JPH01185430A - Method for evaluating bonding strength of thin film - Google Patents
Method for evaluating bonding strength of thin filmInfo
- Publication number
- JPH01185430A JPH01185430A JP63009577A JP957788A JPH01185430A JP H01185430 A JPH01185430 A JP H01185430A JP 63009577 A JP63009577 A JP 63009577A JP 957788 A JP957788 A JP 957788A JP H01185430 A JPH01185430 A JP H01185430A
- Authority
- JP
- Japan
- Prior art keywords
- thin film
- pattern
- tape
- bonding strength
- evaluated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000010409 thin film Substances 0.000 title claims abstract description 59
- 238000000034 method Methods 0.000 title claims abstract description 15
- 238000005530 etching Methods 0.000 claims abstract description 5
- 238000005259 measurement Methods 0.000 claims description 6
- 238000011156 evaluation Methods 0.000 claims description 4
- 239000000758 substrate Substances 0.000 abstract description 13
- 239000002390 adhesive tape Substances 0.000 abstract description 8
- 230000000694 effects Effects 0.000 abstract description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 238000011158 quantitative evaluation Methods 0.000 description 1
- 238000006748 scratching Methods 0.000 description 1
- 230000002393 scratching effect Effects 0.000 description 1
Landscapes
- Sampling And Sample Adjustment (AREA)
Abstract
Description
【発明の詳細な説明】
［発明の目的］
（産業上の利用分野）
本発明は、基板等に形成された薄膜の付着力を評価する
方法に関する。DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Industrial Application Field) The present invention relates to a method for evaluating the adhesion of a thin film formed on a substrate or the like.
（従来の技術）
基板に薄膜を形成した場合、該薄膜の基板に対する付着
力は薄膜の耐久性、耐摩耗性に大きく影響するため、そ
の付着力を適確に評価することが重要である。(Prior Art) When a thin film is formed on a substrate, the adhesion force of the thin film to the substrate greatly affects the durability and abrasion resistance of the thin film, so it is important to accurately evaluate the adhesion force.
このようなことから、従来、薄膜の付着力を評価する方
法としては■粘着テープを薄膜上に貼着し、該テープを
引き剥がした時に薄膜が基板上に残るか、又はテープと
共に剥離されるかを観察して付着力を評価する引き剥が
し法、■基板に付着された薄膜の表面に平坦な円板を接
着し、該基板を固定した上で該円板をその面に垂直方向
に引張って薄膜を剥離し、該剥離時に加えられた力を測
定して付着力を評価する引張り法、■薄膜に硬い小さな
圧子を押付け、種々な荷重によって圧子を動かし、薄膜
に剥離が生じた時の荷重を測定して付着力を評価する引
掻き法、が知られている。For this reason, conventional methods for evaluating the adhesion of thin films include: 1. Sticking an adhesive tape onto the thin film, and when the tape is peeled off, the thin film remains on the substrate or is peeled off together with the tape. The peel-off method evaluates the adhesion strength by observing the The tensile method involves peeling off a thin film and measuring the force applied during the peeling to evaluate the adhesion force. ■ A small hard indenter is pressed against the thin film, the indenter is moved under various loads, and when the thin film peels off, A scratch method is known in which adhesion is evaluated by measuring load.
しかしながら、前記■の引き剥がし法は゛極めて簡便で
広く用いられているものの、いわゆる付着力の大雑把な
合否の判定ができるのみで、正確な評価は困難である。However, although the above-mentioned peeling method (2) is extremely simple and widely used, it is only possible to make a rough judgment of adhesion strength, and accurate evaluation is difficult.
