JPH01176513A - Porous mold - Google Patents
Porous moldInfo
- Publication number
- JPH01176513A JPH01176513A JP33570787A JP33570787A JPH01176513A JP H01176513 A JPH01176513 A JP H01176513A JP 33570787 A JP33570787 A JP 33570787A JP 33570787 A JP33570787 A JP 33570787A JP H01176513 A JPH01176513 A JP H01176513A
- Authority
- JP
- Japan
- Prior art keywords
- metal
- porous
- mold
- porous mold
- bonding material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910052751 metal Inorganic materials 0.000 claims abstract description 55
- 239000002184 metal Substances 0.000 claims abstract description 55
- 239000000463 material Substances 0.000 claims abstract description 47
- 239000002923 metal particle Substances 0.000 claims description 22
- 238000007747 plating Methods 0.000 claims description 10
- 238000009713 electroplating Methods 0.000 claims description 6
- 238000005219 brazing Methods 0.000 claims description 5
- 238000007772 electroless plating Methods 0.000 claims description 5
- 239000008187 granular material Substances 0.000 abstract description 24
- 230000015556 catabolic process Effects 0.000 abstract 1
- 238000006731 degradation reaction Methods 0.000 abstract 1
- 230000001105 regulatory effect Effects 0.000 abstract 1
- 230000029058 respiratory gaseous exchange Effects 0.000 abstract 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 20
- 238000000465 moulding Methods 0.000 description 20
- 229920003002 synthetic resin Polymers 0.000 description 16
- 239000000057 synthetic resin Substances 0.000 description 16
- 239000000498 cooling water Substances 0.000 description 15
- 238000009423 ventilation Methods 0.000 description 13
- 229910052759 nickel Inorganic materials 0.000 description 10
- 238000005323 electroforming Methods 0.000 description 8
- 239000000243 solution Substances 0.000 description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 230000035699 permeability Effects 0.000 description 5
- 239000003822 epoxy resin Substances 0.000 description 4
- 238000001746 injection moulding Methods 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 238000000071 blow moulding Methods 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- 229920001187 thermosetting polymer Polymers 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 2
- 229910001297 Zn alloy Inorganic materials 0.000 description 2
- 239000011324 bead Substances 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000005304 joining Methods 0.000 description 2
- 239000004922 lacquer Substances 0.000 description 2
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- KERTUBUCQCSNJU-UHFFFAOYSA-L nickel(2+);disulfamate Chemical compound [Ni+2].NS([O-])(=O)=O.NS([O-])(=O)=O KERTUBUCQCSNJU-UHFFFAOYSA-L 0.000 description 2
- 238000004904 shortening Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- 239000011701 zinc Substances 0.000 description 2
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 1
- 239000004327 boric acid Substances 0.000 description 1
- 239000004568 cement Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 210000000078 claw Anatomy 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000000110 cooling liquid Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000010985 leather Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000010107 reaction injection moulding Methods 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 238000007666 vacuum forming Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C51/00—Shaping by thermoforming, i.e. shaping sheets or sheet like preforms after heating, e.g. shaping sheets in matched moulds or by deep-drawing; Apparatus therefor
- B29C51/26—Component parts, details or accessories; Auxiliary operations
- B29C51/30—Moulds
- B29C51/36—Moulds specially adapted for vacuum forming, Manufacture thereof
- B29C51/365—Porous moulds
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
Abstract
Description
【発明の詳細な説明】
発明の目的
(産業上の利用分野)
本発明は、合成樹脂材料の凹引き成形(真空成形)、圧
空成形、凹部引き圧空成形、ブロー成形、スタンピング
成形、インジェクション成形、反応インジェクション成
形等に使用される通気性多孔質のポーラス金型に関する
ものである。DETAILED DESCRIPTION OF THE INVENTION Purpose of the Invention (Field of Industrial Application) The present invention is directed to concave forming (vacuum forming), pressure forming, concave pressure forming, blow molding, stamping molding, injection molding, This invention relates to an air-permeable porous mold used in reaction injection molding and the like.
(従来の技術及び発明が解決しようとする問題点〉この
種のポーラス金型は、次の3条件を満足することが必要
である。(Problems to be solved by the prior art and the invention) This type of porous mold needs to satisfy the following three conditions.
■ 通気性が良いこと。合成樹脂の金型への密着性を上
げて成形品の形状粘度や模様転写性を高めたり、吸引効
率や圧空効率を高めたりするためである。■ Good ventilation. This is to improve the adhesion of the synthetic resin to the mold, improve the shape viscosity and pattern transferability of the molded product, and increase the suction efficiency and compressed air efficiency.
