JPH0119345Y2 - - Google Patents

Info

Publication number: JPH0119345Y2
Authority: JP; Japan
Prior art keywords: lead wire; conductive layer; heating element; extraction hole; resistance heating
Prior art date: 1981-02-21
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired

Application number

JP1981023655U

Other languages

English (en)

Japanese (ja)

Other versions

JPS57136196U (de

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1981-02-21

Filing date

1981-02-21

Publication date

1989-06-05

1981-02-21 Application filed filed Critical

1981-02-21 Priority to JP1981023655U priority Critical patent/JPH0119345Y2/ja

1982-08-25 Publication of JPS57136196U publication Critical patent/JPS57136196U/ja

1989-06-05 Application granted granted Critical

1989-06-05 Publication of JPH0119345Y2 publication Critical patent/JPH0119345Y2/ja

Status Expired legal-status Critical Current

Links

WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 24
PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 20
229910052751 metal Inorganic materials 0.000 claims description 20
239000002184 metal Substances 0.000 claims description 20
239000000919 ceramic Substances 0.000 claims description 19
238000010438 heat treatment Methods 0.000 claims description 16
238000000605 extraction Methods 0.000 claims description 15
238000002844 melting Methods 0.000 claims description 13
229910052759 nickel Inorganic materials 0.000 claims description 10
BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 10
229910000679 solder Inorganic materials 0.000 claims description 10
230000008018 melting Effects 0.000 claims description 9
230000002093 peripheral effect Effects 0.000 claims description 6
WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 6
229910052721 tungsten Inorganic materials 0.000 claims description 6
239000010937 tungsten Substances 0.000 claims description 6
ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 5
PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 5
229910052737 gold Inorganic materials 0.000 claims description 5
239000010931 gold Substances 0.000 claims description 5
230000037431 insertion Effects 0.000 claims description 5
238000003780 insertion Methods 0.000 claims description 5
229910052750 molybdenum Inorganic materials 0.000 claims description 5
239000011733 molybdenum Substances 0.000 claims description 5
229910052697 platinum Inorganic materials 0.000 claims description 5
239000000758 substrate Substances 0.000 description 9
230000001070 adhesive effect Effects 0.000 description 3
239000011230 binding agent Substances 0.000 description 3
238000007789 sealing Methods 0.000 description 3
239000000853 adhesive Substances 0.000 description 2
238000001035 drying Methods 0.000 description 2
230000000694 effects Effects 0.000 description 2
239000003822 epoxy resin Substances 0.000 description 2
239000005340 laminated glass Substances 0.000 description 2
229920000647 polyepoxide Polymers 0.000 description 2
239000000843 powder Substances 0.000 description 2
VXQBJTKSVGFQOL-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethyl acetate Chemical compound CCCCOCCOCCOC(C)=O VXQBJTKSVGFQOL-UHFFFAOYSA-N 0.000 description 1
206010014357 Electric shock Diseases 0.000 description 1
239000001856 Ethyl cellulose Substances 0.000 description 1
ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 description 1
239000004840 adhesive resin Substances 0.000 description 1
229920006223 adhesive resin Polymers 0.000 description 1
WUOACPNHFRMFPN-UHFFFAOYSA-N alpha-terpineol Chemical compound CC1=CCC(C(C)(C)O)CC1 WUOACPNHFRMFPN-UHFFFAOYSA-N 0.000 description 1
PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
SQIFACVGCPWBQZ-UHFFFAOYSA-N delta-terpineol Natural products CC(C)(O)C1CCC(=C)CC1 SQIFACVGCPWBQZ-UHFFFAOYSA-N 0.000 description 1
229920001249 ethyl cellulose Polymers 0.000 description 1
235000019325 ethyl cellulose Nutrition 0.000 description 1
239000011521 glass Substances 0.000 description 1
239000012212 insulator Substances 0.000 description 1
150000002739 metals Chemical class 0.000 description 1
238000000465 moulding Methods 0.000 description 1
239000004014 plasticizer Substances 0.000 description 1
238000005476 soldering Methods 0.000 description 1
239000002904 solvent Substances 0.000 description 1
229940116411 terpineol Drugs 0.000 description 1

