JPH01221681A - Testing apparatus for electronic parts - Google Patents
Testing apparatus for electronic partsInfo
- Publication number
- JPH01221681A JPH01221681A JP63045857A JP4585788A JPH01221681A JP H01221681 A JPH01221681 A JP H01221681A JP 63045857 A JP63045857 A JP 63045857A JP 4585788 A JP4585788 A JP 4585788A JP H01221681 A JPH01221681 A JP H01221681A
- Authority
- JP
- Japan
- Prior art keywords
- holder
- probe
- contact
- pressure
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000012360 testing method Methods 0.000 title claims description 23
- 239000000523 sample Substances 0.000 claims abstract description 42
- 238000000926 separation method Methods 0.000 claims description 15
- 238000010586 diagram Methods 0.000 description 6
- 230000007423 decrease Effects 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000013459 approach Methods 0.000 description 2
- 230000033228 biological regulation Effects 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000012777 electrically insulating material Substances 0.000 description 1
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
- Tests Of Electronic Circuits (AREA)
Abstract
Description
【発明の詳細な説明】 ［産業上の利用分野］ 本発明はＩＣ等の電子部品の試験装置に関する。[Detailed description of the invention] [Industrial application field] The present invention relates to a testing device for electronic components such as ICs.
［従来の技術］
従来、例えばＩＣのＡＣ特性、ＤＣ特性を測定するため
、第３図に示す如くの試験装置が用いられる。ここで、
ＩＣＩは部品本体部ＩＡに複数のリード部ＩＢを備え、
試験装置は保持具２と測定子３と接離装置４を有して構
成される。[Prior Art] Conventionally, a test device as shown in FIG. 3 is used to measure, for example, the AC characteristics and DC characteristics of an IC. here,
The ICI has a plurality of lead parts IB in the component main body part IA,
The test device includes a holder 2, a probe 3, and a contact/separation device 4.
保持具２は真空パッド２Ａを備え、この真空パッド２Ａ
によりＩＣＩの部品本体部ＩＡを吸着保持する。測定子
３はＩＣＩのリード部ＩＢに対応して設けられ、測定部
３Ａに接続されＩＣＩの任意の特性を測定可能とする。The holder 2 includes a vacuum pad 2A, and this vacuum pad 2A
The component main body part IA of the ICI is held by suction. The measuring element 3 is provided corresponding to the lead part IB of the ICI, and is connected to the measuring part 3A so as to be able to measure any characteristic of the ICI.
接離装置４はエア源４Ａ、電磁切換弁４Ｂ、エアシリン
ダ４Ｃからなり、エアシリンダ４Ｃに吊り下げ支持され
ている保持具２を測定子３に対して上下動し、保持具２
に保持されるＩＣＩのリード部ＩＢと測定子３とを相互
に接触せしめる。５は保持具２の回り止めガイドロッド
である。The contact/separation device 4 consists of an air source 4A, an electromagnetic switching valve 4B, and an air cylinder 4C, and moves the holder 2 suspended and supported by the air cylinder 4C up and down relative to the probe 3.
The lead portion IB of the ICI held by the probe 3 and the probe 3 are brought into contact with each other. Reference numeral 5 denotes a detent guide rod of the holder 2.
ところで、上記試験装置は、測定子３に対する保持具２
の下降限を調整ねじからなるストッパ６によって調節し
、これによってＩＣＩのリード部ＩＢと測定子３との接
触状態を適正化し、結果としてＩＣＩの特性を確実かつ
安定的に測定可能としている。By the way, the above test device has a holder 2 for the measuring element 3.
The lower limit of the ICI is adjusted by a stopper 6 consisting of an adjustment screw, thereby optimizing the contact state between the lead portion IB of the ICI and the probe 3, and as a result, the characteristics of the ICI can be measured reliably and stably.
