JPH01244467A - Method and device for press-fitting thin film - Google Patents
Method and device for press-fitting thin filmInfo
- Publication number
- JPH01244467A JPH01244467A JP63072959A JP7295988A JPH01244467A JP H01244467 A JPH01244467 A JP H01244467A JP 63072959 A JP63072959 A JP 63072959A JP 7295988 A JP7295988 A JP 7295988A JP H01244467 A JPH01244467 A JP H01244467A
- Authority
- JP
- Japan
- Prior art keywords
- thin film
- substrate
- pressure plate
- vacuum
- vacuum chamber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000010409 thin film Substances 0.000 title claims abstract description 42
- 238000000034 method Methods 0.000 title claims description 23
- 239000000758 substrate Substances 0.000 claims abstract description 53
- 230000002093 peripheral effect Effects 0.000 claims abstract description 5
- 238000002788 crimping Methods 0.000 claims description 33
- 238000010438 heat treatment Methods 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 4
- 239000013013 elastic material Substances 0.000 claims description 2
- 239000010408 film Substances 0.000 abstract description 33
- 230000003028 elevating effect Effects 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 8
- 230000037303 wrinkles Effects 0.000 description 7
- 230000000694 effects Effects 0.000 description 4
- 230000006835 compression Effects 0.000 description 3
- 238000007906 compression Methods 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011888 foil Substances 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 238000011144 upstream manufacturing Methods 0.000 description 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 230000002040 relaxant effect Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
Landscapes
- Lining Or Joining Of Plastics Or The Like (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)
- Laminated Bodies (AREA)
Abstract
Description
【発明の詳細な説明】
（］）発明の目的
〔産業上の利用分野〕
本発明は、薄膜を基板に圧着する技術に係り、特に、印
刷配線基板又はシリコン、ガリウムひ素ウェハ等の電子
回路用基板（以下、単に基板という）にＩくライフィル
ム（透光性樹脂フィル１１の）−′１層側面に感光性樹
脂層を設＋−＋たフィルｌＳ）を圧着する技術において
、圧着時に１〜ライフイル１１と基板との間に気泡が残
らないでかつ１くライフイル１１にしわを発生させない
圧着技術に関する。[Detailed Description of the Invention] (]) Purpose of the Invention [Field of Industrial Application] The present invention relates to a technology for pressure bonding a thin film to a substrate, particularly for use in electronic circuits such as printed wiring boards or silicon or gallium arsenide wafers. In the technique of crimping a photosensitive resin layer (1S) on the side surface of a photosensitive resin film (1 layer of transparent resin film 11) to a substrate (hereinafter simply referred to as a substrate), 1 layer is applied during crimping. -Relates to a crimping technique that does not leave air bubbles between the life foil 11 and the substrate and does not cause wrinkles in the life foil 11.
従来のドライフィルムと基板との圧着装置は、例えば、
特公昭５５−１３３４．１号公報に記載されるように、
真空室内でのｉｊ７撓性重性重合体状フィルム支持体着
されたフカＩ〜レジスト層と基板とを減圧状態に維持し
ているｌｌｉ口こ接触せしめたのち、前記支持体の反フ
カ１ヘレジス１へ層側から前記支持体と前記フカ−１−
レシス１〜層とを共に前記基板上に加圧して加熱する。Conventional dry film and substrate pressure bonding devices are, for example,
As described in Japanese Patent Publication No. 55-1334.1,
After contacting the resist layer and the substrate in a vacuum chamber, the adhesive layer attached to the flexible heavy polymeric film support is removed. From the layer side to the support body and the hook-1-
Resis 1 to layers are pressed together on the substrate and heated.
しかしながら、前記従来の圧着装置では、フカＩ〜レジ
ス１〜層を有するフィルム状支持体に大気をかけて加圧
する方法、又は重合体シー１〜を介して大気をかけて加
圧する方法がとられているが、１）ｉＩ記フィルム支持
体への加圧は大気圧によっているため、前記フカＩ−１
ノシスト層と前記基板との圧着が数箇所で瞬時的にかつ
統制のとオしない状態で始まり、前記フィルム状支持体
にしわが発生するという問題があった。However, in the conventional pressure bonding apparatus, a method is used in which the atmosphere is applied to a film-like support having layers of Hook I to Resist 1, or a method is applied in which air is applied to and pressurized through the polymer sheet 1. However, 1) Since the pressure on the film support described in iI is based on atmospheric pressure, the above-mentioned hook I-1
There was a problem in that the pressure bonding between the nocyst layer and the substrate started instantaneously and uncontrollably at several locations, causing wrinkles in the film-like support.
本発明は、前記問題点を解決するためになされたもので
ある。The present invention has been made to solve the above problems.
本発明の１」的は、薄膜と基板との間に気泡の残留がな
く、かつ１）訂記薄膜にしわを発生させることなく圧着
することかできる技術を提供することにある。The first object of the present invention is to provide a technique that allows no air bubbles to remain between the thin film and the substrate, and 1) that allows the thin film to be pressure-bonded without causing wrinkles.
本発明の他の目的は、ドライフィルムと基板との間に気
泡の残留がなくかつ前記フィルム状支持体にしわを発生
させることなく圧着することができる技術を提供するこ
とにある。Another object of the present invention is to provide a technique that allows pressure bonding between a dry film and a substrate without leaving any air bubbles between the dry film and the substrate and without causing wrinkles on the film-like support.
本発明の１前記ならびにその他の目的と新規な特徴は、
本明細再の記述及び添付図面によって明らかになるであ
ろう。The above and other objects and novel features of the present invention are as follows:
It will become clear from the description of this specification and the accompanying drawings.
〔課題を解決するための手段〕〕
本願において開示される発明のうち、代表的なものの概
要を簡単に説明すれば、次のとおりである。[Means for Solving the Problems] Among the inventions disclosed in this application, a brief overview of typical inventions is as follows.
すなわち、本発明は、薄膜を真空又は減圧された環境の
中で、基板−４二に圧着して積層体を形成する薄膜圧着
方法において、前記真空又は減圧された環境を形成可能
な真空室の中で薄膜と基板との圧着を基板中央部から基
板周縁部へと圧着面積を広げて行うことを主な特徴とす
る。That is, the present invention provides a thin film bonding method for forming a laminate by bonding a thin film to a substrate-4 in a vacuum or reduced pressure environment, in which a vacuum chamber capable of forming the vacuum or reduced pressure environment is provided. The main feature is that the thin film and the substrate are crimped by expanding the crimping area from the center of the substrate to the periphery of the substrate.
また、前記圧着方法により薄膜を基板に圧着して積層体
を形成した後、該積層体を加熱圧着することを特徴とす
る。The present invention is also characterized in that after a laminate is formed by crimping the thin film onto a substrate using the crimping method, the laminate is bonded under heat and pressure.
また、薄膜圧着装置において、薄膜を真空又は減圧され
た環境の中で、基板上に圧着して積層体を形成する薄膜
圧着装置において、前記真空又は減圧された環境を形成
可能な真空室の内部に、弾性相からなる支持部材の下面
に半円筒形状又は中央部分の厚みが周縁部より大なる半
球形状をその凸状部が下向になるように取付けられた上
圧力板と、該１−圧力板に比較して硬さのある材料から
なる平面状の昇降可能な下圧力板と、前記−１−圧力板
と下圧力板との間には薄膜と前記基板とを所定の間隔を
あけて保持する手段、前記真空室の内部の気体を排気し
て真空又は減圧状態にする手段、前記薄膜と基板とを所
定の湿度に加熱する手段、前記下圧力板を」二昇して薄
膜を前記上圧力板との間で所定の力で挟みつける手段を
設けたことを特徴とする。Further, in a thin film crimping apparatus, in which a thin film is crimped onto a substrate in a vacuum or reduced pressure environment to form a laminate, the interior of a vacuum chamber capable of forming the vacuum or reduced pressure environment is provided. an upper pressure plate having a semi-cylindrical shape or a hemispherical shape in which the central portion is thicker than the peripheral portion and is attached to the lower surface of the support member made of an elastic phase with the convex portion thereof facing downward; A planar lower pressure plate that is made of a material that is harder than the pressure plate and can be raised and lowered, and a thin film and the substrate are spaced at a predetermined distance between the pressure plate and the lower pressure plate. a means for holding the thin film in a vacuum or a reduced pressure state by evacuating the gas inside the vacuum chamber; a means for heating the thin film and the substrate to a predetermined humidity; The present invention is characterized in that a means is provided for pinching with a predetermined force between the upper pressure plate and the upper pressure plate.