Landscapes

Resistance Heating (AREA)

JP1981023655U 1981-02-21 1981-02-21 Expired JPH0119345Y2 (de)

Priority Applications (1)

Application Number	Priority Date	Filing Date	Title
JP1981023655U JPH0119345Y2 (de)	1981-02-21	1981-02-21

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP1981023655U JPH0119345Y2 (de)	1981-02-21	1981-02-21

Publications (2)

Publication Number	Publication Date
JPS57136196U JPS57136196U (de)	1982-08-25
JPH0119345Y2 true JPH0119345Y2 (de)	1989-06-05

Family

ID=29821404

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP1981023655U Expired JPH0119345Y2 (de)	1981-02-21	1981-02-21

Country Status (1)

Country	Link
JP (1)	JPH0119345Y2 (de)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
ATE346476T1 (de) *	2003-05-28	2006-12-15	Saint Gobain	Mit einer geheizten schicht ausgestattetes laminiertes element
KR20220062390A (ko) *	2019-10-18	2022-05-16	교세라 가부시키가이샤	구조체 및 가열 장치
WO2023189185A1 (ja) *	2022-03-31	2023-10-05	株式会社巴川製紙所	シート状ヒータ

Citations (4)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS5060513A (de) *	1973-09-28	1975-05-24
JPS51106058A (ja) *	1975-03-14	1976-09-20	Citizen Watch Co Ltd	Seramitsukukiban
JPS545595A (en) *	1977-06-14	1979-01-17	Hitachi Chemical Co Ltd	Method of making electric resistor
JPS5433422U (de) *	1977-08-10	1979-03-05

1981
- 1981-02-21 JP JP1981023655U patent/JPH0119345Y2/ja not_active Expired

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS5060513A (de) *	1973-09-28	1975-05-24
JPS51106058A (ja) *	1975-03-14	1976-09-20	Citizen Watch Co Ltd	Seramitsukukiban
JPS545595A (en) *	1977-06-14	1979-01-17	Hitachi Chemical Co Ltd	Method of making electric resistor
JPS5433422U (de) *	1977-08-10	1979-03-05

Also Published As

Publication number	Publication date
JPS57136196U (de)	1982-08-25

Publication	Publication Date	Title
JPH0714105B2 (ja)	1995-02-15	混成集積回路基板及びその製造方法
JPS6037610A (ja)	1985-02-27	容量性多層導体バーおよびその製造法
JPS62276820A (ja)	1987-12-01	ヒユ−ズ付き固体電解コンデンサ
JPH0119345Y2 (de)	1989-06-05
JP3558998B2 (ja)	2004-08-25	サーマルヘッド及びその製造法
JPS6337738Y2 (de)	1988-10-05
US3292234A (en)	1966-12-20	Method of producing an electrical capacitor
JP2002124755A (ja)	2002-04-26	導電性接着剤と電極との接合方法およびその接合構造
JP2839308B2 (ja)	1998-12-16	多層配線基板
JP2998484B2 (ja)	2000-01-11	半導体装置用リードフレーム
JPS59111350A (ja)	1984-06-27	半導体装置
JPS589371B2 (ja)	1983-02-21	温度検出装置
JPH01261247A (ja)	1989-10-18	低融点ガラス接着による接合体の製造方法，及び接着体
JPS598361Y2 (ja)	1984-03-15	Ｉｃパツケ−ジ
JPH075642Y2 (ja)	1995-02-08	固定部材付集積回路パッケージ
JP2604621B2 (ja)	1997-04-30	半導体素子収納用パッケージの製造方法
JPS6038843A (ja)	1985-02-28	半導体装置およびその製造方法
JPS62264613A (ja)	1987-11-17	積層セラミツクコンデンサ
JPH10172806A (ja)	1998-06-26	温度センサ及びその製造方法
GB2074791A (en)	1981-11-04	Mounting of circuit elements on substrates
JPS6235245B2 (de)	1987-07-31
JPH0637196A (ja)	1994-02-10	半導体素子収納用パッケージ
JPH01239825A (ja)	1989-09-25	電気部品
JPH0132323Y2 (de)	1989-10-03
JPH02281645A (ja)	1990-11-19	半導体装置