しかしながら、上記従来の試験装置にあっては、ＩＣＩ
の製造誤差によりリード部ＩＢの厚みや脚長がばらつい
たり、測定子３の設定位置が使用経過により変化する場
合にも、保持具２の下降限がストッパ６により固定化さ
れ、■ジー１部ＩＢが測定子３に接触できなかったり、
■クー１部ＩＢと測定子３との接触圧が過大になって両
者に破損を生ずるおそれがある。However, in the above conventional test equipment, the ICI
Even if the thickness and leg length of the lead part IB vary due to manufacturing errors, or the setting position of the probe 3 changes over time, the lower limit of the holder 2 is fixed by the stopper 6, and may not be able to contact probe 3,
(2) The contact pressure between the cooler 1 part IB and the probe 3 may become excessive and cause damage to both.
また、上記従来の試験装置において、ＩＣＩのリード部
ＩＢと測定子３との接触圧は、エアシリンダ４Ｃに付与
されるライン圧により一義的に定まってしまい、任意の
レベルに調節できない、このことは１例えば品種変更に
よりリード部ＩＢの本数が異なることとなる各ＩＣＩに
ついて、リード部ＩＢの本数の増加に応じて接触圧を増
加したり、リード部ＩＢの本数の減少に応じて接触圧を
減少する等を不可能とする。In addition, in the conventional test device described above, the contact pressure between the ICI lead part IB and the probe 3 is uniquely determined by the line pressure applied to the air cylinder 4C, and cannot be adjusted to an arbitrary level. 1 For example, for each ICI whose number of lead parts IB differs due to a change in product type, the contact pressure should be increased in accordance with the increase in the number of lead parts IB, and the contact pressure should be increased in accordance with a decrease in the number of lead parts IB. make it impossible to decrease, etc.
本発明は、電子部品のリード部と測定子との接触状態を
常に適正化し、電子部品の特性を確実かつ安定的に測定
することを目的とする。SUMMARY OF THE INVENTION An object of the present invention is to always optimize the contact state between the lead portion of an electronic component and a probe, and to reliably and stably measure the characteristics of the electronic component.
［課題を解決するための手段］
本発明は、部品本体部にリード部を備える電子部品を保
持する保持具と、電子部品のリード部に対応して設けら
れ、該電子部品の任意の性能を測定するための測定子と
、保持具と測定子とを相互に接離するように両者の少な
くとも一方を加圧し、保持具に保持される電子部品のリ
ード部と測定子とを相互に接触させる接離装置とを有し
てなる電子部品の試験装置において、接離装置は、保持
具と測定子の少なくとも一方に加える加圧力を一定に維
持でき、保持具に保持される電子部品のリード部と測定
子とが上記加圧力にて相互に圧接する位置をその加圧端
とするようにしたものである。[Means for Solving the Problems] The present invention provides a holder for holding an electronic component having a lead portion in the component body, and a holder provided corresponding to the lead portion of the electronic component, and a holder that is provided corresponding to the lead portion of the electronic component, and a holder that holds an electronic component, and a holder that is provided corresponding to the lead portion of the electronic component. Pressure is applied to at least one of the gauge head for measurement, the holder, and the gauge head so as to bring them into contact with each other, and the lead portion of the electronic component held by the holder and the gauge head are brought into contact with each other. In an electronic component testing device comprising a contact/separation device, the contact/separation device can maintain a constant pressure force applied to at least one of the holder and the probe, and the lead portion of the electronic component held by the holder. The pressurizing end is defined as the position where the probe and the probe contact each other with the above-mentioned pressurizing force.
また、前記接離装置が、加圧力のレベルを調節できるよ
うにしたものである。Further, the contact/separation device is configured to be able to adjust the level of pressing force.
［作用］
本発明において、保持具と測定子は、該保持具に保持さ
れる電子部品のリード部と測定子とが一定の加圧力にて
相互に圧接する位置を、それらの相対移動の移動限とさ
れる。したがって、保持具と測定子の移動限がストッパ
等にて固定化されないから、電子部品の製造誤差により
リード部の厚みや脚長がばらついたり、測定子の設定位
置が使用経過により変化する場合にも、リード部と測定
子とを所定の接触圧にて確実に接触させることができる
。[Function] In the present invention, the holder and the probe are moved by their relative movement to a position where the lead portion of the electronic component held by the holder and the probe contact each other with a constant pressure. Limited. Therefore, the limit of movement of the holder and probe is not fixed by a stopper or the like, so even if the thickness or leg length of the lead section varies due to manufacturing errors in electronic components, or the set position of the probe changes due to usage, , the lead portion and the probe can be reliably brought into contact with a predetermined contact pressure.