■ 剛性が高いこと。成形時にががる圧力によって金型
が変形するのを防ぐためである。特に、ブロー成形、ス
タンピング成形、インジェクション成形等に使用する金
型には、高い剛性が要求される。■ High rigidity. This is to prevent the mold from being deformed due to pressure during molding. In particular, molds used for blow molding, stamping molding, injection molding, etc. are required to have high rigidity.
■ 熱伝導性が良いこと。合成樹脂の熱による金型の過
熱を防止して、成形サイクルを短縮するためである。■ Good thermal conductivity. This is to prevent the mold from overheating due to the heat of the synthetic resin and shorten the molding cycle.
そこで、従来の一般的なポーラス金型は、ポーラス金型
本体を厚さ2〜7Mの通気性多孔質に形成して通気性を
確保し、該ポーラス金型本体の裏面に通気性バックアッ
プ体を設けて剛性を得るとともに、温調管を設けて熱伝
導性を高めている。Therefore, in conventional general porous molds, the porous mold body is formed into a breathable porous material with a thickness of 2 to 7M to ensure air permeability, and a breathable backup body is provided on the back side of the porous mold body. In addition to providing rigidity, temperature control tubes are also provided to improve thermal conductivity.
前記通気性バックアップ体としては、ポーラス金型本体
の裏面をスタッドポル1〜を介して補強部材に支持させ
る溝造のものがおる(特願昭61−137072号等)
。この通気性バックアップ体を使用したポーラス金型は
、凹引き成形からブロー成形まで使用できる剛性を有す
るが、スタンピング成形やインジェクション成形のよう
に金型に特に高い圧力がかかる成形に使用するには、未
だ剛性が不足するという問題があっ−た。As the breathable backup body, there is a groove structure in which the back surface of the porous mold body is supported by a reinforcing member through stud holes 1 to 1 (Japanese Patent Application No. 137072/1984).
. Porous molds using this breathable backup body have the rigidity to be used for everything from concave molding to blow molding. There was still a problem of insufficient rigidity.
また、無数の鋼球又はガラスピーズを熱硬化性樹脂によ
り部分接合してなる通気性バックアップ体もある(特開
昭61−106820号)。この通気性バックアップ体
はポーラス金型本体の裏面全体をバックアップするとい
う特徴を有づるが、鋼球又はガラスピーズを異種材料で
必る熱硬化性樹脂により部分接合するので接合力が弱い
とか、同熱硬化性樹脂は熱伝導性が低いとか、同熱硬化
性樹脂が成形時の高熱によって劣化するおそれもあると
かという問題があった。There is also an air-permeable back-up body formed by partially bonding numerous steel balls or glass beads with a thermosetting resin (Japanese Patent Application Laid-open No. 106820/1983). This breathable backup body has the feature of backing up the entire back surface of the porous mold body, but since the steel balls or glass beads are partially bonded with different materials using thermosetting resin, the bonding force is weak or the same. Thermosetting resins have problems such as low thermal conductivity and the risk of deterioration due to high heat during molding.
発明の構成
(問題点を解決するための手段)
本発明は、ポーラス金型本体の裏面に、多数の金属粒状
体の相互接触部を金属接合材により接合してなる通気性
バックアップ体を設りるという手段を採用した。Structure of the Invention (Means for Solving Problems) The present invention provides an air-permeable backup body formed by bonding mutual contact portions of a large number of metal particles with a metal bonding material on the back side of a porous mold body. We adopted the method of
(作用)
多数の金属粒状体の相互接触部を同種材料でおる金属接
合材により接合すると、金属粒状体同士が強固に接合さ
れ、耐崩壊性の高い通気性バックアップ体が得られる。(Function) When the mutual contact portions of a large number of metal particles are bonded using a metal bonding material made of the same material, the metal particles are firmly bonded to each other, and a breathable backup body with high collapse resistance is obtained.
この通気性バックアップ体がポーラス金型本体を強力に
バックアップするため、本発明のポーラス金型は剛性に
優れる。Since this breathable backup body strongly backs up the porous mold body, the porous mold of the present invention has excellent rigidity.
また、前記金属粒状体の相互非接触部には多数の通気路
が形成され、通気性の高い通気性バックアップ体が得ら
れるので、本発明のポーラス金型は通気性にも優れる。Further, a large number of ventilation paths are formed in the mutually non-contact portions of the metal particles, and a highly breathable backup body is obtained, so that the porous mold of the present invention also has excellent ventilation.
