JPH01215734A - Mold member for forming optical element - Google Patents
Mold member for forming optical elementInfo
- Publication number
- JPH01215734A JPH01215734A JP4059388A JP4059388A JPH01215734A JP H01215734 A JPH01215734 A JP H01215734A JP 4059388 A JP4059388 A JP 4059388A JP 4059388 A JP4059388 A JP 4059388A JP H01215734 A JPH01215734 A JP H01215734A
- Authority
- JP
- Japan
- Prior art keywords
- mold
- optical element
- forming
- molding
- base material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000003287 optical effect Effects 0.000 title claims abstract description 35
- 239000000463 material Substances 0.000 claims abstract description 37
- 238000000465 moulding Methods 0.000 claims description 40
- 229910052721 tungsten Inorganic materials 0.000 claims description 19
- 239000010937 tungsten Substances 0.000 claims description 19
- -1 tungsten nitride Chemical class 0.000 claims description 16
- 238000000034 method Methods 0.000 abstract description 14
- 238000005498 polishing Methods 0.000 abstract description 8
- 238000005240 physical vapour deposition Methods 0.000 abstract description 4
- 238000004544 sputter deposition Methods 0.000 abstract description 4
- 238000000227 grinding Methods 0.000 abstract description 3
- 238000005229 chemical vapour deposition Methods 0.000 abstract description 2
- 230000003647 oxidation Effects 0.000 abstract description 2
- 238000007254 oxidation reaction Methods 0.000 abstract description 2
- 238000005268 plasma chemical vapour deposition Methods 0.000 abstract description 2
- 239000011159 matrix material Substances 0.000 abstract 4
- 238000007733 ion plating Methods 0.000 abstract 1
- 239000006060 molten glass Substances 0.000 abstract 1
- 239000003870 refractory metal Substances 0.000 abstract 1
- 230000003578 releasing effect Effects 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 14
- 239000011521 glass Substances 0.000 description 11
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 9
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 9
- 238000004519 manufacturing process Methods 0.000 description 8
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 7
- 229910052786 argon Inorganic materials 0.000 description 6
- 229910001873 dinitrogen Inorganic materials 0.000 description 6
- 230000003746 surface roughness Effects 0.000 description 6
- 230000005684 electric field Effects 0.000 description 4
- 230000004927 fusion Effects 0.000 description 4
- 239000007789 gas Substances 0.000 description 4
- 239000005304 optical glass Substances 0.000 description 4
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 4
- 229910010271 silicon carbide Inorganic materials 0.000 description 4
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 229910000831 Steel Inorganic materials 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 229910003460 diamond Inorganic materials 0.000 description 2
- 239000010432 diamond Substances 0.000 description 2
- 230000009477 glass transition Effects 0.000 description 2
- 229910000734 martensite Inorganic materials 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 239000003921 oil Substances 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 206010011224 Cough Diseases 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000004040 coloring Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000010924 continuous production Methods 0.000 description 1
- 239000000498 cooling water Substances 0.000 description 1
- 230000006837 decompression Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- QGLKJKCYBOYXKC-UHFFFAOYSA-N nonaoxidotritungsten Chemical compound O=[W]1(=O)O[W](=O)(=O)O[W](=O)(=O)O1 QGLKJKCYBOYXKC-UHFFFAOYSA-N 0.000 description 1
- 239000010970 precious metal Substances 0.000 description 1
- 238000005546 reactive sputtering Methods 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 239000010802 sludge Substances 0.000 description 1
- 235000012976 tarts Nutrition 0.000 description 1
- 229910001930 tungsten oxide Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B11/00—Pressing molten glass or performed glass reheated to equivalent low viscosity without blowing
- C03B11/06—Construction of plunger or mould
- C03B11/08—Construction of plunger or mould for making solid articles, e.g. lenses
- C03B11/084—Construction of plunger or mould for making solid articles, e.g. lenses material composition or material properties of press dies therefor
- C03B11/086—Construction of plunger or mould for making solid articles, e.g. lenses material composition or material properties of press dies therefor of coated dies
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B2215/00—Press-moulding glass
- C03B2215/02—Press-mould materials
- C03B2215/08—Coated press-mould dies
- C03B2215/14—Die top coat materials, e.g. materials for the glass-contacting layers
- C03B2215/22—Non-oxide ceramics
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野コ
本発明は光学素子成形装置に用いられる型部材に関し、
特に、容易に高精度を実境で＠且つ耐久性良好な光学素
子成形用製部材に関する。この様な光学素子成形用製部
材はたとえば直接光学面を形成する高精度成形のための
型部材として好適に利用される。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a mold member used in an optical element molding device,
In particular, the present invention relates to a member for molding optical elements that can be easily manufactured with high precision and has good durability. Such a member for molding an optical element is suitably used, for example, as a mold member for high-precision molding to directly form an optical surface.
