JPH01242499A - Method of decreasing dislocation of znse single crystal - Google Patents

Method of decreasing dislocation of znse single crystal

Info

Publication number
JPH01242499A
JPH01242499A JP7119388A JP7119388A JPH01242499A JP H01242499 A JPH01242499 A JP H01242499A JP 7119388 A JP7119388 A JP 7119388A JP 7119388 A JP7119388 A JP 7119388A JP H01242499 A JPH01242499 A JP H01242499A
Authority
JP
Japan
Prior art keywords
single crystal
crystal
znse
znse single
heat treatment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7119388A
Other languages
Japanese (ja)
Inventor
Tadashi Koyama
小山 正
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Sheet Glass Co Ltd
Original Assignee
Nippon Sheet Glass Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Sheet Glass Co Ltd filed Critical Nippon Sheet Glass Co Ltd
Priority to JP7119388A priority Critical patent/JPH01242499A/en
Publication of JPH01242499A publication Critical patent/JPH01242499A/en
Pending legal-status Critical Current

Links

Landscapes

  • Crystals, And After-Treatments Of Crystals (AREA)

Abstract

PURPOSE:To decrease dislocation density by heating a ZnSe single crystal in an inert gaseous atmosphere at and for the specified temp. and time. CONSTITUTION:The ZnSe single crystal is heat-treated for >=10 hours at 600-800 deg.C in the inert gaseous atmosphere. The ZnSe single crystal can be heat- treated without deteriorating the properties thereof and without intensifying sublimation, etc., by this method. The strains in the crystal are thus relieved and the lowered and uniformized dislocation density is obtd. accordingly. The quality of the ZnSe single crystal is degraded unless the inert gas is adopted for the heat treatment atmosphere. There is no effect of decreasing the dislocation density if the heat treatment temp. is lower than 600 deg.C. The single crystal is gradually chipped by sublimation if the heat treatment temp. is higher than 800 deg.C. While the heat treatment varies with the perfectness of the crystal, the treatment time, the size of the crystal, etc., the treatment is not effectual unless the time is >=10hours.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本願発明はZnSe単結晶の転位減少法に関し、特に高
温熱処理によるZnSe単結晶の転位減少法に関する。
DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a method for reducing dislocations in a ZnSe single crystal, and particularly to a method for reducing dislocations in a ZnSe single crystal by high-temperature heat treatment.

〔従来の技術〕[Conventional technology]

ZnSe結晶は、従来種々の結晶をエピタキシャル成長
させるための基板用材料等として使用されている。該エ
ピタキシャル成長の基板材料としては、基板の結晶性(
例えば転移等)に反映した結晶が該基板上に成長するた
め、結晶性の良いものが望まれていた。
ZnSe crystals have conventionally been used as substrate materials for epitaxial growth of various crystals. As the substrate material for epitaxial growth, the crystallinity of the substrate (
For example, since crystals reflecting transitions (for example, dislocations, etc.) grow on the substrate, a material with good crystallinity has been desired.

しかしながらZnSe等の単結晶作製においては通常転
位等の欠陥が発生しやすく、特にZnSe結晶における
無転位結晶はいまだ得られていない。
However, in the production of single crystals such as ZnSe, defects such as dislocations are usually likely to occur, and in particular, dislocation-free ZnSe crystals have not yet been obtained.

