JPH01240660A - Sputtering device - Google Patents
Sputtering deviceInfo
- Publication number
- JPH01240660A JPH01240660A JP6572088A JP6572088A JPH01240660A JP H01240660 A JPH01240660 A JP H01240660A JP 6572088 A JP6572088 A JP 6572088A JP 6572088 A JP6572088 A JP 6572088A JP H01240660 A JPH01240660 A JP H01240660A
- Authority
- JP
- Japan
- Prior art keywords
- sample
- insulating
- etching
- specimen
- truck
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004544 sputter deposition Methods 0.000 title claims description 22
- 238000005530 etching Methods 0.000 claims abstract description 22
- 238000010438 heat treatment Methods 0.000 claims abstract description 13
- 238000000034 method Methods 0.000 claims description 10
- 238000010292 electrical insulation Methods 0.000 claims description 2
- 238000009413 insulation Methods 0.000 claims description 2
- 239000011810 insulating material Substances 0.000 abstract description 7
- 239000000919 ceramic Substances 0.000 abstract description 2
- 230000015572 biosynthetic process Effects 0.000 description 5
- 230000032258 transport Effects 0.000 description 4
- 239000007789 gas Substances 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000012774 insulation material Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
Landscapes
- Physical Vapour Deposition (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、スパッタ装置に係り、特にプリベーキング、
エツチング、スパッタ成膜等の処理を真空下で21続的
に又は間欠的に実施するインライン型のスパッタ装置に
関するものである。DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a sputtering device, and in particular, to a sputtering device for prebaking,
The present invention relates to an in-line sputtering apparatus that performs processes such as etching and sputtering film formation continuously or intermittently under vacuum.
インライン型のスパッタ装置としては、例えば。 Examples of in-line sputtering equipment include:
特開昭58−77239号公報に記載のような、トレー
に取付けられた試料なローラコンベヤにてスパッタ成膜
、エツチング等の処理域に搬送するようにしたものが知
られている。There is a known method, as described in Japanese Patent Application Laid-open No. 58-77239, in which a sample attached to a tray is conveyed to a processing area for sputtering, etching, etc. using a roller conveyor.
上記従来技術では、プリベーキング、エツチング等の処
理域において、ローラコンベヤが加熱されて回転不良を
生じたり、エツチングされたりする不具合が生じ、試料
を安定して各処理域に搬送するのが内錐になるといった
問題を有している。In the above-mentioned conventional technology, the roller conveyor is heated in processing areas such as pre-baking and etching, causing problems such as rotation failure and etching. It has the problem of becoming.
本発明の目的は、試料を安定して各処理域に搬送できる
インライン型のスパッタ装置を提供することにある。An object of the present invention is to provide an in-line sputtering apparatus that can stably transport a sample to each processing area.
上記目的は、スパッタ装置を、スパッタ成膜処理される
と共に該スパッタ成膜処理前に加熱処理。The above purpose is to use a sputtering apparatus to perform a sputter film formation process and to perform a heat treatment before the sputter film formation process.
−エツチング処理される試料が取付けられる試料取付手
段を1回動具を有し前記試料取付手段に取付けられた皿
記試料を前記処理域に連続的に又は間欠的に搬送する搬
送手段に電気絶縁、断熱手段を介して設けたものとする
二とにより、達成される。- The sample mounting means on which the sample to be etched is mounted is electrically insulated to the transfer means that has a rotating tool and continuously or intermittently transports the sample attached to the sample mounting means to the processing area. , and 2 provided through heat insulating means.
試料取付手段に取付けられた試料は、例えば、加熱処理
される。この場合、試料と共に試料取付手段も、例えば
、試料の被処理面から水分を除去可能な潤度に加熱され
る。しかし、搬送手段は、電2絶級、M熱手段の機能に
より加熱を防止され。The sample attached to the sample attachment means is, for example, subjected to heat treatment. In this case, the sample mounting means as well as the sample are heated to a moisture level that allows moisture to be removed from the surface of the sample to be treated, for example. However, the conveyance means is prevented from heating due to the function of the electric 2 grade and M heat means.
