JPH01264820A - Die for molding optical disc containing format - Google Patents
Die for molding optical disc containing formatInfo
- Publication number
- JPH01264820A JPH01264820A JP9409988A JP9409988A JPH01264820A JP H01264820 A JPH01264820 A JP H01264820A JP 9409988 A JP9409988 A JP 9409988A JP 9409988 A JP9409988 A JP 9409988A JP H01264820 A JPH01264820 A JP H01264820A
- Authority
- JP
- Japan
- Prior art keywords
- mold
- stamper
- molded
- molding
- cavity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000465 moulding Methods 0.000 title claims abstract description 28
- 230000003287 optical effect Effects 0.000 title claims description 17
- 239000004033 plastic Substances 0.000 claims abstract description 22
- 229920003023 plastic Polymers 0.000 claims abstract description 22
- 238000012546 transfer Methods 0.000 claims abstract description 7
- 239000000758 substrate Substances 0.000 claims description 46
- 238000000034 method Methods 0.000 abstract description 11
- 239000011347 resin Substances 0.000 abstract description 9
- 229920005989 resin Polymers 0.000 abstract description 9
- 239000002991 molded plastic Substances 0.000 abstract description 8
- 230000006866 deterioration Effects 0.000 abstract description 3
- 238000001816 cooling Methods 0.000 abstract 1
- 238000002347 injection Methods 0.000 description 5
- 239000007924 injection Substances 0.000 description 5
- 238000000635 electron micrograph Methods 0.000 description 4
- 238000001746 injection moulding Methods 0.000 description 4
- 238000007796 conventional method Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 238000007664 blowing Methods 0.000 description 2
- 229920005668 polycarbonate resin Polymers 0.000 description 2
- 239000004431 polycarbonate resin Substances 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 208000035389 Ring chromosome 6 syndrome Diseases 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
- B29D17/00—Producing carriers of records containing fine grooves or impressions, e.g. disc records for needle playback, cylinder records; Producing record discs from master stencils
- B29D17/005—Producing optically read record carriers, e.g. optical discs
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/44—Moulds or cores; Details thereof or accessories therefor with means for, or specially constructed to facilitate, the removal of articles, e.g. of undercut articles
- B29C33/46—Moulds or cores; Details thereof or accessories therefor with means for, or specially constructed to facilitate, the removal of articles, e.g. of undercut articles using fluid pressure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C37/00—Component parts, details, accessories or auxiliary operations, not covered by group B29C33/00 or B29C35/00
- B29C37/0003—Discharging moulded articles from the mould
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/263—Moulds with mould wall parts provided with fine grooves or impressions, e.g. for record discs
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/263—Moulds with mould wall parts provided with fine grooves or impressions, e.g. for record discs
- B29C2045/2648—Outer peripheral ring constructions
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/263—Moulds with mould wall parts provided with fine grooves or impressions, e.g. for record discs
- B29C2045/2657—Drive means for the outer peripheral ring
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Fluid Mechanics (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Manufacturing Optical Record Carriers (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明はＣＤ５ＶＤのようなＲＯＭディスク、ＤＲＡＷ
ディスクあるいはＥ−ＤＲＡＤディスク等の光ディスク
や光カード等の高密度情報記録担体用のプラスチック基
板の射出成形方法およびそれに用いる金型に関するもの
である。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention is applicable to ROM disks such as CD5VD, DRAW disks, etc.
The present invention relates to a method of injection molding a plastic substrate for a high-density information recording carrier such as an optical disk such as a disk or an E-DRAD disk or an optical card, and a mold used therein.
従来の技術
上記光ディスク等の高密度情報記録担体用の基板は一般
にガラス、金属、セラミックスあるいはプラスチックで
作られているが、軽量性、強度および生産性の点からプ
ラスチックスが望ましい。BACKGROUND OF THE INVENTION Substrates for high-density information recording carriers such as the above-mentioned optical disks are generally made of glass, metal, ceramics, or plastics, and plastics are preferred from the viewpoint of lightness, strength, and productivity.
