JPH01262638A - Sucking pad - Google Patents
Sucking padInfo
- Publication number
- JPH01262638A JPH01262638A JP63092128A JP9212888A JPH01262638A JP H01262638 A JPH01262638 A JP H01262638A JP 63092128 A JP63092128 A JP 63092128A JP 9212888 A JP9212888 A JP 9212888A JP H01262638 A JPH01262638 A JP H01262638A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- handling
- sucking pad
- resin
- suction pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims abstract description 17
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 12
- 239000011521 glass Substances 0.000 claims abstract description 12
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 12
- 239000010703 silicon Substances 0.000 claims abstract description 12
- 229920005989 resin Polymers 0.000 claims abstract description 8
- 239000011347 resin Substances 0.000 claims abstract description 8
- 235000012431 wafers Nutrition 0.000 claims description 11
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 244000043261 Hevea brasiliensis Species 0.000 abstract description 4
- 229920003052 natural elastomer Polymers 0.000 abstract description 4
- 229920001194 natural rubber Polymers 0.000 abstract description 4
- 239000004065 semiconductor Substances 0.000 abstract description 4
- 229920005992 thermoplastic resin Polymers 0.000 abstract description 4
- 229920001187 thermosetting polymer Polymers 0.000 abstract description 4
- 238000000465 moulding Methods 0.000 abstract description 3
- 239000003795 chemical substances by application Substances 0.000 abstract description 2
- 238000013329 compounding Methods 0.000 abstract description 2
- 230000005611 electricity Effects 0.000 abstract description 2
- 239000011888 foil Substances 0.000 abstract description 2
- 239000000843 powder Substances 0.000 abstract description 2
- 239000002994 raw material Substances 0.000 abstract description 2
- 230000003068 static effect Effects 0.000 abstract description 2
- 230000015556 catabolic process Effects 0.000 abstract 2
- 239000003921 oil Substances 0.000 abstract 1
- 229920000642 polymer Polymers 0.000 abstract 1
- 229920003002 synthetic resin Polymers 0.000 abstract 1
- 239000000057 synthetic resin Substances 0.000 abstract 1
- 239000012212 insulator Substances 0.000 description 6
- 239000004020 conductor Substances 0.000 description 4
- 239000002184 metal Substances 0.000 description 3
- 229920003051 synthetic elastomer Polymers 0.000 description 3
- 239000005061 synthetic rubber Substances 0.000 description 3
- 229920001940 conductive polymer Polymers 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000004094 surface-active agent Substances 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 230000003449 preventive effect Effects 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
Landscapes
- Manipulator (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、半導体製造等の工程においてシリコンウェハ
ー、ガラス基板等のハンドリングに使用する吸着パッド
に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a suction pad used for handling silicon wafers, glass substrates, etc. in processes such as semiconductor manufacturing.
従来の吸着パッドは、ゴム、ナイロン等の樹脂材料で構
成されているものが知られていた。Conventional suction pads are known to be made of resin materials such as rubber and nylon.
しかし、前述の従来技術では吸着パッドが吸着している
対象物からはなれるときに帯電し次の吸着するものに近
ｆ寸いた時に、その対象物を帯電させ静電気破壊の原因
をつくると言う問題点を有する。そこで本発明はこのよ
うな問題点を解決するものでその目的は、半導体製造等
の工程においてシリコンウェハー、ガラス基板等のハン
ドリング時の基板上の素子の静電気破壊を防止すること
にある。However, with the above-mentioned conventional technology, there is a problem in that when the suction pad separates from the object it is adsorbing, it becomes electrically charged, and when it approaches the next object to be adsorbed, it charges the object, causing electrostatic damage. Has a point. The present invention is intended to solve these problems, and its purpose is to prevent electrostatic damage to elements on substrates during handling of silicon wafers, glass substrates, etc. in semiconductor manufacturing processes.