また、本発明において、接離装置が定める一定の加圧力
を調節可能とする場合には、例えば品種変更によりリー
ド部の本数が異なることとなる各電子部品について、リ
ード部の本数の増加に応じて接触圧を増加したり、リー
ド部の本数の減少に応じて接触圧を減少する等、リード
部と測定子との接触圧を任意の適正レベルに設定できる
。In addition, in the present invention, when the constant pressing force determined by the contact/separation device is adjustable, for example, for each electronic component whose number of lead parts changes due to a change in product type, it is possible to adjust the pressure according to the increase in the number of lead parts. The contact pressure between the lead part and the probe can be set to any appropriate level by increasing the contact pressure according to the number of lead parts or decreasing the contact pressure according to the decrease in the number of lead parts.
すなわち、本発明によれば、電子部品のリード部と測定
子との接触状態を常に適正化し、電子部品の特性を確実
かつ安定的に測定することができる。That is, according to the present invention, the contact state between the lead portion of the electronic component and the probe can be always optimized, and the characteristics of the electronic component can be measured reliably and stably.
［実施例］ 第１図は本発明の第１実施例を示す模式図である。[Example] FIG. 1 is a schematic diagram showing a first embodiment of the present invention.
試験装置１１１０は、保持具１１と測定子１２と接離袋
ｆｉ１３とを有して構成され、ＩＣＩの例えばＡＣ特性
、ＤＣ特性を測定する。ＩＣＩは例えば第１図、第４図
に示す如くのフラットパッケージ型であり、部品本体部
ＩＡの側部に複数のリード部ＩＢを備える。The test device 1110 includes a holder 11, a probe 12, and a detachable bag fi13, and measures, for example, AC characteristics and DC characteristics of ICI. The ICI is a flat package type as shown in FIGS. 1 and 4, for example, and includes a plurality of lead portions IB on the side of a component body portion IA.
試験装置ｌＯの保持具１１は、保持ガイド１４と真空パ
ッド１５からなり、ＩＣＩの部品本体部ＬＡを真空パッ
ド１５により吸着しながら保持ガイド１４が定める適正
な姿勢に保持する。なお、保持ガ、イド１４は電気絶縁
材料にて構成される。The holder 11 of the test apparatus IO consists of a holding guide 14 and a vacuum pad 15, and holds the ICI component main body LA in an appropriate posture determined by the holding guide 14 while adsorbing it with the vacuum pad 15. Note that the holding guide and the guide 14 are made of an electrically insulating material.
試験装置ｌＯの測定子１２は、第４図に示す如＜ Ｉ
、Ｃ１のリード部ＩＢに対応して設けられ、測定部１６
に接続されＩＣＩの特性を測定可能とする。１２Ａは測
定子台である。The probe 12 of the test device 10 is arranged as shown in FIG.
, C1, and is provided corresponding to the lead part IB of C1, and the measuring part 16
It is possible to measure the characteristics of the ICI. 12A is a measurement head stand.
試験装置ｌＯの接離装置１３は、エア源１７、電磁切換
弁１８、エアシリンダ１９からなり、エアシリンダ１９
のピストンロッド先端部に前述の保持具１１を吊下げ支
持する。これにより、接離装置１３は、保持具１１’が
測定子１２に接離（接近／＃隔）するように保持具１１
を加圧し、保持具１１に保持されるＩＣＩのリード部Ｉ
Ｂと測定子１２とを相互に接触させる。２０は保持具１
１の回り止めガイドロッドである。The contact/separation device 13 of the test apparatus IO consists of an air source 17, an electromagnetic switching valve 18, and an air cylinder 19.
The aforementioned holder 11 is suspended and supported from the tip of the piston rod. Thereby, the contact/separation device 13 moves the holder 11' so that the holder 11' approaches/separates from (approaches/# distances from) the probe 12.