−旦作製された単結晶中の欠陥は、恒温焼鈍、熱サイク
ル焼鈍等の方法によって減少させることができ、より良
質な単結晶を作製するために利用されている。例えばm
−v族化合物結晶、特にGaAs結晶に対しても高温状
態に保持することが転位減少に効果があることが知られ
ている。(例えばMaterals Letter 5
+ 196 )しかしながら上記ZnSe単結晶につい
て上記恒温焼鈍、熱サイクル焼鈍等の手段によって単結
晶中の転移を減少させる試みは今だ行なわれておらず、
又この様な手段によってZnSe単結晶中の欠陥を減少
することができたという報告は今だなされていない。
- Defects in single crystals once produced can be reduced by methods such as constant temperature annealing and thermal cycle annealing, which are used to produce higher quality single crystals. For example m
It is known that maintaining a -V group compound crystal, especially a GaAs crystal, at a high temperature is effective in reducing dislocations. (For example, Materials Letter 5
+196) However, no attempt has been made to reduce the dislocations in the single crystal of ZnSe by means of constant temperature annealing, thermal cycle annealing, etc.
Furthermore, there has been no report that defects in ZnSe single crystals can be reduced by such means.

〔発明が解決しようとする課題〕[Problem to be solved by the invention]

本発明は、従来知られていないZnSe単結晶の転位減
少法を提供するものであって、転位密度の小さい良質の
ZnSe単結晶の製造を可能とするものである。
The present invention provides a conventionally unknown method for reducing dislocations in ZnSe single crystals, and makes it possible to produce high-quality ZnSe single crystals with low dislocation density.

〔課題を解決するための手段〕[Means to solve the problem]

本発明は、ZnSe単結晶を不活性ガス雰囲気下の60
0〜800℃で10時間以上保持するZnSe単結晶の
転位密度の減少法である。
In the present invention, ZnSe single crystal is grown at 60°C under an inert gas atmosphere.
This is a method of reducing the dislocation density of a ZnSe single crystal by holding it at 0 to 800°C for 10 hours or more.

本発明においては、ZnSe単結晶を不活性ガス中で加
熱しているが、例えば02等の活性ガス雰囲気下で加熱
するとZnSe表面に酸化物等の不純物を形成し、Zn
Se単結晶の品質を低下させることになる。
In the present invention, the ZnSe single crystal is heated in an inert gas, but when heated in an active gas atmosphere such as 02, impurities such as oxides are formed on the ZnSe surface, and the ZnSe single crystal is heated in an inert gas atmosphere.
This will reduce the quality of the Se single crystal.

又加熱温度は600〜800℃であるが、該温度が60
0°Cより低いと転位密度を減少させる効果がなく、又
800℃より高いと昇華により単結晶が欠なわれていく
様になる。
The heating temperature is 600 to 800°C, but if the temperature is 60°C
If it is lower than 0°C, there is no effect of reducing the dislocation density, and if it is higher than 800°C, single crystals will be lost due to sublimation.

又該温度における保持時間は10時間以上とすることが
必要である。転位密度を減少させられる処理時間は、結
晶の完全性、処理温度、結晶の大きさ等によって変化す
るが、600〜800°Cの温度で処理を行なう本発明
においては10時間以上保持しないと本発明の効果は現
れない。
Further, it is necessary that the holding time at this temperature be 10 hours or more. The treatment time required to reduce the dislocation density varies depending on the completeness of the crystal, the treatment temperature, the size of the crystal, etc., but in the present invention, where the treatment is carried out at a temperature of 600 to 800°C, it is necessary to hold the treatment for more than 10 hours. The effect of the invention does not appear.

上記熱処理を行なったZnSe単結晶は、室温に冷却さ
れて切断石層等を行なって前記エピタキシャル成長用基
板等に加工されるが、該室温への冷却は3°C/min
以下の冷却速度で冷却することが好ましい。該冷却速度
が3’C/minより速くなると、冷却時の熱歪に基づ
いてせっかく転位密度を減少させたZnSe単結晶中に
転移を形成するおそれがある。
The ZnSe single crystal subjected to the above heat treatment is cooled to room temperature and processed into the epitaxial growth substrate etc. by cutting a stone layer, etc., but the cooling to room temperature is performed at a rate of 3°C/min.
It is preferable to cool at the following cooling rate. If the cooling rate is faster than 3'C/min, there is a risk that dislocations will be formed in the ZnSe single crystal whose dislocation density has been reduced due to thermal strain during cooling.