また、前記■の引張り法は円板と薄膜の確実な接着が難
しく、かつ薄膜が円板の縁の箇所から裂けてしまうこと
が多いため、測定値にばらつきが生じる問題がある。更
に、前記■の引掻き法は異なる大きさの荷重により数多
くの引掻きを薄膜に形成する必要があるため、操作が繁
雑化し、しかも剥離した否かの判定が難しいという問題
があった。Furthermore, in the tensile method (2), it is difficult to reliably bond the disc and the thin film, and the thin film often tears from the edge of the disc, resulting in variations in measured values. Furthermore, the scratching method (2) requires forming a large number of scratches on the thin film using loads of different magnitudes, which makes the operation complicated and makes it difficult to determine whether peeling has occurred.
（発明が解決しようとする課題）
本発明は、上記従来の問題点を解決するためになされた
もので、薄膜の付着力の強さを簡単な手段で高精度かつ
定量的に評価することが可能な薄膜付着力評価方法を提
供しようとするものである。(Problems to be Solved by the Invention) The present invention has been made in order to solve the above-mentioned conventional problems, and it is possible to highly accurately and quantitatively evaluate the strength of adhesion of a thin film by a simple means. This paper attempts to provide a possible thin film adhesion evaluation method.
［発明の構成］
（課題を解決するための手段）
本発明は、薄膜が付るされた被測定物の測定領域の薄膜
を選択的にエツチングして寸法の異なる複数のパターン
を形成する工程と、このパターン群の付着力を評価する
工程とを具備したことを特徴とする薄膜付着力評価方法
である。[Structure of the Invention] (Means for Solving the Problems) The present invention includes a step of selectively etching a thin film in a measurement area of a workpiece to which a thin film is attached to form a plurality of patterns having different dimensions. This is a thin film adhesion evaluation method characterized by comprising a step of evaluating the adhesion of this pattern group.
（作用）
本発明は、薄膜が付着された被測定物の測定領域の薄膜
を選択的にエツチングして寸法の異なる複数のパターン
を形成した後、このパターン群に例えば粘着テープを貼
着し、該テープを引き剥がす。この場合、寸法の小さい
パターン程、前記選択エツチングでの内部応力の影響か
ら、該テープと共に剥離し易い傾向を持つ。このため、
前記テープの引き剥がしによりパターン群中のテープと
共に剥離されたパターン（パターンの面積の大小）から
薄膜の付着力を評価できる。つまり、パターン群中の面
積の小さいパターンのみしかテープと共に剥離されない
場合には、薄膜の基板等に対する付着力が強いと評価で
き、一方面積の大きいパターンをもテープと共に剥離さ
れる場合には薄膜の基板等に対する付着力が弱いと評価
できる。(Function) The present invention selectively etches the thin film in the measurement area of the object to be measured to which the thin film is attached to form a plurality of patterns with different dimensions, and then affixes, for example, an adhesive tape to the group of patterns. Peel off the tape. In this case, the smaller the pattern, the easier it is to peel off together with the tape due to the influence of internal stress in the selective etching. For this reason,
The adhesive force of the thin film can be evaluated from the pattern (size of pattern area) that is peeled off together with the tape in the pattern group by peeling off the tape. In other words, if only a pattern with a small area in a group of patterns is peeled off together with the tape, it can be evaluated that the thin film has strong adhesion to the substrate, etc. On the other hand, if a pattern with a large area is also peeled off with the tape, the thin film can be evaluated as having strong adhesion to the substrate. It can be evaluated that the adhesion to the substrate etc. is weak.
従って、本発明方法によれば薄膜の付着力の強さを簡単
な手段で高精度かつ定量的に評価することができる。Therefore, according to the method of the present invention, the strength of adhesion of a thin film can be evaluated quantitatively and with high precision using simple means.
（発明の実施例）
以下、本発明の実施例を図面を参照して詳細に説明する
。(Embodiments of the Invention) Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
まず、第１図（ａ）に示す基板１上に薄膜２を付着した
被測定物を用意した。つづいて、同図（ｂ）示すように
薄膜２上にレジスト膜３を塗布した後、該レジスト膜３
を露光、現像処理してレジストパターン４を形成した（
同図（Ｃ）図示）。First, an object to be measured with a thin film 2 attached on a substrate 1 shown in FIG. 1(a) was prepared. Subsequently, as shown in FIG. 2(b), a resist film 3 is applied on the thin film 2, and then
was exposed and developed to form a resist pattern 4 (
Figure (C) shown).
