JPH01197816A - Cooling structure for electronic device - Google Patents

Cooling structure for electronic device

Info

Publication number
JPH01197816A
JPH01197816A JP63023178A JP2317888A JPH01197816A JP H01197816 A JPH01197816 A JP H01197816A JP 63023178 A JP63023178 A JP 63023178A JP 2317888 A JP2317888 A JP 2317888A JP H01197816 A JPH01197816 A JP H01197816A
Authority
JP
Japan
Prior art keywords
electronic circuit
temperature
circuit package
fan
cooling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP63023178A
Other languages
Japanese (ja)
Other versions
JP2658120B2 (en
Inventor
Yasuo Nishi
康夫 西
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP63023178A priority Critical patent/JP2658120B2/en
Publication of JPH01197816A publication Critical patent/JPH01197816A/en
Application granted granted Critical
Publication of JP2658120B2 publication Critical patent/JP2658120B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
    • Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Control Of Temperature (AREA)

Abstract

PURPOSE:To equalize a temperature distribution in a rack, and also, to realize a low noise by controlling separately the number of revolution of a cooling fan for cooling an electronic circuit package by a temperature in the upper part of an area cooled by its fan. CONSTITUTION:In an area for cooling a high power consumption electronic circuit package group 1, a temperature sensor 6 provided on the upper part instructs a high temperature, therefore, the number of revolution of a variable wind speed fan 4 is operated in a high speed state so as to be stabilized at a set temperature. On the other hand, in an area for cooling an electronic circuit package group 2 of normal power, the temperature sensor provided on the upper part instructs a low temperature, therefore, the number of revolution of the variable wind speed fan 4 is operated in a low speed state so as to be stabilized at a set temperature. In such a way, a temperature distribution in a rack can be held uniformly. Also, other part than the high power consumption electronic circuit package circuit is cooled by the fan of a low speed rotation, therefore, a noise generated from the device can be lowered.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は電子装置の冷却構造に関する。[Detailed description of the invention] [Industrial application field] The present invention relates to a cooling structure for an electronic device.

〔従来の技術〕[Conventional technology]

電子装置、たとえばコンピュータにおいては装置の高性
能、高信頼性を実現するためＬＳＩ、ＩＣからの発熱を
効果的に外部へ放出する冷却方法が重要になってきてい
る。この種の電子装置ではＬＳＩ、ＩＣの内部温度を低
く保つために一般にはファンによる強制空冷が用いられ
るが、装置に実装される電子回路パッケージは定まった
機能単位で形成されるので、各電子回路パッケージの消
費電力はそれぞれ異なる。特に高消費電力の電子回路パ
ッケージが実装される場合、Ｌ、ＳＩ、ＩＣの内部温度
を低く保つためにこの電子回路パッケージに対しては通
常電力の電子回路パッケージのみの場合と異なり、装置
としての冷却能力を高めておく必要がある。BACKGROUND ART In electronic devices such as computers, cooling methods that effectively release heat generated from LSIs and ICs to the outside have become important in order to achieve high performance and high reliability of the devices. In this type of electronic device, forced air cooling using a fan is generally used to keep the internal temperature of LSIs and ICs low, but since the electronic circuit package mounted on the device is formed in fixed functional units, each electronic circuit Each package has different power consumption. In particular, when a high power consumption electronic circuit package is mounted, in order to keep the internal temperature of L, SI, and IC low, this electronic circuit package is different from the case where only a normal power electronic circuit package is used. It is necessary to increase the cooling capacity.

