JPH01255290A - Metal base wiring substrate - Google Patents
Metal base wiring substrateInfo
- Publication number
- JPH01255290A JPH01255290A JP8342188A JP8342188A JPH01255290A JP H01255290 A JPH01255290 A JP H01255290A JP 8342188 A JP8342188 A JP 8342188A JP 8342188 A JP8342188 A JP 8342188A JP H01255290 A JPH01255290 A JP H01255290A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- base material
- amorphous alloy
- dustlike
- metal foil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 22
- 239000002184 metal Substances 0.000 title claims abstract description 22
- 239000000758 substrate Substances 0.000 title description 2
- 239000000463 material Substances 0.000 claims abstract description 15
- 229910000808 amorphous metal alloy Inorganic materials 0.000 claims abstract description 13
- 239000011888 foil Substances 0.000 claims abstract description 9
- 229920005989 resin Polymers 0.000 abstract description 12
- 239000011347 resin Substances 0.000 abstract description 12
- 230000000694 effects Effects 0.000 abstract description 7
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 abstract description 6
- 229910004337 Ti-Ni Inorganic materials 0.000 abstract description 5
- 229910011209 Ti—Ni Inorganic materials 0.000 abstract description 5
- 229910052782 aluminium Inorganic materials 0.000 abstract description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract description 5
- KHYBPSFKEHXSLX-UHFFFAOYSA-N iminotitanium Chemical compound [Ti]=N KHYBPSFKEHXSLX-UHFFFAOYSA-N 0.000 abstract description 5
- 229910045601 alloy Inorganic materials 0.000 abstract description 4
- 239000000956 alloy Substances 0.000 abstract description 4
- 238000000465 moulding Methods 0.000 abstract description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 3
- 239000011230 binding agent Substances 0.000 abstract description 3
- 239000004744 fabric Substances 0.000 abstract description 3
- 229910052742 iron Inorganic materials 0.000 abstract description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 abstract description 3
- 239000000843 powder Substances 0.000 abstract description 3
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 abstract description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 abstract description 2
- 229910052802 copper Inorganic materials 0.000 abstract description 2
- 239000010949 copper Substances 0.000 abstract description 2
- 229930003836 cresol Natural products 0.000 abstract description 2
- 239000000835 fiber Substances 0.000 abstract description 2
- 229910052752 metalloid Inorganic materials 0.000 abstract description 2
- 150000002738 metalloids Chemical class 0.000 abstract description 2
- 239000002245 particle Substances 0.000 abstract description 2
- 239000005011 phenolic resin Substances 0.000 abstract description 2
- 229920005992 thermoplastic resin Polymers 0.000 abstract description 2
- 229920001187 thermosetting polymer Polymers 0.000 abstract description 2
- 229910052725 zinc Inorganic materials 0.000 abstract description 2
- 239000011701 zinc Substances 0.000 abstract description 2
- 230000008878 coupling Effects 0.000 abstract 4
- 238000010168 coupling process Methods 0.000 abstract 4
- 238000005859 coupling reaction Methods 0.000 abstract 4
- 239000002131 composite material Substances 0.000 abstract 1
- 239000003822 epoxy resin Substances 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- 229910000976 Electrical steel Inorganic materials 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 238000007596 consolidation process Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- 229920000742 Cotton Polymers 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- 206010041349 Somnolence Diseases 0.000 description 1
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical group C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 239000010425 asbestos Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 1
- ZZTCPWRAHWXWCH-UHFFFAOYSA-N diphenylmethanediamine Chemical compound C=1C=CC=CC=1C(N)(N)C1=CC=CC=C1 ZZTCPWRAHWXWCH-UHFFFAOYSA-N 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000008187 granular material Substances 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000012784 inorganic fiber Substances 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- -1 polyacrylic Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920006380 polyphenylene oxide Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000012209 synthetic fiber Substances 0.000 description 1
- 229920002994 synthetic fiber Polymers 0.000 description 1
- 229920006305 unsaturated polyester Polymers 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000002759 woven fabric Substances 0.000 description 1
- XOOUIPVCVHRTMJ-UHFFFAOYSA-L zinc stearate Chemical compound [Zn+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O XOOUIPVCVHRTMJ-UHFFFAOYSA-L 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は′眠気機器、電子機２ｇ５通信機器、計算機器
等に用いられる金属ベース配線基板に関するもので、特
にパワー関連や高周波回路部品に用いられる金属ベース
配線基板に関するものである。[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to a metal-based wiring board used for drowsiness equipment, electronic 2G5 communication equipment, computing equipment, etc., and particularly for use in power-related and high-frequency circuit parts. The present invention relates to a metal-based wiring board.
