを測定する
ことによって接合不良による空隙やクラック等を検出す
る超音波探傷法や、セラミックス接合体にＸ線を当てて
、その吸収程度の差により不良を検出するＸ線透過検査
法等により行われている。Incidentally, such a ceramic-metal bonded body or a ceramic-ceramic bonded body requires non-destructive testing of the bonded portion after fabrication in order to determine the quality of the bond. Non-destructive testing of such ceramic bonded bodies involves sending ultrasonic waves from one end of the bonded body and measuring the difference in output when the ultrasonic waves are received at the opposite end, or measuring the output time of reflected waves. The ultrasonic flaw detection method detects voids and cracks caused by poor bonding by measuring the difference in the amount of radiation and the size of detected echoes, and the This is done using the radiographic inspection method, etc.
（発明が解決しようとする課題）
しかしなから、超音波探傷法やＸ線透過法といった従来
の方法では、単純な形状の接合体には適用可能であるが
、複雑形状の場合、超音波やＸ線の入反射特性か複雑と
なって欠陥の検出を行うことか困難であった。(Problem to be solved by the invention) However, although conventional methods such as ultrasonic flaw detection and The incidence and reflection characteristics of X-rays are complicated, making it difficult to detect defects.
また、接合部におけるろう材分布や接合界面の健全性と
いったような接合部内部の状態まで正確に把握しうるこ
とは困難であった。Furthermore, it has been difficult to accurately grasp the internal state of the joint, such as the brazing material distribution in the joint and the soundness of the joint interface.
これは、超音波探傷法ではクラック程度の単純な欠陥の
検出しかできず、一方Ｘ線透過法ではろう４ＡのＸ線吸
収係数かセラミックス部材や金属部材より小さかったり
、あるいはろう材中の構成成分の組合わせ方により接合
状態を示す像が得られなかったり、また得られた像が不
鮮明であったりするため使用範囲か限定されるという問
題があるためである。This is because the ultrasonic flaw detection method can only detect simple defects such as cracks, while the X-ray transmission method detects that the X-ray absorption coefficient of solder 4A is smaller than that of ceramic members or metal members, or that the constituent components in the filler metal This is because, depending on the combination of the two, it may not be possible to obtain an image showing the bonded state, or the obtained image may be unclear, resulting in a problem that the range of use is limited.
本発明はこのような従来技術の課題に対処するためにな
されたもので、多角的に接合状態を検査して接合界面近
傍のクラックや接合部内部の接合体強度に影響を与える
、例えばろう材分布、ろう祠の偏析、剥離部等を正確に
判定することのできるセラミックス接合体の非破壊検査
方法を提供することを目的とする。The present invention has been made to address the problems of the prior art, and it inspects the joint condition from multiple angles to check for cracks near the joint interface and for problems that affect the strength of the joint inside the joint, such as brazing filler metal. The object of the present invention is to provide a non-destructive inspection method for a ceramic bonded body that can accurately determine distribution, segregation of solder deposits, peeled parts, etc.
［発明の構成］
（課題を解決するための手段）
本発明のセラミックス接合体の非破壊検査方法は、セラ
ミックス部材と金属部材あるいはセラミックス部材とセ
ラミックス部材とを接合一体化してなるセラミックス接
合体の接合状態を検査するにあたり、前記セラミックス
接合体の接合面に対して平行方向に超音波Ｃスキャンを
行い前記セラミックス接合体の接合部を平面的に画像化
するとともに、前記セラミックス接合体の少なくとも接
合部近傍を放射線ＣＴにより断層状に画像化し、これら
超音波Ｃスキャンおよび放射線ＣＴによる画像情報から
多角的に接合状態を検査することを特徴としている。[Structure of the Invention] (Means for Solving the Problems) The non-destructive testing method for a ceramic bonded body of the present invention is a method for bonding a ceramic bonded body formed by bonding and integrating a ceramic member and a metal member or a ceramic member and a ceramic member. In inspecting the condition, ultrasonic C-scanning is performed in a direction parallel to the bonding surface of the ceramic bonded body to image the bonded portion of the ceramic bonded body in a two-dimensional manner, and at least the vicinity of the bonded portion of the ceramic bonded body is imaged in a two-dimensional manner. It is characterized in that it is imaged in tomographic form using radiation CT, and the bonding state is inspected from multiple angles based on the image information obtained from these ultrasonic C scans and radiation CT.
