JPH01264226A - Washing apparatus of semiconductor substrate - Google Patents
Washing apparatus of semiconductor substrateInfo
- Publication number
- JPH01264226A JPH01264226A JP9251988A JP9251988A JPH01264226A JP H01264226 A JPH01264226 A JP H01264226A JP 9251988 A JP9251988 A JP 9251988A JP 9251988 A JP9251988 A JP 9251988A JP H01264226 A JPH01264226 A JP H01264226A
- Authority
- JP
- Japan
- Prior art keywords
- water
- washing
- liquid
- valve
- drainage
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005406 washing Methods 0.000 title claims abstract description 45
- 239000004065 semiconductor Substances 0.000 title claims abstract description 29
- 239000000758 substrate Substances 0.000 title claims description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 63
- 239000000126 substance Substances 0.000 claims abstract description 34
- 230000000694 effects Effects 0.000 claims description 6
- 239000007788 liquid Substances 0.000 abstract description 26
- 238000000034 method Methods 0.000 abstract description 4
- 235000012431 wafers Nutrition 0.000 description 19
- 238000010586 diagram Methods 0.000 description 8
- 238000012993 chemical processing Methods 0.000 description 3
- 230000003749 cleanliness Effects 0.000 description 3
- 238000011010 flushing procedure Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000007865 diluting Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000006386 neutralization reaction Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 239000008400 supply water Substances 0.000 description 1
Landscapes
- Cleaning By Liquid Or Steam (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は半導体製造工程に使用される半導体基板（以下
、半導体ウェハーという）の水洗装置に関するものであ
る。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a water washing apparatus for semiconductor substrates (hereinafter referred to as semiconductor wafers) used in semiconductor manufacturing processes.
半導体製造工程において、半導体つ°エバーを直接化学
薬液に浸し処理する工程がある０本工程の処理装置は薬
液槽、水洗槽、乾燥器を有しており、薬液槽では化学薬
液と半導体つ、エバー表面の化学反応により処理を行な
い、水洗槽では薬液処理後の薬液を洗い流し乾燥器では
水洗後の乾燥を行なう。In the semiconductor manufacturing process, the processing equipment for the 0-step process, in which semiconductor substrates are directly immersed in chemical solutions, has a chemical bath, a washing tank, and a dryer. The treatment is carried out through a chemical reaction on the surface of the EVER, and the chemical solution after chemical treatment is washed away in the washing tank and dried after washing in the dryer.
従来、この水洗槽ではオーバーフロー付のクイックダン
プ式の構造で、水洗水には純水が使用されるのが一般的
であり、薬液処理後の半導体ウェハーの清浄度はその時
使用される純水の水質に依存するといわれている。Conventionally, this washing tank has a quick dump type structure with an overflow, and pure water is generally used as the washing water, and the cleanliness of semiconductor wafers after chemical treatment depends on the pure water used at that time. It is said to depend on water quality.
その水洗のシーケンスは以下のとおりである。The water washing sequence is as follows.
半導体ウェハーが投入されるまでは雰囲気中より降了し
、水面に浮遊する塵埃を純水とともにオーバーフローさ
せるため、常時底部より純水が給水される。半導体ウェ
ハーが水洗槽に投入されると、一定設定時間純水が給水
され、その後、槽内の純水を一挙に排水給水をする置換
を行なう０通常、この置換を３〜５回繰返す、置換を繰
返すことにより水洗槽内の清浄度は増し、半導体ウェハ
ー表面に付着して持込まれた薬液は洗い流される。Until semiconductor wafers are introduced, pure water is constantly supplied from the bottom to allow dust that falls from the atmosphere and floats on the water surface to overflow with the pure water. When a semiconductor wafer is placed in a washing tank, pure water is supplied for a set period of time, and then the pure water in the tank is drained and supplied all at once.Normally, this replacement is repeated 3 to 5 times. By repeating this process, the cleanliness inside the washing tank increases, and the chemical solution that has adhered to the semiconductor wafer surface and is brought in is washed away.
従来例を図を用いて説明する。A conventional example will be explained using figures.
第４図と第５図は従来の水洗装置の構造図とジ−ケンス
図である。4 and 5 are a structural diagram and sequence diagram of a conventional water washing device.