第２図は上記のような場合の冷却構造を示す説明図であ
る。同図において装置筺体５１内に架枠３が設けられ、
この架枠３に通常の電子回路パッケージ群２および高消
費電力の電子回路パッケージ群１が実装される。装置筐
体５１の下部にはファン組立体５２が設置され、冷却空
気は矢印の如く装置下部から吸入され電子回路パッケー
ジ群を通って装置上部へ排出される。この場合、ファン
組立体５２は高消費電力の電子回路パッケージ１を冷却
可能とする冷却能力の高い大形ファン５３で構成しなけ
ればならない。FIG. 2 is an explanatory diagram showing the cooling structure in the above case. In the figure, a frame 3 is provided within the device housing 51,
A normal electronic circuit package group 2 and a high power consumption electronic circuit package group 1 are mounted on this frame 3. A fan assembly 52 is installed at the bottom of the device housing 51, and cooling air is taken in from the bottom of the device as shown by the arrow, passes through the electronic circuit package group, and is discharged to the top of the device. In this case, the fan assembly 52 must be comprised of a large fan 53 with a high cooling capacity capable of cooling the electronic circuit package 1 with high power consumption.

〔発明が解決しようとする課題〕[Problem to be solved by the invention]

上述した従来の冷却構造は局部的に実装される高消費電
力の電子回路パッケージを冷却するために装置全体を大
形ファンにより冷却するので、消費電力の差により架内
の温度分布が不均一になり、また装置から発生する騒音
が大きくなるという欠点がある。The conventional cooling structure described above uses a large fan to cool the entire device in order to cool the locally mounted high power consumption electronic circuit package, so the temperature distribution within the rack becomes uneven due to the difference in power consumption. This also has the disadvantage that the noise generated from the device increases.

本発明の目的は排気温度に応じて冷却ファンの送風量を
変更できるようにして上記の欠点を改善した電子装置の
冷却構造を提供することにある。SUMMARY OF THE INVENTION An object of the present invention is to provide a cooling structure for an electronic device that improves the above-mentioned drawbacks by making it possible to change the amount of air blown by a cooling fan depending on the exhaust temperature.

〔課題を解決するための手段〕[Means to solve the problem]

本発明による電子装置の冷却構造は、高消′ｇ！！電力
電子回路パッケージ群および通常電力電子回路パッケー
ジ群を実装した架枠と、前記電子回路パッケージ群を冷
却する複数個の可変風速ファンを組み込んだファン組立
体と、前記可変風速ファンの各々が冷却する領域の上部
に設けた複数個の温度センサと、前記温度センサが送出
する信号に従って前記可変風速ファンの回転数を個別に
制御する可変風速制御ユニットとを有して構成される。The cooling structure for an electronic device according to the present invention has a high power consumption! ! A frame on which a power electronic circuit package group and a normal power electronic circuit package group are mounted, a fan assembly incorporating a plurality of variable wind speed fans that cool the electronic circuit package group, and each of the variable wind speed fans cools the electronic circuit package group. It is configured to include a plurality of temperature sensors provided in the upper part of the area, and a variable wind speed control unit that individually controls the rotation speed of the variable wind speed fan according to the signal sent by the temperature sensor.

〔実施例〕〔Example〕

次に本発明について図面を参照して説明する。 Next, the present invention will be explained with reference to the drawings.

第１図は本発明の一実施例の正面図である。同図におい
て電子装置の冷却構造は高消費電力電子回路パッケージ
群１と通常電力電子回路パッケージ群２を実装する架枠
３と、多数個の可変風速ファン４を組み込んだファン組
立体５と、各々の可変風速ファンが冷却する領域の上部
に設けた温度センサ６と、温度センサ６の出力によって
各々の可変風速ファン４の回転数を制御する可変風速制
御ユニット７とを含む装置筐体８を有している。FIG. 1 is a front view of one embodiment of the present invention. In the figure, the cooling structure of the electronic device includes a frame 3 in which a high power consumption electronic circuit package group 1 and a normal power electronic circuit package group 2 are mounted, and a fan assembly 5 incorporating a large number of variable speed fans 4. A device housing 8 includes a temperature sensor 6 provided above the area cooled by the variable wind speed fans, and a variable wind speed control unit 7 that controls the rotation speed of each variable wind speed fan 4 based on the output of the temperature sensor 6. are doing.