前述の手段によれは、真空又は減圧された環境を形成可
能な真空室の中で＃膜と基板との圧着を基板中央部から
基板周縁部へと圧着面積を広げて行うので、薄膜と基板
との間に気泡の残留がなく、かつ薄膜にしわを発生させ
ることなく圧着することができる。According to the above-mentioned method, the # film and the substrate are crimped in a vacuum chamber that can create a vacuum or reduced pressure environment by expanding the crimping area from the center of the substrate to the periphery of the substrate. There are no air bubbles left between the two, and the thin film can be crimped without wrinkles.
以下、本発明の一実施例を図面に基づいて詳細に説明す
る。Hereinafter, one embodiment of the present invention will be described in detail based on the drawings.
なお、実施例を説明するための全図においで、同一機能
を有するものは同一符号を付け、その繰り返しの説明は
省略する。In addition, in all the figures for explaining the embodiment, parts having the same functions are given the same reference numerals, and repeated explanations thereof will be omitted.
第１図は、本発明詮ドライフィルム圧着方法及びその実
施装置に適用した実施例Ｉのドライフィルム圧着装置の
概略構成を説明するための断面図、第２図は、第１図に
示すドライフィル１１圧着装置を説明するための要部断
面図である。FIG. 1 is a cross-sectional view for explaining the schematic structure of a dry film crimping device of Example I applied to the dry film crimping method and its implementation device according to the present invention, and FIG. 2 is a sectional view of the dry film crimping method shown in FIG. 11 is a sectional view of a main part for explaining the crimping device.
本実施例Ｉのトライフィルム圧着装置は、第１−図に示
すように、左側（以下上流側という）から右側（以下、
下流側という）に矢印Ｑで示す方向に基板１は移動され
る。基板１は、一対のローラ２ａ、２ｂからなる弛緩ロ
ーラ２によって所定のたるみを与えられたフィルム状の
搬送体３に載置されて真空室６内に搬入部６Ｃから搬入
されて停止される。As shown in Fig. 1, the tri-film pressure bonding device of this embodiment I is arranged from the left side (hereinafter referred to as upstream side) to the right side (hereinafter referred to as upstream side).
The substrate 1 is moved in the direction indicated by the arrow Q (referred to as the downstream side). The substrate 1 is placed on a film-shaped carrier 3 which is given a predetermined slack by a pair of relaxing rollers 2, 2a and 2b, and is carried into the vacuum chamber 6 from the carry-in section 6C and stopped.
Ｉ・ライフィルム（薄膜）４は、緊張ローラ５によって
所定の張力を与えられて真空室６内に搬入部６Ｃから搬
入されて停［にされる。真空室６は位置の固定された上
箱６ａと）１降シリンダ６ｄに昇降可能に支持された下
箱６ｂとからなっている。The I-lye film (thin film) 4 is applied with a predetermined tension by the tension roller 5, is carried into the vacuum chamber 6 from the carry-in section 6C, and is stopped. The vacuum chamber 6 consists of an upper box 6a whose position is fixed and a lower box 6b which is supported so as to be movable up and down by a lowering cylinder 6d.