本発明の吸着パッドは、シリコンウェハー、ガラス基板
等のハンドリングに使用する吸着パッドにおいて、該吸
着パッドが導電性を付与した樹脂で形成されたことを特
徴とする。The suction pad of the present invention is a suction pad used for handling silicon wafers, glass substrates, etc., and is characterized in that the suction pad is made of a resin imparted with conductivity.
ふたつの絶縁体または電気的に絶縁されている物を密着
させ、それらを引き離すとき辷それらは帯電する。半導
体製造等の工程においてシリコンウェハー、ガラス基板
等のバンドリング時には絶縁体である吸着パッドと絶縁
体であるシリコンウエバー、ガラス基板等は密着と離れ
ることを繰り返えしている。このためシリコンウェハー
、ガラス基板等には、かなりの分極電荷が存在するよう
になる。この分極電荷により、配線上に電荷が誘起され
る。この状態の時に配線がアースされたり、容量の大き
な導体に触れたりすると、電流が流れ素子が破壊される
。この防止策として、シリコンウェハー、ガラス基板等
を帯電させない一方法として、吸着パッドを導電性にす
れば絶縁体であるシリコンウェハー、ガラス基板等に電
荷を誘起させる絶縁体の電場が存在しなくなるため、シ
リコンウェハー、ガラス基板上等の分極電荷は存在しな
くなる。このため配線上に電荷が誘起されることもなく
なり素子の破壊も起らなくなる。When two insulators or electrically insulated objects are brought into close contact and pulled apart, they become charged. BACKGROUND ART During bundling of silicon wafers, glass substrates, etc. in processes such as semiconductor manufacturing, suction pads, which are insulators, and silicon wafers, glass substrates, etc., which are insulators, repeatedly come into close contact and separate from each other. For this reason, silicon wafers, glass substrates, and the like come to have a considerable amount of polarized charge. This polarized charge induces charges on the wiring. If the wiring is grounded or touches a conductor with large capacity in this state, current will flow and the device will be destroyed. As a preventive measure, one way to prevent charging of silicon wafers, glass substrates, etc. is to make the suction pad conductive, since the electric field of the insulator that induces charges in the silicon wafer, glass substrate, etc., which is an insulator, will no longer exist. , polarized charges on silicon wafers, glass substrates, etc. no longer exist. Therefore, charges are not induced on the wiring, and the device does not break down.
〔実 施 例 １〕
天然ゴム、合成ゴム、熱可塑性樹脂、熱硬化性樹脂で吸
着パッドを成型する場合、成型前の原材料に配合剤とし
て、金属粉末または金属箔または導電性をもつ高分子ポ
リマーまたは導電性をもつ高分子モノマーまたは炭素ま
たは界面活性剤を工％〜９０％配合し吸着パッドを成型
した。[Example 1] When molding a suction pad using natural rubber, synthetic rubber, thermoplastic resin, or thermosetting resin, metal powder, metal foil, or conductive polymer is added as a compounding agent to the raw materials before molding. Alternatively, an adsorption pad was formed by blending a conductive polymer monomer, carbon, or surfactant in an amount of 90% to 90%.
〔実 施 例 ２〕
天然ゴム、合成ゴム、熱可塑性樹脂、熱硬化性樹脂で吸
着パッドを形成した後、界面活性剤を表面に塗布し導電
性を付与した。[Example 2] After a suction pad was formed from natural rubber, synthetic rubber, thermoplastic resin, and thermosetting resin, a surfactant was applied to the surface to impart conductivity.
〔実 施 例 ３〕
天然ゴム、合成ゴム、熱可塑性樹脂、熱硬化性樹脂で吸
着パッドを形成した後表面に金属膜を形成し導電性を付
与した。[Example 3] After a suction pad was formed using natural rubber, synthetic rubber, thermoplastic resin, or thermosetting resin, a metal film was formed on the surface to impart conductivity.