第４図に示すように、従来の水洗装置においては、オー
バーフロー槽１に給水配管３、排水配管２、オーバーフ
ロー排水配管７が接続され、給水配管３、排水配管２に
は給水弁５、バイパス弁６、排水弁４がそれぞれ取付け
られている。As shown in FIG. 4, in the conventional flushing device, a water supply pipe 3, a drainage pipe 2, and an overflow drainage pipe 7 are connected to an overflow tank 1, and a water supply valve 5 and a bypass valve are connected to the water supply pipe 3 and the drainage pipe 2. 6. Drain valves 4 are installed respectively.
半導体ウェハー８が投入されるまでは、バイパス弁６、
給水配管３を通りオーバーフロー槽１に給水され、オー
バーフローし、オーバーフロー排水配管７を通り排水さ
れる。Until the semiconductor wafer 8 is introduced, the bypass valve 6,
Water is supplied to the overflow tank 1 through the water supply pipe 3, overflows, and drained through the overflow drainage pipe 7.
半導体ウェハー８が投入されると、一定設定時間給水弁
５が開き給水配管３を通りオーバーフロー槽１に給水さ
れる。一定設定時間経過後、給水弁５か閉じ、排水弁４
が開き、オーバーフロー槽１の純水は排水される。排水
後、排水弁４は閉じ、給水弁５が開き給水される。When the semiconductor wafer 8 is introduced, the water supply valve 5 is opened for a predetermined period of time, and water is supplied to the overflow tank 1 through the water supply pipe 3. After a certain set time has passed, the water supply valve 5 is closed and the drain valve 4 is closed.
is opened, and the pure water in the overflow tank 1 is drained. After draining water, the drain valve 4 is closed, and the water supply valve 5 is opened to supply water.
この排水、給水の動作を３〜５回繰返すことにより、置
換を繰返し行い、半導体ウェハー８の表面に付着して持
込まれた薬液は純水により洗われ槽外に排出され、オー
バーフロー槽１内の清浄度は増す。By repeating this draining and water supplying operation 3 to 5 times, replacement is repeated, and the chemical solution that adheres to the surface of the semiconductor wafer 8 and is brought in is washed with pure water and discharged to the outside of the tank. Cleanliness increases.
上述した従来の水洗装置ηにおいては、半導体ウェハー
に付着した薬液を除去するために純水を使用し、表面よ
り徐々に希釈しながら行なっていた。In the above-mentioned conventional water washing apparatus η, pure water is used to remove the chemical solution adhering to the semiconductor wafer, and the water is gradually diluted from the surface.
そのため、水洗効果は薬液の純水への溶解度に大きく依
存した。Therefore, the water washing effect largely depended on the solubility of the chemical solution in pure water.
粘性が高く溶解度の低い薬液処理を行なう工程の水洗に
おいては、薬液除去が即座に行なわれず、水洗中にもか
かわらず、半導体ウェハー表面の薬液処理が進行してし
まう、また、水洗用の純水量が多証に必要であり、また
、水洗時間が長時間必要であるなどの欠点があった。During water washing, which is a process that involves chemical processing with high viscosity and low solubility, the chemical solution is not removed immediately, and the chemical processing on the surface of the semiconductor wafer progresses even during washing. However, there are drawbacks such as the need for multiple tests and the need for a long washing time.
本発明の目的は前記問題点を解消した半導体ウェハーの
水洗装置を提供することにある。SUMMARY OF THE INVENTION An object of the present invention is to provide a semiconductor wafer washing apparatus that solves the above-mentioned problems.
上述した従来の水洗装置においては、半導体ウェハーに
付着した薬液を純水の希釈により除去していたのに対し
、本発明は水洗処理の開始時に半導体ウェハーに付着し
た薬液を中和し、溶解度を高くしなという相違点を有し
ている。In the conventional water washing apparatus described above, the chemical solution adhering to the semiconductor wafer was removed by diluting it with pure water, whereas the present invention neutralizes the chemical solution adhering to the semiconductor wafer at the start of the water washing process and reduces the solubility. The difference is that it is tall and thin.