しかし上記のような光ディスクに用いられるプラスチッ
クス基板は厚さが約１．２〜１．５ｍｍ、直径が最大的
３００ｍｍと極めて薄くて偏平である上、材料としては
一般に流動性の悪いアクリル樹脂やポリカーボネート樹
脂が用いられるため、複屈折等の光学的特性と転写性等
の成形性とを同時に完全に満足させるプラスチック基板
を射出成形するのは難しい。However, the plastic substrates used in the above-mentioned optical discs are extremely thin and flat, with a thickness of about 1.2 to 1.5 mm and a maximum diameter of 300 mm, and the materials are generally made of acrylic resin, which has poor fluidity. Since polycarbonate resin is used, it is difficult to injection mold a plastic substrate that completely satisfies optical properties such as birefringence and moldability such as transferability at the same time.
この種ディスク基板に要求される種々の性能の中で、゛
金型内に配置されたスタンパ−の表面形状すなわち情報
ピット列を正確に転写する転写性能は最も重要な要因の
一つである。Among the various performances required of this type of disk substrate, one of the most important factors is the transfer performance for accurately transferring the surface shape of the stamper placed in the mold, that is, the information pit array.
従来、光ディスク用プラスチック基板の射出成形用金型
としては第２．３図に示すような構造のものが一般的で
ある。Conventionally, a mold for injection molding a plastic substrate for an optical disk generally has a structure as shown in FIG. 2.3.
第２図に示す金型は１対の金型部分すなわち割型、例え
ば可動型１゛と、固定型２°とで形成される成形キャビ
ティ３”を有し、この成形キャビティの表面の一部（図
では可動型１”の表面）にはサブミクロンオーダーの情
報ピットやトラック等をその表面に有するスタンパ−４
′がスタンパ−ホルダー５°によって取り付けられてい
る。また、固定型の成形キャビティ表面上には外周リン
グ６″が取り付けられている。樹脂はスプルー７°を介
して成形キャビティ３°中に射出される。The mold shown in FIG. 2 has a molding cavity 3" formed by a pair of mold parts or split molds, for example a movable mold 1" and a fixed mold 2°, and a part of the surface of this molding cavity (In the figure, the surface of the movable mold 1") has a stamper 4 with information pits, tracks, etc. of submicron order on its surface.
' is attached by a stamper holder 5°. A peripheral ring 6'' is also mounted on the surface of the fixed molding cavity.Resin is injected into the molding cavity 3° via a sprue 7°.
第３図は従来例の他の射出成形金型を示している。なお
、第３図では第２図に対応する部材には二重のダッシュ
（”）が付けられている。この第３図の射出成形金型は
、第２図の場合の外周リング６′を無＜シ、スタンパ−
ホルダー５”のテーパー付き内周表面１０”上に固定型
２”の対向表面９”が当接して成形キャビティの外周端
面が規定されるようになっている。この型式の金型を一
般にインロウ型の金型といっている。FIG. 3 shows another conventional injection mold. In addition, in FIG. 3, double dashes ('') are attached to parts corresponding to those in FIG. 2. The injection mold in FIG. Nothing, stamper
The opposing surface 9'' of the stationary mold 2'' abuts on the tapered inner circumferential surface 10'' of the holder 5'', thereby defining the outer circumferential end surface of the molding cavity. This type of mold is generally called a spigot mold.
第２図の金型を用いてディスク基板の成形方法を説明す
ると、先ず、射出成形機（図示せず）の金型取付は用固
定盤に固定型２°が、また、可動盤に可動型１°が取付
けられる。成形時には、可動型と固定型を閉じ後に、溶
融された樹脂がスプルー７°を介してキャビティ３°内
に射出される。その後キャビティ内に溶融射出された樹
脂が一定時間冷却され固化した後、型締機構を駆動して
可動型を固定型から分離して型開きすると同時に、固定
型の中央部附近にもうけられたエアーエジェクターより
エアーを吹き出し、成形された基板を固定型鏡面より離
型させる。To explain the method of molding a disk substrate using the mold shown in Figure 2, first, when installing the mold of an injection molding machine (not shown), the fixed mold 2° is mounted on the fixed plate, and the movable mold is mounted on the movable plate. 1° is installed. During molding, after the movable mold and fixed mold are closed, molten resin is injected into the cavity 3° through the sprue 7°. After that, the resin melted and injected into the cavity is cooled and solidified for a certain period of time, and then the mold clamping mechanism is driven to separate the movable mold from the fixed mold and open the mold.At the same time, air is generated near the center of the fixed mold. Air is blown out from the ejector to release the molded substrate from the fixed mirror surface.