そして、この真空室６内の気体を真空ポンプ（図示して
いない）で壮気して真空又は減圧環境（以下、真空環境
という）を形成する時の密閉手段としてのシール６０か
少なくとも下箱６ｂの−」−箱６ａど接する面に設けら
れている。また、下箱６ａの内部には、アクチュエータ
７ｂに昇降可能に支持されたＩ・圧力板７Ｇが配設され
ている。上箱６ａの上縁６１と上圧力板７ａの下縁７
ａ ’とはほぼ同−ｒｆｉｉとし、第１図に示す如く、
市記下縁６■から間隔αをあけて１〜ライフイルム４が
更に間隔δをあけて搬送体３が、更に間隔βをあけて下
箱６ｂのシール６ｅの−１−Ｂに配置されている。本実
施例では、間隔αは例えば０ 、５ｍｍ〜・１．５ｍｍ
、間隔δは５〜１．５ｍｍ、間隔βは５〜千５ｍｍとし
である。Then, a seal 60 or at least a lower box 6b is used as a sealing means when the gas in the vacuum chamber 6 is energized by a vacuum pump (not shown) to form a vacuum or reduced pressure environment (hereinafter referred to as a vacuum environment). -' - is provided on the surface that comes into contact with the box 6a. Further, inside the lower box 6a, an I/pressure plate 7G supported by an actuator 7b so as to be movable up and down is disposed. Upper edge 61 of upper box 6a and lower edge 7 of upper pressure plate 7a
a' is almost the same as −rfii, and as shown in Figure 1,
The carriers 3 are placed at a distance α from the lower edge 6■ of the lower box 6b, and the carrier 3 is placed at a further distance δ from the lower edge 6■ of the seal 6e of the lower box 6b. There is. In this embodiment, the interval α is, for example, 0.5 mm to 1.5 mm.
, the interval δ is 5 to 1.5 mm, and the interval β is 5 to 1,500 mm.
基板１の搬入後、）１降シリンタロｄを上昇して下箱６
ａと下箱６ｂは、シール６ｅを介して密閉され、排気孔
６ｇから真空ポンプによって真空環境が形成される。こ
の真空環境か形成された状態を第２図に示す。After loading the board 1, raise the descending cylinder d and lower the box 6.
a and the lower box 6b are sealed via a seal 6e, and a vacuum environment is created from the exhaust hole 6g by a vacuum pump. FIG. 2 shows the state in which this vacuum environment is formed.
この第２図の状態では、たるみを有する搬送体３の−に
面に基板１か載Ｆテｊされているので、基板ｊとＩへラ
イフィルム４との間には所定の間隔が形成される。次に
、アクチュエータ７ｂにより下圧力板７ｃが」二昇して
押し１−けられ、ドライフィル１１４と基板１と搬送体
３とが所定の？！ＩＪ度に維持された」ユバ力板７ン１
に押し付けられると、下圧力板７ｄは前記の押し付は力
に応して中央部から周縁に順次圧着面積を拡げてゆき、
最終的には、第７３図に示す如く基板１の全面積に１−
ライフイルｔｚ ４が１）；ｆ記の上圧力板７ ＋ｉの
紐持する温度で圧着され、ドライフィルｌ＼４と基板１
と搬送体３とは積層されたフィルム積層体１ａになる。In the state shown in FIG. 2, since the substrate 1 is mounted on the - side of the carrier 3 which has slack, a predetermined gap is formed between the substrate j and the lay film 4. Ru. Next, the lower pressure plate 7c is raised and pushed by the actuator 7b, and the dry fill 114, the substrate 1, and the carrier 3 are moved to a predetermined position. ! Maintained at IJ degree” Yuba Riki Board 7-1
When pressed, the lower pressure plate 7d gradually expands its crimping area from the center to the periphery according to the pressing force.
Finally, as shown in FIG. 73, 1-
The dry fill tz 4 is crimped at the temperature maintained by the upper pressure plate 7 +i in 1); f, and the dry fill l\4 and the substrate 1
and the conveying body 3 are laminated to form a film laminate 1a.
真空室６が人気状態に戻されて下箱６ａと下箱６１）が
離れると、真？：？室６の下流側に設けた一弓・１のロ
ーラ８２〕と８ｂとからなるピンチローラ８により、フ
ィルム積層体１ン１が真空室６の搬送部６１１から搬出
される。When the vacuum chamber 6 is returned to the popular state and the lower box 6a and lower box 61) are separated, is it true? :? The film laminate 1 is carried out from the conveying section 611 of the vacuum chamber 6 by a pinch roller 8 consisting of a bow of rollers 82 and 8b provided on the downstream side of the chamber 6.
