JPH0118583B2 - - Google Patents

Info

Publication number
JPH0118583B2
JPH0118583B2 JP18548684A JP18548684A JPH0118583B2 JP H0118583 B2 JPH0118583 B2 JP H0118583B2 JP 18548684 A JP18548684 A JP 18548684A JP 18548684 A JP18548684 A JP 18548684A JP H0118583 B2 JPH0118583 B2 JP H0118583B2
Authority
JP
Japan
Prior art keywords
power chip
package
dielectric plate
electrode
sealed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP18548684A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6094742A (ja
Inventor
Jon Yaaman Arekusandaa
Aroisu Nyuugebauaa Konsutanchin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
General Electric Co
Original Assignee
General Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by General Electric Co filed Critical General Electric Co
Publication of JPS6094742A publication Critical patent/JPS6094742A/ja
Publication of JPH0118583B2 publication Critical patent/JPH0118583B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/049—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads being perpendicular to the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
    • H01L2224/331—Disposition
    • H01L2224/3318—Disposition being disposed on at least two different sides of the body, e.g. dual array
    • H01L2224/33181—On opposite sides of the body

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
JP18548684A 1983-09-06 1984-09-06 密封式電力チツプ用パツケ−ジ Granted JPS6094742A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US52929583A 1983-09-06 1983-09-06
US529295 1990-05-29

Publications (2)

Publication Number Publication Date
JPS6094742A JPS6094742A (ja) 1985-05-27
JPH0118583B2 true JPH0118583B2 (de) 1989-04-06

Family

ID=24109306

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18548684A Granted JPS6094742A (ja) 1983-09-06 1984-09-06 密封式電力チツプ用パツケ−ジ

Country Status (4)

Country Link
JP (1) JPS6094742A (de)
CA (1) CA1216960A (de)
DE (1) DE3432449A1 (de)
GB (1) GB2146174B (de)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5148264A (en) * 1990-05-02 1992-09-15 Harris Semiconductor Patents, Inc. High current hermetic package
US5446316A (en) * 1994-01-06 1995-08-29 Harris Corporation Hermetic package for a high power semiconductor device
FR2793350B1 (fr) * 1999-05-03 2003-08-15 St Microelectronics Sa Protection d'une puce semiconductrice
DE10156626A1 (de) * 2001-11-17 2003-06-05 Bosch Gmbh Robert Elektronische Anordnung
US7138708B2 (en) 1999-09-24 2006-11-21 Robert Bosch Gmbh Electronic system for fixing power and signal semiconductor chips
DE19950026B4 (de) * 1999-10-09 2010-11-11 Robert Bosch Gmbh Leistungshalbleitermodul
US6693350B2 (en) 1999-11-24 2004-02-17 Denso Corporation Semiconductor device having radiation structure and method for manufacturing semiconductor device having radiation structure
US6703707B1 (en) 1999-11-24 2004-03-09 Denso Corporation Semiconductor device having radiation structure
JP4479121B2 (ja) 2001-04-25 2010-06-09 株式会社デンソー 半導体装置の製造方法
US8018056B2 (en) * 2005-12-21 2011-09-13 International Rectifier Corporation Package for high power density devices
CN111146152B (zh) * 2019-10-30 2021-09-10 苏师大半导体材料与设备研究院(邳州)有限公司 一种半导体封装件

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3125709A (en) * 1960-10-17 1964-03-17 Housing assembly
DE1815799C3 (de) * 1968-12-19 1979-09-13 Siemens Ag, 1000 Berlin Und 8000 Muenchen Anordnung eines Halbleiterbauelementgehäuses
US3646405A (en) * 1969-01-08 1972-02-29 Mallory & Co Inc P R Hermetic seal
DE2213915A1 (de) * 1972-03-22 1973-10-04 Siemens Ag Gehaeuse fuer halbleitersysteme
US3994430A (en) * 1975-07-30 1976-11-30 General Electric Company Direct bonding of metals to ceramics and metals
CH660258A5 (de) * 1983-01-20 1987-03-31 Landis & Gyr Ag Keramikgehaeuse fuer einen hybridschaltkreis.

Also Published As

Publication number Publication date
GB2146174A (en) 1985-04-11
JPS6094742A (ja) 1985-05-27
GB2146174B (en) 1987-04-23
GB8420944D0 (en) 1984-09-19
DE3432449A1 (de) 1985-04-04
CA1216960A (en) 1987-01-20
DE3432449C2 (de) 1991-08-22

Similar Documents

Publication Publication Date Title
US4646129A (en) Hermetic power chip packages
EP0115000B1 (de) Leistungschip-Packung
JPH11330283A (ja) 半導体モジュール及び大型半導体モジュール
KR100364681B1 (ko) 고출력반도체장치용밀폐패키지
US4227036A (en) Composite flanged ceramic package for electronic devices
US5041695A (en) Co-fired ceramic package for a power circuit
US6157076A (en) Hermetic thin pack semiconductor device
JPH0118583B2 (de)
US5248901A (en) Semiconductor devices and methods of assembly thereof
US5057648A (en) High voltage hybrid package
JP4886104B2 (ja) ボールグリッドアレイを具えるパワー半導体実装パッケージ
EP0517967A1 (de) Hermetisches Hochstromgehäuse
US4931906A (en) Hermetically sealed, surface mountable component and carrier for semiconductor devices
US6982482B2 (en) Packaging of solid state devices
JP2001217333A (ja) 気密封止型半導体パッケージ
KR100244826B1 (ko) 반도체장치 및 그 제조방법
JP3830919B2 (ja) 大型半導体モジュール
JPH05315467A (ja) 混成集積回路装置
JPH0513603A (ja) 半導体集積回路装置
JPS639664B2 (de)
JPS6025900Y2 (ja) 半導体装置
JP2870501B2 (ja) 半導体装置
JP2669310B2 (ja) 半導体集積回路装置およびその実装方法
US5313091A (en) Package for a high power electrical component
JP2008172120A (ja) パワーモジュール

Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees