JPH01266961A - Automatic soldering device - Google Patents
Automatic soldering deviceInfo
- Publication number
- JPH01266961A JPH01266961A JP9142588A JP9142588A JPH01266961A JP H01266961 A JPH01266961 A JP H01266961A JP 9142588 A JP9142588 A JP 9142588A JP 9142588 A JP9142588 A JP 9142588A JP H01266961 A JPH01266961 A JP H01266961A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- printed board
- soldering
- nozzle
- fixing table
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 title claims abstract description 35
- 229910000679 solder Inorganic materials 0.000 abstract description 33
- 238000007664 blowing Methods 0.000 abstract description 4
- 238000000034 method Methods 0.000 abstract 1
- 235000011962 puddings Nutrition 0.000 description 13
- 238000005516 engineering process Methods 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Molten Solder (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明はプリン１〜板のはんだ付け装置に係り、特に、
表面実装部品とスルホール挿入部品が混載するプリント
板のはんだ付けに好適なプリン１−板はんだ付け装置に
関する。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a soldering device for pudding 1 to a board, and in particular,
The present invention relates to a printed circuit board soldering device suitable for soldering a printed circuit board on which surface mount components and through-hole insertion components are mounted together.
従来、プリン１一基板の自動はんだ付け装置は、エレク
１−ロニクスのはんだ付け、第２３１頁から２４７頁、
はんだ付け技術委貝会編において論じられているような
プリント板の一辺と同しか又はそれ以上の大きさを持つ
噴流はんた槽」二をコンベアによりプリント板を一方向
に移動し、プリント板裏面全体をはんだ付けする構造と
なっていた。Conventionally, an automatic soldering device for a Print 1 board is described in Electronics 1-Soldering, pages 231 to 247,
The printed board is moved in one direction by a conveyor using a jet solder bath having a size equal to or larger than one side of the printed board, as discussed in the Soldering Technology Committee. It had a structure in which the entire back side was soldered.
又、必要箇所のみ、自動ではんだ付けする装置としては
、精密接合技術集成、第２２８頁から２４７頁、窪田規
他編において論しられてるような多関節型ＮＣロボツ１
−に、はんだゴテ、糸はんだ供給機構を付備したはんだ
付けロボットにて、−ポイントずつ、はんだ付けを行っ
ていた。In addition, as a device that automatically solders only necessary parts, there is an articulated NC robot 1 as discussed in Precision Joining Technology Collection, pages 228 to 247, edited by Nori Kubota et al.
A soldering robot equipped with a soldering iron and a thread solder supply mechanism was used to solder points at a time.
」二足前述の従来技術は、プリント板裏面全体が溶融は
んだに接触するため、裏面に耐熱性の低いフラン１〜プ
ラスチツクＩＣ等が混載するプリン１−板には、適用で
きなかった。又後述の従来技術は、−ポインＩ〜すつは
んた伺けする機構のため、ロボッＩ−に供給すべきデー
タ量が膨大、且つ複雑である、はんだ付けスピードが遅
い等の問題があった。The above-mentioned conventional technology could not be applied to printed circuit boards on which plastic ICs, etc. with low heat resistance are mixed on the back surface, because the entire back surface of the printed circuit board comes into contact with molten solder. In addition, the conventional technology described below has problems such as the amount of data to be supplied to the robot I is enormous and complicated, and the soldering speed is slow because of the mechanism that allows the soldering to be carried out from the point I. Ta.
本発明の目的は、プリン１〜板の必要箇所のみ自動で比
較的高速にはんだ付けすることができる、はんだ付け装
置を供給することにある。SUMMARY OF THE INVENTION An object of the present invention is to provide a soldering device that can automatically and relatively quickly solder only the necessary parts of the pudding 1 to the board.
」二足目的は、小型の、ノズル対向方式にて供給される
噴流はんだ上て、プリント板固定テーブルをＸ−Ｙ−Ｚ
方向に可動させることにより、達成される。The purpose of the two legs is to place the printed board fixing table in
This is achieved by moving in the direction.
噴流はんだ槽は、小型吹き出し口を用いたノズル２個を
、第３図に示すように対向して設ける。The jet solder bath is provided with two nozzles each using a small outlet facing each other as shown in FIG.
これにより噴流したはんだは、吹き出しＬｌの内側へ流
れようとするため、プリン１〜板にはんだが接触した際
、必要最少限の面積のみ、はんだ付けを行うことか可能
となる。As a result, the jetted solder tends to flow inside the blowout Ll, so that when the solder contacts the pudding 1 to the board, it is possible to solder only the minimum necessary area.