また、前記金属粒状体のみならず、この金属粒状体の相
互接触部を接合する金属接合材も、金属の特徴である高
い熱伝導度を備えている。従って、本発明のポーラス金
型は熱伝導性にも優れ、合成樹脂成形時にポーラス金型
本体に加わる熱は、通気性バックアップ体の金属粒状体
間を素早く伝わって放熱する。Furthermore, not only the metal granules but also the metal bonding material that joins the mutual contact portions of the metal granules have high thermal conductivity, which is a characteristic of metals. Therefore, the porous mold of the present invention has excellent thermal conductivity, and the heat applied to the porous mold body during synthetic resin molding is quickly transmitted between the metal particles of the breathable backup body and radiated.
(第一実施例)
以下、本発明をコンソールボックスの蓋をスタンピング
成形するだめの金型(ここでは雌型側)に具体化した第
一実施例を、第1〜4図に従って説明する。(First Embodiment) Hereinafter, a first embodiment of the present invention will be described in accordance with FIGS. 1 to 4, in which the present invention is embodied in a secondary mold (here, the female mold side) for stamping the lid of a console box.
このスタンピング成形用金型は、第1図に示づように、
ポーラス雌型1と通気性のない雄型2とからなり、ポー
ラス雌型1の成形凹部3と雄型2の成形凸部4との間に
ギャビ゛ティ5が形成される。This stamping mold is, as shown in Fig. 1,
It consists of a porous female mold 1 and a non-air permeable male mold 2, and a gap 5 is formed between a molding recess 3 of the porous female mold 1 and a molding convex part 4 of the male mold 2.
ポーラス雌型1において、前記キャビティ5を形成する
ポーラス金型本体6は電鋳により約3#の厚さに一体形
成され、同ポーラス金型本体6には第2図に示ずように
シボ模様8と多数の通気孔9とが形成されている。この
通気孔9は前記電鋳と同時にポーラス金型本体6の表面
側から裏面側にかけて直径を拡大しながら形成されてお
り、その直径はポーラス金型本体6の表面において50
〜500μm1裏面において100〜2000μmの範
囲にあることが好ましく、分布密度は10cm2当り5
〜1000個の範囲におることが好ましい。In the porous female mold 1, a porous mold body 6 forming the cavity 5 is integrally formed by electroforming to a thickness of about 3#, and the porous mold body 6 has a grain pattern as shown in FIG. 8 and a large number of ventilation holes 9 are formed. This vent hole 9 is formed while increasing in diameter from the front side to the back side of the porous mold body 6 at the same time as the electroforming, and its diameter is 50 mm on the surface of the porous mold body 6.
~500 μm 1 It is preferable that it is in the range of 100 to 2000 μm on the back surface, and the distribution density is 5 per 10 cm2.
The number is preferably in the range of 1,000 to 1,000.
前記ポーラス金型本体6は箱体10によって支持され、
この箱体10はポーラス金型本体6の縁部を取付ける枠
部11と、同枠部11の底部に取付けられた底板12と
からなっている。同枠部11の上端から30#以内には
ポーラス雌型1内を減圧するための吸引口13が設けら
れている。The porous mold body 6 is supported by a box 10,
This box body 10 consists of a frame 11 to which the edge of the porous mold body 6 is attached, and a bottom plate 12 attached to the bottom of the frame 11. A suction port 13 for reducing the pressure inside the porous female mold 1 is provided within 30 # from the upper end of the frame portion 11 .
前記ポーラス金型本体6の裏面には温調管14か接する
よう配設され、同温調管14には図示し−〇 −
ない冷却水循環装置が接続されている。A temperature control pipe 14 is disposed so as to be in contact with the back surface of the porous mold body 6, and a cooling water circulation device (not shown) is connected to the temperature control pipe 14.