従って、成形されたプラスチック基板は、可動型鏡面す
なわちスタンパ−４′の表面に付着した状態で型開きが
行われる。次いで、金型が完全に開いた後に、可動型の
中央部附近に設けられた他のエアーエジェクターからエ
アーを吹き出してスタンパ−と基板を分離し、さらに、
機械的エジェクターロッドを用いて基板を突き出すこと
によって、基板を金型より完全に離型させる。Therefore, the mold is opened while the molded plastic substrate is attached to the movable mirror surface, that is, the surface of the stamper 4'. Next, after the mold is completely opened, air is blown out from another air ejector installed near the center of the movable mold to separate the stamper and the substrate, and further,
The substrate is completely released from the mold by ejecting it using a mechanical ejector rod.
発明が解決しようとする課題
光ディスクには、プリフォーマット方式とポストフォー
マット方式がある。Problems to be Solved by the Invention There are two types of optical discs: pre-format and post-format.
プリフォーマット方式の場合には、ガイドトラックとな
るグループ（連続溝）のみを光ディスク用プラスチック
基板に成形しておき、必要なフォーマットは、こうして
得られた溝付きプラスチック基板に記録膜を付けて得ら
れる光ディスクをドライブに組込んだ後に書き込まれる
。従って、基板成形には、上記グループを精度よくスタ
ンパ−より転写させるだけでよい。In the case of the pre-format method, only the groups (continuous grooves) that will serve as guide tracks are molded onto a plastic substrate for optical discs, and the necessary format is obtained by attaching a recording film to the thus obtained grooved plastic substrate. Written after the optical disc is installed in the drive. Therefore, in order to mold the substrate, it is only necessary to accurately transfer the group from a stamper.
しかし、最近では、ポストフォーマット法の非経済性に
加えて、マスクリング或いはドライブ設計技術等の進歩
により、プラスチック基板の成形段階でグループと同時
にフォーマットを入れる、いわゆるプリフォーマット方
式が主流となってきた。このプリフォーマット信号は、
前記の連続したガイドトラックとは異なり一定の長さを
もったピットで構成されている。However, in recent years, in addition to the uneconomical nature of the post-format method, due to advances in mask ring or drive design technology, the so-called pre-format method has become mainstream, in which the format is inserted at the same time as the group at the plastic substrate molding stage. . This preformatted signal is
Unlike the above-mentioned continuous guide track, it is composed of pits with a fixed length.
プリフォーマット信号は一般ににマスクリング法を用い
てスタンパ−に切られるが、このプリフォーマット信号
の入ったスタンパ−を前記従来型金型で前記手順で成形
したところグループ部では見られないピットの円周方向
への「流れ現象」すなわちスタンパ−から転写・成形さ
れたプラスチック基板の凹凸形状が「だれて」、正確に
転写が行われないという現象が発生する。The preformat signal is generally cut into a stamper using the mask ring method, but when the stamper containing this preformat signal was molded using the conventional mold according to the above procedure, pit circles that were not seen in the group parts were found. A "flow phenomenon" occurs in the circumferential direction, that is, a phenomenon in which the uneven shape of the plastic substrate transferred and molded from the stamper "sags" and the transfer is not performed accurately.
この現象が発生したプラスチック基板に記録膜を付けた
光ディスク基板は、反射光量に悪影響が出て、最終的に
は記録・再検特性に悪影響を及ぼすということが記録特
性の評価で判明した。Evaluation of the recording characteristics of optical disk substrates in which this phenomenon occurs, in which a recording film is attached to a plastic substrate, has an adverse effect on the amount of reflected light, and ultimately on recording and retesting characteristics.
この現象について鋭意検討した結果、本発明達は、上記
現象は金型を開く時から成形されたディスク基板をスタ
ンパ−面より離型するまでの間に発生することを見出し
、これを解決する方法を発明した。As a result of intensive study on this phenomenon, the present inventors discovered that the above phenomenon occurs between the time the mold is opened and the time the molded disk substrate is released from the stamper surface, and a method for solving this problem was found. invented.