本発明における超音波Ｃスキャンによる検出は、セラミ
ックス接合体の接合面に対して平行な一端面上を探触子
を走査させて超音波を送り込み、この透過または反射超
音波強度の平面分布を、コンピュータ支援により画像処
理することによって、探触点下における状態を平面的に
輝点または暗点、さらには透過・反射超音波強度を階調
化のうえ擬似カラーにて直接ＣＲＴ上に描かせるか、あ
るいは記録紙上に描かせて行う。使用する超音波の周波
数は、セラミックス接合体を構成する素材等によって適
宜設定されるものであるが、５〜５０８Ｈ２程度が好ま
しい。Detection by ultrasonic C-scanning in the present invention involves sending an ultrasonic wave by scanning a probe over one end surface parallel to the bonding surface of the ceramic bonded body, and measuring the planar distribution of the transmitted or reflected ultrasonic intensity. By computer-assisted image processing, the state below the probe point can be drawn two-dimensionally as bright spots or dark spots, and furthermore, the intensity of transmitted and reflected ultrasonic waves can be gradated and drawn directly on the CRT in pseudo color. , or by drawing it on recording paper. The frequency of the ultrasonic waves to be used is appropriately set depending on the material constituting the ceramic bonded body, and is preferably about 5 to 508H2.
また、本発明における放射線ＣＴ（コンピユーテッドト
モグラフィ）による検出は、セラミックス接合体の少な
くとも接合部近傍の全周方向から一定厚さの透過放射線
データを収集し、この透過放射線強度を前述の超音波Ｃ
スキャンと同様に画像処理して断層画像に再構成して行
う。さらに、各断層画像データを再処理して断面変換処
理で立体構築することにより、接合部に対して垂直方向
の画像を得ることも可能である。この放射線ＣＴは、断
層画像から異物やクラ・ツク等の欠陥の検出やろう４Ａ
分布やろう材の偏析等の検■の他に、例えば得られたデ
ータの単位体積当りのＸ線吸収度（ＣＴ値）から密度測
定や物質同定を行うことも可能である。Furthermore, in the detection using radiation CT (computed tomography) in the present invention, transmitted radiation data of a constant thickness is collected from the entire circumference direction at least near the joint of the ceramic bonded body, and the transmitted radiation intensity is determined to exceed the above-mentioned range. Sound wave C
Similar to a scan, the image is processed and reconstructed into a tomographic image. Furthermore, by reprocessing each tomographic image data and constructing a three-dimensional image using cross-sectional conversion processing, it is also possible to obtain an image in a direction perpendicular to the junction. This radiation CT can detect defects such as foreign objects and cracks from tomographic images.
In addition to checking the distribution and segregation of the brazing filler metal, it is also possible to measure the density and identify substances from the X-ray absorbance per unit volume (CT value) of the obtained data, for example.
この放射線ＣＴ法に使用する放射線としては、Ｘ線か一
般的であるが、セラミ・ノクス接合体を１１へ１成する
素材かＸ線吸収度の大きい、例えばＺｒＯ２、Ｃｒ２０
３ 、Ｐｅ等の場合には高出力Ｘ線やγ線を使用するこ
とにより同様に行える。なお、Ｘ線の適用可能なセラミ
ックス部材としては、５ｉ３０４、ＳｉＣ，Ａｎ２０３
、ＳｉＯ２等容種のものが挙げられる。The radiation used in this radiation CT method is generally X-rays, but it is also possible to use materials that form the ceramic-nox composite or materials with high X-ray absorption, such as ZrO2 and Cr20.