従来、金属ベース配線基板としては、珪素鋼板と金属箔
とを樹脂含浸基材を介して積層一体止したものや、アル
ミニウム板と金属箔とを樹脂含浸基材を介して積層一体
止したものが用いられていた。Conventionally, metal-based wiring boards include those in which a silicon steel plate and metal foil are laminated and bonded together via a resin-impregnated base material, and those in which an aluminum plate and metal foil are laminated and bonded together through a resin-impregnated base material. It was used.
従来の技術で述べたように、珪素鋼板をベースとするも
のにあっては磁気シールド効果はあるが、高周波が配線
基板に流れると渦電流が発生し、その損失が発熱となる
ため、パワー関連や高周波回路部品に用いることが出来
ないという問題があり、アルミニウム板をベースとする
ものにあっては磁気シールド効果がなく、且つ高周波に
よって発熱するためパワー関連や高周波回路部品に用い
ることができないという問題があった。本発明は従来の
技術における上述の問題点に鑑みてなされたもので、そ
の目的とするところは磁気シールド効果があり、高周波
によっても発熱のない金属ベース配４１１１基板を提供
することにある。As mentioned in the conventional technology section, silicon steel plate-based materials have a magnetic shielding effect, but when high frequency waves flow through the wiring board, eddy currents are generated, and the loss becomes heat generation, so it is difficult to use power-related materials. There is a problem that it cannot be used for power-related or high-frequency circuit components, and those based on aluminum plates have no magnetic shielding effect and generate heat due to high frequencies, so they cannot be used for power-related or high-frequency circuit components. There was a problem. The present invention has been made in view of the above-mentioned problems in the prior art, and its purpose is to provide a metal-based 4111 board that has a magnetic shielding effect and does not generate heat even at high frequencies.
本発明はダスト状アモルファス合金固結板に、樹脂含浸
基材を介して金属箔を配設一体化してなることを特徴と
する金属ベース配線基板のため、磁気シールド効果があ
り且つ渦電流の発生を阻止することができるので発熱を
防止することができたもので、以下本発明の詳細な説明
する。The present invention is a metal-based wiring board that is formed by integrally disposing metal foil on a dust-like amorphous alloy solidified plate through a resin-impregnated base material, which has a magnetic shielding effect and generates eddy current. The present invention will be described in detail below.
本発明のダスト状アモルファス合金固結板としては、１
〜９０ミクロンの粉状、粒状、針状のＦｅ−２％Ｆｅ−
Ｂ等のメタＡ／％メタロイド系やＣｕ−Ｚｖ、Ｔｉ −
Ｎｉ等の合金等からなるアモルファス合金粉に０．１〜
ｌＯ重社％（以下単に％と記す）の熱可塑性樹脂、熱硬
化性樹脂等のバインダーを添加、混合し厚み０．１〜１
０ ＩＭの板状に加圧成形したものであるが必要に応じ
て離型剤を少量添加して成形性を向上させることもでき
る。加圧成形に際しては必要に応じて加熱し、更に固結
板を必要に応じて加熱乃至焼成してもよい。なお固結板
表面を粗面化処理して接着性を向上させることもできる
。The dust-like amorphous alloy consolidated plate of the present invention includes 1
~90 micron powder, granule, needle-like Fe-2%Fe-
Meta A/% metalloid systems such as B, Cu-Zv, Ti −
0.1 to amorphous alloy powder made of alloys such as Ni
A binder such as a thermoplastic resin or a thermosetting resin of 10% (hereinafter simply referred to as %) is added and mixed to a thickness of 0.1 to 1.