また、前記箱体10内において、ポーラス金型本体6の
裏面には前記温調管]4を埋めるようにして厚さ約30
mの通気性バックアップ体15が設けられ、同通気性バ
ックアップ体]5は多数の金属粒状体16の相互接触部
が金属接合材17により接合されて構成されている。こ
のように、金属粒状体16を同じく金属である金属接合
材17により接合すると、金属粒状体16同士が強固に
接合されるため、耐崩壊性の高い通気性バックアップ体
15が得られる。この通気性バックアップ体15がポー
ラス金型本体6を強力にバックアップするため、本ポー
ラス雌型i型1は剛性に優れている。In addition, in the box body 10, the temperature control tube] 4 is buried in the back surface of the porous mold body 6 to a thickness of approximately 30 mm.
m air-permeable backup bodies 15 are provided, and the air-permeable backup bodies] 5 are constructed by joining mutually contacting portions of a large number of metal particles 16 with a metal bonding material 17. In this way, when the metal granules 16 are bonded using the metal bonding material 17 which is also metal, the metal granules 16 are firmly bonded to each other, so that a breathable backup body 15 with high collapse resistance is obtained. Since this air-permeable backup body 15 strongly backs up the porous mold body 6, this porous female mold i type 1 has excellent rigidity.
また、前記金属粒状体16のみならず金属接合材17も
、金属の特徴でおる高い熱伝導度を備えている。従って
、本ポーラス雌型1は熱伝導性にも優れ、合成樹脂成形
時にポーラス金型本体6に加わる熱は、通気性バックア
ップ体15の金属粒状体16間を素早く伝わって放熱す
る。Furthermore, not only the metal particles 16 but also the metal bonding material 17 have high thermal conductivity, which is a characteristic of metal. Therefore, this porous female mold 1 also has excellent thermal conductivity, and the heat applied to the porous mold body 6 during synthetic resin molding is quickly transmitted between the metal particles 16 of the breathable backup body 15 and radiated.
本実施例では、前記金属粒状体16として粒度14〜2
4メツシユ(平均径1250〜710μm)の銅製の金
属粒状体が使用され、第1図に示すようにほぼ稠密状態
に詰められている。しかし、同金属粒状体16の相互非
接触部には多数の通気路1Bが形成され、通気性の高い
通気性バックアップ体15が得られるので、本ポーラス
雌型1は通気性にも優れる。In this embodiment, the metal particles 16 have a particle size of 14 to 2.
Copper metal granules of 4 meshes (average diameter 1250 to 710 .mu.m) are used, and are packed almost densely as shown in FIG. However, a large number of ventilation paths 1B are formed in the non-contact portions of the metal particles 16, and a highly breathable backup body 15 is obtained, so the present porous female mold 1 also has excellent breathability.
また、前記金属接合材17はポーラス金型本体6の裏面
及び金属粒状体16に無電解メッキしてなる膜厚的20
μmのニッケルメッキ材で必って、第3図に示すように
ポーラス金型本体6と金属粒状体16との間や、金属粒
状体16の相互接触部を強固に接合している。なお、同
金属接合材17は前記通気孔9や通気路18を埋めるも
のではないので、ポーラス金型本体6及び通気性バック
アップ体15の通気性を損なわない。Further, the metal bonding material 17 is formed by electroless plating on the back surface of the porous mold body 6 and the metal particles 16, and has a thickness of 20.
As shown in FIG. 3, the nickel plating material with a thickness of .mu.m strongly bonds the porous mold body 6 and the metal granules 16 and the mutual contact portions of the metal granules 16. Note that since the metal bonding material 17 does not fill the ventilation holes 9 and the ventilation paths 18, the air permeability of the porous mold body 6 and the air permeable backup body 15 is not impaired.
さらに、前記箱体10内において、前記通気性バックア
ップ体15の裏面にはせメンi−製のバックアップ充填
体19が充填形成されており、通気性バックアップ体1
5に使用する金属粒状体16を節約しながら、同通気性
バックアップ体15の裏面を更にバックアップしている
、。Furthermore, in the box body 10, a backup filling body 19 manufactured by Semeni is filled and formed on the back surface of the breathable backup body 15.
The back surface of the breathable backup body 15 is further backed up while saving the metal granules 16 used in the second embodiment.
次に、前記ポーラス雌型]の製造方法について説明する
。Next, a method for manufacturing the porous female mold will be described.
まず、自動者用コンソールボックスの蓋と同一形状の木
型にシボ模様用の本皮を貼着して図示しないマスターモ
デルを形成した後、同マスターモデルの形状をゴム雌型
に写しとり、同ゴム雌型にエポキシ樹脂を注入して第4
図に示すマンドレル20を形成する。First, a master model (not shown) is formed by pasting real leather for the grain pattern onto a wooden mold of the same shape as the lid of the auto operator's console box.Then, the shape of the master model is copied onto a rubber female mold, and the same pattern is created. Inject epoxy resin into the rubber female mold and make the fourth
The mandrel 20 shown in the figure is formed.
