JPH01225327A - Wire bonding apparatus - Google Patents

Wire bonding apparatus

Info

Publication number
JPH01225327A
JPH01225327A JP63051922A JP5192288A JPH01225327A JP H01225327 A JPH01225327 A JP H01225327A JP 63051922 A JP63051922 A JP 63051922A JP 5192288 A JP5192288 A JP 5192288A JP H01225327 A JPH01225327 A JP H01225327A
Authority
JP
Japan
Prior art keywords
wire
capillary
clamper
tip
electric torch
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP63051922A
Other languages
Japanese (ja)
Other versions
JP2506904B2 (en
Inventor
Shinya Matsumura
信弥 松村
Akihiro Yamamoto
章博 山本
Yutaka Makino
豊 牧野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP63051922A priority Critical patent/JP2506904B2/en
Publication of JPH01225327A publication Critical patent/JPH01225327A/en
Application granted granted Critical
Publication of JP2506904B2 publication Critical patent/JP2506904B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/78268—Discharge electrode
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/786—Means for supplying the connector to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/786—Means for supplying the connector to be connected in the bonding apparatus
    • H01L2224/78621—Holding means, e.g. wire clampers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/82—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI]
    • H01L2224/8212—Aligning
    • H01L2224/82148—Aligning involving movement of a part of the bonding apparatus
    • H01L2224/82169—Aligning involving movement of a part of the bonding apparatus being the upper part of the bonding apparatus, e.g. nozzle
    • H01L2224/8218—Translational movements
    • H01L2224/82181—Translational movements connecting first on the semiconductor or solid-state body, i.e. on-chip
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85009—Pre-treatment of the connector or the bonding area
    • H01L2224/8503—Reshaping, e.g. forming the ball or the wedge of the wire connector
    • H01L2224/85035—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball"
    • H01L2224/85045—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball" using a corona discharge, e.g. electronic flame off [EFO]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/8512—Aligning
    • H01L2224/85148—Aligning involving movement of a part of the bonding apparatus
    • H01L2224/85169—Aligning involving movement of a part of the bonding apparatus being the upper part of the bonding apparatus, i.e. bonding head, e.g. capillary or wedge
    • H01L2224/8518—Translational movements
    • H01L2224/85181—Translational movements connecting first on the semiconductor or solid-state body, i.e. on-chip, regular stitch

Abstract

PURPOSE:To prevent a wire from coming out from a capillary by a method wherein a current value flowing between a clamper and an electric torch is detected and the clamper is controlled to be opened or shut in accordance with the value in order to detect a ball formation error on the basis of the current value flowing at a spark and to control the clamper. CONSTITUTION:The followings are installed: an electric torch 5 used to form a ball 1a by melting the tip of a wire 1; a current detection means 6 used to detect a current value flowing between a clamper 3 and the electric torch 5 at a spark. When the current value is a prescribed value or higher, it is judged that the ball has been formed and the clamper 3 is opened; an ordinary wire bonding operation is executed; when the value is less than the prescribed value, it is prevented that the wire 1 comes out from a capillary 2 while the clamper 3 is kept shut; a restoring operation is started.

Description

【発明の詳細な説明】 産業上の利用分野 本発明は半導体製造工程において利用されるワイヤボン
ディング装置に関する。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a wire bonding apparatus used in a semiconductor manufacturing process.

従来の技術 一般にワイヤボンディング装置においては、第６図に示
すようにワイヤ３１を挿通されるとともに先端部にでワ
イヤ３１を被ボンディング部に押し付けで両者を接合す
るキャピラリ３２と、ワイヤ３１を挟持しで固定するク
ランパ３３と、ワイヤ先端との間にスパークを生じさせ
でワイヤ先端を溶融し、ボールを形成する電気トーチ３
５とを備えている。BACKGROUND OF THE INVENTION In general, a wire bonding apparatus, as shown in FIG. 6, has a capillary 32 through which a wire 31 is inserted and whose tip presses the wire 31 against a bonded part to join them together, and a capillary 32 which holds the wire 31 between them. An electric torch 3 generates a spark between the clamper 33 that fixes the wire and the tip of the wire and melts the tip of the wire to form a ball.
5.