In the case of 3, Pe, etc., the same method can be performed by using high-power X-rays or γ-rays. Note that ceramic members to which X-rays can be applied include 5i304, SiC, and An203.
, SiO2 equivalent type.
（作 用）
そして、上記手段を用いることにより、検査対象となる
セラミックス接合体の接合部を超音波Ｃスキャン法によ
る平面的な画像によれば、超音波の透過・反射の不連続
性、すなわち接合界面の連続性による接合強度分布やろ
う材分布等の接合部の平面内分布が明確に検圧できる。(Function) By using the above means, it is possible to detect discontinuities in the transmission and reflection of ultrasonic waves by using a flat image of the bonded part of the ceramic bonded body to be inspected using the ultrasonic C-scan method. The in-plane distribution of the joint, such as the joint strength distribution and brazing filler metal distribution due to the continuity of the joint interface, can be clearly measured.
なお、超音波透過・反射分解能の調整により、接合部近
傍の被接合物であるセラミックス部材内に生じるクラッ
ク等を検出し、クラックの面分布を画像化したり、セラ
ミックス接合体の接合面に対する垂直方向の距離をＢス
フ−１表示で表すことも可能である。In addition, by adjusting the ultrasonic transmission/reflection resolution, it is possible to detect cracks that occur in ceramic members that are objects to be joined near the joint, and to visualize the surface distribution of cracks, and to visualize the surface distribution of the cracks in the direction perpendicular to the joint surface of the ceramic joint. It is also possible to express the distance in B-suf-1 notation.
また、セラミックス接合体の接合部近傍の放射線ＣＴ法
による断層画像によれば、接合界面近傍で生じるセラミ
ックス部材側の内部クラックの検出や、例えばＸ線吸収
度の大きい元素を含むろうＨの分布や偏析、異物の混入
等が検出できる。Furthermore, according to tomographic images obtained by radiation CT near the joints of ceramic joints, it is possible to detect internal cracks on the ceramic member side that occur near the joint interface, and to detect, for example, the distribution of wax H containing elements with high X-ray absorption. Segregation, contamination of foreign substances, etc. can be detected.
そして、この両者の情報を多角的に判定することにより
、接合体強度の推定も可能となる。By evaluating both of these pieces of information from multiple angles, it is also possible to estimate the strength of the bonded body.
（実施例） 次に、本発明の実施例について説明する。(Example) Next, examples of the present invention will be described.
実施例１
第１図に示すように、外径７５＋ｎｍ Ｘ厚さ ５ｍｍ
の円板状のモリブデンからなる金属部１’ １と、一方
の面に金属部材１の挿入用四部を有する外径９０ｍｍＸ
厚さ２０ｍｍのほぼ円板状の窒化ケイ素を主成分とする
セラミックス部材２とを、セラミックス部材２の四部に
金属部材１を挿入し、これらの間に厚さ１ｍｍのチタン
からなる応力緩衝材３を介在させ、さらに各層の間に２
重量％Ｔｉ−７１重量％Ａｇ−２７重量％Ｃｕろうから
なるろう材４を介在させて真空中、８４０°Ｃの温度で
６分間加熱して両者を接合してセラミックス−金属接合
体を作製した。Example 1 As shown in Fig. 1, outer diameter 75+nm x thickness 5mm
A metal part 1' made of disk-shaped molybdenum and having four parts for inserting the metal member 1 on one side, with an outer diameter of 90 mm
A ceramic member 2 having a thickness of 20 mm and having a substantially disk shape mainly composed of silicon nitride is inserted, and a metal member 1 is inserted into the four parts of the ceramic member 2, and a stress buffering material 3 made of titanium and having a thickness of 1 mm is inserted between them. interposed between each layer, and 2 layers between each layer.