次に、このマンドレル20の表面に導電被膜を形成する
。この導電被膜はペース1〜状銀ラツカー、酢酸ブチル
溶液及び塩化ビニルラッカーの混合液をスプレーしたり
、銀鏡反応を利用したりして形成することかできる。Next, a conductive film is formed on the surface of this mandrel 20. This conductive coating can be formed by spraying a mixture of PACE 1 silver lacquer, butyl acetate solution and vinyl chloride lacquer, or by using a silver mirror reaction.
続いて、スルファミン酸ニッケルと硼酸を主成分とする
図示しないメッキ液中に前記マンドレル20をカソード
としてS2Mし、ニッケル製アノードとの間に通電する
。こうして10〜15日間電鋳を行うと、マンドレル2
0の表面にポーラス金型本体6が約3mの厚さに形成さ
れ、同時に通気孔9が形成される。Subsequently, S2M is performed using the mandrel 20 as a cathode in a plating solution (not shown) containing nickel sulfamate and boric acid as main components, and electricity is applied between the mandrel 20 and the nickel anode. After performing electroforming in this way for 10 to 15 days, the mandrel 2
A porous mold body 6 with a thickness of about 3 m is formed on the surface of the mold 0, and at the same time, a ventilation hole 9 is formed.
この通気孔9は、前記導電被膜に塩化ビニルが含まれて
いること、メッキ液にピンホールの生成を抑止する界面
活性剤か含まれていないこと、電鋳初期の電流が大きい
こと等の要因によって、電鋳と同時に発生及び成長して
形成される。従って、電鋳後に通気孔を機械加ニーする
必要がないので、高品質のポーラス金型本体6を容易に
かつ安価に製造することができる。また、前記各要因の
変更・調節によって通気孔9の直径及び数を自由に制御
することもできる。This vent hole 9 is caused by factors such as the fact that the conductive film contains vinyl chloride, the plating solution does not contain a surfactant that suppresses the formation of pinholes, and the current at the initial stage of electroforming is large. It is generated and grown simultaneously with electroforming. Therefore, since there is no need to mechanically knead the vent holes after electroforming, a high quality porous mold body 6 can be manufactured easily and at low cost. Further, the diameter and number of the ventilation holes 9 can be freely controlled by changing and adjusting each of the above-mentioned factors.
ざらに、通気孔9はポーラス金型本体6表面において径
が小さく発生しても、電鋳とともに成長して前述のよう
に拡径するため、通気性に優れている。In general, even if the vent holes 9 are formed with a small diameter on the surface of the porous mold body 6, they grow with electroforming and expand in diameter as described above, so they have excellent ventilation.
次に、第4図に示ず通りマンドレル20表面に付いたま
まのポーラス金型本体6に前記箱体10の枠部11を取
(=Jす、同枠部11にポンプ21のサクション管22
を開口接続する。また、同ポンプ21のデリバリ−管2
3には沸騰水を介してメッキ液を90〜100°Cに加
熱するタイプの加熱装置24を接続し、同加熱装置24
の出口管25を枠部11の上部に開口させる。Next, as shown in FIG.
Connect the opening. In addition, the delivery pipe 2 of the same pump 21
3 is connected to a heating device 24 of a type that heats the plating solution to 90 to 100°C via boiling water.
The outlet pipe 25 is opened at the upper part of the frame part 11.
続いて、前記金属粒状体16を酸洗、中和、水洗及び湯
洗したものを、枠部11の−F方からポーラス金型本体
6の裏面に1〜・3#の厚さになるよう振掛ける。Subsequently, the metal particles 16 which have been pickled, neutralized, washed with water and hot water are applied to the back surface of the porous mold body 6 from the -F side of the frame part 11 to a thickness of 1 to 3 #. Sprinkle.
そして、枠部11内にニッケル無電解メッキ液26を注
入し、同メッキ液26を枠部11→ポンプ21→加熱装
置24→枠部11の順に循環させながら、ポーラス金型
本体6と金属粒状体16にニッケル無電解メッキを行い
、ポーラス金型本体6と金属粒状体16の間や、金属粒
状体16の相互接触部を金属接合材17で接合する。Then, a nickel electroless plating solution 26 is injected into the frame 11, and while circulating the plating solution 26 in the order of the frame 11 → pump 21 → heating device 24 → frame 11, the porous mold body 6 and metal particles are Electroless nickel plating is applied to the body 16, and the areas between the porous mold body 6 and the metal granules 16 and the mutual contact portions of the metal granules 16 are bonded with a metal bonding material 17.