本冷却構造における可変風速ファン４は可変風　　□速
制御ユニット７と接続することにより回転数を広範囲に
設定できる。また可変風速制御ユニット７は温度センサ
６の出力により各可変風速ファン４毎の回転数を制御す
る機能を有し、温度センサ６の温度があらかじめ設定さ
れた温度より高い場合には可変風速ファン４の回転数を
高くするように、そして設定温度より低い場合には可変
風速ファン４の回転数を低くするように制御する。The variable speed fan 4 in this cooling structure can be connected to the variable speed control unit 7 to set the rotation speed over a wide range. Further, the variable wind speed control unit 7 has a function of controlling the rotation speed of each variable wind speed fan 4 based on the output of the temperature sensor 6, and when the temperature of the temperature sensor 6 is higher than a preset temperature, the variable wind speed fan 4 When the temperature is lower than the set temperature, the rotation speed of the variable speed fan 4 is controlled to be lowered.

本冷却構造において高消費電力電子回路パッケージ群１
を冷却する領域においては上部に設けた温度センサ６は
高温を指示するので、設定温度に安定するように可変風
速ファン４の回転数は高速状態で運転される。一方、通
常電力の電子回路パッケージ群２を冷却する領域におい
ては上部に設けた温度センサは上記よりも低い温度を指
示するので、設定温度に安定するように可変風速ファン
４の回転数は低速状態で運転される。In this cooling structure, high power consumption electronic circuit package group 1
Since the temperature sensor 6 provided at the top indicates a high temperature in the region where the air is cooled, the variable speed fan 4 is operated at a high rotational speed so as to stabilize the temperature at the set temperature. On the other hand, in the area where the normally powered electronic circuit package group 2 is cooled, the temperature sensor installed at the top indicates a lower temperature than the above, so the rotation speed of the variable speed fan 4 is kept at a low speed so that the temperature is stabilized at the set temperature. It is driven by.

このようにして架内の温度分布は均一に保つことが可能
となる。また高消費電力電子回路パッケージ部以外の部
分は低速回転のファンにより冷却するので、装置から発
生する騒音を低くすることが可能となる。In this way, it is possible to maintain a uniform temperature distribution within the rack. Furthermore, since parts other than the high power consumption electronic circuit package part are cooled by a fan rotating at a low speed, it is possible to reduce the noise generated from the device.

設定温度が一定の場合、装置の設置環境温度が低ければ
可変風速ファン４の回転数が平均的に低くなるので、更
に低騒音化を計ることができる。When the set temperature is constant, if the temperature of the installation environment of the device is low, the rotation speed of the variable speed fan 4 will be lower on average, so that noise can be further reduced.

〔発明の効果〕〔Effect of the invention〕

以上説明したように本発明は電子回路パッケージを冷却
する冷却ファンの回転数をそのファンが冷却する領域の
上部の温度によって個別に制御することにより、架内の
温度分布を均一化でき、さらに低騒音化が実現できる効
果がある。As explained above, the present invention can uniformize the temperature distribution within the rack by individually controlling the rotational speed of the cooling fan that cools the electronic circuit package depending on the temperature above the area that the fan cools. This has the effect of reducing noise.

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本発明の一実施例を示す正面図、第２図は従来
の冷却構造を示す正面図である。 １・・・高消費電力電子回路パッケージ群、２・・・通
常電力電子回路パッケージ群、３・・・架枠、４・・・
可変風速ファン、５・・・ファン組立体、６・・・温度
センサ、７・・・可変風速制御ユニット。FIG. 1 is a front view showing an embodiment of the present invention, and FIG. 2 is a front view showing a conventional cooling structure. 1... High power consumption electronic circuit package group, 2... Normal power electronic circuit package group, 3... Frame, 4...
Variable wind speed fan, 5... Fan assembly, 6... Temperature sensor, 7... Variable wind speed control unit.