〔作用〕[Effect]

本発明によれば、不活性ガス雰囲気下で加熱を行なって
いるため、ZnSe単結晶を変質させることなく、又昇
華等が激しくなることなく熱処理が行なえる。又600
〜800℃の温度で10時間以上熱処理を行なうことに
よって結晶中の歪を緩和し、それにともなって転位密度
の低下および均一化が行なわれる。
According to the present invention, since heating is performed under an inert gas atmosphere, heat treatment can be performed without altering the ZnSe single crystal or causing severe sublimation. 600 again
By performing heat treatment at a temperature of ~800° C. for 10 hours or more, strain in the crystal is relaxed, and dislocation density is accordingly reduced and made uniform.

〔実施例〕〔Example〕

ZnSe(111)ウェハについて実施した例について
記載する。成長結晶から(111)面に対して平行に任
意の厚さに切り出したものを成形し、ラッピング、ポリ
ッシングを行ない、最後に加工歪を臭、素−メタノール
液等で取り除いた。また、不活性ガスとしては窒素を用
いた。該結晶を洗浄済みの石英ボートにのせ窒素雰囲気
炉に入れ徐々に温度を上げ700°Cまで昇温した。こ
のときの窒素流量は100cc/min程度である。
An example performed on a ZnSe (111) wafer will be described. The grown crystal was cut parallel to the (111) plane to a desired thickness, then molded, lapped and polished, and finally, processing distortion was removed using an odor, base-methanol solution, or the like. Further, nitrogen was used as the inert gas. The crystals were placed on a cleaned quartz boat and placed in a nitrogen atmosphere furnace to gradually raise the temperature to 700°C. The nitrogen flow rate at this time is about 100 cc/min.

この条件下で23時間置き、その後3℃/minの降温
速度で室温まで冷却した。
It was left under these conditions for 23 hours, and then cooled to room temperature at a rate of 3° C./min.

この結晶の処理前と処理後の結晶性を比較したものが、
第1表である。その評価法としてはエッチピットデンシ
ティ、X線2結晶回折法による、強度曲線全半値幅を用
いた。
A comparison of the crystallinity of this crystal before and after treatment is as follows.
This is Table 1. As the evaluation method, etch pit density and full width at half maximum of the intensity curve by X-ray two-crystal diffraction method were used.

第1表より明らかに熱処理をほどこしたものはエッチピ
ットデンシティ、X線の半値幅が変化しており、結晶性
が向上していることがわかる。
From Table 1, it is clear that the etch pit density and X-ray half width of the heat-treated samples change, indicating that the crystallinity is improved.

第  1  表 〔発明の効果〕 本発明によれば、実施例からもあきらかな通り、ZnS
e単結晶の転位密度を十分減少させることができ、より
高品質のZnSe単結晶を作製することができる。又本
発明によって処理したZnSe車結晶をエピタキシャル
成長用基板として用いれば、欠陥の少ない各種結晶を得
ることができ、高性能のデバイスを作製することができ
る。
Table 1 [Effects of the invention] According to the present invention, as is clear from the examples, ZnS
The dislocation density of the e single crystal can be sufficiently reduced, and a higher quality ZnSe single crystal can be produced. Furthermore, if the ZnSe wheel crystal treated according to the present invention is used as a substrate for epitaxial growth, various crystals with few defects can be obtained, and high-performance devices can be manufactured.