そして、！＃６図（ａ）に示すように、キャピラリ３２
が上昇位置にあってワイヤ３１の先端にボール３１＆が
形ｒ＆されかつクランパ３３が開いた状態から、キャピ
ラリ３２を矢印の如く下降させて基板３６上の半導体３
７に形成された電極にワイヤの先端をボンディングして
＃Ｓ１ボンディング部３８を形成し、次にキャピラリ３
２を上昇させるとともに基板３６を相対移動させた後、
再びキャビ２す３２を下降させ、第６図（ｂ）に示すよ
うに、基板３６上の電極にワイヤ３１をボンディングし
て第２ボンディング部３９を形成し、その後ｔｌＳ６図
（ｃ）に示す如くキャピラリ３２を適当相離上昇させた
後、ワイヤ３１をクランパ３３で挟み、その後キャピラ
リ３２とクランパ３３をともに上昇させてワイヤ３１を
第２ボンディング部３９で切断し、次に第６図（ｄ）に
示す如くキャピラリ３２を上昇位置まで上昇させ、側方
に待機していた電気トーチ３５をキャピラリ３２の下方
位置に移動させ、突出したワイヤ３１の先端と電気トー
チ３５との間でスパークを生じさせでワイヤ先端にボー
ル３１ａを形成するという一連の動作を繰り返すことに
より順次ワイヤボンディングを行っている。and,! #6 As shown in Figure (a), the capillary 32
is in the raised position, a ball 31& is formed at the tip of the wire 31, and the clamper 33 is open, then the capillary 32 is lowered as shown by the arrow to remove the semiconductor 3 on the substrate 36.
#S1 bonding part 38 is formed by bonding the tip of the wire to the electrode formed in capillary 3.
2 and relative movement of the substrate 36,
The cavity 2 32 is lowered again, and as shown in FIG. 6(b), the wire 31 is bonded to the electrode on the substrate 36 to form a second bonding part 39, and then as shown in FIG. After raising the capillary 32 with an appropriate separation, the wire 31 is sandwiched between the clampers 33, and then both the capillary 32 and the clamper 33 are raised to cut the wire 31 at the second bonding part 39, and then as shown in FIG. 6(d). As shown in the figure, the capillary 32 is raised to the raised position, the electric torch 35 that was waiting on the side is moved to a position below the capillary 32, and a spark is generated between the tip of the protruding wire 31 and the electric torch 35. Wire bonding is performed sequentially by repeating a series of operations in which a ball 31a is formed at the tip of the wire.

ところで、上記第２ボンディングｇ３９を形成したとき
にワイヤ３１が切れでしまうことがあり、その場合は、
第７図（ａ）に示すように、キャピラリ３２を適当距離
上昇させてもワイヤ３１が一緒に上昇してその先端がキ
ャピラリ３２の先端から突出しない。そのため、第７１
！Ｉ（１＋）に示すように、キャピラリ３２をそのまま
上昇位ｌ！！本で上昇させてもワイヤ３１の先端と電気
トーチ３５との間でスパークが生じず、ボール３１ａは
形成されない。By the way, when forming the second bonding g39, the wire 31 may break, in which case,
As shown in FIG. 7(a), even if the capillary 32 is raised a suitable distance, the wire 31 rises together with the wire 31 and its tip does not protrude from the tip of the capillary 32. Therefore, the 71st
! As shown in I(1+), the capillary 32 is moved upward to l! ! Even if it is lifted by a book, no spark is generated between the tip of the wire 31 and the electric torch 35, and no ball 31a is formed.

さらに、その状態から第７図（ｂ）に矢印で示すように
、り２ンパ３３を開いて次の動作に移行すると、第８図
（ａ）に示すように、パフクテンシ１ン装置３４にでワ
イヤ３１にパックテンシ１ンが付加されているため、第
８図（ｂ）に示すように、ワイヤ３１がキャピラリ３２
から抜は出してしまい、さらにワイヤ３１ががイド４０
から外れてワイヤ３１の抜は出しが検出され、それによ
って装置を停止している。Further, from this state, as shown by the arrow in FIG. 7(b), when the second pump 33 is opened and the next operation is started, the puff tension device 34 is opened as shown in FIG. 8(a). Since a pack tension is added to the wire 31, the wire 31 is attached to the capillary 32 as shown in FIG. 8(b).
The wire 31 is removed from the id 40.
It is detected that the wire 31 is disconnected from the wire 31, and the device is thereby stopped.

発明が解決しようとする課題 ところが、このようにワイヤ３１が一旦キャピラリ３２
から抜は出してがら装置が停止すると、正常動作に復帰
させる時にワイヤ３１を袴ヤピラ１１３２に再び通す必
要があり、その際数１０μ−程度の細さのワイヤ３１を
ピンセットでつまんでキャピラリ３２に通さねばならな
いために作業が難しく時間を要するという問題があった
。Problem to be Solved by the Invention However, the wire 31 is once connected to the capillary 32 in this way.
If the device stops while being removed from the capillary, it is necessary to pass the wire 31 through the capillary 32 again to restore normal operation. There was a problem that the work was difficult and time consuming because it had to be passed through.

一方、キャピラリ３２からのワイヤ３１の抜は出しを防
止するために、第９図に示すように、ワイヤ３１を常時
軽く挟持するようにしたＰＩＳ２のクランパ４１を設け
たものもあるが、この第２のクランパ４１は、ワイヤ３
１を両側から挟持する一対の挟圧片を備えており、その
平行度を高精度に保つ必要があるため、機構が複雑で高
価となるとともにメンテナンス性が悪いという問題があ
った。On the other hand, in order to prevent the wire 31 from being pulled out from the capillary 32, as shown in FIG. The clamper 41 of No. 2 is connected to the wire 3
1 from both sides, and it is necessary to maintain their parallelism with high precision, which causes problems such as a complicated and expensive mechanism and poor maintainability.