次いで、同図（ｄ）に示すようにレジストパターン４を
マスクとして露出する薄膜２部分を選択的のエツチング
して寸法の異なる罠数の薄膜パターン５からなるパター
ン群を形成した後、レジストパターン４を除去した（同
図（ｅ）図示）。ここで、パターン群は顕微鏡視野部を
示す第２図のようにＸ、Ｙ方向に夫々１００μｍＸＩｏ
ｇｎの間隔で形成された両対数目盛状の１０本のエツチ
ング線（格子） ６ａ〜８ｊ、 ７ａ 〜７ｊにより１
００μｍＸ１００μｍの測定領域８を区画した８１の薄
膜パターン５から構成される。Next, as shown in FIG. 4(d), the exposed thin film 2 portions are selectively etched using the resist pattern 4 as a mask to form a pattern group consisting of thin film patterns 5 with different dimensions and a number of traps. was removed (as shown in Figure (e)). Here, the pattern group is 100 μmXIo in each of the X and Y directions as shown in FIG. 2 showing the microscope field of view.
1 by 10 etched lines (lattice) 6a to 8j, 7a to 7j in the form of logarithmic scale formed at intervals of gn.
It is composed of 81 thin film patterns 5 that define a measurement area 8 of 00 μm×100 μm.
次いで、粘着テープ（図示せず）を前記測定領域に貼着
して該テープを引き剥がすことによりパターン群中のテ
ープと共に剥離された薄膜パターンの面積（Ｓ）を１１
定した。Next, an adhesive tape (not shown) is attached to the measurement area and the tape is peeled off, so that the area (S) of the thin film pattern peeled off together with the tape in the pattern group is 11
Established.
ところで、前記パターン群中の寸法の小さい薄膜パター
ン５ （例えば６１、Ｏｊ、 ７１．７ｊの格子で分離
されたパターン）は、寸法の大きい薄膜パターン５ （
例えば８ａ、 ８ｂ、 ７ａ、 ７ｂの格子で分離され
たパターン）に比べて上記エツチングでの内部応力の影
響により前記粘着テープの引き剥がしに際し、テープと
共に剥離し易い傾向にある。また、前記粘着テープの引
き剥がしに際し、基板に対する付着力の強い薄膜ではテ
ープと共に剥離される薄膜パターンの面積が小さく、反
対に付着力の弱い薄膜ではテープと共に剥離される薄膜
パターンの面積が大きくなる。こうしたことから、下記
（１）式に示す測定領域の面積（Ｓｏ ）とテープと共
に剥離された薄膜パターンの面積（Ｓｌ）との比である
剥、！１ｉＩｔ面積比（Ａ）から薄膜の付着力度合を評
価できる。By the way, thin film patterns 5 with small dimensions in the pattern group (for example, patterns separated by grids of 61, Oj, 71.7j) are different from thin film patterns 5 with large dimensions (
For example, when the adhesive tape is peeled off, it tends to be peeled off together with the adhesive tape due to the influence of the internal stress caused by the etching, compared to a pattern separated by grids 8a, 8b, 7a, and 7b. Furthermore, when the adhesive tape is peeled off, a thin film with strong adhesion to the substrate will have a small area of the thin film pattern to be peeled off together with the tape, whereas a thin film with weak adhesion will have a large area of the thin film pattern to be peeled off together with the tape. . From these facts, peeling, which is the ratio of the area of the measurement area (So) shown in equation (1) below to the area of the thin film pattern (Sl) peeled off together with the tape, is calculated as follows: The degree of adhesion of the thin film can be evaluated from the 1iIt area ratio (A).