Claims (2)

【特許請求の範囲】[Claims] (1)ZnSe単結晶を不活性ガス雰囲気下の600〜
800℃で10時間以上保持するZnSe単結晶の転位
減少法。
(1) ZnSe single crystal was heated to 600 ~
A method for reducing dislocations in a ZnSe single crystal held at 800°C for 10 hours or more.
(2)600〜800℃の熱処理温度から3℃/min
以下の速度で降温する請求項1項記載のZnSe単結晶
の転位減少法。
(2) 3℃/min from a heat treatment temperature of 600 to 800℃
A method for reducing dislocations in a ZnSe single crystal according to claim 1, wherein the temperature is lowered at a rate of:
JP7119388A 1988-03-25 1988-03-25 Method of decreasing dislocation of znse single crystal Pending JPH01242499A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7119388A JPH01242499A (en) 1988-03-25 1988-03-25 Method of decreasing dislocation of znse single crystal

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7119388A JPH01242499A (en) 1988-03-25 1988-03-25 Method of decreasing dislocation of znse single crystal

Publications (1)

Publication Number Publication Date
JPH01242499A true JPH01242499A (en) 1989-09-27

Family

ID=13453587

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7119388A Pending JPH01242499A (en) 1988-03-25 1988-03-25 Method of decreasing dislocation of znse single crystal

Country Status (1)

Country Link
JP (1) JPH01242499A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR19980018445A (en) * 1996-08-12 1998-06-05 구라우치 노리타카 Heat treatment method of YSN crystal
JP2007204324A (en) * 2006-02-02 2007-08-16 Tokyo Denpa Co Ltd Manufacturing method of high purity zinc oxide single crystal, and high purity zinc oxide single crystal
CN103590112A (en) * 2013-11-18 2014-02-19 北京雷生强式科技有限责任公司 Post-processing method of iron-doped zinc selenide laser crystal

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR19980018445A (en) * 1996-08-12 1998-06-05 구라우치 노리타카 Heat treatment method of YSN crystal
JP2007204324A (en) * 2006-02-02 2007-08-16 Tokyo Denpa Co Ltd Manufacturing method of high purity zinc oxide single crystal, and high purity zinc oxide single crystal
CN103590112A (en) * 2013-11-18 2014-02-19 北京雷生强式科技有限责任公司 Post-processing method of iron-doped zinc selenide laser crystal
CN103590112B (en) * 2013-11-18 2016-03-30 北京雷生强式科技有限责任公司 A kind of post-treating method of iron-doped zinc selenide laser crystals

Similar Documents

Publication Publication Date Title
JPH06504878A (en) Method of controlling precipitation conditions in silicon wafers
JP7085833B2 (en) Method for manufacturing silicon carbide single crystal
JP2006054350A5 (en)
JP2008290895A (en) Method for producing silicon carbide single crystal
CN100343961C (en) Production method for anneal wafer and anneal wafer
CN109338463B (en) High-purity silicon carbide single crystal substrate
JP2742247B2 (en) Manufacturing method and quality control method for silicon single crystal substrate
JPH1121197A (en) Seed crystal for crystal growth and fluoride crystal
TWI723578B (en) High-purity silicon carbide single crystal substrate and preparation method and application thereof
KR20030023509A (en) Silicon semiconductor substrate and method for production thereof
JPH01242499A (en) Method of decreasing dislocation of znse single crystal
US3441385A (en) Reducing dislocation defects of silicon semiconductor monocrystals by heat treatment
JPS61178497A (en) Method for growing gallium arsenide single with low dislocation density
JP2003068744A (en) Silicon wafer manufacturing method, silicon wafer, and soi wafer
JPS61201692A (en) Method for pulling and growing silicon single crystal with less generation of defect
JPS6344720B2 (en)
WO2022202767A1 (en) Ga2o3-based single crystal substrate and method for manufacturing ga2o3-based single crystal substrate
JPH1059800A (en) Heat treatment of zinc-selection crystal
JP3560180B2 (en) Method for producing ZnSe homoepitaxial single crystal film
JPH01122999A (en) Heat treatment of compound semiconductor single crystal
JPH03271199A (en) Method for heat-treating gaas single crystal wafer
JPH03199198A (en) Lanthanum gallate single crystal and production thereof
JPH03193698A (en) Silicon single crystal and its production
JPS6144800A (en) Method for improving crystal quality
JPH02293399A (en) Heat treatment of gaas ingot