さらに正常動作に復帰させるには、まず第１０図（ａ）
に示すように、作業者がワイヤ３１をピンセット等で挟
んで繰り出し、キャピラリ３２の先端からワイヤ３１を
突出させてその先端３１ｂを折り曲げ、次にキャピラリ
３２を下降させて基板３６の空き空間に、第１０図（ｂ
）に示すように、第２ボンディング部３９に対応する捨
てボンディング部４２を形成し、その後キャピラリ３２
を適当距離上昇させてワイヤ３１を功断した後、キャピ
ラリ３２を上昇位Ｗ１まで上昇させ、ワイヤ３１の先端
と電気トーチ３５との間にスパークを生じさせでボール
３１ａを形成するという手動操作が必要であり、人手作
業を要するとともに復帰本で時間がかかって能率が悪く
、また夜間に無人作業を行っている場合にはワイヤボン
ディング装置は停止したままになる等の問題があった。To further restore normal operation, first see Figure 10(a).
As shown in FIG. 3, an operator holds the wire 31 with tweezers and draws it out, causes the wire 31 to protrude from the tip of the capillary 32, bends the tip 31b, and then lowers the capillary 32 into the empty space of the substrate 36. Figure 10 (b
), a sacrificial bonding part 42 corresponding to the second bonding part 39 is formed, and then the capillary 32
After raising the wire 31 by a suitable distance and successfully breaking the wire 31, the capillary 32 is raised to the raised position W1, and a spark is generated between the tip of the wire 31 and the electric torch 35 to form a ball 31a. This method requires manual labor, is time consuming, and is inefficient, and also poses problems such as the wire bonding device remaining stopped when unmanned work is performed at night.

本発明は上記従来の問題点に鑑み、ボール形成エラーが
生じた場合に簡単な構成でこれを検出し、ワイヤがキャ
ピラリから抜は出すのを防止できるワイヤボンディング
装置の提供を目的とする。In view of the above conventional problems, it is an object of the present invention to provide a wire bonding device that can detect a ball formation error with a simple configuration and prevent the wire from being pulled out from the capillary.

さらに、本発明はボール形成エラーが生じた場合に正常
動作に自動復帰できるワイヤボンデイン本発明は、上記
目的を達成するため、クランパと電気トーチの間に流れ
る電流値を検出する電流検出手段を設け、その検出電流
値に応じて前記クランパをｍ閉制御する手段を設けてい
る。Furthermore, the present invention provides a wire bonding device that can automatically return to normal operation when a ball formation error occurs.In order to achieve the above object, the present invention includes a current detection means for detecting the value of the current flowing between the clamper and the electric torch. and means for controlling the clamper to close according to the detected current value.

さらに、本発明はキャピラリとクランパを一体的に移動
させる手段と、キャピラリとクランパの相対位置を変化
させる手段とを設け、前記電流検出手段による検出電流
値が所定値未満のときに、クランパによりワイヤを固定
したままキャピラリを上昇させてキャピラリからワイヤ
先端を突出させた後電気トーチとワイヤ先端との間隔を
所定距離に設定してそれら間にアーク電流を流すように
、キャピラリ、クランパ及び電気トーチを制御する手段
を設けている。Furthermore, the present invention includes means for integrally moving the capillary and the clamper, and means for changing the relative positions of the capillary and the clamper, so that when the current value detected by the current detection means is less than a predetermined value, the clamper After raising the capillary while keeping it fixed, and making the wire tip protrude from the capillary, set the distance between the electric torch and the wire tip to a predetermined distance, and move the capillary, clamper, and electric torch so that an arc current flows between them. A means of control is provided.

また、キャピラリからワイヤ先端を突出させる際にキャ
ピラリに超音波を印加し、またワイヤ先端と電気トーチ
を接触導通させてスパーク前にワイヤの突出を確認する
ようにしている。Further, when the wire tip is made to protrude from the capillary, ultrasonic waves are applied to the capillary, and the wire tip and an electric torch are brought into contact with each other to confirm the protrusion of the wire before sparking.

ｆｔ用 本発明は上記構成を有するので、ボール形成エラーを生
じた場合、それをスパーク時に流れる電流値によって検
出することができ、エラー時にクランパを閏じたままと
することによってキャピラリからワイヤが抜は出すのを
防止でき、復帰に必要な時間が短かくて済み、しかも機
構の複雑な第２のクランパなどが不要であるため、構成
も簡単で、メンテナンス性も良好である。Since the present invention for FT has the above configuration, if a ball formation error occurs, it can be detected by the current value flowing at the time of sparking, and by keeping the clamper clamped in the event of an error, the wire can be pulled out from the capillary. It is possible to prevent the device from coming out, the time required for return is short, and since there is no need for a second clamper with a complicated mechanism, the structure is simple and maintainability is also good.