A ceramic-metal bonded body was produced by heating the two in vacuum at a temperature of 840°C for 6 minutes with a brazing filler metal 4 made of a solder material of %Ti-71%Ag-27%Cu by weight interposed therebetween to produce a ceramic-metal bonded body. .
このセラミックス−金属接合体について、超音波Ｃスキ
ャン法とＸ線ＣＴ法とにより接合部を検査した。The joint portion of this ceramic-metal bonded body was inspected using an ultrasonic C-scan method and an X-ray CT method.
まず、金属部材１側とセラミックス部材２側の両端面か
ら超音波Ｃスキャン（周波数ＬＯＭＨｚ、スキャンピッ
チ０．２５ ｍｍ）を行い、各々接合部の画像を得た。First, ultrasonic C-scanning (frequency LOMHz, scan pitch 0.25 mm) was performed from both end faces of the metal member 1 side and the ceramic member 2 side, and images of the joints were obtained for each.
次いで、接合部近傍をＸ線ＣＴ（１２０ｋｅＶ、 ３
００ｍＡパルスＸ線）により複数の断層画像を得た。Next, the vicinity of the joint was subjected to X-ray CT (120 keV, 3
Multiple tomographic images were obtained using 00 mA pulsed X-rays).
超音波Ｃスキャンによるセラミックス部材側からの画像
により接合端からセラミックス部月内部へ伸びていると
思われるクラックが検出された。An ultrasonic C-scan image taken from the ceramic member side detected a crack that appeared to be extending from the joint end to the inside of the ceramic member.
次いて、Ｘ線ＣＴによる複数の断層画像によりこのクラ
ックを確認したところ、接合端よりセラミックス部材の
中心方向にクラックが進展したことか判明した。Next, when this crack was confirmed using a plurality of tomographic images obtained by X-ray CT, it was found that the crack had progressed from the joint end toward the center of the ceramic member.
このクラックは窒化ケイ素とモリブデンとの熱膨脹係数
差に起因する残留応力により発生したものと思われ、確
認のためにセラミックス接合体を切断して内部の目視検
査を行ったところ、第１図に示すように、セラミックス
部材２内部にクラック５が観察され、超音波Ｃスキャン
およびＸ線ＣＴの画像による非破壊検査結果と同一結果
が得られた。This crack is thought to have occurred due to residual stress caused by the difference in coefficient of thermal expansion between silicon nitride and molybdenum.To confirm this, we cut the ceramic bonded body and visually inspected the inside, as shown in Figure 1. As shown, cracks 5 were observed inside the ceramic member 2, and the same results as those of the non-destructive inspection using ultrasonic C-scan and X-ray CT images were obtained.
実施例２
第２図に示すように、外径８０ｍｍで中央部に直径２５
＋ｎ＋ｎ Ｘ高さＩ ５ｍｍの凸部を有する円板状の窒
化ケイ素を主成分とするセラミックス部材２と、中心孔
を有する外径８０ｍｍのモリブデンからなる金属部材］
とを嵌合し、これらの間に厚さ ０．２ｍｍの銅からな
る応力緩衝材３を介在させ、各層の間に実施例１で使用
したものと同一のろう材４を介在させて実施例１と同一
条件で加熱接合してセラミックス−金属接合体を得た。Example 2 As shown in Figure 2, the outer diameter is 80 mm and the center part has a diameter of 25 mm.
+n+n
A stress buffering material 3 made of copper having a thickness of 0.2 mm was interposed between these layers, and a brazing material 4, which was the same as that used in Example 1, was interposed between each layer. A ceramic-metal bonded body was obtained by heating and bonding under the same conditions as No. 1.
このセラミックス接合体についても実施例１と同様に超
音波ＣスキャンとＸ線ＣＴとにより接合部を検査した。Regarding this ceramic bonded body, the bonded portion was also inspected using ultrasonic C-scan and X-ray CT in the same manner as in Example 1.