従って、搬送手段の回動具が加熱されて回動不良を起こ
すのを防止できる。また、試料取付手段に取付けられた
試料は、例えば、高周波印加によりエツチング処理され
る。しかし、搬送手段は、電気絶縁、断熱手段の機能に
よりエツチングを抑制され、従って、搬送手段の回動具
がエツチングされる不都合を除去できる。Therefore, it is possible to prevent the rotating tool of the conveying means from being heated and causing rotation failure. Further, the sample attached to the sample attachment means is subjected to etching treatment, for example, by applying high frequency. However, the conveyance means is prevented from etching by the functions of the electrical insulation and heat insulation means, and therefore, the inconvenience of the rotary tool of the conveyance means being etched can be eliminated.
以下、本発明の一実施例を第1図により説明する。 An embodiment of the present invention will be described below with reference to FIG.
第1図で、台車10は、回動具、例えば、複数のコロ(
図示省略)によってレール加に、該レール美に案内され
て移動可能に設けられている。台車10の、この場合、
上表面には、電気絶縁、断熱手段、例えば、セラミック
(アルミナ)製の絶縁材間が例けられている。パレット
荀は、絶縁材間に設ケられている。パレット荀は、この
場合、試料間な被処理面垂直姿勢で保持可能に絶縁材間
に設けられている。台車10の、この場合、底面には、
ラック11が形成されている。ラックINこは、ピニオ
ン12が一合させられている。ビニオン校の駆動軸13
は、回転駆動装置(図示省略)に連結されている。ピニ
オン12.レールm等は、加熱処理室。In FIG. 1, the cart 10 includes a rotating tool, for example, a plurality of rollers (
(not shown), and is movable while being guided by the rails. In this case, in the trolley 10,
On the upper surface, electrically insulating and thermally insulating means, for example ceramic (alumina) insulators, are provided. The pallet rack is installed between the insulating materials. In this case, the pallet rack is provided between the insulating materials so that the surface to be processed between the samples can be held in a vertical position. In this case, on the bottom of the trolley 10,
A rack 11 is formed. The pinion 12 is connected to the rack IN. Binion school drive shaft 13
is connected to a rotational drive device (not shown). Pinion 12. Rail m etc. are heat treatment chambers.
エツチング室、スパッタ成膜室(図示省略)にそれぞれ
設けられている。各室は、仕切弁ωを介してそれぞれ隔
離可能に連設されている。仕切弁ωは1台車10.該台
車IOに絶縁材間を介して設けられたパレット切が通過
可能な開口を有している。They are provided in an etching chamber and a sputtering film forming chamber (not shown), respectively. The chambers are connected to each other so as to be isolated from each other via a gate valve ω. Gate valve ω is 1 bogie 10. The cart IO has an opening through which a pallet cutter provided between insulating materials can pass.
このような場合、ピニオン校、駆動軸13は、各室−の
人口側と出口側とに少なくとも1個配設される。In such a case, at least one pinion drive shaft 13 is provided on the population side and the exit side of each chamber.
また、台車10は、隣接する室にスムーズに移動可能な
長さを有している。Moreover, the trolley 10 has a length that allows it to be smoothly moved to an adjacent chamber.
第1図で、試料間は、この場合、形状が略方形であり、
パレット切に、この場合、16個、被処理面垂直姿勢で
それぞれ取付けられる。このようにパレット伯に取付け
られた試料間は、例えば。In FIG. 1, the space between the samples is approximately rectangular in shape,
In this case, 16 pieces are mounted on a pallet in a vertical position with respect to the surface to be processed. For example, between samples mounted on a pallet in this way.
加熱処理室にて加熱処理され、これにより試料間の被処
理面の水分が除去される。このような加熱処理時におい
て試料間と共にパレット旬も加熱されるが、しかし、台
車10は、絶縁材Iの機能によって加熱を防止される。Heat treatment is performed in a heat treatment chamber, thereby removing moisture from the surfaces to be treated between the samples. During such heat treatment, the pallet is heated together with the space between the samples, but the trolley 10 is prevented from being heated due to the function of the insulating material I.