［従来の技術及びその問題点］
一般に、レンズ、プリズム、ミラー及びフィルタ等の光
学素子は、ガラス等の素材を研１’ｌｌｊして外形を所
望の形状とした後に、機能面即ち光が透過及び／ｌたけ
反射するｔｆｉｔ研摩して光学面とすることによシ製造
されている。[Prior art and its problems] In general, optical elements such as lenses, prisms, mirrors, and filters are manufactured by polishing a material such as glass to a desired external shape, and then polishing the functional surface, that is, the light transmitting surface. The optical surface is manufactured by polishing the optical surface to reflect tfit.
しかして、以上の様な光学素子の装造においては、研削
及び研摩によシＰｆＴ望の表面積置（即ち表面形状及び
表面粗さ等のｎ１ｋ）を得るためには、熟練した作東者
が相当の時間加工を行なうことが処置でめった。また、
機能面が非球面である光字素子を製造する場合には、−
膚烏腿な研８ｕ及び研摩の技術が要求され且つ加工時間
も長くならざるを得なかった、。Therefore, in the fabrication of optical elements as described above, in order to obtain the desired surface area (i.e. n1k of surface shape and surface roughness) through grinding and polishing, a skilled fabricator is required. The treatment rarely required a considerable amount of processing time. Also,
When manufacturing an optical element whose functional surface is an aspherical surface, −
This required extensive polishing and polishing techniques, and the processing time had to be long.
そこで、最近では、上記の様な伝統的な光学素子製造方
法に代って、所定の表ｒＨｎ度を有する成形用全屋内に
光学素子材料を収容して加熱及び加圧することＫよジグ
レス成形にて直ちに機能面を含む全体的形状を形成する
方法が行なわれる様になってきている。これによれば、
機能面が非球面である場合でさえも比較的簡単且つ短時
間で光学素子を製造することができる。この様なプレス
成形法は光学素子の連続製造に適する。Therefore, recently, in place of the traditional optical element manufacturing method as described above, jigless molding has been developed, in which the optical element material is housed in a molding room having a predetermined temperature and then heated and pressurized. Nowadays, methods of immediately forming the overall shape, including the functional aspects, are being used. According to this,
Even when the functional surface is an aspherical surface, the optical element can be manufactured relatively easily and in a short time. Such a press molding method is suitable for continuous production of optical elements.
以上の様なプレス成形において使用される盤部材に要求
される性質としては、十分な硬度、良好な耐熱性、良好
な鏡面加工性及び成形時において光学素子材料と融着を
起さないこと等があげられる。The properties required of the plate member used in press molding as described above include sufficient hardness, good heat resistance, good mirror workability, and no fusion with the optical element material during molding. can be given.
そこで、従来、この様なブレス成形用製部材としては金
属、セラミックス、及びこれらに適宜の材料をコーティ
ングした材料等数多くの種類が提案されている。Therefore, many kinds of materials have been proposed as such members for press molding, such as metals, ceramics, and materials coated with appropriate materials.