Claims (1)

【特許請求の範囲】[Claims] 高消費電力電子回路パッケージ群および通常電力電子回
路パッケージ群を実装した架枠と、前記電子回路パッケ
ージ群を冷却する複数個の可変風速ファンを組み込んだ
ファン組立体と、前記可変風速ファンの各々が冷却する
領域の上部に設けた複数個の温度センサと、前記温度セ
ンサが送出する信号に従って前記可変風速ファンの回転
数を個別に制御する可変風速制御ユニットとを有するこ
とを特徴とする電子装置の冷却構造。a frame mounting a high power consumption electronic circuit package group and a normal power electronic circuit package group; a fan assembly incorporating a plurality of variable wind speed fans for cooling the electronic circuit package group; and each of the variable wind speed fans. An electronic device comprising: a plurality of temperature sensors provided above an area to be cooled; and a variable wind speed control unit that individually controls the rotation speed of the variable wind speed fan according to signals sent by the temperature sensors. Cooling structure.
JP63023178A 1988-02-02 1988-02-02 Electronic device cooling structure Expired - Lifetime JP2658120B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP63023178A JP2658120B2 (en) 1988-02-02 1988-02-02 Electronic device cooling structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63023178A JP2658120B2 (en) 1988-02-02 1988-02-02 Electronic device cooling structure

Publications (2)

Publication Number Publication Date
JPH01197816A true JPH01197816A (en) 1989-08-09
JP2658120B2 JP2658120B2 (en) 1997-09-30

Family

ID=12103386

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63023178A Expired - Lifetime JP2658120B2 (en) 1988-02-02 1988-02-02 Electronic device cooling structure

Country Status (1)

Country Link
JP (1) JP2658120B2 (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1085272A2 (en) * 1999-09-17 2001-03-21 Matsushita Seiko Co.Ltd. Heating-element accommodating-box cooling apparatus and method of controlling the same
JP2010232327A (en) * 2009-03-26 2010-10-14 Nec Tohoku Ltd Device equipped with cooling mechanism, and cooling mechanism
CN102195455A (en) * 2010-03-10 2011-09-21 株式会社大亨 Power supply apparatus
JP2011211773A (en) * 2010-03-29 2011-10-20 Daihen Corp Power supply apparatus
JP2013181728A (en) * 2012-03-05 2013-09-12 Furukawa Electric Co Ltd:The Flow velocity control method and flow velocity control device
JP2020053445A (en) * 2018-09-25 2020-04-02 株式会社明電舎 Electronic equipment housing

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102478937A (en) * 2010-11-30 2012-05-30 英业达股份有限公司 Rack-mounted server system

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1085272A2 (en) * 1999-09-17 2001-03-21 Matsushita Seiko Co.Ltd. Heating-element accommodating-box cooling apparatus and method of controlling the same
EP1085272A3 (en) * 1999-09-17 2002-07-24 Matsushita Seiko Co.Ltd. Heating-element accommodating-box cooling apparatus and method of controlling the same
US6612365B1 (en) 1999-09-17 2003-09-02 Matsushita Electric Industrial Co., Ltd. Heating-element accommodating-box cooling apparatus and method of controlling the same
JP2010232327A (en) * 2009-03-26 2010-10-14 Nec Tohoku Ltd Device equipped with cooling mechanism, and cooling mechanism
CN102195455A (en) * 2010-03-10 2011-09-21 株式会社大亨 Power supply apparatus
JP2011211773A (en) * 2010-03-29 2011-10-20 Daihen Corp Power supply apparatus
JP2013181728A (en) * 2012-03-05 2013-09-12 Furukawa Electric Co Ltd:The Flow velocity control method and flow velocity control device
JP2020053445A (en) * 2018-09-25 2020-04-02 株式会社明電舎 Electronic equipment housing

Also Published As

Publication number Publication date
JP2658120B2 (en) 1997-09-30

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