さらに、前記金属粒状体1−6をポーラス金型本体6の
裏面に徐々に賑掛けて重ねていきながら、前記無電解メ
ッキを続けることにより、厚さ約30mの通気性バック
アップ体15を形成する。Furthermore, the electroless plating is continued while the metal particles 1-6 are gradually piled up on the back surface of the porous mold body 6, thereby forming a breathable backup body 15 with a thickness of about 30 m. .
次に、枠部11内のニッケル無電解メッキ液26を除去
し、通気性バックアップ体15を水洗・乾燥させる。そ
して、通気性バックアップ体15の裏面にセメン1〜を
流し込んで硬化させ、バックアップ充填体19を形成す
る。Next, the nickel electroless plating solution 26 inside the frame portion 11 is removed, and the breathable backup body 15 is washed with water and dried. Then, cement 1 to 1 is poured onto the back surface of the breathable backup body 15 and hardened to form the backup filling body 19.
最後に、枠部11に前記吸引口13及び底板12を取付
ければ、ポーラス雌型1が完成する。Finally, by attaching the suction port 13 and the bottom plate 12 to the frame 11, the porous female mold 1 is completed.
以上の通り構成されたポーラス雌型1及び雄型2を使用
してコンソールボックスの蓋をスタンピング成形する方
法について説明する。A method of stamping molding the lid of a console box using the porous female mold 1 and male mold 2 configured as described above will be described.
まず、ポーラス雌型1と雄型2の間に、加熱して可塑化
させた合成樹脂シート27を張設し、前記温調管14に
冷却水を流すとともに、吸引口13に接続した真空ポン
プ29を運転させる。すると、箱体10内が減圧され、
ポーラス金型本体6の表面側の空気が通気孔9から通気
性バックアップ体15内に吸引されるため、合成樹脂シ
ー1〜27はポーラス金型本体6の表面に吸着される。First, a heated and plasticized synthetic resin sheet 27 is stretched between the porous female mold 1 and the male mold 2, cooling water is flowed through the temperature control pipe 14, and a vacuum pump connected to the suction port 13 is used. 29 to drive. Then, the pressure inside the box 10 is reduced,
Since the air on the surface side of the porous mold body 6 is sucked into the breathable backup body 15 through the ventilation holes 9, the synthetic resin sheets 1 to 27 are adsorbed to the surface of the porous mold body 6.
こうして、合成樹脂シー1〜27が蓋形状に賦形される
とともに、合成樹脂シート27にポーラス金型本体6表
面のシボ模様8が正確に転写される。In this way, the synthetic resin sheets 1 to 27 are shaped into a lid shape, and the grain pattern 8 on the surface of the porous mold body 6 is accurately transferred to the synthetic resin sheet 27.
ここで、ポーラス金型本体6及び通気性バックアップ体
15は前述の通り高い通気性を有しているため、上記吸
着を強力に行うことかできる。Here, since the porous mold main body 6 and the air permeable backup body 15 have high air permeability as described above, the above-mentioned suction can be performed strongly.
続いて、前記合成樹脂シート27の上に加熱して可塑化
させた合成樹脂素材28を定量注入してから、雄型2を
ポーラス雌型1に移動させて同合成樹脂素材28を強圧
し、キャビティ5内に移動充満させる(スタンピング成
形)。ここで、ポーラス雌型1は、前述の通り耐崩壊性
の高い通気性バックアップ体15によって高い剛性を有
しているため、スタンピング成形時の高い圧力にも充分
に耐えうる。Subsequently, a fixed amount of synthetic resin material 28 that has been heated and plasticized is injected onto the synthetic resin sheet 27, and then the male mold 2 is moved to the porous female mold 1 and the synthetic resin material 28 is strongly pressed. Move and fill the cavity 5 (stamping molding). Here, since the porous female mold 1 has high rigidity due to the breathable backup body 15 having high collapse resistance as described above, it can sufficiently withstand high pressure during stamping molding.
また、通気性バックアップ体15は前述の通り高い熱伝
導性を有しているため、上記成形時にポーラス金型本体
6に加わる熱は、この通気性バックアップ体15と前記
温調管14に効率良く伝わって放熱する。こうしてポー
ラス金型本体6が素早く冷却されるので、成形サイクル
を短縮することもできる。In addition, since the breathable backup body 15 has high thermal conductivity as described above, the heat applied to the porous mold body 6 during the molding is efficiently transferred to the breathable backup body 15 and the temperature control tube 14. heat is transmitted and radiated. Since the porous mold body 6 is thus quickly cooled, the molding cycle can also be shortened.