以上の説明においては、−１−圧力板７ン１か固定され
、下圧力板７ｃがアクチュエータ７ｂにより押し」−げ
Ｉン〕れる構成にしたか、逆にしても効果は回しである
。また、前記実施例Ｉては、上圧力板７１１は発熱体を
内蔵したもので説明したが、真空室６内に別に設けても
よい。真空室６は下箱６ａとド箱６ ｂに別れる構造と
して説明したか１１流側に搬入１−１を、下流側に搬出
１−１を設けて、開閉可能な密閉手段を搬入１■」と搬
出口にそれぞれ改番づた箱体構造でもよい。下箱６ｂの
昇降シリンダ６ｄとド圧力板７ｃのアクチュエータ７ｂ
は、エア式でも油圧式でも電動式でもよい１１問題点を
解決するための手段の項に説明したごとく、上圧力板７
ａは弾力性のある士に凸な半円筒状又は半球形状のもの
で、スポンジゴムの他エアクッシ９ンでもよく、また、
下圧力板７Ｇは、本実施例Ｉにおいては、例えはＳ Ｕ
Ｓ板又はそれに薄いスポンジを貼り付けたものを使用
したが、基板１に支障となる変形を与えないことが必要
であり、その機能を有するものであればどのようなもの
でもよい。In the above description, the pressure plate 7c is fixed and the lower pressure plate 7c is pushed by the actuator 7b, or vice versa, the effect is the same. Further, in the above-described embodiment I, the upper pressure plate 711 is described as having a built-in heating element, but it may be provided separately within the vacuum chamber 6. As described above, the vacuum chamber 6 has a structure divided into a lower box 6a and a lower box 6b.11 An inlet 1-1 is provided on the downstream side, and an outlet 1-1 is provided on the downstream side, and an openable and closable sealing means is provided for the inlet 1-1. It may also be a box structure with different numbers for the and exit ports. Lifting cylinder 6d of lower box 6b and actuator 7b of pressure plate 7c
The upper pressure plate 7 may be an air type, a hydraulic type, or an electric type.
a is an elastic semi-cylindrical or hemispherical material with a convex surface, and may be made of sponge rubber or an air cushion;
In this embodiment I, the lower pressure plate 7G is, for example, S U
Although an S plate or one with a thin sponge attached thereto was used, it is necessary that the substrate 1 is not deformed in any way, and any material can be used as long as it has this function.
以上の説明かられかるように、本実施例Ｉによれは、真
空室６内で」ｋ板１と１〜ライフイルム４とを間隔をあ
けて保持して４Ｊｌ気し、基板１の中央部から周縁部に
向かって順次圧着をしてゆくので、基板１上の電子回路
の有無にかかわらす、気泡の残留がなく、かつドライフ
ィルム４にしわを発生させることなく基板１にドライフ
ィルＡ ４を圧着することができる。また、Ｉ〜ライフ
イルＡ ４は、圧着時の加圧を弾性材の上圧力板７ｄで
行うので、露光時に支障となる損傷の発生を低減するこ
とができる。As can be seen from the above explanation, according to the present embodiment I, the substrate 1 and the life film 4 are held at intervals of 4Jl in the vacuum chamber 6, and the central part of the substrate 1 is heated. Since the pressure bonding is performed sequentially from the beginning to the peripheral edge, the dry film A 4 is applied to the substrate 1 without leaving any air bubbles and without causing wrinkles in the dry film 4, regardless of the presence or absence of electronic circuits on the substrate 1. can be crimped. In addition, in I to Lifefile A4, since the pressurization during crimping is performed by the upper pressure plate 7d made of an elastic material, it is possible to reduce the occurrence of damage that would be a hindrance during exposure.
第４図は、本発明を１くライフィルム圧着方法及びその
実施装置に適用した実施例Ｈのドライフィル１１圧着装
置の概略構成を説明するための断面図である。FIG. 4 is a cross-sectional view for explaining the schematic structure of a dry film 11 compression bonding device of Example H in which the present invention is applied to a dry film 11 compression bonding method and its implementation device.