さらに、キャピラリ及びクランパを動作させてキャピラ
リ先端からワイヤを繰り出し、その先端と電気トーチと
の間でスパークを発生させてボールを形成させることに
より正常動作に自動復帰することもでき、自動連続運転
が可能となる。Furthermore, by operating the capillary and clamper to feed out the wire from the tip of the capillary, a spark is generated between the tip and the electric torch to form a ball, which can automatically return to normal operation, allowing automatic continuous operation. It becomes possible.

実施例 以下、本発明の一実施例を＃＆１図〜第５図を参照しな
がら説明する。EXAMPLE Hereinafter, an example of the present invention will be described with reference to FIGS.

まず、第１図及び第２図により本発明の１部の構成と動
作を説明すると、ワイヤ１を挿通されたキャピラリ２が
設けられ、ワイヤ１をキャピラリ２の先端部にで接合す
べき被ボンディング部に押し付けながら超音波を印加す
ることによって両者を接合するようにされている。この
キャピラリ２上方にはワイヤ１を挟持し°て固定するク
ランパ３が設けられ、さらに上方に吸引エア流によって
ワイヤ１にバックテンシランを付加するパックテンシラ
ン装置４が設けられている。また、各ワイヤリング終了
後にワイヤ１の先端との間にスパークを生じさせ、ワイ
ヤ１の先端を溶融してボール１ａを形成する電気トーチ
５が設けられ、かつスパーク時に前記クランパ３とＴＬ
２ｃ）−チ５の間に流れる電流値を検出する電流検出手
段６が設けられ、検出信号がクランパ制御手段３ａに入
力されている。First, the structure and operation of a part of the present invention will be explained with reference to FIGS. The two are bonded by applying ultrasonic waves while pressing the two. A clamper 3 for clamping and fixing the wire 1 is provided above the capillary 2, and a pack tension run device 4 for applying back tension to the wire 1 using a suction air flow is provided above the capillary 2. Further, an electric torch 5 is provided which generates a spark between the tip of the wire 1 after each wiring is completed, and melts the tip of the wire 1 to form a ball 1a.
2c) Current detection means 6 for detecting the value of the current flowing between -5 and 5 is provided, and a detection signal is input to the clamper control means 3a.

そして、前記電流検出手段６により検出した電流値が所
定値以上であれば、ボールが形成されていると判断し、
第２図の（ａ）から（ｂ）に移行してクランパ３を開き
、通常のワイヤボンディング動作を行い、所定値未満で
あれば、ボールを形成するのに十分な電流が流れなかっ
たのであるからボールは形成されていないと判断し、第
２図の（ａ）から（ｃ）に移行し、クランパ３を閉じた
ままにしてワイヤ１がキャピラリ２から抜は出すのを防
止し、次に手動による復帰又は自動復帰動作に移るよう
に構成されている。If the current value detected by the current detection means 6 is equal to or greater than a predetermined value, it is determined that a ball is formed;
Moving from (a) to (b) in Figure 2, the clamper 3 is opened and a normal wire bonding operation is performed, and if it is less than a predetermined value, then insufficient current to form a ball was not flowing. It is determined that no ball has been formed, and the process moves from (a) to (c) in FIG. It is configured to move to manual return or automatic return operation.

次に、通常のボンディング動作に自動復帰させる場合の
動作を第３図により説明する。Next, the operation for automatically returning to normal bonding operation will be explained with reference to FIG.

まず上記要領でボールが形成されたか否かの判断を行い
、形成されなかった場合、クランパ３を閉じて停止した
ままでキャピラリ２に超音波を印加し、このキャビ２す
２を適当距離上昇させることによってワイヤ１をキャピ
ラリ２の先端から突出させ、次に電気トーチ５をスパー
ク位置に移動させた後、クランパ３とキャピラリ２を下
降させ、ワイヤ１の先端と電気トーチ５が接触して導通
したか否かを判断し、導通しなかった場合はワイヤ１が
突出していないので、停止してエラー表示する。導通し
た場合にはクランパ３とキャピラリ２を一定量上昇させ
た後電気トー千５との間でスパークさせてボールを形成
する。そして元に戻り、ボールが形成された場合には、
クランパ３を開いて通常のボンディング動作に移行する
。First, it is determined whether or not a ball has been formed as described above, and if it has not been formed, an ultrasonic wave is applied to the capillary 2 while the clamper 3 is closed and stopped, and this cavity 2 is raised an appropriate distance. By doing this, the wire 1 was made to protrude from the tip of the capillary 2, and then the electric torch 5 was moved to the spark position, and then the clamper 3 and the capillary 2 were lowered, and the tip of the wire 1 and the electric torch 5 came into contact and became electrically conductive. If there is no conduction, the wire 1 is not protruding, so the process stops and an error message is displayed. When conduction is established, the clamper 3 and capillary 2 are raised by a certain amount, and then a spark is generated between the clamper 3 and the electric tow 5 to form a ball. And if it returns to its original state and forms a ball,
The clamper 3 is opened and normal bonding operation begins.