たとえば、特開昭４９−５１１１２号公報には１３ Ｃ
ｒマルテンサイト鋼を用いた型部材が開示されておシ、
時開１１ｆｉ５２−４５６１３号公報には炭化ケイ素（
ＳｔＣ）を用いた型部材及び窒化ケイ素（Ｓｉ＝、Ｎ４
）を用いた盤部材が開示されておシ、特開昭６０−２４
６２３０号公報には超硬合金に貴金属をコーティングし
た盤部材が開示されている・しかして、上記１３０Ｆマ
ルテンサイト鋼は酸化しゃすぐ更に高温のブレス成形時
においてＦｅがガラス材料中に拡散してガラスが着色す
る難点がある。また、上記ＳＩＣ−？ Ｓ、ｉ、Ｎ４は
一般的には酸化されにくいのであるが、高温ではめる程
度の酸化が生じ製部材ｔ１面にＳ１０□の換が形成され
るためガラスとの融着を生じゃすく更に硬度が高ずき′
るため加工性が極めて悪いという難点がある。For example, 13 C
r A mold member using martensitic steel is disclosed,
Jikai 11fi52-45613 publication describes silicon carbide (
Mold members using StC) and silicon nitride (Si=, N4
) has been disclosed in JP-A-60-24.
Publication No. 6230 discloses a board member made of a cemented carbide coated with a noble metal.However, the above-mentioned 130F martensitic steel does not oxidize, but during press forming at a higher temperature, Fe diffuses into the glass material and forms a glass. There is a problem with coloring. Also, the above SIC-? S, i, and N4 are generally hard to oxidize, but at high temperatures they oxidize to the extent that they fit, forming an S10 square on the t1 surface of the product, which prevents fusion with glass and increases the hardness. It's high
The problem is that the processability is extremely poor because of the
更に、表面に貴金属をコーティングした材料は硬度が低
いために傷付きやすく且つ変形しやすいという難点があ
る。Furthermore, materials whose surfaces are coated with precious metals have low hardness and are therefore easily damaged and deformed.
そこで、本発明は、上記従来技術にｍみ、容易に高精度
で！１１１！でき且つプレス成形に際し精度劣化の少な
い長寿命の光学素子成形用型部材を提供することを目的
とする。Therefore, the present invention is based on the above-mentioned conventional technology and can be easily achieved with high precision! 111! It is an object of the present invention to provide a mold member for molding an optical element that can be formed easily and has a long life with little deterioration in accuracy during press molding.
［問題点を解決するための手段］
本発明によれば、以上の如き目的を達成するものとして
、
光学素子成形用型部材において、製部材の少なくとも成
形面が窒化タングステンで被榎されていることを特徴と
する、光学素子成形用製部材、が提供される。[Means for Solving the Problems] According to the present invention, in order to achieve the above objects, in a mold member for molding an optical element, at least the molding surface of the member is coated with tungsten nitride. Provided is a member for molding an optical element, characterized by:
［実施例］
以下、図面を参照しながら本発明の具体的実施例′ｆ：
説明する。[Examples] Hereinafter, with reference to the drawings, specific embodiments of the present invention'f:
explain.
第１図は本発明による型部材の一実施例を示す概略断面
園である。本図において、３０は製部材を示し、３１１
Ｉ′ｉ該型母材の成形面に形成された窒化タングステン
被覆層を示す。FIG. 1 is a schematic cross-sectional view showing one embodiment of a mold member according to the present invention. In this figure, 30 indicates a manufactured member, and 311
I'i shows a tungsten nitride coating layer formed on the molding surface of the mold base material.
本発明において母材材料としては、たとえば超硬合金や
焼結ＳＩＣを用いることができる。これら母材材料は切
劇、研ｉＩ！ｕ、研摩等の加工によシ所望の外形とし、
特に成形面は所望の表面精度に仕上げておく。In the present invention, as the base material, for example, cemented carbide or sintered SIC can be used. These base materials are Kirigaku, Ken II! u. Processing such as polishing to obtain the desired external shape.
In particular, the molding surface is finished to the desired surface precision.
上記母材３０の表面に窒化タングステン層３１を形成す
るＫは、たとえばスノ母ツタリング伝するいはイオング
レーティング法等の物理蒸着法（ＰＶＤ法）やプラズマ
ＣＶＤ法等の化学蒸着法（ＣＶＯ法）を用いる。K, which forms the tungsten nitride layer 31 on the surface of the base material 30, can be formed by, for example, a physical vapor deposition method (PVD method) such as a sludge or ion grating method, or a chemical vapor deposition method (CVO method) such as a plasma CVD method. Use.