本実施例ＩＴのドライフィルム圧着方法及びその実施装
置は、第１図に示す実施例Ｉの真空室６とピンチローラ
８との間にステージ９及び第２回］」の熱圧着を行うた
めの加熱圧着ローラ１０を設けたものである。この圧着
方法は、前記の真空室６内における圧着（以下、第１回
］」の圧着という）の後、第２回目の圧着を行う二回圧
着方法である。The dry film compression bonding method and the apparatus for carrying out the same according to the present embodiment IT include a stage 9 and a stage 9 between the vacuum chamber 6 and the pinch roller 8 of the embodiment I shown in FIG. A heated pressure bonding roller 10 is provided. This crimping method is a two-time crimping method in which the second crimping is performed after the crimping in the vacuum chamber 6 (hereinafter referred to as "first crimping").
この二回圧着方法の場合においては、第１回目の圧着の
時には加熱なしで行い、第２回目の圧着の時のみ加熱圧
着ローラ１０てトライフィルム４を所定の湿度に加熱し
て行うようにしてもよい。In the case of this two-time crimping method, the first crimping is performed without heating, and only the second crimping is performed by heating the try film 4 to a predetermined humidity using the heated crimping roller 10. Good too.
このようにすることにより、前記実施例Ｉの効果をさら
に向上することができる。By doing so, the effect of Example I can be further improved.
以上、本発明を実施例にもとすき具体的に説明したが、
本発明は、前記実施例に限定されるものではなく、その
要旨を逸脱しない範囲において種々変更可能であること
は言うまでもない。The present invention has been specifically explained above using examples, but
It goes without saying that the present invention is not limited to the embodiments described above, and can be modified in various ways without departing from the spirit thereof.
以」―、説明したように、本発明によれば、真空又は減
圧された環境を形成可能な真空室の中で薄膜と基板との
圧着を基板中央部から基板周縁部へと圧着面積を広げて
行うので、薄膜とＪ、（板との間に気泡の残留かなくか
つ薄膜にしわを発生させることなく薄膜を基板に圧着す
ることができる。As described above, according to the present invention, the crimping area between the thin film and the substrate is expanded from the center of the substrate to the periphery of the substrate in a vacuum chamber capable of creating a vacuum or reduced pressure environment. The thin film can be pressure-bonded to the substrate without leaving any air bubbles between the thin film and the substrate and without causing wrinkles in the thin film.
第１−図は、本発明を１〜ライフィルム圧着方法及びそ
の実施装置に適用した一実施例のドライフィルム圧着装
置の概略構成を説明するための断面図、第２図は、第１
図に示すＩくライフイルｌ＼圧着装−１１＝
置を説明するための要部断面図、
第３図は、第１図に示すドライフィルムを基板に圧着し
た後の状態を示す断面図、
第４図は、本発明をドライフィルム圧着方法及びその実
施装置に適用した実施例■のドライフィルム圧着装置の
概略構成を説明するための断面図である。
図中、１・・基板、２・・弛緩ローラ、２ａ、２ｂ・ロ
ーラ、３・・・搬送体、４・・・ドライフィルム（薄膜
）、５・・緊張ローラ、６・・真空室、６ａ・」−箱、
６ｂ 下箱、６ｃ・・搬入部、６ｄ ・昇降シリンダ、
６ｅ・・シール、７ａ・」ユバ力板、７ｂ・・アクチュ
エータ、７ ｃ−下圧力板、８ａ、８ｂ−ローラ、８・
ピンチローラである。Fig. 1 is a cross-sectional view for explaining the schematic structure of a dry film crimping device according to an embodiment in which the present invention is applied to the dry film crimping method and its implementation device;
Figure 3 is a cross-sectional view of the main parts to explain the dry film shown in Figure 1 after it has been pressure-bonded to the substrate; FIG. 4 is a cross-sectional view for explaining the schematic structure of a dry film pressure bonding apparatus of Example (2) in which the present invention is applied to a dry film pressure bonding method and an apparatus for implementing the same. In the figure, 1...substrate, 2...relaxation roller, 2a, 2b...roller, 3...conveyor, 4...dry film (thin film), 5...tension roller, 6...vacuum chamber, 6a・”-box,
6b Lower box, 6c... Loading section, 6d Lifting cylinder,
6e... Seal, 7a... Yuba force plate, 7b... Actuator, 7 c - Lower pressure plate, 8a, 8b - Roller, 8...