次に、具体的なワイヤボンディング装置の構成例を第４
図により説明する。ワイヤ１は、吸引気流によりワイヤ
１に引張力を付与するパックテンシａン装置４、がイド
７及びクランパ３を介してキャピラリ２に挿通されてい
る。Next, a specific example of the configuration of a wire bonding device will be explained in the fourth section.
This will be explained using figures. The wire 1 is inserted into the capillary 2 via an id 7 and a clamper 3, and a pack tensioning device 4 that applies a tensile force to the wire 1 by suction airflow.

前記キャピラリ２は超音波ホーン８の先ｊ１部に装着さ
れており、この超音波ホーン８のｔ１端部は、支持軸９
回りに上下揺動可能に支持された揺動腕１０にで、前記
支持軸９と同−軸心回りに揺動可能に支持されでいる。The capillary 2 is attached to the tip j1 of the ultrasonic horn 8, and the t1 end of the ultrasonic horn 8 is connected to the support shaft 9.
It is supported so as to be able to swing about the same axis as the support shaft 9 by a swinging arm 10 that is supported so as to be able to swing up and down.

又、前記超音波ホーン８の後端からは揉作杆１１が延出
され、そのｉ端部と前記揺動腕１０との間に、前記超音
波ホー２８の先端部を下方に向かつて付勢するリニアモ
ータ１２が介装されている。Further, a rubbing rod 11 is extended from the rear end of the ultrasonic horn 8, and a tip of the ultrasonic horn 28 is attached between the i end thereof and the swinging arm 10 in a downward direction. A linear motor 12 is interposed to provide power.

尚、前記超音波ホーン８の後端部の側面には防泥揺動腕
１０に係合して超音波ホーン８の先端部の下方揺動端を
規制するストッパ１３が突設されている。さらに、前記
リニアモータ１２は前記超音波ホーン８を上方に揺動さ
せ、前記キャビ２す２をクランパ３に対して相対的に上
昇させ得るように収縮可能であり、かつ前記揺動腕１０
には前記ストッパ１３が係合して前記超音波水−ン８の
上方への揺動端を規制する係合片１４が突設されている
。A stopper 13 is protruded from the side surface of the rear end of the ultrasonic horn 8 and engages with the anti-mud swinging arm 10 to restrict the downward swinging end of the tip of the ultrasonic horn 8. Furthermore, the linear motor 12 is retractable so as to swing the ultrasonic horn 8 upward and raise the cabinet 2 relative to the clamper 3, and the swing arm 10
An engaging piece 14 is protrudingly provided on the holder so that the stopper 13 engages with the engaging piece 14 to restrict the upward swinging end of the ultrasonic water fountain 8.

前記クランパ３は前記揺動腕１０から超音波ホー２８の
先端部に向かって延出されたＭ長腕１５に装着されてい
る。The clamper 3 is attached to an M long arm 15 extending from the swinging arm 10 toward the tip of the ultrasonic hoe 28.

前記揺動腕１０の後１１１部に取り付けられたカムロー
ラ１ＧがＡＣサーボモータ１８にで回転駆動可能なリニ
７モーシａンカム１７に係合しでおり、揺動腕１０がＡ
Ｃサーボモータ１８の回松角に比例して上下揺動するよ
うに構成されている。A cam roller 1G attached to the rear part 111 of the swing arm 10 is engaged with a linear motion cam 17 that can be rotated by an AC servo motor 18, and the swing arm 10 is
It is configured to swing up and down in proportion to the turning angle of the C servo motor 18.

前記ワイヤ１の先端との間でスパークを生じさせろ電気
トーチ５は、前記キャピラリ２の直下位置と側方の待機
位置との間で往復移動可能なトーチ支持体１９に装着さ
れでいる。又、このトーチ支持体１９は昇降駆動シリン
グ２０にで上方位置と下方位置の２位置間で切換え可能
に構成されている。The electric torch 5 that generates a spark between the tip of the wire 1 is attached to a torch support 19 that can reciprocate between a position directly below the capillary 2 and a standby position on the side. Further, the torch support 19 is configured to be switchable between two positions, an upper position and a lower position, by means of a lifting drive sill 20.

２１は、水平面上で互いに直交するＸ方向とＹ方向に位
置決め可能なＸ−Ｙテーブルであり、ワイヤボンディン
グすべき半導体等を装着された基板２２を固定支持する
ように構成されている。Reference numeral 21 denotes an X-Y table that can be positioned in X and Y directions perpendicular to each other on a horizontal plane, and is configured to fixedly support a substrate 22 on which a semiconductor or the like to be wire-bonded is mounted.

以上の構成のワイヤボンディング装置を用いた正常なワ
イヤボンディング工程は従来例で説明した通りであり、
説明は省略する。The normal wire bonding process using the wire bonding device with the above configuration is as explained in the conventional example.
Explanation will be omitted.