従って、本発明の目的は、上記のピットの「流れ現象」
に起因する転写性の低下を解決する方法と、それに用い
る金型組立体を提供することにある。Therefore, the object of the present invention is to solve the above-mentioned "flow phenomenon" of the pit.
The object of the present invention is to provide a method for solving the problem of deterioration in transferability caused by the problem, and a mold assembly used therein.
課題を解決するための手段
本発明の提供する光ディスク用プラスティック基板の成
形用金型は、固定型と可動型の一対の割型を有し、この
一方の割型の内表面は鏡面であり、その他方の割型の内
表面には成形されたディスクに情報ピットを転写するた
めのスタンパ−が取付けられており、上記鏡面と上記ス
タンパ−とによって成形キャビティーが規定されるフォ
ーマット信号の入った光ディスク用プラスティック基板
の成形用金型において、上記スタンパ−が固定型に取付
けられていることを特徴としている。Means for Solving the Problems The mold for molding a plastic substrate for an optical disk provided by the present invention has a pair of split molds, a fixed mold and a movable mold, and the inner surface of one of the split molds is a mirror surface. A stamper for transferring information pits onto the molded disk is attached to the inner surface of the other split mold, and a stamper containing a format signal that defines a molding cavity by the mirror surface and the stamper is attached. The mold for molding a plastic substrate for an optical disc is characterized in that the stamper is attached to a fixed mold.
作用
先ず、前記のような従来方法で光ディスク基板を成形し
た場合について説明する。Function First, the case where an optical disc substrate is molded by the conventional method as described above will be explained.
キャビティ内に射出された溶融樹脂は、冷却が進むにつ
れ円周方向に収縮しようとするが、金型が閉じている間
は、金型からの押圧力と金型面との摩擦により押さえ込
まれているため、応力は発生するが収縮は起こらない。The molten resin injected into the cavity tries to contract in the circumferential direction as it cools, but while the mold is closed, it is held down by the pressing force from the mold and the friction with the mold surface. Therefore, stress is generated but no contraction occurs.
次に、金型が開き始め、基板の信号面がスタンパ−とま
だ密着した状態で、成形された基板の信号面と逆の面が
金型より離れると、基板のその面は内周方向にむかって
収縮を始める。この時点で基板の信号面がスタンパ−と
まだ密着しているので、この信号面はスタンパ−面との
摩擦力によりそのまま保持されようとする。しかし、樹
脂の収縮力の方が大きいため、力のバランスが取れる点
まで引きずられる。Next, when the mold begins to open and the signal surface of the substrate is still in close contact with the stamper, when the surface of the molded substrate opposite to the signal surface separates from the mold, that surface of the substrate will move toward the inner circumference. It starts to contract. At this point, since the signal surface of the substrate is still in close contact with the stamper, this signal surface tends to be held as it is by the frictional force with the stamper surface. However, since the shrinkage force of the resin is greater, it is dragged until the point where the forces are balanced.
ピットの「流れ現象」はいわばスタンパ−とディスク基
板の収縮率の差によって生ずるスタンパ−のピットによ
り成形基板につけられた痕跡である。従って、この現象
はピットの高さに影響を与え、高ければ高い程流れ距離
は長くなる。The "flow phenomenon" of pits is, so to speak, a mark left on the molded substrate by the pits of the stamper, which is caused by the difference in shrinkage rate between the stamper and the disk substrate. Therefore, this phenomenon affects the height of the pit, the higher the pit, the longer the flow distance.
前記解析から、本発明達は、この現象を解決するために
は、基板の信号面が逆の面によりひきずられる前に、ス
タンパ−より離型させておけばよいと考え、本発明を完
成した。From the above analysis, the present inventors thought that in order to solve this phenomenon, it would be best to release the mold from the stamper before the signal surface of the substrate is dragged by the opposite surface, and thus completed the present invention. .
すなわち、本発明では、上記のピットの「流れ現象」に
起因する転写性の低下を解決するために、スタンパ−の
取り付は面をこれまでの可動型面から固定型面にした。That is, in the present invention, in order to solve the problem of the deterioration in transferability caused by the above-mentioned "flow phenomenon" of pits, the surface on which the stamper is attached is changed from the conventional movable mold surface to a fixed mold surface.