以上の各実施例の吸着パッドを、シリコンウェハーのハ
ンドリングや、ＩＴＯ等の透明電極が形成されたガラス
基板のハンドリングに使用したが、基板上の素子の静電
気による破壊はなかった。The suction pads of the above examples were used for handling silicon wafers and glass substrates on which transparent electrodes such as ITO were formed, but no elements on the substrate were destroyed by static electricity.
以上述べたように本発明によれば、吸着パッドに導電性
を付与することにより、二つの絶縁体が密着と離れるこ
とを繰り返す時に帯電して導体配線上に電荷のアンバラ
ンスを生じ、この状態の時導体配線がアースまたは容量
の大きな導体に接続されたときに起こる静電気破壊を防
ぐという優れた効果を有する。As described above, according to the present invention, by imparting conductivity to the suction pad, when two insulators are repeatedly brought into close contact with each other and then separated from each other, they are charged, causing an imbalance of charge on the conductor wiring, and this state It has the excellent effect of preventing electrostatic damage that occurs when conductor wiring is connected to ground or a conductor with large capacity.
以上 出願人 セイコーエプソン株式会社that's all Applicant: Seiko Epson Corporation
Claims (1)
用する吸着パッドにおいて、該吸着パッドが導電性を付
与した樹脂で形成されたことを特徴とする吸着パッド。A suction pad used for handling silicon wafers, glass substrates, etc., characterized in that the suction pad is made of a resin imparted with conductivity.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63092128A JPH01262638A (en) | 1988-04-14 | 1988-04-14 | Sucking pad |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63092128A JPH01262638A (en) | 1988-04-14 | 1988-04-14 | Sucking pad |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01262638A true JPH01262638A (en) | 1989-10-19 |
Family
ID=14045798
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63092128A Pending JPH01262638A (en) | 1988-04-14 | 1988-04-14 | Sucking pad |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01262638A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0425100A (en) * | 1990-05-16 | 1992-01-28 | Nec Kyushu Ltd | Suction pad |
| JPH0432888U (en) * | 1990-07-11 | 1992-03-17 | ||
| JPH0447989U (en) * | 1990-08-28 | 1992-04-23 | ||
| JPH0531694A (en) * | 1991-06-20 | 1993-02-09 | Fuji Photo Film Co Ltd | Sucker |
| JPH07156035A (en) * | 1993-11-17 | 1995-06-20 | Ckd Corp | Adsorbing plate of vacuum chuck and manufacture thereof |
| JP2007128967A (en) * | 2005-11-01 | 2007-05-24 | Shin Etsu Polymer Co Ltd | Suction pad for semiconductor wafer |
| JP2007324449A (en) * | 2006-06-02 | 2007-12-13 | Shin Etsu Polymer Co Ltd | Suction pad for semiconductor wafer |
-
1988
- 1988-04-14 JP JP63092128A patent/JPH01262638A/en active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0425100A (en) * | 1990-05-16 | 1992-01-28 | Nec Kyushu Ltd | Suction pad |
| JPH0432888U (en) * | 1990-07-11 | 1992-03-17 | ||
| JPH0447989U (en) * | 1990-08-28 | 1992-04-23 | ||
| JPH0531694A (en) * | 1991-06-20 | 1993-02-09 | Fuji Photo Film Co Ltd | Sucker |
| JPH07156035A (en) * | 1993-11-17 | 1995-06-20 | Ckd Corp | Adsorbing plate of vacuum chuck and manufacture thereof |
| JP2007128967A (en) * | 2005-11-01 | 2007-05-24 | Shin Etsu Polymer Co Ltd | Suction pad for semiconductor wafer |
| JP4675213B2 (en) * | 2005-11-01 | 2011-04-20 | 信越ポリマー株式会社 | Suction pad for semiconductor wafer |
| JP2007324449A (en) * | 2006-06-02 | 2007-12-13 | Shin Etsu Polymer Co Ltd | Suction pad for semiconductor wafer |
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