Ｘ線ＣＴによる画像からはろう祠か均一に分布している
ように思われたが、超音波Ｃスキャンによるセラミック
ス部材側および金属部月例からの画像からはともに、接
合界面の不均一性、すなわちろう材分布の不均一による
接合強度のばらつきが確認された。この検査結果が接合
体の特性と一致するかを確認するため、このセラックス
接合体の接合強度を測定したところ、１．２ｋｇ／−と
健全なセラミックス−金属接合体より若干低い値が得ら
れ、非破壊検査結果と一致していることが確認された。From the X-ray CT image, it appeared that the wax was evenly distributed, but from the ultrasonic C-scan images from both the ceramic component side and the metal component side, it was found that there was non-uniformity at the bonding interface, i.e. It was confirmed that there were variations in bonding strength due to non-uniform distribution of brazing filler metal. In order to confirm whether this test result matches the characteristics of the bonded body, we measured the bonding strength of this ceramics bonded body, and found that it was 1.2 kg/-, which is slightly lower than a healthy ceramic-metal bonded body. It was confirmed that the results were consistent with the non-destructive test results.
実施例３
外径６０＋ｎｍ Ｘ高さ１０ＩｎＩ１１の円板状の窒化
ケイ素を主成分とするセラミックス部材と同一形状の銅
相・５４５Ｃからなる金属部材との間に実施例１と同一
のろう祠を介在させ、さらに人工的に欠陥を作製するた
めに直径０，０５〜ｌ 、 Ｏｔｎ＋のタングステン粒
を介在させて実施例１と同一条件で両者を加熱接合して
セラミックス−金属接合体を作製した。Example 3 The same brazing hole as in Example 1 was interposed between a disc-shaped ceramic member mainly composed of silicon nitride with an outer diameter of 60 + nm and a height of 10 InI11 and a metal member made of copper phase 545C with the same shape. Further, in order to create artificial defects, tungsten grains with a diameter of 0.05 to 1 Otn+ were interposed, and the two were heated and bonded under the same conditions as in Example 1 to produce a ceramic-metal bonded body.
得られたセラミックス接合体について実施例１と同様に
超音波ＣスキャンとＸ線ＣＴで接合部を検査したところ
、超音波Ｃスキャンによる画像からはろう材分布が不均
一であることが判明し、さらにＸ線ＣＴによる画像から
ろう材中のＡｇが偏析していることが判明した。また、
Ｘ線ＣＴによる画像からは介在させたタングステン粒が
接合界面に分散していることが確認でき、直径０．２＋
ｎ＋ｎのものまで判定することが可能であった。When the bonded portion of the obtained ceramic bonded body was inspected using ultrasonic C-scan and X-ray CT in the same manner as in Example 1, it was found that the brazing material distribution was non-uniform from the ultrasonic C-scan image. Furthermore, it was found from X-ray CT images that Ag in the brazing filler metal was segregated. Also,
From the X-ray CT image, it was confirmed that the interposed tungsten grains were dispersed at the bonding interface, and the diameter was 0.2+
It was possible to judge up to n+n.
［発明の効果］
以上説明したように本発明方法によれば、超音波Ｃスキ
ャンにより得られる接合部の平面的な情報をＸ線ＣＴに
より得られる内部および深さ方向の情報で補足して多角
的に接合状態を把握し、またＸ線ＣＴでは検出しにくい
Ｘ線吸収係数の小さいろう材の分布は超音波Ｃスキャン
により検出てき、両者の検査方法を組合わせてより詳し
い接合部内部までの情報を得ることが可能となり、これ
により接合状態、接合体強度、接合面内部欠陥等を正確
に判定することが可能となる。[Effects of the Invention] As explained above, according to the method of the present invention, planar information of the joint obtained by ultrasonic C-scanning is supplemented with internal and depth direction information obtained by X-ray CT to obtain a polygonal image. In addition, the distribution of filler metal with a small X-ray absorption coefficient, which is difficult to detect with X-ray CT, can be detected by ultrasonic C-scan, and by combining both inspection methods, it is possible to obtain a more detailed inspection of the inside of the joint. It becomes possible to obtain information, thereby making it possible to accurately determine the bonding state, the strength of the bonded body, defects inside the bonding surface, etc.