次に、雄型2を型開きして成形品を取出し、余分の合成
樹脂シー1〜27を除去すれば、シボ模様表皮付きのコ
ンソールボックスの蓋か完成する。Next, the male mold 2 is opened to take out the molded product, and the excess synthetic resin sheets 1 to 27 are removed to complete the console box lid with the textured skin.
(第二実施例〉
次に、本発明の第二6実施例を、第5図及び第6図に従
って説明する。(Second Embodiment) Next, a twenty-sixth embodiment of the present invention will be described with reference to FIGS. 5 and 6.
この実施例は、■金属粒状体16の相互接触部を接合す
る金属接合材17が電気メッキしてなるメッキ材である
点と、■バックアップ充填体19をエポギシ樹脂により
形成した点と、■通気性バックアップ体15内に直接冷
却水を循環させることによって前記温調管14を省略し
た点において、第一実施例と相違している。This embodiment has the following features: (1) the metal bonding material 17 that joins the mutual contact portions of the metal particles 16 is a plating material formed by electroplating, (2) the backup filler 19 is formed of epoxy resin, and (2) ventilation. This embodiment differs from the first embodiment in that the temperature control pipe 14 is omitted by directly circulating cooling water within the temperature backup body 15.
このポーラス雌型1の製造方法を説明する。A method of manufacturing this porous female mold 1 will be explained.
まず、マンドレル20の表面にポーラス金型本体6を電
鋳形成するまでの工程は、前記第一実施例と同様である
。First, the steps up to electroforming the porous mold body 6 on the surface of the mandrel 20 are the same as in the first embodiment.
次に、第6図に示す通り、ポーラス金型本体6に合成樹
脂枠体30を取付け、金属粒状体16を酸洗、中和、水
洗及び湯洗したものをポーラス金型本体6の裏面に1〜
3mの厚さになるよう振掛ける。これらをメッキ槽31
内のスルファミン酸ニッケルを主成分とする電気メッキ
液32に浸漬し、カソードとしてのポーラス金型本体6
とニッケル製アノード39との間に約5A/dm2の電
流密度で通電する。こうして1〜2時間電気メッキを行
うと、ポーラス金型本体6と金属粒状体16の間や、金
属粒状体16の相互接触部に金属接合材17としての膜
厚的50μmのニッケルが付着し、それらが強固に接合
される。Next, as shown in FIG. 6, a synthetic resin frame 30 is attached to the porous mold body 6, and the metal granules 16 are pickled, neutralized, washed with water and hot water, and then placed on the back side of the porous mold body 6. 1~
Sprinkle it to a thickness of 3m. Plating tank 31
The porous mold body 6 is immersed in an electroplating solution 32 containing nickel sulfamate as a main component to serve as a cathode.
A current is applied between the nickel anode 39 and the nickel anode 39 at a current density of about 5 A/dm2. When electroplating is performed for 1 to 2 hours in this manner, 50 μm thick nickel as the metal bonding material 17 is deposited between the porous mold body 6 and the metal granules 16 and at the mutual contact portions of the metal granules 16. They are firmly joined.
さらに、前記金属粒状体16をポーラス金型本体6の裏
面に徐々に警世・けて重ねていきながら、前記電気メッ
キを続けることにより、厚さ約30Mの通気性バックア
ップ休15が形成される。Furthermore, by continuing the electroplating while gradually overlapping the metal particles 16 on the back surface of the porous mold body 6, an air-permeable back-up layer 15 with a thickness of about 30M is formed.
次に、合成樹脂枠30内の電気メッキ液32を除去し、
通気性バックアップ体15を水洗・乾燥させる。そして
、枠部11を付は代えるとともに通気性バックアップ体
15の裏面にエポキシ樹脂を流し込んで硬化さけ、バッ
クアップ充填体1つを形成する。エポキシ樹脂は硬化時
の収縮が少なく、軽いという特徴がある。Next, the electroplating liquid 32 inside the synthetic resin frame 30 is removed,
The breathable backup body 15 is washed with water and dried. Then, the frame portion 11 is attached or replaced, and an epoxy resin is poured onto the back surface of the breathable backup body 15 to avoid hardening, thereby forming one backup filling body. Epoxy resins are characterized by low shrinkage during curing and are lightweight.