従って、コロおよびレール美の加熱も防止される。この
ような加熱処理完了後、ピニオン社は、駆動軸13を介
して回転駆動装置により回転させられる。これと共に、
仕切弁ωは開弁される。ピニオンジの回転により台車1
0は、レール囚に案内され、開弁している仕切弁ωを介
して1例えば、エツチング室に搬送される。Therefore, heating of the rollers and rails is also prevented. After completion of such heat treatment, the pinion is rotated by a rotary drive device via the drive shaft 13. Along with this,
Gate valve ω is opened. Due to the rotation of the pinion, the trolley 1
0 is guided by a rail prisoner and transported to, for example, an etching chamber via an open gate valve ω.
仕切弁θを通過した台車10はエツチング室のレール加
に受は取られ、エツチング室のピニオンUを回転させる
ことでエツチング室螢こ搬入される。その後、開弁して
いる仕切弁ωは閉弁される。この状態で、エツチング室
にはエツチングガス、例えば、アルゴンガスが導入され
、また、ノくレット切には、高周波が印加される。これ
によりエツチング室内ではグロー放電が生じ、エツチン
グ室内のエツチングガスは、この放電によりプラズマ化
される。このプラズマにより試料間の被処理面はエツチ
ング処理され、試料(資)の被処理面にあるスパッタ成
膜にとりで不都合な不純物は除去されて試料間の被処理
面は清浄化される。しかし、台*10は、絶縁材間の機
能によりエツチングを抑制される。また、これと共に、
構造上、コロがプラズマに露呈されるのを抑制されるの
で、コロがエツチングされるといった不都合が除去され
る。このようなエツチング処理完了後、ピニオンnは、
駆動軸13を介して回転駆動装置により回転させられる
。The cart 10 that has passed through the gate valve θ is received by a rail in the etching chamber, and is carried into the etching chamber by rotating the pinion U of the etching chamber. Thereafter, the open gate valve ω is closed. In this state, an etching gas such as argon gas is introduced into the etching chamber, and a high frequency is applied to the knotlet. This causes a glow discharge in the etching chamber, and the etching gas in the etching chamber is turned into plasma by this discharge. This plasma etches the surfaces to be processed between the samples, removing impurities present on the surfaces of the samples to be processed that are inconvenient for sputtering film formation, and cleaning the surfaces to be processed between the samples. However, the pedestal *10 is prevented from etching due to the function between the insulating materials. Also, along with this,
Since the structure prevents the rollers from being exposed to plasma, the inconvenience of etching the rollers is eliminated. After completing such etching process, the pinion n is
It is rotated by a rotary drive device via a drive shaft 13.
これと共に、仕切弁ωは開弁される。ピニオンLの回転
により台車lOは、レール加に案内され、開弁している
仕切弁ωを介して、例えば、スパッタ成膜室に搬送され
る。仕切弁ωを通過した台車10はスパッタ成り室のレ
ールmに受は取られ、スパッタ成膜室のビニオンジを回
転させることでスパッタ成膜室に搬入される。その後、
開弁している仕切弁(イ)は閉弁される。この状態で、
スパッタ成膜室では、スパッタ成膜処理が実施され、こ
れにより試料間の被処理面には膜が形成される。このよ
うにスパッタ成膜処理が完了した試料間は1例えば、真
空下で冷却された後に搬出室(図示省略)を介して系外
へ取り出される。At the same time, the gate valve ω is opened. By the rotation of the pinion L, the trolley lO is guided by the rails and transported to, for example, a sputtering film forming chamber via the gate valve ω which is open. The trolley 10 that has passed through the gate valve ω is received by a rail m of the sputtering chamber, and is carried into the sputtering chamber by rotating the binniture in the sputtering chamber. after that,
The open gate valve (a) is closed. In this state,
In the sputter film forming chamber, a sputter film forming process is performed, whereby a film is formed on the processing surface between the samples. After the sputtering film-forming process has been completed in this manner, the sample is cooled under vacuum, for example, and then taken out of the system through an unloading chamber (not shown).
本実施例によれば、コロおよびレールの加熱が防止され
るので、コロの回転不良が生じるのを防止できる。また
、これと共に、コロがエツチングされる不都合を除去で
きる。従って、パレットに取付けられた試料を加熱処理
室、エツチング室。According to this embodiment, since heating of the rollers and rails is prevented, malfunction of the rollers can be prevented from occurring. Additionally, the inconvenience of the rollers being etched can be eliminated. Therefore, samples mounted on pallets are placed in a heat treatment chamber and an etching chamber.