0 IM plate shape, but if necessary, a small amount of mold release agent may be added to improve moldability. During pressure molding, heating may be performed as necessary, and the solidified plate may be further heated or fired as necessary. Note that the adhesion can also be improved by roughening the surface of the consolidation plate.
樹脂含浸基材の樹脂としては、フェノール樹脂、クレゾ
ール樹脂、エポキシ樹脂、不飽和ポリエステ７ｖ樹脂、
メフミン樹脂、ポリイミド樹脂、フッ化樹脂、ポリフェ
ニレンオキサイド樹脂等の樹脂の単独、変性物、混合物
が用いられ必要に応じて粘度ｘ整に水、メチルアルコー
ル、アセトン、スチレンモノマー等の溶媒を添加したも
ので、更に必要に応じて無機充填剤等の充填剤を添加し
ておくこともできる。基材としてはガラス、アスベスト
等の無機繊維やポリエステル、ポリアクリル、ポリウレ
タン、ポリイミド、ポリアミド、ポリビニルアルコール
等の有機合成繊維や木綿等の天然繊維からなる織布、不
織布、マット、寒冷紗、ネット、紙等である。樹脂含浸
基材の厚みはα０５〜０．５絹がよく、樹脂含有量は乾
燥后で切〜６０％がよい。更に樹脂含浸基材の使用枚数
は通常１〜２枚であるが特に限定するものではない。金
属箔として１−ｊｉ４０．０１８〜０．０７１肩の銅、
アルミニウム、鉄、ニッケル、亜鉛等の単独、合金、複
合量であり、必要に応じて接着面を化学処理及び又は物
理処理し、更に必要に応じて接着剤層を設けたものであ
る。なお樹脂含浸基材、金属箔は固結板の片面丈に配設
してもよく、両面に配設してもよく任意である。一体化
手段としてはプレス、ロール、ダブルベルト等のように
積層一体止できるものであればよく特に限定するもので
はない。Examples of resins for the resin-impregnated base material include phenolic resin, cresol resin, epoxy resin, unsaturated polyester 7V resin,
Mehumine resin, polyimide resin, fluorinated resin, polyphenylene oxide resin, etc. alone, modified products, and mixtures are used, and if necessary, a solvent such as water, methyl alcohol, acetone, styrene monomer, etc. is added to adjust the viscosity. In addition, fillers such as inorganic fillers may be added as necessary. Base materials include woven fabrics, nonwoven fabrics, mats, cheesecloth, nets, and paper made of inorganic fibers such as glass and asbestos, organic synthetic fibers such as polyester, polyacrylic, polyurethane, polyimide, polyamide, and polyvinyl alcohol, and natural fibers such as cotton. etc. The thickness of the resin-impregnated base material is preferably α05 to 0.5 silk, and the resin content is preferably from 60% to 60% after drying. Further, the number of resin-impregnated substrates used is usually 1 to 2, but is not particularly limited. 1-ji40.018-0.071 shoulder copper as metal foil,
It is made of aluminum, iron, nickel, zinc, etc. alone, in alloys, or in combination, and the adhesive surface is chemically and/or physically treated as necessary, and an adhesive layer is further provided as necessary. Note that the resin-impregnated base material and the metal foil may be disposed on one side of the consolidation plate, or may be disposed on both sides as desired. The integration means is not particularly limited as long as it can be used to laminate them together, such as a press, roll, double belt, etc.
以下本発明を実施例にもとづいて説明する。The present invention will be explained below based on examples.