尚、基板２２を固定設置するＸ−Ｙテーブル２１は、基
板２２に装着されたボンディングすべき各半導体上の被
ボンディング部及びそれに対応する基板２２上の各被ボ
ンディング部をキャピラリ２の動作と連動して順次キャ
ピラリ２の直下位置に位置決めするように、予め制御部
に移動行程が、教示されている。また、キャピラリ２及
びクランパ３は揺動腕１０が上下揺動することによって
一体的に昇降し、キャピラリ２が被ポンディング部に当
接した後はキャピラリ２はリニアモータ１２の付勢力に
で被ボンディング部に押圧される。Incidentally, the X-Y table 21 on which the substrate 22 is fixedly installed is linked to the operation of the capillary 2 to move the bonded portions on each semiconductor to be bonded mounted on the substrate 22 and the corresponding bonded portions on the substrate 22. The movement stroke is taught to the control unit in advance so that the capillary 2 is sequentially positioned directly below the capillary 2. Further, the capillary 2 and the clamper 3 are moved up and down as a unit by the vertical swinging of the swinging arm 10, and after the capillary 2 comes into contact with the pounded part, the capillary 2 is subjected to the biasing force of the linear motor 12. Pressed against the bonding part.

次に、ボールが形成されなかった時の自動復帰工程を第
５図を参照しながら説明する。第２ボンディング部の形
成時にワイヤ切れが生じた状態でキャピラリ２が上昇位
置に上昇し、ボールが形成されなかった場合、クランパ
３は（イ）の如く閉じたままであり、続いて（ロ）の如
くリニアモータ１２を収縮動作させてクランパ３に対し
てキャビラ＋７２を上昇させ、キャピラリ２の先端から
ワイヤ１を突出させる。このとき、キャピラリ２に超音
波を印加してワイヤ１の滑りを良くする０次に、（ハ）
の如く電気トーチ５をキャピラリ２の直下位置に移動さ
せた後、ＡＣサーボモータ１８を回転させで揺動腕１０
を揺動させ、（ニ）の如くワイヤ１をクランプしたクラ
ンパ３とキャピラリ２を一体的に下方に移動させ、ワイ
ヤ１の先端を電気トーチ５に接触・導通させてワイヤ１
の先端がキャピラリ２から突出しでいることを確認する
。導通しなかった場合は自動復帰不可能なエラーが発生
しているので、停止してエラー表示を行う０次に、ＡＣ
サーボモータ１８を逆回転させてクランｔ＜３及びキャ
ピラリ２を所定量上昇させ、（ホ）の如くキャピラリ２
を所定位置に復帰させる。その後、（へ）の如くスパー
クを発生させてワイヤ１の先端にボール１ａを形成する
０次に（ト）の如くクランパ３を開いた後、（チ）の如
＜ＡＣサーボモータ１８を逆回転させてクランパ３とキ
ャピラリ２を一体的に上昇させ、クランパ３を所定位置
に復帰位置させ、最後にリニアモータ１２を伸張状態に
復帰させてキャピラリ２をクランパ３に対して相対的に
下降させ、（す）の如くキャピラリ２を所定位置に再び
復帰させる。こうして、ワイヤ１の先端にボール１ａが
形成されるとともにクランノ（３及びキャピラリ２が所
定位置に位置した状態となり、正常なボンディング工程
に復帰する。Next, the automatic return process when no ball is formed will be explained with reference to FIG. If the capillary 2 rises to the raised position with wire breakage occurring during formation of the second bonding part and no ball is formed, the clamper 3 remains closed as shown in (a), and then continues as shown in (b). The linear motor 12 is operated to retract as shown in FIG. At this time, ultrasonic waves are applied to the capillary 2 to improve the slippage of the wire 1 (c)
After moving the electric torch 5 to a position directly below the capillary 2 as shown in FIG.
The clamper 3 that clamps the wire 1 and the capillary 2 are moved downward as a unit as shown in (d), and the tip of the wire 1 is brought into contact with and electrically connected to the electric torch 5, and the wire 1 is
Make sure that the tip of the capillary protrudes from the capillary 2. If there is no continuity, an error that cannot be automatically recovered has occurred, so the AC will stop and display the error.
The servo motor 18 is reversely rotated to raise the clamp t<3 and the capillary 2 by a predetermined amount, and as shown in (e), the capillary 2
Return to the specified position. After that, a spark is generated as shown in (f) to form a ball 1a at the tip of the wire 1. After opening the clamper 3 as shown in (g), the AC servo motor 18 is rotated in the reverse direction as shown in (h). the clamper 3 and the capillary 2 are raised together, the clamper 3 is returned to a predetermined position, and finally the linear motor 12 is returned to the extended state to lower the capillary 2 relative to the clamper 3. Return the capillary 2 to the predetermined position as shown in (S). In this way, the ball 1a is formed at the tip of the wire 1, and the cranometer 3 and the capillary 2 are placed in the predetermined positions, and the normal bonding process is resumed.