窒化タングステン層３１の厚さは製造条件によシ逼宜設
定されるが、使用時の所望の特性に鑑みて十分な耐久性
が得られる様な厚さとすればよい。The thickness of the tungsten nitride layer 31 is appropriately set depending on the manufacturing conditions, but may be set to a thickness that provides sufficient durability in view of the desired characteristics during use.
窒化タングステン層は高温での耐酸化性も尚いのでガラ
スとの融着性が低く離屋性が良好であるので、繰返し使
用しても良好な精度の光学素子を得ることができる。The tungsten nitride layer also has good oxidation resistance at high temperatures, has low fusion bonding with glass, and has good separation properties, so an optical element with good precision can be obtained even after repeated use.
以下、本発明による型部材の製造及びそれを用いたガラ
ス成形の実施例を示す。尚、同時に、比較のために、従
来の盤部材の製造及びそれを用いたガラス成形の例をも
示−ｊ−０
製造及び成形の実施例：
超硬合金（ＷＣ（９０％）＋Ｃｏ（１０％）コ及び焼結
ＳＩＣ型母材材料として戯母材を作シ、咳母材の成形１
ｉｉｆＫ窒化タングステン層を形成して、以下の通ル本
発明による型部材を製造した。また、比較のために、上
記型母材の成形面に核種を行なわない型部材及び該成形
面Ｋ ＳｉＣ層を形成した型部材を製造した。製造した
型部材の一覧表を第１表に示す。尚、第１表において、
４１及びＡ２は本発明実施例であシ、４３．４４及びＡ
５は比較例である。Hereinafter, examples of manufacturing a mold member according to the present invention and glass molding using the same will be shown. At the same time, for comparison, examples of conventional production of plate members and glass molding using the same are also shown. %) Producing a play base material as a sintered SIC type base material, forming the cough base material 1
An iifK tungsten nitride layer was formed to produce a mold member according to the invention as follows. For comparison, a mold member in which no nuclide was applied to the molding surface of the mold base material and a mold member in which a SiC layer was formed on the molding surface were manufactured. Table 1 shows a list of the manufactured mold members. Furthermore, in Table 1,
41 and A2 are examples of the present invention, 43.44 and A
5 is a comparative example.
第 １ 表
先ず、型母材材料を切削加工し、次いで成形光学素子の
機能面（光学ｒｆＪ）に対応する成形面を所望の表面精
度に加工した。型母材の成形面は凹面であり、先ずダイ
ヤモンド砥石による研削で所望の曲単に加工し、次いで
粒径１μｍのダイヤモンドノ４ウダーを用いた研摩を行
ない、ニュートンリング１木根度の表面形状精度及びＲ
ｍ、ｘｏ、 ０２μｍ程度の弐面粗さ精度に仕上げた。Table 1 First, the mold base material was cut, and then the molding surface corresponding to the functional surface (optical rfJ) of the molded optical element was processed to a desired surface accuracy. The molding surface of the mold base material is a concave surface, and it is first processed into the desired curve by grinding with a diamond grindstone, and then polished using a diamond grinder with a grain size of 1 μm to achieve a surface shape accuracy of Newton ring 1 degree. R
Finished with a surface roughness accuracy of approximately 0.02μm.
次に、上記Ａ１及び４２については、第２図に示される
装置を用いて反応性スパッタリング法によシ壓母材の成
形而上に窒化タングステン層を形成した。Next, regarding A1 and 42 above, a tungsten nitride layer was formed on the molded base material by a reactive sputtering method using the apparatus shown in FIG.