スパッタ成膜室等各室に安定して搬送することができる
。It can be stably transported to each chamber such as a sputtering film forming chamber.
なお、上記一実施例において、搬送手段を被駆動部と該
被駆動部を、例えば、非接触にて駆動する駆動部とで構
成し、被駆動部を真空側に、駆動部を大気側にそれぞれ
設けるようにすれば、スパッタ成膜処理時におけるスパ
ッタ粒子の付着、それによる移動不都合を除去すること
ができ、インライン型のスパッタ装置において試料を更
に安定して各処理室モこ搬送することができる。また、
上記一実施例では、試料を被処理面垂直姿勢で取付。In the above-mentioned embodiment, the conveyance means is composed of a driven part and a driving part that drives the driven part, for example, in a non-contact manner, and the driven part is placed on the vacuum side and the driving part is placed on the atmospheric side. If provided separately, it is possible to eliminate the adhesion of sputtered particles during sputtering film formation processing and the movement problems caused by this, and it is possible to more stably transport the sample to each processing chamber in an in-line sputtering device. can. Also,
In the above embodiment, the sample is mounted vertically to the surface to be processed.
保持可能にパレットを設けているが、このような試料の
取付姿勢に特に限定される必要はない。Although a pallet is provided so that the sample can be held, there is no need to be particularly limited to such a mounting posture of the sample.
本発明によれば、試料を各処理域に安定して搬送できる
インライン型のスパッタ装置を提供できる効果がある。According to the present invention, it is possible to provide an in-line sputtering apparatus that can stably transport a sample to each processing area.
4、図面の簡単説明
M1図は1本発明の一実施例のインライン型のスパッタ
装置の試料搬送部の斜視外観図である。4. Brief Description of the Drawings FIG. 1 is a perspective external view of a sample conveying section of an in-line sputtering apparatus according to an embodiment of the present invention.
10・・・・・・台車、11・・・・・・ラック、校・
・・・・・ビニオン。10...Dolly, 11...Rack, school
... Binion.
囚・・・・・・レール、30・・・・・・絶縁材、切・
・・・・・パレット、父・・・・・・試料、■・・・・
・・仕切弁代理人 弁理士 小 川 勝 男′F−\
(、−: −A
\、−“Prisoner...Rail, 30...Insulation material, cut
...palette, father...sample, ■...
...Shikiriben agent Patent attorney Masaru Ogawa 'F-\
(, -: -A \, -“
Claims (1)
前に加熱処理、エッチング処理される試料が取付けられ
る試料取付手段を、回動具を有し前記試料取付手段に取
付けられた前記試料を前記処理域に連続的に又は間欠的
に搬送する搬送手段に電気絶縁、断熱手段を介して設け
たことを特徴とするスパッタ装置。1. A sample mounting means to which a sample to be subjected to a sputter film forming process and a heat treatment and an etching process before the sputter film forming process is mounted, is provided with a rotating tool, and the sample mounted on the sample mounting means is mounted on the sample mounting means. A sputtering apparatus characterized in that a conveying means for conveying continuously or intermittently to a processing area is provided via electrical insulation and heat insulation means.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6572088A JPH01240660A (en) | 1988-03-22 | 1988-03-22 | Sputtering device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6572088A JPH01240660A (en) | 1988-03-22 | 1988-03-22 | Sputtering device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH01240660A true JPH01240660A (en) | 1989-09-26 |
Family
ID=13295136
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6572088A Pending JPH01240660A (en) | 1988-03-22 | 1988-03-22 | Sputtering device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH01240660A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07280709A (en) * | 1994-04-08 | 1995-10-27 | Chubu Electric Power Co Inc | Coal ash quality control method and device therefor |
-
1988
- 1988-03-22 JP JP6572088A patent/JPH01240660A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07280709A (en) * | 1994-04-08 | 1995-10-27 | Chubu Electric Power Co Inc | Coal ash quality control method and device therefor |
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