上記実施例では揺動腕１０の上下揺動によってクランパ
３とキャピラリ２が一体的に昇降するとともに、リニア
モータ１２にでキャピラリ２をクランパ３に対して相対
的に上昇及び復帰させるようにしたが、クランパ３とキ
ャピラリ２を各別に昇降できるように構成してもよい。In the above embodiment, the clamper 3 and the capillary 2 are raised and lowered together by the vertical swinging of the swinging arm 10, and the capillary 2 is raised and returned relative to the clamper 3 by the linear motor 12. , the clamper 3 and the capillary 2 may be configured to be able to be raised and lowered separately.

発明の効果 本発明のワイヤボンディング装置によれば、ボール形成
エラーを生じた場合、それをスパーク時に流れる電流値
によって検出することができ、エラー時にクランパを閉
じたままとすることによってキャピラリからワイヤが抜
は出すのを防止でき、復帰に必要な時間が短かくて済む
、又、機構の複雑な第２のクランパなどが不要であるた
め、構成も簡単でメンテナンス性も良好である。Effects of the Invention According to the wire bonding device of the present invention, if a ball formation error occurs, it can be detected by the current value flowing at the time of sparking, and by keeping the clamper closed in the event of an error, the wire can be removed from the capillary. It is possible to prevent pulling out, the time required for return is short, and since there is no need for a second clamper with a complicated mechanism, the structure is simple and maintainability is good.

さらに、キャピラリ及びクランパを動作させてキャピラ
リからワイヤを繰り出し、その先端と電気トーチとの間
でスパークを発生させてボールを形成させることにより
正常動作に自動復帰することもでき、そのため夜間の無
人作業においてもワイヤ切れによってワイヤボンディン
グ装置が停止したままとなることはなく、ワイヤボンデ
ィング作業の生産性を着しく向上で外るという効果が得
られる。Furthermore, by operating the capillary and clamper to feed out the wire from the capillary, a spark is generated between the tip of the capillary and an electric torch to form a ball, allowing automatic recovery to normal operation.This allows unattended operation at night. Even in this case, the wire bonding apparatus does not remain stopped due to wire breakage, and the productivity of wire bonding work can be significantly improved.

又、キャピラリを上昇させてワイヤをその先端から突出
させる際にキャピラリに超音波を印加すると、ワイヤの
滑りを良くして容易かつ確実にワイヤを突出させること
ができる。Furthermore, if an ultrasonic wave is applied to the capillary when the capillary is raised to cause the wire to protrude from its tip, the wire will slide more easily and the wire can be protruded easily and reliably.

さらに、スパーク前にワイヤと電気トーチを接触導通さ
せてワイヤが突出したかどうかを確認することによって
自動復帰不可能な状態であるにも拘わらず、復帰動作を
繰り返すのを防止できる。Further, by bringing the wire and the electric torch into contact with each other before sparking and checking whether the wire has protruded, it is possible to prevent the return operation from repeating even though automatic return is not possible.

【図面の簡単な説明】 第１図〜第５図は本発明の一実施例を示し、第１図は要
部の概略構成図、第２図は動作説明図、第３図はボール
形成エラーを生じた時の自動復帰動作の７０−チャート
、第４図はワイヤボンディング装置の錯視図、第５図は
ＰＩ４４図のワイヤボンディング装置における自動復帰
動作の説明図、第６図（ａ）〜（ｄ）は正常なボンディ
ング工程の動作説明図、第７図（ａ）　、（ｂ）はワイ
ヤ切れを生じた状態の説明図、第８図〜ｆｊ４１θ図は
従来例を示し、第８図（ａ）　、（ｂ）は第１の従来例
における動作説明図、第９図はＰＩＳ２の従来例の概略
構成図、第１０図（ａ）　、　（ｂ）は正常なボンディ
ング工程に復帰するための従来の工程の説明図である。 １・・・・・・・・・ワイヤ １ａ・・・・・・ボール ２・・・・・・・・・キャピラリ ３・・・・・・・・・クランパ ３ａ・・・・・・クランパ制御手段 ４・・・・・・・・・バックテンシ屋ン装置５・・・・
・・・・・電気トーチ ６・・・・・・・・・電流検出手段 ８・・・・・・・・・超音波ホーン １０・・・・・・・・・揺動腕 １２・・・・・・・・・リニアモータ １８・・・・・・・・・ＡＣサーボモータ。 第３図 第４図 １Ｂ−−−ＡＣ４−本′も−ク 第５図[BRIEF DESCRIPTION OF THE DRAWINGS] Figures 1 to 5 show an embodiment of the present invention. Figure 1 is a schematic diagram of the main parts, Figure 2 is an explanatory diagram of the operation, and Figure 3 is a ball formation error. 70-chart of the automatic return operation when a problem occurs, FIG. 4 is an optical illusion diagram of the wire bonding device, FIG. d) is an explanatory diagram of the operation of a normal bonding process, FIGS. 7(a) and (b) are explanatory diagrams of a state in which wire breakage has occurred, FIGS. 8 to fj41θ are conventional examples, and FIG. ), (b) are explanatory diagrams of the operation in the first conventional example, Figure 9 is a schematic configuration diagram of the conventional example of PIS2, and Figures 10 (a) and (b) are conventional diagrams for returning to the normal bonding process. It is an explanatory diagram of the process of. 1...Wire 1a...Ball 2...Capillary 3...Clamper 3a...Clamper control Means 4... Back tensioner device 5...
..... Electric torch 6 ..... Current detection means 8 ..... Ultrasonic horn 10 ..... Rocking arm 12 ...・・・・・・Linear motor 18・・・・・・AC servo motor. Figure 3 Figure 4 1B---AC4-book Figure 5