第１図および第２図は本発明の一実施例で使用したセラ
ミックス−金属接合体の各々の断面図である。
１・・・・・・・・・金属部材
２・・・・・・・・・セラミックス部材３・・・・・・
・応力緩衝材
４・・・・・・・ろう材
出願人 株式会社 東芝
代理人 弁理士 須 山 佐 −FIGS. 1 and 2 are sectional views of ceramic-metal bonded bodies used in one embodiment of the present invention. 1...Metal member 2...Ceramic member 3...
・Stress buffer material 4・・・Brazing metal applicant Toshiba Corporation Representative Patent attorney Sasu Suyama −
Claims (1)
ス部材とセラミックス部材とを接合一体化してなるセラ
ミックス接合体の接合状態を検査するにあたり、 前記セラミックス接合体の接合面に対して平行方向に超
音波Ｃスキャンを行い前記セラミックス接合体の接合部
を平面的に画像化するとともに、前記セラミックス接合
体の少なくとも接合部近傍を放射線ＣＴにより断層状に
画像化し、これら超音波Ｃスキャンおよび放射線ＣＴに
よる画像情報から多角的に接合状態を検査することを特
徴とするセラミックス接合体の非破壊検査方法。(1) When inspecting the bonding state of a ceramic bonded body formed by bonding a ceramic member and a metal member or a ceramic member and a ceramic member, ultrasonic C-scanning is performed in a direction parallel to the bonding surface of the ceramic bonded body. The bonded portion of the ceramic bonded body is imaged in a two-dimensional manner, and at least the vicinity of the bonded portion of the ceramic bonded body is imaged in a tomographic manner using radiation CT, and a multifaceted image is obtained from the image information obtained by these ultrasonic C scans and radiation CT. A method for non-destructive testing of ceramic bonded bodies, characterized by inspecting the bonded state.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63101680A JPH01272961A (en) | 1988-04-25 | 1988-04-25 | Nondestructive inspecting method for ceramic-joined body |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63101680A JPH01272961A (en) | 1988-04-25 | 1988-04-25 | Nondestructive inspecting method for ceramic-joined body |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01272961A true JPH01272961A (en) | 1989-10-31 |
Family
ID=14307062
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63101680A Pending JPH01272961A (en) | 1988-04-25 | 1988-04-25 | Nondestructive inspecting method for ceramic-joined body |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01272961A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006189349A (en) * | 2005-01-06 | 2006-07-20 | Kawasaki Heavy Ind Ltd | Nondestructive defect inspection system |
| CN102095798A (en) * | 2010-11-04 | 2011-06-15 | 西安航空动力股份有限公司 | Method for detecting brazing rate of brazed parts by ultrasonic immersed C-scanning |
| CN108802074A (en) * | 2018-08-02 | 2018-11-13 | 赵克 | The detection method of zirconium oxide bilayer All-ceramic restoration body piercing porcelain internal flaw |
-
1988
- 1988-04-25 JP JP63101680A patent/JPH01272961A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006189349A (en) * | 2005-01-06 | 2006-07-20 | Kawasaki Heavy Ind Ltd | Nondestructive defect inspection system |
| CN102095798A (en) * | 2010-11-04 | 2011-06-15 | 西安航空动力股份有限公司 | Method for detecting brazing rate of brazed parts by ultrasonic immersed C-scanning |
| CN108802074A (en) * | 2018-08-02 | 2018-11-13 | 赵克 | The detection method of zirconium oxide bilayer All-ceramic restoration body piercing porcelain internal flaw |
| CN108802074B (en) * | 2018-08-02 | 2020-11-06 | 赵克 | Method for detecting internal defects of zirconia double-layer all-ceramic restoration body decorative ceramic |
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