従来金型においても、型開きの際に、可動型のエアーエ
ジェクターからのエアーブローを固定型のエアーエジェ
クターからのエアーブローより時間的に先に働かせるこ
とによって上記現象の解決は可能である。しかし、その
場合には、成形されたプラスティック基板は固定型に付
着し、一方スブルーは可動型に付くため、ロボット等の
自動取り出し装置の操作が煩雑となるという欠点が生ず
る。Even in conventional molds, the above phenomenon can be solved by blowing air from a movable air ejector earlier than air blowing from a fixed air ejector when opening the mold. However, in that case, the molded plastic substrate adheres to the fixed mold, while the sublue adheres to the movable mold, resulting in a disadvantage that the operation of an automatic take-out device such as a robot becomes complicated.
本発明においては、スタンパ−取付は面を可動型から固
定型に変えることにより上記現象が解決できると同時に
、成形条件や取出し装置の操作を従来の成形装置のもの
をそのまま用いて、従来技術を一切変更せずに成形でき
るという大きな利点がある。In the present invention, the above-mentioned phenomenon can be solved by changing the stamper mounting surface from a movable type to a fixed type, and at the same time, the conventional technology can be improved by using the same molding conditions and operation of the take-out device as in the conventional molding equipment. It has the great advantage of being able to be molded without making any changes.
以下、添付図面を用いてさらに具体的に説明する。A more specific explanation will be given below using the accompanying drawings.
第１図は第３図に示した従来公知のスローイン型の金型
組立体に本発明を適用した場合を示している。FIG. 1 shows a case where the present invention is applied to the conventionally known slow-in mold assembly shown in FIG.
この第１図において、１は可動型、２は固定型、３は成
形キャビティ、４はガイドグループおよび／またはフォ
マット信号ピットを表面に有するスタンパ−１５は可動
型に保持された外周リング、８はパーティングライン、
１０は外周リング５の内周面に形成された型開き方向に
向かって拡大したテーパー面すなわち可動型方向に向か
って拡大したテーパー面、１１は上記スタンパ−を中心
で保持する中心スタンパ−ホルダーである。なお、可動
型１と固定型２は成形機 （図示せず）の可動盤と固定
盤にそれぞれ取り付けられている。In FIG. 1, 1 is a movable mold, 2 is a fixed mold, 3 is a molding cavity, 4 is a stamper having guide groups and/or format signal pits on its surface, and 15 is a peripheral ring held on the movable mold. parting line,
Reference numeral 10 designates a tapered surface formed on the inner peripheral surface of the outer circumferential ring 5 that expands toward the mold opening direction, that is, a taper surface that expands toward the movable mold direction, and 11 designates a central stamper holder that holds the stamper at the center. be. Note that the movable mold 1 and the fixed mold 2 are respectively attached to a movable platen and a fixed platen of a molding machine (not shown).
以下、この第１図の金型を用いて実際に成形した際の作
動順序を説明する。Hereinafter, the sequence of operations when actually molding is performed using the mold shown in FIG. 1 will be explained.
先ず、可動型と固定型が閉じられ、溶融樹脂１１がキャ
ビティ内に射出充填される。次に、キャビティ内に溶融
射出された樹脂１０が一定時間冷却固化した後、成形さ
れたプラスチックディスクを金型から取り出すための型
開き操作を開始する。First, the movable mold and the fixed mold are closed, and molten resin 11 is injected and filled into the cavity. Next, after the resin 10 melted and injected into the cavity is cooled and solidified for a certain period of time, a mold opening operation is started to take out the molded plastic disk from the mold.
この型開き操作の開始時には、成形されたプラスチック
基板の離型のために、固定型の中央附近に設けられたエ
アーブローエジェクター（図示せず）を介してエアーが
吹き出される。従って、成形されたプラスチック基板は
先ずスタンパ−面側から離型し、スプルーもプラスチッ
ク基板と同時に離型される。なお、このスプルーは後で
機械的に切り取ることができる。At the start of this mold opening operation, air is blown out through an air blow ejector (not shown) provided near the center of the fixed mold in order to release the molded plastic substrate. Therefore, the molded plastic substrate is first released from the stamper side, and the sprue is also released from the mold at the same time as the plastic substrate. Note that this sprue can be mechanically cut later.