The lead part I of the ICI held by the holder 11
B and the probe 12 are brought into contact with each other. 20 is holder 1
This is the No. 1 anti-rotation guide rod.
なお、試験装置ｌＯは旋回装置２１を有し、この旋回装
置２１の旋回アーム２ＬＡに接離装置１３のエアシリン
ダ１９および回り止めガイドロッド２０を設けている。The test apparatus IO has a swing device 21, and the swing arm 2LA of the swing device 21 is provided with an air cylinder 19 of the contact/separation device 13 and a detent guide rod 20.
旋回装置２１は旋回アーム２１Ａを旋回し、接１ｌＩｌ
装置１３に支持されている保持具１１＠ＩＣ供給位置、
上記測定子１２による測定位置、ＩＣ排出位置の３位置
に順次移動する。The rotation device 21 rotates the rotation arm 21A and makes contact with the rotation arm 21A.
Holder 11 supported by device 13 @ IC supply position,
It sequentially moves to three positions: a measurement position using the probe 12 and an IC ejection position.
しかして、試験袋２ｔｌＯは、接離装置１３を構成して
いるエア配管に調圧装置２２を備えている。調圧装置２
２は、公知のエアレギュレータからなり、調圧ノブ２３
の操作により、エアシリンダ１９が保持具１１に加える
加圧力のレベルを調節し、かつ調節後の加圧力を一定に
維持可能とする。これにより、試験装置ｌＯの接離装置
１３は、保持具１１に加える加圧力を一定に維持し、保
持具１１に保持されるＩＣＩのリード部ＩＢと測定子１
２とが上記加圧力にて相互に圧接する位置をその加圧端
とすることとしている。Thus, the test bag 2tlO is equipped with a pressure regulating device 22 in the air pipe constituting the contact/separation device 13. Pressure regulator 2
2 consists of a known air regulator, and a pressure adjustment knob 23
By this operation, the level of the pressing force applied by the air cylinder 19 to the holder 11 can be adjusted, and the adjusted pressing force can be maintained constant. As a result, the contact/separation device 13 of the test device IO maintains a constant pressure force applied to the holder 11, and connects the lead part IB of the ICI held by the holder 11 to the probe 1.
2 and 2 are pressed against each other by the above-mentioned pressing force, and the position thereof is defined as the pressing end.
次に、上記第１実施例の作用について説明する。Next, the operation of the first embodiment will be explained.
上記実施例において、保持具１１と測定子１２は、該保
持具１１に保持されるＩＣＩのリード部ＩＢと測定子１
２とが一定の加圧力にて相互に圧接する位置を、それら
の相対移動の移動限とされる。したがって、保持具１１
と測定子１２の移動限がストッパ等にて固定化されない
から、ＩＣＩの製造誤差によりリード部ＩＢの厚みや脚
長がばらついたり、測定子１２の設定位置が使用経過に
より変化する場合にも、リード部ＩＢと測定子１２とを
所定の接触圧にて確実に接触させることができる。In the above embodiment, the holder 11 and the measuring element 12 are connected to the lead part IB of the ICI held by the holder 11 and the measuring element 1.
The position where 2 and 2 are pressed against each other with a constant pressure is defined as the limit of their relative movement. Therefore, the holder 11
Since the movement limit of the probe 12 is not fixed by a stopper or the like, even if the thickness or leg length of the lead part IB varies due to ICI manufacturing errors or the set position of the probe 12 changes over time, the lead The portion IB and the probe 12 can be reliably brought into contact with each other with a predetermined contact pressure.
また、上記実施例においては、樅離装置１３が保持具１
１に加える加圧力を調圧装置２２により調節できるから
１例えば品種変更によりリード部ＩＢの本数が異なるこ
ととなる各ＩＣＩについて、リード部ＩＢの本数の増加
に応じて接触圧を増加したり、リード部ＩＢの本数の減
少に応じて接触圧を減少する等、リード部ＩＢと測定子
１２との接触圧を任意の適正レベルに設定できる。Further, in the above embodiment, the release device 13 is
Since the pressure applied to 1 can be adjusted by the pressure regulating device 22, 1. For example, for each ICI whose number of lead parts IB differs due to a change in product type, the contact pressure can be increased in accordance with the increase in the number of lead parts IB, The contact pressure between the lead part IB and the probe 12 can be set to any appropriate level, such as by reducing the contact pressure as the number of lead parts IB decreases.