上記噴流はんだ槽上には、ｘ、−ｙ −ｚ方向に可動可
能なプリン１〜板固定テーブルを設け、これに取付けら
れたプリン１〜板のはんだ伺けを必要とする箇所へ、Ｘ
−Ｙ方向の移動を行う。次にプリン１〜板固定テーブル
を噴流はんだとプリンｌ−板が接触する箇所まで降下さ
せ、はんだ付けを行う。第２図に示すように、はんだ付
けを必要とする箇所が連続的に存在する場合は、プリン
１〜板をはんだに接触された状態で、プリン１〜板固定
テーブルをＸ−Ｙ方向に移動させはんだ付けを行う。Above the jet soldering bath, there is provided a board fixing table that is movable in the x, -y, and z directions.
-Move in the Y direction. Next, the pudding 1-board fixing table is lowered to the point where the jet solder contacts the pudding 1 board, and soldering is performed. As shown in Figure 2, if there are continuous locations that require soldering, move Pudding 1 to the plate fixing table in the X-Y direction while keeping Pudding 1 to the board in contact with the solder. Perform soldering.
以下、本発明の一実施例を第１図、第３図により説明す
る。An embodiment of the present invention will be described below with reference to FIGS. 1 and 3.
噴流はんだ槽２内のはんだ９は、ヒータ６により溶融さ
せ、２５０°Ｃ前後で温度が一定になるように制御部５
にてコン１ヘロールする。吹き出しノズル１−は３０Ｘ
１０画程度の吹き出し口を有し、］、 ５ ｎ１Ｉｎ程
度の間隔をとり対向に設ける。吹き出しノズル］の取付
け角度は、噴流されたはんだか２対の吹き出し［１の内
側へ流れ込む角度（約６０°）に設定する。又、噴流は
んだの高さは、吹き出″し１コより５ ｎｏ 前後にな
るようポンプ７を制御部５てコン１ヘロールする。The solder 9 in the jet solder bath 2 is melted by a heater 6, and controlled by a controller 5 to keep the temperature constant at around 250°C.
Con1 heror at. Blowout nozzle 1- is 30X
It has an air outlet of about 10 strokes, and is placed facing each other with an interval of about 5 n1In. The installation angle of the blowout nozzle is set at an angle (approximately 60°) at which the jetted solder flows into the inside of the two pairs of blowouts [1]. Further, the pump 7 is controlled by the controller 5 so that the height of the solder jet is about 5 no.
プリンｌ−板固定テーブル３は、Ｘ、 −Ｙ−Ｚ方向に
可動可能なＸ、−Ｙ −Ｚ駆動部４に取り付け、噴流は
んだ槽２上に設ける。Ｘ−Ｙ方向のストロータは、はん
だ付けするプリンｌ−板の外形寸法具」ニを有し、２方
向のス１〜ロークは、１０〜２０冊１程度必要とする。The pudding L-board fixing table 3 is attached to an X, -Y-Z drive unit 4 movable in the X, -Y-Z directions, and is provided on the jet solder bath 2 . The stroker in the X-Y direction has a pudding plate to be soldered and an external dimension tool for the board to be soldered, and approximately 10 to 20 strokes in the two directions are required.
Ｘ−Ｙ−Ｚ駆動部４は、あらかしめ制御部５に入力され
たデータにより移動速度。The X-Y-Z drive section 4 determines the moving speed based on data input to the preliminary control section 5.
ス１へローフ等がコントロールされる。Loaf, etc. to step 1 is controlled.
プリン１〜板８は、プリン１−板固定テーブル３にセラ
１−シ、必要はんだ付け箇所のＸ−Ｙ座標データに基づ
き、吹き出しノズル］」二まで移動させる。The pudding 1 to the plate 8 are moved to the blowing nozzle 2 based on the X-Y coordinate data of the required soldering location on the pudding 1-plate fixing table 3.
この際、吹き出しノズル１からは、はんだ噴流させてお
く。次にプリント板裏面が吹き出しノズル上３ ｎ＋＋
ｎ程の距離になるまでプリン１〜板固定テーブルを降下
させ、はんだ付けを行う。降下速度は、噴流はんだの波
形をくずさない程度の速度（５ｍｍ／秒程度）とする。At this time, the solder is jetted from the blowing nozzle 1. Next, the back of the printed board is above the blowout nozzle 3 n++
The pudding 1 to board fixing table are lowered until they are at a distance of about n, and soldering is performed. The descending speed is set to a speed (approximately 5 mm/sec) that does not destroy the waveform of the solder jet.
必要はんだ付け箇所が連続して存在する場合は、プリン
ト板固定テーブルを降下した状態で、ｘ−ｙ方向の移動
を行い、はんだ付けを行う。又、第４図に示すように、
必要はんだ付け箇所が点在する場合は、プリント板固定
テーブルを一度上昇させ、次のはんだ付け箇所までＸ−
Ｙ方向の移動を行い、再び降下させはんだ付けを行う。If there are consecutive soldering points, the printed board fixing table is lowered and moved in the x-y directions to perform soldering. Also, as shown in Figure 4,
If the required soldering points are scattered, raise the printed board fixing table once and move it to the next soldering point.
Move in the Y direction and lower again to perform soldering.