上記目的を達成するため、本発明の水洗装置において、
化学薬液に浸漬処理した後の半導体基板を水洗する水洗
装置において、水洗処理開始時にオーバーフロー槽内の
水洗水に薬液を給液し、水洗水と混合することにより水
洗効果を高める薬液槽を装備したものである。In order to achieve the above object, in the water washing device of the present invention,
A washing device that washes semiconductor substrates after being immersed in a chemical solution is equipped with a chemical tank that increases the washing effect by supplying the chemical into the washing water in the overflow tank at the start of the washing process and mixing it with the washing water. It is something.
次に本発明について図面を用いて説明する。 Next, the present invention will be explained using the drawings.
（実施例１）
第１図と第２図は本発明の水洗装置の構造図とシーケン
ス図である。(Example 1) FIG. 1 and FIG. 2 are a structural diagram and a sequence diagram of a water washing device of the present invention.
第１図に示すように、本発明の水洗装置において、オー
バーフロー槽１に給水配管３、排水配管２、オーバーフ
ロー排水配管７及び給液配管１０が接続され、給液配管
１０には薬液槽９及び給液弁１１が取付けられている。As shown in FIG. 1, in the flushing apparatus of the present invention, an overflow tank 1 is connected to a water supply pipe 3, a drainage pipe 2, an overflow drainage pipe 7, and a liquid supply pipe 10, and a chemical liquid tank 9 and a liquid supply pipe 10 are connected to the liquid supply pipe 10. A liquid supply valve 11 is attached.
半導体ウェハー８が投入されるまでは、バイパス弁６、
給水配管３を通り、オーバーフロー槽１に給水され、オ
ーバーフローし、オーバーフロー排水配管７を通り排水
される。Until the semiconductor wafer 8 is introduced, the bypass valve 6,
Water is supplied to the overflow tank 1 through the water supply pipe 3, overflows, and drained through the overflow drainage pipe 7.
半導体ウェハー８か投入されると、一定設定時間給液弁
１１が開き、給液配管１０を通りオーバーフロー槽１に
薬液が給液され、給液弁１１は閉じる。When the semiconductor wafer 8 is loaded, the liquid supply valve 11 is opened for a predetermined period of time, the chemical liquid is supplied to the overflow tank 1 through the liquid supply pipe 10, and the liquid supply valve 11 is closed.
一定設定時間経過後、排水弁４か開き、オーバーフロー
槽１内は排水される。排水後、排水弁４は閉じ、。給水
弁５が開き給水される。After a certain set time has elapsed, the drain valve 4 is opened and the overflow tank 1 is drained. After draining water, the drain valve 4 is closed. The water supply valve 5 opens and water is supplied.
この排水、給水の動作を２〜４回繰返す。Repeat this draining and watering operation 2 to 4 times.
（実施例２） 第３図は本発明の実施例２の構造図である。(Example 2) FIG. 3 is a structural diagram of a second embodiment of the present invention.
定量給液ポンプ１２は、給液配管１０に取付ζＪられ、
給液時は薬液タンク１３より薬液を吸い上げ、本水洗装
置に給液する。The metering liquid supply pump 12 is attached to the liquid supply pipe 10,
At the time of liquid supply, the chemical liquid is sucked up from the chemical liquid tank 13 and is supplied to the main washing device.
本実施例では給液動作を薬液槽から落差にて行なうので
はなく、移動式の薬液タンクより定量給液ポンプにて一
定量給液を行なうことが可能である。そのため、水洗装
置の純水に給液する薬液量のばらつきが減少し、実施例
１の装置において薬液量が少量の時、半導体ウェハーに
付着して持ち込まれた薬液との中和が行なわれず、水洗
が充分に行なわれなかったり、薬液量が過多になり、水
洗後も薬液が残ってしまう欠点がなくなり、水洗が充分
に行なわれるという利点がある。In this embodiment, the liquid supply operation is not carried out by dropping from the chemical liquid tank, but it is possible to supply a fixed amount of liquid from a mobile chemical liquid tank using a metering liquid supply pump. Therefore, variations in the amount of chemical solution supplied to the pure water of the water washing device are reduced, and when the amount of chemical solution is small in the device of Example 1, neutralization with the chemical solution brought in adhering to the semiconductor wafer is not performed. This eliminates the disadvantages of insufficient water washing, excessive amount of chemical solution, and residual chemical solution even after water washing, and the advantage that water washing can be performed sufficiently.