第２図において、５０はスパッタリング装置の気密室で
ある。気密室５０には排気口５１が接続されておシ、排
気口５１は不図示の減圧源に接続されている。気密室５
０内の上部には加熱ヒータ５２が配置されておシ、該ヒ
ータにはヒータ電源５３が接続されている。ヒータ５２
の下方に型母材支持体５４が配置されておシ、該支持体
には型母材バイアス電源５５が接続されている。支持体
５４には型母材５６が成形面を下向きにして支持される
。支持体５４の下方に窒素ガスあるいはアンモニア導入
用パイｆ５７、グロー放電発生用コイル５８が配置され
ておシ、該コイルには整合回路５９ｔ−介して高周波電
源６０が接続されている。In FIG. 2, 50 is an airtight chamber of the sputtering apparatus. An exhaust port 51 is connected to the airtight chamber 50, and the exhaust port 51 is connected to a decompression source (not shown). Airtight room 5
A heater 52 is disposed at the upper part of the interior, and a heater power source 53 is connected to the heater. Heater 52
A mold base material support 54 is disposed below, and a mold base material bias power source 55 is connected to the support. A mold base material 56 is supported on the support body 54 with the molding surface facing downward. A piping f 57 for introducing nitrogen gas or ammonia and a coil 58 for generating glow discharge are arranged below the support 54, and a high frequency power source 60 is connected to the coil through a matching circuit 59t.
気密室５０の下部にはカソード電極６１が配置されてい
る。電極６１の上部にはタングステンターゲット６２が
設けられておシ、下部には冷却水用ノ４イグ６３が接続
されている。電極６１の上方にアルゴンガス導入用パイ
プ６４が配置されている。A cathode electrode 61 is arranged at the bottom of the airtight chamber 50. A tungsten target 62 is provided on the upper part of the electrode 61, and a cooling water source 63 is connected to the lower part. An argon gas introducing pipe 64 is arranged above the electrode 61.
窒化タングステン層の形成時には、上前の様にして得ら
れた型母材５６を７七トンで洗浄し、支持体５４によシ
支持した後気密室５０内を２Ｘ１０−’Ｔｏｒｒまで減
圧した。次に％／４イア’６４からアルゴンガスを導入
し、コイル５８に高周波電界（１３，５６ＭＨｚ 、
０．２ ｋＷ−ｈｒ ）を印ｍ Ｌ ７ ｋ ｆ ｙ
（Ｄ ／ ｏ −放電を発生させ、バイアス電源５５に
よシ星母材５６に負バイアス（−５０Ｖ）を印加してア
ルゴンイオンによるスノＪ？ツタクリーニングを行う。When forming the tungsten nitride layer, the mold base material 56 obtained as above was washed with 77 tons, supported on the support 54, and the pressure inside the airtight chamber 50 was reduced to 2.times.10-' Torr. Next, argon gas is introduced from the %/4 ear '64, and a high frequency electric field (13,56MHz,
0.2 kW-hr) m L 7 k f y
(A D/o-discharge is generated, and a negative bias (-50V) is applied to the star base material 56 by the bias power supply 55 to perform snow J? ivy cleaning with argon ions.
その後、ノやイブ６４からアルゴンガスを導入しながら
カソード電極６１に高周波電界（１３，５６ＭＨｚ。Thereafter, a high frequency electric field (13.56 MHz) is applied to the cathode electrode 61 while introducing argon gas from the tube 64.
０、５ ｋＷ−ｈｒ ）を印加しタングステンターゲッ
ト６２の近傍にアルコ９ンのグロー放電を発生させ、タ
ングステンターゲットにアルゴンイオンの衝撃を与えて
スパッタリングを行う。同時に、パイプ５７によシ窒素
ガスを型母材５６の近傍に吹きっけ、コイル５８に高周
波電界（１３，５６ＭＨｚ 。0.5 kW-hr) is applied to generate a glow discharge of argon ions near the tungsten target 62, and the tungsten target is bombarded with argon ions to perform sputtering. At the same time, nitrogen gas is blown into the vicinity of the mold base material 56 through the pipe 57, and a high frequency electric field (13.56 MHz) is applied to the coil 58.