実施例
粒子径１０ミクロンのＴｉ−Ｎｉアモルファス合金扮９
７重量部（以下単に部と記す）に対し、エポキシ樹脂（
シェル化学株式会社製、品番エピコート８２８ ） １
００部、ジアミノジフェニルメタン５部、ステアリン酸
亜鉛１部からなるエポキシ樹脂バインダー３部を添加、
混合後、成形圧力８００ ｋｑ／ｃｉ、１６０°Ｃで印
分間加熱加圧成形して厚みｌＯのＴｉ−Ｎｉアモルファ
ス合金固結板を得た。次に該固定板の片面に、エポキシ
樹脂（ンエル化学株式会社製、品番エピコート１００１
） １００部、ジンアンジアミド４部、ベンジルジメ
チルアミン０．２部、メチルオキシト−３１００部から
なるエボキン樹月旨ワニスを厚み０．１５ｆｆのガラス
布に乾燥後の樹脂量が４５％になるように含浸、乾燥し
たエポキシ樹脂含浸ガフス布１枚を介して厚み０．０３
５Ｈの銅箔を配設した積層体を成形圧力１） ｋｔｉ／
ｃｄ、１６０”Ｃで（７）分間加熱加圧成形して金属ベ
ース配線基板を得た。Example Ti-Ni amorphous alloy with particle size of 10 microns 9
7 parts by weight (hereinafter simply referred to as parts), epoxy resin (
Manufactured by Shell Chemical Co., Ltd., product number Epicote 828) 1
00 parts, 3 parts of an epoxy resin binder consisting of 5 parts of diaminodiphenylmethane, and 1 part of zinc stearate,
After mixing, the mixture was heated and pressed at a molding pressure of 800 kq/ci and 160° C. to obtain a consolidated Ti-Ni amorphous alloy plate having a thickness of 1O. Next, apply epoxy resin (manufactured by Neru Kagaku Co., Ltd., product number Epicoat 1001) to one side of the fixing plate.
) 100 parts of ginandiamide, 0.2 parts of benzyl dimethylamine, and 3100 parts of methyl oxyto. Thickness 0.03 through one piece of impregnated and dried epoxy resin-impregnated gaff cloth
Molding pressure of a laminate with 5H copper foil 1) kti/
CD, 160''C for (7) minutes to obtain a metal base wiring board.
比較例１
実施例のＴｉ −Ｎｉアモルファス合金固結板を厚さＩ
ＮＨの珪素鋼板に変えた以外は実施例と同様に処理し
て金属ベース配線基板を得た。Comparative Example 1 The Ti-Ni amorphous alloy consolidated plate of the example was
A metal base wiring board was obtained in the same manner as in the example except that the NH silicon steel plate was used.
比較例２
実施例のＴｉ−Ｎｉアモルファス合金固結板を厚さＩ
Ｉｆｆのアルミニウム板に変えた以外は実施例と同様に
処理して金属ベース配線基板を得た。Comparative Example 2 The Ti-Ni amorphous alloy consolidated plate of the example was
A metal base wiring board was obtained in the same manner as in the example except that the aluminum plate of Iff was used.
実施例及び比較例１と２の金属ベース配線基板の性能は
第１表のようである。The performance of the metal-based wiring boards of Examples and Comparative Examples 1 and 2 is shown in Table 1.
第１表
〔発明の効果〕
本発明は上述した如く構成されている。特許請求の範囲
第１項に記載した構成を有する金属ベース配線基板にお
いては磁気シールド効果があり、且つ使用時の基板発熱
がないのでパワ部品、高周波回路部品に用いることがで
きる効果がある。Table 1 [Effects of the Invention] The present invention is constructed as described above. The metal-based wiring board having the configuration described in claim 1 has a magnetic shielding effect and does not generate heat during use, so it can be used for power components and high-frequency circuit components.
Claims (1)
材を介して金属箔を配設一体化してなることを特徴とす
る金属ベース配線基板。(1) A metal-based wiring board characterized by being formed by integrally disposing metal foil on a dust-like amorphous alloy solidified plate through a resin-impregnated base material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8342188A JPH01255290A (en) | 1988-04-05 | 1988-04-05 | Metal base wiring substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8342188A JPH01255290A (en) | 1988-04-05 | 1988-04-05 | Metal base wiring substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01255290A true JPH01255290A (en) | 1989-10-12 |
Family
ID=13801972
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8342188A Pending JPH01255290A (en) | 1988-04-05 | 1988-04-05 | Metal base wiring substrate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01255290A (en) |
-
1988
- 1988-04-05 JP JP8342188A patent/JPH01255290A/en active Pending
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