It's a pinch roller.
Claims (4)
圧着して積層体を形成する薄膜圧着方法において、前記
真空又は減圧された環境を形成可能な真空室の中で薄膜
と基板との圧着を基板中央部から基板周縁部へと圧着面
積を広げて行うことを特徴とする薄膜圧着方法。(1) In a thin film bonding method in which a thin film is pressure bonded onto a substrate in a vacuum or reduced pressure environment to form a laminate, the thin film and the substrate are placed in a vacuum chamber capable of forming the vacuum or reduced pressure environment. A thin film crimping method characterized by expanding the crimping area from the center of the substrate to the periphery of the substrate.
層体を形成した後、該積層体を加熱圧着することを特徴
とする特許請求の範囲第１項に記載の薄膜圧着方法。(2) The thin film pressure bonding method according to claim 1, wherein the thin film is pressure bonded to a substrate to form a laminate by the thin film pressure bonding method, and then the laminate is heat pressure bonded.
圧着して積層体を形成する薄膜圧着装置において、前記
真空又は減圧された環境を形成可能な真空室の内部に、
弾性材からなる支持部材の下面に半円筒形状又は中央部
分の厚みが周縁部より大なる半球形状をその凸状部が下
向になるように取付けられた上圧力板と、該上圧力板に
比較して硬さのある材料からなる平面状の昇降可能な下
圧力板と、前記上圧力板と下圧力板との間には薄膜と前
記基板とを所定の間隔をあけて保持する手段と、前記真
空室の内部の気体を排気して真空又は減圧状態にする手
段と、前記薄膜と基板とを所定の温度に加熱する手段と
、前記下圧力板を上昇して薄膜を前記上圧力板との間で
所定の力で挟みつけて圧着する手段を設けたことを特徴
とする薄膜圧着装置。(3) In a thin film bonding apparatus that presses a thin film onto a substrate to form a laminate in a vacuum or reduced pressure environment, inside a vacuum chamber capable of forming the vacuum or reduced pressure environment,
An upper pressure plate is attached to the lower surface of the support member made of an elastic material, and the upper pressure plate has a semi-cylindrical shape or a hemispherical shape in which the thickness of the center portion is larger than that of the peripheral portion, and the convex portion thereof faces downward. a planar lower pressure plate made of a relatively hard material that can be raised and lowered; and means for holding the thin film and the substrate at a predetermined distance between the upper pressure plate and the lower pressure plate; , a means for evacuating the gas inside the vacuum chamber to bring it into a vacuum or reduced pressure state; a means for heating the thin film and the substrate to a predetermined temperature; and a means for raising the lower pressure plate to heat the thin film to the upper pressure plate. What is claimed is: 1. A thin film crimping device characterized in that a thin film crimping device is provided with means for crimping the thin film by clamping it with a predetermined force between the thin film crimping device and the thin film crimping device.
けて所定の温度に加熱して圧着することを特徴とする特
許請求の範囲第３項に記載の薄膜の基板への圧着装置。(4) The apparatus for press-bonding a thin film to a substrate as set forth in claim 3, wherein a heating element is provided on at least the upper pressure plate in the vacuum chamber to heat the thin film to a predetermined temperature for pressure-bonding.