そして、金型が完全に開いた後に、機械的突出しリング
、ロッド等を用いて成形されたプラスチック基板を固定
型より完全に離型させる。After the mold is completely opened, the molded plastic substrate is completely released from the fixed mold using a mechanical ejection ring, rod, or the like.
以下、本発明の好ましい実施例を説明するが、本発明は
これにのみ限定されるものではない。Preferred embodiments of the present invention will be described below, but the present invention is not limited thereto.
実施例
第１図に示す改良型インロー型の金型に、溝深さが８０
０ 人でビット高さが１６００人のスプルーを取付け、
名機製作所製Ｍ−７０射出成形機を用い、ポリカーボネ
ート樹脂をシリンダー温度３３０℃、金型温度１１０℃
で直径２００ｍｍ、厚さｌ、 ２ｍｍの基板の成形を行
った。Example: The improved spigot type mold shown in Fig. 1 has a groove depth of 80 mm.
0 people can install a sprue with a bit height of 1600,
Using Meiki Seisakusho M-70 injection molding machine, polycarbonate resin was molded at a cylinder temperature of 330°C and a mold temperature of 110°C.
A substrate with a diameter of 200 mm, a thickness of 1, and 2 mm was molded.
このとき、成形された基板の金型からの離型手順として
は、従来法と同様まず固定型すなわちスプルー４が取付
けられている方の割型から離型させ、金型が完全に開い
た後に、可動型から形成品を離型させた。At this time, as in the conventional method, the molded substrate is released from the mold first from the fixed mold, that is, the split mold to which the sprue 4 is attached, and after the mold is completely opened. , the molded product was released from the movable mold.
この成形品のビットの電顕写真を示す図４から明らかな
ように、流れ現象は見られなかった。As is clear from FIG. 4, which shows an electron micrograph of the bit of this molded product, no flow phenomenon was observed.
なお、この成形を続けて１０００シヨート実施したが、
成形された基板の特性の不良または取り出し時のトラブ
ル等は一切発生しなかった。This molding was continued for 1000 shots, but
There were no defects in the properties of the molded substrates or any trouble when taking them out.
比較例１
第２図の金型を用いて、実施例１と同じ条件で成形した
。Comparative Example 1 Molding was carried out under the same conditions as in Example 1 using the mold shown in FIG.
この場合には、成形された基板はスタンパ−に付着した
状態で先ず固定型２”から離型した。In this case, the molded substrate was first released from the fixed mold 2'' while it was still attached to the stamper.
得られた成形品のビット部分の電顕写真を示す図５から
明らかなように、流れ現象が発生していた。As is clear from FIG. 5, which shows an electron micrograph of the bit portion of the obtained molded product, a flow phenomenon occurred.
効果
上記の実施例から明らかなように、本発明によって、上
記スタンパ−を固定型に取付けることによって、ロボッ
ト等の自動取り出し装置の操作を煩雑とせずに、しかも
、上記の流れ現象が解決でき、成形条件や取出し装置の
操作を従来の成形装置のものをそのまま用いて、従来技
術を一切変更せずに成形できるという大きな利点がある
。Effects As is clear from the embodiments described above, according to the present invention, by attaching the stamper to a fixed mold, the operation of an automatic take-out device such as a robot is not complicated, and the flow phenomenon described above can be solved. There is a great advantage in that molding can be performed without changing the conventional technology by using the same molding conditions and operation of the take-out device as in the conventional molding apparatus.
さらに、以下のような効果も得られる。Furthermore, the following effects can also be obtained.
（リ 型開きと同時に信号面が離型されるため、信号面
全体が均一に収縮する。従って、グループの真円度がよ
くなる。(Re) Since the signal surface is released from the mold at the same time as the mold is opened, the entire signal surface shrinks uniformly. Therefore, the roundness of the group is improved.
（２）さらに、型開きと同時に信号面が離型され、従っ
て、離型のアンバランスが解消されるため、一般にＣＤ
で問題となるいわゆるクラッドといわれるガス状模様が
無くなる。(2) Furthermore, since the signal surface is released from the mold at the same time as the mold is opened, and therefore the unbalance of mold release is eliminated, CD
This eliminates the gaseous pattern known as cladding, which is a problem.