０、５ ｋＷ−ｈｒ ）を印加して窒素プラズマを形成
させ、バイアス電源５５によりｍ母材５６に負バイアス
（−ＳＯＷ）を印加して窒素イオンを型母材５６に引込
みながらタングステンの反応性スパッタリングを行って
型母材５６の表１ｉｉｉｉＫｉａｌ化タングステン層を
形成した。このとき型母材の温度は５００℃であった。0.5 kW-hr) is applied to form a nitrogen plasma, and a negative bias (-SOW) is applied to the m base material 56 by the bias power supply 55 to draw nitrogen ions into the mold base material 56 while reducing the reactivity of tungsten. Sputtering was performed to form a tungsten oxide layer of the mold base material 56. At this time, the temperature of the mold base material was 500°C.
得られた窒化タングステン層の厚さは１μｍであった。The thickness of the obtained tungsten nitride layer was 1 μm.
前記実施例において、窒素ガスの代シにアンモニアガス
、あるいはカソード電極に高周波電界の代ｊ５ＫＤｃ電
圧を印加しても同様な輩化タングステン層が得られ九。In the above embodiment, a similar thickened tungsten layer can be obtained by applying ammonia gas instead of nitrogen gas or by applying a voltage of 5 KDc to the cathode electrode instead of a high frequency electric field.
上記Ｉ６５については、第２図に示される装置を用いて
同様にして型母材の成形而上に炭化ケイ素層を形成した
。この際に、窒素ガスの導入を行わず同じ撤のＣＨ４ガ
スを導入し、かつタングステンターゲットの代シにケイ
素ターｒットを用いた。Regarding I65, a silicon carbide layer was formed on the mold base material in the same manner using the apparatus shown in FIG. At this time, the same amount of CH4 gas was introduced without introducing nitrogen gas, and a silicon tart was used in place of the tungsten target.
炭化ケイ素層の厚さはｌＲｎでめった。The thickness of the silicon carbide layer was determined by lRn.
次に１以上の様にして製造された臘部材を用いて、光学
ガラスのプレス成形を行なった。Next, optical glass was press-molded using the frame member manufactured as described above.
第３図はプレス成形に用いた装置を示す断面図である。FIG. 3 is a sectional view showing the apparatus used for press molding.
第３図において、ｌは密閉容器でろシ、２はその量であ
シ、３，４は光学素子（両凸レンズ）を成形するための
上記盤部材であ夛、３は上製部材でめり、４は下盤部材
である。５は上履押えであ）、６は網製部材であり、７
は履ホルダーで６シ、８はヒーターであシ、９は下温突
き上げ棒で６９．１０は線棒を駆動させるエアーシリン
ダーである。In FIG. 3, 1 is a closed container for filtering, 2 is the amount, 3 and 4 are the above-mentioned plate members for molding the optical element (biconvex lens), 3 is a hollow member, 4 is a lower board member. 5 is a shoe presser), 6 is a net member, and 7
6 is the shoe holder, 8 is the heater, 9 is the lower temperature push-up rod, and 69.10 is the air cylinder that drives the wire rod.
１１は油回転ポンプでろり、１２．１３，１４はパルプ
で６’）、１５は窒素ガス導入ノ９イグでめシ、１６は
パルプであシ、１７は排出ノ母イブでろシ、１８はパル
プで６９．１９は温度センサーであシ、２０は水冷パイ
プであシ、２１は密閉容器ｌの台である。11 is filtered with an oil rotary pump, 12, 13, and 14 are filtered with pulp (6'), 15 is filtered with nitrogen gas introduction 9, 16 is filtered with pulp, 17 is filtered with a discharge mother plate, and 18 is filtered with pulp. For pulp, 69.19 is a temperature sensor, 20 is a water cooling pipe, and 21 is a stand for the closed container l.
フリント系光学ガラス（８１１４、軟化点Ｓ。Flint optical glass (8114, softening point S.
＝５８６℃、ガラス転移点Ｔ、＝４８５℃）を所定重量
の球形状として成形のためのブランクを作成したＯ
密閉容器１の蓋２を開き、上型部材３及び上型押え５を
取外して下盤部材４上〈上記ブランクを載せて、上屋部
材３及び上製押え５を堰付けた。= 586°C, glass transition point T, = 485°C) and a spherical shape with a predetermined weight to create a blank for molding. The above blank was placed on the lower plate member 4, and the shed member 3 and upper presser foot 5 were attached.