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63072959A JPH0622199B2 (en) | 1988-03-25 | 1988-03-25 | Thin film crimping method and thin film crimping apparatus |
| US07/328,402 US5078820A (en) | 1988-03-25 | 1989-03-24 | Method and apparatus for pressure sticking a thin film to a base plate |
| EP89105433A EP0339275B1 (en) | 1988-03-25 | 1989-03-28 | Method and apparatus for pressure sticking a thin film to a base plate |
| DE68926361T DE68926361T2 (en) | 1988-03-25 | 1989-03-28 | Method and device for applying a thin layer on a substrate under pressure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63072959A JPH0622199B2 (en) | 1988-03-25 | 1988-03-25 | Thin film crimping method and thin film crimping apparatus |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01244467A true JPH01244467A (en) | 1989-09-28 |
| JPH0622199B2 JPH0622199B2 (en) | 1994-03-23 |
Family
ID=13504426
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63072959A Expired - Fee Related JPH0622199B2 (en) | 1988-03-25 | 1988-03-25 | Thin film crimping method and thin film crimping apparatus |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0622199B2 (en) |
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|---|---|---|---|---|
| FR2809583A1 (en) * | 2000-05-26 | 2001-11-30 | Siemens Ag | Printed circuit layering technique/method having adhesive layer with sections added having different surface centre of gravity and pressure centre adhesive layer centre of gravity based. |
| JP2002079584A (en) * | 2000-09-05 | 2002-03-19 | Mikado Technos Kk | Method and apparatus for manufacturing thin-wall laminate by directional consecutive sticking process |
| JP2003025445A (en) * | 2001-07-23 | 2003-01-29 | Hitachi Industries Co Ltd | Film sticking device |
| JP2003048249A (en) * | 2001-08-08 | 2003-02-18 | Mikado Technos Kk | Sealing structure for vacuum evacuation continuous laminating apparatus for film, sheet or the like and continuously laminating apparatus |
| CN101396898A (en) * | 2007-09-28 | 2009-04-01 | 富士胶片株式会社 | Manufacture device and method of photosensitive lamination body |
| JP2010123940A (en) * | 2008-11-21 | 2010-06-03 | Komax Holding Ag | Apparatus for laminating solar modules |
| CN111993663A (en) * | 2020-08-21 | 2020-11-27 | 宁波猎知乐科技咨询有限公司 | Laminating machine is used in processing of waterproof timber |
| CN112848614A (en) * | 2021-01-26 | 2021-05-28 | 湖北洁尔卫浴股份有限公司 | Be used for toilet lid PVC tectorial membrane device |
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| WO2005008734A2 (en) * | 2003-07-10 | 2005-01-27 | Brewer Science Inc. | Automated process and apparatus for planarization of topographical surfaces |
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1988
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Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2809583A1 (en) * | 2000-05-26 | 2001-11-30 | Siemens Ag | Printed circuit layering technique/method having adhesive layer with sections added having different surface centre of gravity and pressure centre adhesive layer centre of gravity based. |
| JP2002079584A (en) * | 2000-09-05 | 2002-03-19 | Mikado Technos Kk | Method and apparatus for manufacturing thin-wall laminate by directional consecutive sticking process |
| JP2003025445A (en) * | 2001-07-23 | 2003-01-29 | Hitachi Industries Co Ltd | Film sticking device |
| JP2003048249A (en) * | 2001-08-08 | 2003-02-18 | Mikado Technos Kk | Sealing structure for vacuum evacuation continuous laminating apparatus for film, sheet or the like and continuously laminating apparatus |
| JP4702714B2 (en) * | 2001-08-08 | 2011-06-15 | ミカドテクノス株式会社 | Seal structure and continuous laminating apparatus for continuous vacuum laminating apparatus for film, sheet, etc. |
| CN101396898A (en) * | 2007-09-28 | 2009-04-01 | 富士胶片株式会社 | Manufacture device and method of photosensitive lamination body |
| JP2010123940A (en) * | 2008-11-21 | 2010-06-03 | Komax Holding Ag | Apparatus for laminating solar modules |
| CN113715318A (en) * | 2020-05-26 | 2021-11-30 | 毅力科技有限公司 | Vacuum film pressing system and vacuum film pressing method |
| CN111993663A (en) * | 2020-08-21 | 2020-11-27 | 宁波猎知乐科技咨询有限公司 | Laminating machine is used in processing of waterproof timber |
| CN112848614A (en) * | 2021-01-26 | 2021-05-28 | 湖北洁尔卫浴股份有限公司 | Be used for toilet lid PVC tectorial membrane device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0622199B2 (en) | 1994-03-23 |
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