Claims (4)

【特許請求の範囲】[Claims] （１）ワイヤを挿通されるとともに先端部にでワイヤを
被ボンディング部に押し付けで両者を接合するキャピラ
リと、ワイヤを挟持して固定するクランパと、ワイヤに
バックテンションを付加する手段と、ワイヤ先端との間
にスパークを生じさせでワイヤ先端を溶融し、ボールを
形成する電気トーチとを備えたワイヤボンディング装置
においで、前記クランパと電気トーチの間に流れる電流
値を検出する電流検出手段を設け、その検出電流値に応
じて前記クランパを開閉制御する手段を設けたことを特
徴とするワイヤボンディング装置。(1) A capillary through which the wire is inserted and whose tip presses the wire against the bonded part to join them together, a clamper that clamps and fixes the wire, a means for applying back tension to the wire, and a tip of the wire. A wire bonding apparatus is provided with an electric torch that generates a spark between the clamper and the electric torch to melt the tip of the wire and form a ball. , A wire bonding apparatus characterized in that a means for controlling opening and closing of the clamper according to the detected current value is provided. （２）キャピラリとクランパを一体的に移動させる手段
と、キャピラリとクランパの相対位置を変化させる手段
とを設け、さらに電流検出手段による検出電流値が所定
値未満のときに、クランパによりワイヤを固定したまま
キャピラリを上昇させてキャピラリからワイヤ先端を突
出させた後電気トーチとワイヤ先端との間隔を所定距離
に設定してそれら間にアーク電流を流すように、キャピ
ラリ、クランパ及び電気トーチを制御する手段を設けた
請求項１記載のワイヤボンディング装置。(2) A means for integrally moving the capillary and the clamper, and a means for changing the relative position of the capillary and the clamper are provided, and the wire is fixed by the clamper when the current value detected by the current detection means is less than a predetermined value. The capillary, clamper, and electric torch are controlled so as to raise the capillary while keeping the capillary in place so that the tip of the wire protrudes from the capillary, and then set the distance between the electric torch and the tip of the wire to a predetermined distance and to flow an arc current between them. The wire bonding apparatus according to claim 1, further comprising means. （３）キャピラリを上昇させてワイヤ先端を突出させる
ときにキャピラリに超音波を印加するようにした請求項
２記載のワイヤボンディング装置。(3) The wire bonding apparatus according to claim 2, wherein ultrasonic waves are applied to the capillary when the capillary is raised to project the tip of the wire. （４）電気トーチとワイヤ先端との間隔を所定距離に設
定するときに、電気トーチとワイヤ先端を接触導通させ
た後キャピラリとクランパを所定距離上昇させるように
した請求項２又は３記載のワイヤボンディング装置。(4) The wire according to claim 2 or 3, wherein when setting the distance between the electric torch and the tip of the wire to a predetermined distance, the capillary and the clamper are raised a predetermined distance after the electric torch and the tip of the wire are brought into contact and conduction. bonding equipment.
JP63051922A 1988-03-04 1988-03-04 Wire bonding equipment Expired - Fee Related JP2506904B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP63051922A JP2506904B2 (en) 1988-03-04 1988-03-04 Wire bonding equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63051922A JP2506904B2 (en) 1988-03-04 1988-03-04 Wire bonding equipment

Publications (2)

Publication Number Publication Date
JPH01225327A true JPH01225327A (en) 1989-09-08
JP2506904B2 JP2506904B2 (en) 1996-06-12

Family

ID=12900367

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63051922A Expired - Fee Related JP2506904B2 (en) 1988-03-04 1988-03-04 Wire bonding equipment

Country Status (1)

Country Link
JP (1) JP2506904B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6294144B1 (en) 1992-05-22 2001-09-25 Hyperion Catalysis International, Inc. Methods and catalysts for the manufacture of carbon fibrils

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62179733A (en) * 1986-02-04 1987-08-06 Toshiba Corp Wire bonding system

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62179733A (en) * 1986-02-04 1987-08-06 Toshiba Corp Wire bonding system

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6294144B1 (en) 1992-05-22 2001-09-25 Hyperion Catalysis International, Inc. Methods and catalysts for the manufacture of carbon fibrils

Also Published As

Publication number Publication date
JP2506904B2 (en) 1996-06-12

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