更に蓋２を閉じてから、水冷・皆イブ２０に水を流し、
ヒーター８に通電した。この時、ｉｊｉ素ガス用パルプ
１６．パルプ１８及び排気系パルプ１２゜１３．１４を
閉じておい友。次に、油回転ポンプ１１を作動させ、パ
ルプ１２を開き、容器１内を排気した。容器ｌ内の真空
度が１０”２Ｔｏｒｒとなった後、パルプ１２を閉じ、
パルプ１６．１８を開いて窒素ガスをボンベから密閉容
器１内へと尋人した。所定温度になった後にエアーシリ
ンダーｌＯを作動させて１０ ｋｃＩ ／ ｃｍ２の圧
力で５分間プレス成形を行なった。加圧力を除去し１．
約り℃／分の速度でガラス転移点以下になるまで冷却し
、その後２０℃／分以上の速度で冷却を行ない、温度が
２００℃以下に下り九俊に、パルプ１６ ＃ １８を閉
じ、リークパルプ１３を開いて密閉容器１内に空気を尋
人した。次に、１ｌｉｚを開き、上屋部材３及び上履押
え５を取外して成形済光学素子を取出した。Furthermore, after closing the lid 2, pour water into the water cooling/Minaibu 20,
The heater 8 was energized. At this time, 16. Close the pulp 18 and exhaust system pulp 12, 13, and 14. Next, the oil rotary pump 11 was operated, the pulp 12 was opened, and the inside of the container 1 was evacuated. After the degree of vacuum in the container l reaches 10"2 Torr, the pulp 12 is closed,
Pulp 16.18 was opened and nitrogen gas was introduced from the cylinder into the closed container 1. After reaching a predetermined temperature, the air cylinder IO was activated and press molding was performed for 5 minutes at a pressure of 10 kcI/cm2. Remove the pressure 1.
Cool at a rate of approximately 16°C/min until the temperature drops below the glass transition point, then cool at a rate of 20°C/min or higher until the temperature drops to below 200°C, close Pulp 16 #18, and check for leakage. The pulp 13 was opened to vent air into the sealed container 1. Next, 1liz was opened, the shed member 3 and the shoe holder 5 were removed, and the molded optical element was taken out.
７８４図はプレス成形時のガラスの温度変化を示す図で
ある。Figure 784 is a diagram showing the temperature change of glass during press molding.
以上の様なプレス成形の前後における盤部材３゜４の成
形面の表面粗さ及び成形された光学素子の光学面の表面
粗さ、ならびに成形光学素子と盤部材３．４との離型性
について第２餞に示す。The surface roughness of the molded surface of the plate member 3.4, the surface roughness of the optical surface of the molded optical element, and the releasability of the molded optical element and the plate member 3.4 before and after press molding as described above. The details are shown in the second issue.
次に、融着発生のない４１．７＃ｌ＆２及びＡ３につい
て、同−盤部材を用いて１００００回のプレス成形を行
ない、２００回、１０００回、５０００回、１００００
回後における盤部材３，４の成形−面の表面粗さ及び成
形された光学素子の光学面の表面粗さについて第３表に
示す。Next, for 41.7 #l & 2 and A3 without any fusion, press molding was performed 10,000 times using the same plate member, 200 times, 1,000 times, 5,000 times, 10,000 times.
Table 3 shows the surface roughness of the molded surfaces of the plate members 3 and 4 after the molding and the surface roughness of the optical surface of the molded optical element.
以上の様に、本発明実施例においては、繰返しプレス成
形に使用しても良好な表面精度を十分に維持でき、良好
な表面精度の光学素子が成形できた。As described above, in the examples of the present invention, good surface precision could be sufficiently maintained even when used in repeated press molding, and optical elements with good surface precision could be molded.
上記実施例では成形される光学ガラスとしてフリント系
のものが用いられているが、その他のクラウン系等のガ
ラスについても同様に良好なｓｉでの成形が可能である
。In the above embodiments, a flint-based optical glass is used as the optical glass to be molded, but other types of glasses such as crown-based glasses can be similarly molded with good Si.