（３）本発明金型を射出−圧縮成形法において用いた場
合には、金型からの圧縮力がプラスチック基板に均一に
加えられるため、基板全体の応力分布が均一となり、従
って、成形されたプラスチック基板の変形量が小さくな
る。(3) When the mold of the present invention is used in the injection-compression molding method, the compressive force from the mold is uniformly applied to the plastic substrate, so the stress distribution on the entire substrate becomes uniform, and therefore the molded The amount of deformation of the plastic substrate is reduced.
第１図は本発明の一実施例による光ディスク用のプラス
チック基板の成形に用いられる射出成形金型組立体の概
念的断面図である。
第２および３図は従来公知の光ディスク用のプラスチッ
ク基板の成形に用いられる射出成形金型組立体の概念的
断面図である。
第４図は本発明によって成形されたプラスチックディス
ク基板のビット部の電顕写真の模写図。
第５図は従来法によって成形されたプラスチックディス
ク基板のビット部の電顕写真の模写図。
（図中符号）
１・・・可動型、 ２・・・固定型、３・・・
成形キャビティ、
４・・・スタンパ−１５・・・外周リング、７・・・ス
プルー、
８・・・パーティングライン、
１０・・・テーパー面
１１・・・中心スタンパ−ホルタ−FIG. 1 is a conceptual cross-sectional view of an injection mold assembly used for molding a plastic substrate for an optical disk according to an embodiment of the present invention. 2 and 3 are conceptual cross-sectional views of an injection mold assembly used for molding a conventionally known plastic substrate for an optical disk. FIG. 4 is a copy of an electron micrograph of a bit portion of a plastic disk substrate molded according to the present invention. FIG. 5 is a reproduction of an electron micrograph of a bit portion of a plastic disk substrate molded by a conventional method. (Symbols in the figure) 1... Movable type, 2... Fixed type, 3...
Molding cavity, 4... Stamper 15... Outer ring, 7... Sprue, 8... Parting line, 10... Tapered surface 11... Center stamper holter
Claims (1)
割型の内表面は鏡面であり、その他方の割型の内表面に
は成形されたディスクに情報ピットを転写するためのス
タンパーが取付けられており、上記鏡面と上記スタンパ
ーとによって成形キャビティーが規定されるフォーマッ
ト信号の入った光ディスク用プラスティック基板の成形
用金型において、上記スタンパーが固定型に取付けられ
ていることを特徴とする金型。(1) It has a pair of fixed and movable split molds, the inner surface of one of the split molds is a mirror surface, and the inner surface of the other split mold is used to transfer information pits to the molded disk. In a mold for molding a plastic substrate for an optical disk, the stamper is attached to a fixed mold and contains a format signal in which a molding cavity is defined by the mirror surface and the stamper. A mold featuring:
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63094099A JPH0763991B2 (en) | 1988-04-16 | 1988-04-16 | Mold for molding optical disc substrate with format |
| US07/339,264 US5106553A (en) | 1988-04-16 | 1989-04-17 | Method for molding a formatted substrate for an optical disk |
| EP89401056A EP0338906B1 (en) | 1988-04-16 | 1989-04-17 | Method for molding a formatted substrate for an optical disk and a mold assembly used in the method |
| DE68918623T DE68918623T2 (en) | 1988-04-16 | 1989-04-17 | Process and manufacture of a formatted substrate for an optical disk and injection mold for its use. |
| US07/873,514 US5171585A (en) | 1988-04-16 | 1992-04-20 | Apparatus for molding a formatted substrate for an optical disk |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63094099A JPH0763991B2 (en) | 1988-04-16 | 1988-04-16 | Mold for molding optical disc substrate with format |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01264820A true JPH01264820A (en) | 1989-10-23 |
| JPH0763991B2 JPH0763991B2 (en) | 1995-07-12 |
Family
ID=14100998
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63094099A Expired - Lifetime JPH0763991B2 (en) | 1988-04-16 | 1988-04-16 | Mold for molding optical disc substrate with format |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0763991B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01306214A (en) * | 1988-06-03 | 1989-12-11 | Hitachi Ltd | Optical disk base and its molding die |
| JPH0267116A (en) * | 1988-09-01 | 1990-03-07 | Meiki Co Ltd | Die for molding disc |
Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5469169A (en) * | 1977-10-31 | 1979-06-02 | Mca Disco Vision | Apparatus in injection molding machine |
| JPS59176029A (en) * | 1983-03-28 | 1984-10-05 | Sony Corp | Releasing method of molded article made of synthetic resin from die |
| JPS609721A (en) * | 1983-06-29 | 1985-01-18 | Daicel Chem Ind Ltd | Assembly of mold for injection molding for plastic disc for carrier of high density informaton record |
| JPS6019518A (en) * | 1983-07-13 | 1985-01-31 | Daicel Chem Ind Ltd | Injection molding and mold assembly of plastic disk for high density information recording carrier |
| JPS60155424A (en) * | 1984-01-26 | 1985-08-15 | Daicel Chem Ind Ltd | Large diameter optical disc substrate made of polycarbonate and its preparation |
| JPS60245529A (en) * | 1984-05-22 | 1985-12-05 | Sumitomo Heavy Ind Ltd | Forming die for disk recording medium such as compact disk or video disk |
| JPS60187022U (en) * | 1984-05-23 | 1985-12-11 | 株式会社テクノプラス | Peeling structure on the fixed mold plate side of a mold for forming a disc-shaped recording medium |
| JPS62191112A (en) * | 1986-02-17 | 1987-08-21 | Idemitsu Petrochem Co Ltd | Injection molding of high density information recording disc and injection mold unit |
| JPS62216713A (en) * | 1986-03-19 | 1987-09-24 | Toshiba Corp | Mold for molding video disk |
| JPS62261416A (en) * | 1986-05-09 | 1987-11-13 | Japan Steel Works Ltd:The | Separation of molded form in injection molding |
| JPH01194151A (en) * | 1988-01-28 | 1989-08-04 | Ricoh Co Ltd | Manufacture of optical disk substrate |
-
1988
- 1988-04-16 JP JP63094099A patent/JPH0763991B2/en not_active Expired - Lifetime
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5469169A (en) * | 1977-10-31 | 1979-06-02 | Mca Disco Vision | Apparatus in injection molding machine |
| JPS59176029A (en) * | 1983-03-28 | 1984-10-05 | Sony Corp | Releasing method of molded article made of synthetic resin from die |
| JPS609721A (en) * | 1983-06-29 | 1985-01-18 | Daicel Chem Ind Ltd | Assembly of mold for injection molding for plastic disc for carrier of high density informaton record |
| JPS6019518A (en) * | 1983-07-13 | 1985-01-31 | Daicel Chem Ind Ltd | Injection molding and mold assembly of plastic disk for high density information recording carrier |
| JPS60155424A (en) * | 1984-01-26 | 1985-08-15 | Daicel Chem Ind Ltd | Large diameter optical disc substrate made of polycarbonate and its preparation |
| JPS60245529A (en) * | 1984-05-22 | 1985-12-05 | Sumitomo Heavy Ind Ltd | Forming die for disk recording medium such as compact disk or video disk |
| JPS60187022U (en) * | 1984-05-23 | 1985-12-11 | 株式会社テクノプラス | Peeling structure on the fixed mold plate side of a mold for forming a disc-shaped recording medium |
| JPS62191112A (en) * | 1986-02-17 | 1987-08-21 | Idemitsu Petrochem Co Ltd | Injection molding of high density information recording disc and injection mold unit |
| JPS62216713A (en) * | 1986-03-19 | 1987-09-24 | Toshiba Corp | Mold for molding video disk |
| JPS62261416A (en) * | 1986-05-09 | 1987-11-13 | Japan Steel Works Ltd:The | Separation of molded form in injection molding |
| JPH01194151A (en) * | 1988-01-28 | 1989-08-04 | Ricoh Co Ltd | Manufacture of optical disk substrate |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01306214A (en) * | 1988-06-03 | 1989-12-11 | Hitachi Ltd | Optical disk base and its molding die |
| JPH0267116A (en) * | 1988-09-01 | 1990-03-07 | Meiki Co Ltd | Die for molding disc |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0763991B2 (en) | 1995-07-12 |
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