以上説明したように本発明は半導体ウェハーに付着した
薬液を中和かつ水溶性にするため、短時間で水洗を行な
うことができ、水洗中における半導体ウェハーの表面の
薬液処理の進行を極端に少なくし、また水洗用の純水量
を少量にする効果がある。特に粘性が高く、溶解度の低
い薬液処理後の水洗においては、本装置での水洗時間を
極端に短くすることができる効果を有する。As explained above, the present invention neutralizes the chemical solution adhering to the semiconductor wafer and makes it water-soluble, so it can be washed with water in a short time, and the progress of chemical processing on the surface of the semiconductor wafer during washing can be extremely reduced. It also has the effect of reducing the amount of pure water used for washing. In particular, when washing with water after treatment with a chemical solution having high viscosity and low solubility, this device has the effect of extremely shortening the washing time.
第１図は本発明の実施例１を示す構造図、第２図は本発
明のタイミングチャート図、第３図は本発明の実施例２
を示す構造図、第４図は従来例を示す構造図、第５図は
タイミングチャート図である。
１・・・オーバーフロー槽 ２・・・排水配管３・・
・給水配管 ４・・・排水弁５・・・給水弁
６・・・バイパス弁７・・・排水配管
８・・・半導体ウェハー９・・・薬液槽
１０・・・給液配管１１・・・給液弁
特許出願人 日本電気株式会社
スタート
エンド第２図
／Ｚ、定量希液ポンプ
第３図
第４図FIG. 1 is a structural diagram showing a first embodiment of the present invention, FIG. 2 is a timing chart diagram of the present invention, and FIG. 3 is a second embodiment of the present invention.
4 is a structural diagram showing a conventional example, and FIG. 5 is a timing chart. 1... Overflow tank 2... Drainage piping 3...
・Water supply pipe 4...Drain valve 5...Water supply valve 6...Bypass valve 7...Drain pipe
8... Semiconductor wafer 9... Chemical solution tank
10...Liquid supply pipe 11...Liquid supply valve Patent applicant Started by NEC Corporation
End figure 2/Z, metering diluted liquid pump figure 3 figure 4
Claims (1)
る水洗装置において、水洗処理開始時にオーバーフロー
槽内の水洗水に薬液を給液し、水洗水と混合することに
より水洗効果を高める薬液槽を装備したことを特徴とす
る半導体基板の水洗装置。(1) In a washing device that washes semiconductor substrates that have been immersed in a chemical solution, the chemical solution is supplied to the washing water in the overflow tank at the start of the washing process, and the chemical solution is mixed with the washing water to enhance the washing effect. A semiconductor substrate washing device characterized by being equipped with.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9251988A JPH01264226A (en) | 1988-04-14 | 1988-04-14 | Washing apparatus of semiconductor substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9251988A JPH01264226A (en) | 1988-04-14 | 1988-04-14 | Washing apparatus of semiconductor substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01264226A true JPH01264226A (en) | 1989-10-20 |
Family
ID=14056579
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9251988A Pending JPH01264226A (en) | 1988-04-14 | 1988-04-14 | Washing apparatus of semiconductor substrate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01264226A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04207031A (en) * | 1990-11-30 | 1992-07-29 | Sharp Corp | Cleaning method for semiconductor substrate |
| US5881748A (en) * | 1994-03-28 | 1999-03-16 | Shin-Etsu Handotai Co. Ltd. | Apparatus for rinsing wafers adhered with chemical liquid by use of purified water |
-
1988
- 1988-04-14 JP JP9251988A patent/JPH01264226A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04207031A (en) * | 1990-11-30 | 1992-07-29 | Sharp Corp | Cleaning method for semiconductor substrate |
| JP2573418B2 (en) * | 1990-11-30 | 1997-01-22 | シャープ株式会社 | Semiconductor substrate cleaning method |
| US5881748A (en) * | 1994-03-28 | 1999-03-16 | Shin-Etsu Handotai Co. Ltd. | Apparatus for rinsing wafers adhered with chemical liquid by use of purified water |
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