［発明の効果〕
以上の様な本発明によれば、型母材の成形面を窒化タン
グステンで被覆することによシ、繰返しプレス成形に際
し精度劣化が少なく寿命が長い光学素子成形用盤部材が
提供される。また、本発明型部材は、型母材としての加
工性の良好なものを選択することができるので、製造が
容易である。[Effects of the Invention] According to the present invention as described above, by coating the molding surface of the mold base material with tungsten nitride, it is possible to obtain a plate member for molding optical elements that has a long life and less accuracy deterioration during repeated press molding. provided. Further, the mold member of the present invention is easy to manufacture because a material with good workability can be selected as the mold base material.
第１図は本発明によるｍ部材の一実施例を示す概Ｗ＆断
面図である。
第２図は本発明による型部材の製造において量化タング
ステン層の形成に使用される装ｆＩＩＬｔ−示す図であ
る。
第３図は光学素子のプレス成形装置の断面図である。
第４図はブレス成形時のガラスの温度変化を示す図であ
る。
３．４・・・型部材、３０・・・型母材、３１・・・窒
化タングステン層、５６・・・型母材。FIG. 1 is a schematic W& cross-sectional view showing an embodiment of the m member according to the present invention. FIG. 2 is a diagram illustrating the equipment used to form a quantified tungsten layer in the manufacture of a mold member according to the invention. FIG. 3 is a sectional view of a press molding apparatus for optical elements. FIG. 4 is a diagram showing the temperature change of glass during press molding. 3.4... Mold member, 30... Mold base material, 31... Tungsten nitride layer, 56... Mold base material.
Claims (1)
とも成形面が窒化タングステンで被覆されていることを
特徴とする、光学素子成形用型部材。(1) A mold member for molding an optical element, characterized in that at least the molding surface of the mold base material is coated with tungsten nitride.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4059388A JPH01215734A (en) | 1988-02-25 | 1988-02-25 | Mold member for forming optical element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4059388A JPH01215734A (en) | 1988-02-25 | 1988-02-25 | Mold member for forming optical element |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01215734A true JPH01215734A (en) | 1989-08-29 |
Family
ID=12584806
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4059388A Pending JPH01215734A (en) | 1988-02-25 | 1988-02-25 | Mold member for forming optical element |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01215734A (en) |
-
1988
- 1988-02-25 JP JP4059388A patent/JPH01215734A/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2620875B2 (en) | Manufacturing method of glass molded products for precision optics | |
| JP2004359481A (en) | Method for manufacturing replica pattern for lens molding | |
| JPH09301722A (en) | Formation of release film | |
| JP3273921B2 (en) | Mold for glass optical element, method for manufacturing glass optical element, and method for reproducing mold | |
| JPH01215734A (en) | Mold member for forming optical element | |
| JPH0359016B2 (en) | ||
| JPS6221733B2 (en) | ||
| JP2505897B2 (en) | Mold for optical element molding | |
| JP2002274867A (en) | Optical glass element press forming die and optical glass element | |
| JP2571290B2 (en) | Mold for optical element molding | |
| JP2785888B2 (en) | Mold for optical element molding | |
| JP2612627B2 (en) | Mold for optical element molding | |
| JP2612621B2 (en) | Mold for optical element molding | |
| JPH10231129A (en) | Mold for press molding and glass molded product by the mold | |
| JP2004210550A (en) | Molding mold | |
| JPS63288924A (en) | Die member for molding optical element | |
| JP3308720B2 (en) | Mold for optical element molding | |
| JPS63151628A (en) | Mold for forming optical element | |
| JPH092827A (en) | Production of glass lens | |
| JP3341520B2 (en) | Optical lens manufacturing method | |
| JPH01108372A (en) | Sputtering device | |
| JPH09194216A (en) | Die for forming optical element | |
| JPH0372018B2 (en) | ||
| JPH08208245A (en) | Production of forming mold for optical element | |
| JPS63134527A (en) | Method for forming optical glass element |