Ａ＝Ｓ１ ／ Ｓｏ −（１）
しかして、本実施例においてパターン群中のテープと共
に剥離された薄膜パターンの面積（Ｓ）を前記（１）式
（但し式中のＳ。は１００μｍＸ１００ ａ ｍ −Ｉ
ＱＯＱＯｕ ｍ）に代入し、剥離面積比（Ａ）が小さい
場合は付着力が強く、反対に大きい場合には付着力が弱
いと定量的に評価できた。A=S1/So - (1) Therefore, in this example, the area (S) of the thin film pattern peeled off together with the tape in the pattern group is expressed by the above equation (1) (where S in the equation is 100 μm x 100 am - I
QOQOum), it was quantitatively evaluated that when the peeled area ratio (A) is small, the adhesion is strong, and on the other hand, when it is large, the adhesion is weak.
従って、本発明方法によれば剥離したパターンの面積か
ら薄膜の付着力の度合を定量的に評価できる。特に、薄
膜パターンを両対数目盛状に形成すれば剥離の生じた薄
膜パターンと生じない薄膜パターンとを容易に識別でき
るともに、剥離された薄膜パターンの面積計測が容易と
なり、薄膜の付着力の度合をより高精度に評価できる。Therefore, according to the method of the present invention, the degree of adhesion of the thin film can be quantitatively evaluated from the area of the peeled pattern. In particular, if the thin film pattern is formed on a double-logarithmic scale, it is possible to easily distinguish between thin film patterns that have peeled off and thin film patterns that have not peeled off. can be evaluated with higher accuracy.
なお、上記実施例ではパターンを対数目盛の間隔の格子
で区画して形成したが、これに限定されず、格子の間隔
を段階的に密から↑■と変化させて寸法の異なるパター
ンを形成すればよい。また、格子で区画されたパターン
形状の正方形に限らず、長方形や菱形にしてもよい。In the above embodiment, the pattern is formed by dividing it into grids with intervals on a logarithmic scale, but the invention is not limited to this, and patterns with different dimensions can be formed by changing the grid intervals from close to ↑■ in stages. Bye. Further, the pattern shape is not limited to a square defined by a lattice, but may be a rectangle or a rhombus.
上記実施例では、パターン群の付着力の評価を粘着テー
プの貼着、引き剥がしにより行なったが、これに限定さ
れない。例えば、活管テープ以外の機械的な手段でパタ
ーン群に外力を与えたり、超克
音波をパターン群に与えてパターン群の付着力Ｖ評価し
てもよい。In the above examples, the adhesive force of the pattern group was evaluated by pasting and peeling off the adhesive tape, but the present invention is not limited to this. For example, the adhesion force V of the pattern group may be evaluated by applying an external force to the pattern group by mechanical means other than live tube tape, or by applying ultrasonic waves to the pattern group.
［発明の効果］
以上詳述した如く、本発明によれば薄膜の付着力の強さ
を簡単な手段で高精度かつ定量的に評価することが可能
な薄膜付着力評価方法を提供できる。[Effects of the Invention] As detailed above, according to the present invention, it is possible to provide a method for evaluating thin film adhesion force that enables highly accurate and quantitative evaluation of the strength of adhesion force of a thin film using simple means.
第１図（ａ）〜（ｅ）は本発明の実施例における薄膜パ
ターンの形成工程を示す断面図、第２図は第１図（ｅ）
の薄膜パターン形成後の基板における顕微鏡視野部を示
す平面図である。
ｌ・・・基板、２・・・薄膜、４・・・レジストパター
ン、５・・・薄膜パターン、６ａ〜Ｂｊ、 ７ａ〜７ｊ
・・・ｍ子、８・・・７１ｐ１定領域。
出願人代理人 弁理士 鈴江武彦FIGS. 1(a) to (e) are cross-sectional views showing the process of forming a thin film pattern in an embodiment of the present invention, and FIG. 2 is the same as FIG. 1(e).