すなわち、上記実施例によれば、ＩＣＩのリード部ＩＢ
と測定子１２の接触状態を常に適正化し、ＩＣＩの特性
を確実かつ安定的に測定することができる。That is, according to the above embodiment, the lead portion IB of the ICI
By always optimizing the contact state between the contact point 12 and the probe 12, the characteristics of the ICI can be measured reliably and stably.
第２図は本発明の第２実施例を示す模式図である。FIG. 2 is a schematic diagram showing a second embodiment of the present invention.
試験装置３０が上述の試験袋ＷｌＯと異なる点は、接離
装置３１をリニヤモータ３２により構成したことのみに
ある。リニヤモータ３２は、固定子３２Ａと可動ロッド
３２Ｂを備え、可動ロッド３２Ｂの先端部に前述の保持
具１１を吊下支持している。この接離装！！３１は、リ
ニヤモータ３２に設けられる供給電流調整ノブ３３の操
作により可動ロッド３２Ｂの移動力、したがって保持具
１１に加える加圧力のレベルを調節し、かつｒ１４ｆＭ
後の加圧力を一定に維持可能とする。これにより、試験
袋！１３０の接離装置３１は、保持具１１に加える加圧
力を一定に維持し、保持具１１に保持されるＩＣＩのリ
ード部ＩＢと測定子１２とが。The test device 30 differs from the test bag WlO described above only in that the contact/separation device 31 is configured by a linear motor 32. The linear motor 32 includes a stator 32A and a movable rod 32B, and the above-mentioned holder 11 is suspended and supported at the tip of the movable rod 32B. This contact/separation device! ! 31 adjusts the moving force of the movable rod 32B, and therefore the level of the pressing force applied to the holder 11, by operating the supply current adjustment knob 33 provided on the linear motor 32, and r14fM.
The subsequent pressurizing force can be maintained constant. This gives you a test bag! The contact/separation device 31 of 130 maintains a constant pressure force applied to the holder 11 so that the ICI lead portion IB held by the holder 11 and the probe 12 are connected to each other.
上記加圧力にて圧接する位置をその加圧端とすることと
している。The position where the pressure is applied with the above-mentioned pressure is defined as the pressure end.
すなわち、この試験装置３０にあっても、リード部ＩＢ
と測定子１２とを所定の接触圧にて確実に接触させるこ
とができ、またリード部ＩＢと測定子１２との接触圧を
任意の適正レベルに設定できる。これにより、ＩＣＩの
リード部ＩＢと測定子１２の接触状態を常に適正化し、
ＩＣＩの特性を確実かつ安定的に測定することができる
。That is, even in this test device 30, the lead portion IB
and the probe 12 can be reliably brought into contact with each other with a predetermined contact pressure, and the contact pressure between the lead portion IB and the probe 12 can be set to any appropriate level. As a result, the contact state between the ICI lead part IB and the probe 12 is always optimized,
The characteristics of ICI can be measured reliably and stably.
なお、本発明の実施において、接離装置を構成するエア
シリンダやりニヤモータに測定子台を結合し、測定子の
側を駆動するものであってもよい。In addition, in carrying out the present invention, the measuring head stand may be coupled to an air cylinder or a near motor constituting the approaching/separating device to drive the measuring head side.
［発明の効果］
以上のように本発明によれば、電子部品のリード部と測
定子との接触状態を常に適正化し、電子部品の特性を確
実かつ安定的に測定することができる。[Effects of the Invention] As described above, according to the present invention, the contact state between the lead portion of the electronic component and the probe can be always optimized, and the characteristics of the electronic component can be measured reliably and stably.
第１図は本発明の第１実施例を示す模式図、第２図は本
発明の第２実施例を示す模式図、第３図は従来例を示す
模式図、第４図はＩＣと測定子との接触状態を示す斜視
図である。
１・・・ＩＣ（電子部品）、
ＩＡ・・・部品本体部、
１Ｂ・・・リード部、
１０．３０・・・試験装置、
１１・・・保持具。
１２・・・測定子。
１３．３１・・・接ｍ装置、
１９・・・エアシリンダ。
２２・・・調圧装置、
２３・・・調圧ノブ。
３２・・・リニヤモータ、
３３・・・供給電流調整ノブ。
代理人 弁理士 塩 川 修 治
第２図
第３図
２ＡFig. 1 is a schematic diagram showing the first embodiment of the present invention, Fig. 2 is a schematic diagram showing the second embodiment of the invention, Fig. 3 is a schematic diagram showing the conventional example, and Fig. 4 is a schematic diagram showing the IC and measurement. FIG. 3 is a perspective view showing a state of contact with a child. DESCRIPTION OF SYMBOLS 1... IC (electronic component), IA... Component body part, 1B... Lead part, 10.30... Test device, 11... Holder. 12... Measuring head. 13.31... Contact device, 19... Air cylinder. 22...Pressure regulation device, 23...Pressure regulation knob. 32... Linear motor, 33... Supply current adjustment knob. Agent Patent Attorney Osamu Shiokawa Figure 2 Figure 3 2A
Claims (2)
る保持具と、電子部品のリード部に対応して設けられ、
該電子部品の任意の性能を測定するための測定子と、保
持具と測定子とを相互に接離するように両者の少なくと
も一方を加圧し、保持具に保持される電子部品のリード
部と測定子とを相互に接触させる接離装置とを有してな
る電子部品の試験装置において、接離装置は、保持具と
測定子の少なくとも一方に加える加圧力を一定に維持で
き、保持具に保持される電子部品のリード部と測定子と
が上記加圧力にて相互に圧接する位置をその加圧端とす
ることを特徴とする電子部品の試験装置。(1) A holder for holding an electronic component having a lead portion in the component body, and a holder provided corresponding to the lead portion of the electronic component;
A measuring element for measuring arbitrary performance of the electronic component, a holder and a measuring element, pressurizing at least one of them so as to bring them into contact with each other, and a lead portion of the electronic component held by the holder. In an electronic component testing device that includes a contacting/separating device that brings the measuring probe into contact with each other, the contacting/separating device can maintain a constant pressure applied to at least one of the holder and the measuring probe, and 1. A testing device for electronic components, characterized in that a pressure end is defined as a position where a lead portion of an electronic component to be held and a probe contact each other with the above-mentioned pressure force.
求項１記載の電子部品の試験装置。(2) The electronic component testing device according to claim 1, wherein the contact/separation device is capable of adjusting the level of pressing force.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63045857A JPH01221681A (en) | 1988-03-01 | 1988-03-01 | Testing apparatus for electronic parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63045857A JPH01221681A (en) | 1988-03-01 | 1988-03-01 | Testing apparatus for electronic parts |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01221681A true JPH01221681A (en) | 1989-09-05 |
Family
ID=12730878
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63045857A Pending JPH01221681A (en) | 1988-03-01 | 1988-03-01 | Testing apparatus for electronic parts |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01221681A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0463084U (en) * | 1990-10-12 | 1992-05-29 | ||
| KR20020070121A (en) * | 2001-02-27 | 2002-09-05 | 안도덴키 가부시키가이샤 | Autohandler |
| WO2023112221A1 (en) * | 2021-12-15 | 2023-06-22 | 株式会社アドバンテスト | Temperature adjusting unit, electronic component handling device, and electronic component testing device |
-
1988
- 1988-03-01 JP JP63045857A patent/JPH01221681A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0463084U (en) * | 1990-10-12 | 1992-05-29 | ||
| KR20020070121A (en) * | 2001-02-27 | 2002-09-05 | 안도덴키 가부시키가이샤 | Autohandler |
| WO2023112221A1 (en) * | 2021-12-15 | 2023-06-22 | 株式会社アドバンテスト | Temperature adjusting unit, electronic component handling device, and electronic component testing device |
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