本実施例によれは、噴流はんだ槽を小型のノズル対向方
式にしであるため、プリント板にはんだが接触した際の
はんだの広がりを最小限に押さえられるため、はんだ付
け必要部と、不必要部は、最低５ｎｎの間隔で、はんだ
付け可能となる。又、小型噴流槽上でプリント板をｘ、
−ｙ −ｚ方向に可動させはんだ付けを行うため、必
要箇所のみ自動で、且つ比較的高速にはんだ付けできる
効果がある。In this embodiment, since the jet solder bath is designed with small nozzles facing each other, it is possible to minimize the spread of solder when it comes into contact with the printed circuit board. can be soldered at intervals of at least 5 nn. Also, print the printed board on a small jet tank,
Since the soldering is performed by moving in the -y-z directions, it is possible to solder only the necessary parts automatically and at a relatively high speed.
〔発明の効果〕
本発明によれば、必要箇所のみ自動的にはんだ付けでき
る効果がある。又、従来のはんだ付けロボツ１〜と比較
すると、はんだ付けポイントが２００ポイン１−時、は
んだ付け時間を１７１０に低減できる効果がある。[Effects of the Invention] According to the present invention, it is possible to automatically solder only necessary parts. Moreover, when compared with the conventional soldering robots 1 to 1, there is an effect that the soldering time can be reduced to 1710 points when the number of soldering points is 200 points.
第１図は本発明の一実施例の全体構成図、第２図はプリ
ン１−板とはんだ噴流槽との関係図、第３図ははんだ噴
流槽内の断面図、第４図ははんだ付け時のプリント板の
動きを説明した図である。
１− 吹き出しノズル、２・噴流はんた槽、３ プリン
ト板固定テーブル、４ ・ｘ−ｙ−ｚ駆動部、５ 制御
部、６・ヒータ、７ ポンプ、８ プリン１〜板、９・
はんだ。Fig. 1 is an overall configuration diagram of an embodiment of the present invention, Fig. 2 is a diagram of the relationship between the pudding 1 board and the solder jet tank, Fig. 3 is a sectional view inside the solder jet tank, and Fig. 4 is soldering. FIG. 1- Blowout nozzle, 2. Jet solder bath, 3. Printed board fixing table, 4.
Solder.
Claims (1)
より成るプリント板はんだ付け装置において、噴流はん
だ槽を、小型ノズル対向方式にし、その上に設けたプリ
ント板固定テーブルを、Ｘ−Ｙ−Ｚ方向に可動させる機
構を設けたことを特徴とする自動はんだ付け装置。1. In a printed board soldering device consisting of a soldering bath, a printed board fixing table, and a control unit, the jet soldering bath is made into a small nozzle facing type, and the printed board fixing table installed above it is movable in the X-Y-Z direction. An automatic soldering device characterized by being equipped with a mechanism for soldering.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9142588A JPH01266961A (en) | 1988-04-15 | 1988-04-15 | Automatic soldering device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9142588A JPH01266961A (en) | 1988-04-15 | 1988-04-15 | Automatic soldering device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01266961A true JPH01266961A (en) | 1989-10-24 |
Family
ID=14026023
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9142588A Pending JPH01266961A (en) | 1988-04-15 | 1988-04-15 | Automatic soldering device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01266961A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6138890A (en) * | 1997-10-30 | 2000-10-31 | Nec Corporation | Automatic soldering mechanism capable of improving a working efficiency with stabilizing a soldering quality |
| JP2007134609A (en) * | 2005-11-14 | 2007-05-31 | Asti Corp | Spot soldering apparatus and jet nozzle therefor |
| WO2012143967A1 (en) * | 2011-04-18 | 2012-10-26 | 三菱電機株式会社 | Solder jet nozzle, soldering device, and soldering method |
| CN104249208A (en) * | 2013-06-26 | 2014-12-31 | 国际商业机器公司 | Wave soldering device and spray nozzle thereof |
-
1988
- 1988-04-15 JP JP9142588A patent/JPH01266961A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6138890A (en) * | 1997-10-30 | 2000-10-31 | Nec Corporation | Automatic soldering mechanism capable of improving a working efficiency with stabilizing a soldering quality |
| JP2007134609A (en) * | 2005-11-14 | 2007-05-31 | Asti Corp | Spot soldering apparatus and jet nozzle therefor |
| WO2012143967A1 (en) * | 2011-04-18 | 2012-10-26 | 三菱電機株式会社 | Solder jet nozzle, soldering device, and soldering method |
| CN104249208A (en) * | 2013-06-26 | 2014-12-31 | 国际商业机器公司 | Wave soldering device and spray nozzle thereof |
| US20150014394A1 (en) * | 2013-06-26 | 2015-01-15 | International Business Machines Corporation | Wave soldering apparatus and nozzle thereof |
| US9527151B2 (en) * | 2013-06-26 | 2016-12-27 | Lenovo Enterprise Solutions (Singapore) Pte. Ltd. | Wave soldering apparatus and nozzle thereof |
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