FIG. 3 is a plan view showing the microscope field of view of the substrate after forming the thin film pattern. l...Substrate, 2...Thin film, 4...Resist pattern, 5...Thin film pattern, 6a to Bj, 7a to 7j
...m child, 8...71p1 constant region. Applicant's agent Patent attorney Takehiko Suzue
Claims (1)
エッチングして寸法の異なる複数のパターンを形成する
工程と、このパターン群の付着力を評価する工程とを具
備したことを特徴とする薄膜付着力評価方法。The method is characterized by comprising the steps of: selectively etching the thin film in the measurement area of the object to be measured to which the thin film is attached to form a plurality of patterns with different dimensions; and evaluating the adhesion of the group of patterns. A thin film adhesion evaluation method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63009577A JPH01185430A (en) | 1988-01-21 | 1988-01-21 | Method for evaluating bonding strength of thin film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63009577A JPH01185430A (en) | 1988-01-21 | 1988-01-21 | Method for evaluating bonding strength of thin film |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01185430A true JPH01185430A (en) | 1989-07-25 |
Family
ID=11724167
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63009577A Pending JPH01185430A (en) | 1988-01-21 | 1988-01-21 | Method for evaluating bonding strength of thin film |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01185430A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10056527A1 (en) * | 2000-11-15 | 2002-05-23 | Siemens Ag | Arrangement for testing the adhesion strength between a surface protective coating and a component underneath, by formation and growth of a crack in the surface layer, by pulling away of a special test body glued to the coating |
| WO2003008938A3 (en) * | 2001-07-16 | 2003-05-22 | Siemens Ag | Method for determining the adhesiveness of a coating on a component |
| KR100866895B1 (en) * | 2007-04-05 | 2008-11-04 | 희성금속 주식회사 | Peel test sample manufacturing method of metal same and different kind cladding materials and peel testing method by the sample |
| WO2009040999A1 (en) * | 2007-09-27 | 2009-04-02 | Daikin Industries, Ltd. | Crosscut testing method, and cross-cut testing device |
| JP2009079985A (en) * | 2007-09-26 | 2009-04-16 | Toshiba Corp | Method and apparatus for testing adhesion strength of film and manufacturing method of product |
-
1988
- 1988-01-21 JP JP63009577A patent/JPH01185430A/en active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10056527A1 (en) * | 2000-11-15 | 2002-05-23 | Siemens Ag | Arrangement for testing the adhesion strength between a surface protective coating and a component underneath, by formation and growth of a crack in the surface layer, by pulling away of a special test body glued to the coating |
| DE10056527C2 (en) * | 2000-11-15 | 2002-11-28 | Siemens Ag | Test body, test device and method for determining the adhesive strength of a coating on a component |
| WO2003008938A3 (en) * | 2001-07-16 | 2003-05-22 | Siemens Ag | Method for determining the adhesiveness of a coating on a component |
| KR100866895B1 (en) * | 2007-04-05 | 2008-11-04 | 희성금속 주식회사 | Peel test sample manufacturing method of metal same and different kind cladding materials and peel testing method by the sample |
| JP2009079985A (en) * | 2007-09-26 | 2009-04-16 | Toshiba Corp | Method and apparatus for testing adhesion strength of film and manufacturing method of product |
| WO2009040999A1 (en) * | 2007-09-27 | 2009-04-02 | Daikin Industries, Ltd. | Crosscut testing method, and cross-cut testing device |
| JP2009098113A (en) * | 2007-09-27 | 2009-05-07 | Daikin Ind Ltd | Method and device for testing cross-cut |
| EP2204644A4 (en) * | 2007-09-27 | 2015-08-05 | Daikin Ind Ltd | Crosscut testing method, and cross-cut testing device |
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