最後に、枠部11に前記吸引口13及び底板12の仙、
本実施例特有のものである冷却水の注入口33を爪側け
れば、ポーラス雌型1が完成する。Finally, the suction port 13 and the base of the bottom plate 12 are attached to the frame 11.
If the cooling water inlet 33, which is unique to this embodiment, is placed on the claw side, the porous female mold 1 is completed.
上記ポーラス雌型1を使用してのスタンピング成形方法
は、第一実施例とほぼ同様でおるが、ポーラス雌型1の
冷却方法については全く異なる。The stamping method using the porous female mold 1 is almost the same as in the first embodiment, but the cooling method of the porous female mold 1 is completely different.
すなわち、第5図に示すように、前記吸引口13及び注
入口33には、冷却液供給装置及び真空ポンプとしての
両機能を備えた吸引ポンプとして、本実施例では岐阜精
機工業株式会社製造の商標名「ロジックシール」なる吸
引ポンプ34を接続する。That is, as shown in FIG. 5, the suction port 13 and the injection port 33 are equipped with a suction pump manufactured by Gifu Seiki Kogyo Co., Ltd., which functions as both a cooling liquid supply device and a vacuum pump. A suction pump 34 with the trade name "Logic Seal" is connected.
また、前記吸引ポンプ34には、同吸引ポンプ34に一
定温度の冷却水を供給するとともに、同吸引ポンプ34
から冷却水を回収する冷却装置としての温調器35.3
6を接続する。一方の温調器35は90〜100’Cの
高温の冷却水を、他方の温調器36は0〜20℃の低温
の冷却水を前記吸引ポンプ34に供給するようになって
いる。Further, cooling water at a constant temperature is supplied to the suction pump 34, and cooling water at a constant temperature is supplied to the suction pump 34.
Temperature controller 35.3 as a cooling device that collects cooling water from
Connect 6. One temperature regulator 35 supplies high temperature cooling water of 90 to 100'C, and the other temperature regulator 36 supplies low temperature cooling water of 0 to 20C to the suction pump 34.
そして、前記冷却水を吸引ポンプ34に供給開始及び供
給停止するタイミングは、成形タイミングに合わせて前
記温調器35.36と吸引ポンプ34間に設りたバルブ
37を開閉することにより制御する。具体的には、合成
樹脂シート27を吸着させるときには、シ小模様8を転
写しやすくするために、高温の冷却水を供給づべく温調
器35のバルブ37を開く。また、合成樹脂素材28を
スタンピング成形するときには、ポーラス金型本体6を
急速に冷却するために、冷温の冷却水を供給すべく温調
器36のバルブ37を開き、温調器35のバルブ37は
閉じる。The timing of starting and stopping the supply of the cooling water to the suction pump 34 is controlled by opening and closing the valve 37 provided between the temperature controller 35, 36 and the suction pump 34 in accordance with the molding timing. Specifically, when adsorbing the synthetic resin sheet 27, the valve 37 of the temperature regulator 35 is opened to supply high-temperature cooling water in order to facilitate the transfer of the striped pattern 8. Further, when stamping the synthetic resin material 28, in order to rapidly cool the porous mold body 6, the valve 37 of the temperature regulator 36 is opened to supply cold cooling water. closes.
前記吸引ポンプ34を作動させると、ポーラス金型本体
6の表面側の空気が通気孔9から通気性バックアップ体
15内に吸引されるとともに、温調器35.36の冷却
水が注入口33から通気性バックアップ体15内に循環
され、これらの空気及び冷却水は吸引口13から同時に
排出される。When the suction pump 34 is activated, the air on the surface side of the porous mold body 6 is sucked into the breathable backup body 15 through the ventilation holes 9, and the cooling water of the temperature controllers 35 and 36 is sucked through the inlet 33. The air and cooling water are circulated within the breathable backup body 15 and discharged from the suction port 13 at the same time.
従って、ポーラス金型本体6及び通気性バッファツブ体
15は、これに冷却水が直接接することによって効率良
くしかも均一に冷却されるため、成形サイクルをさらに
短縮することができるという効果がある。Therefore, the porous mold body 6 and the breathable buffer tube body 15 are efficiently and uniformly cooled by direct contact with the cooling water, which has the effect of further shortening the molding cycle.
(第3実施例)
次に、本発明の第三実施例を、第7図及び第8図に従っ
て説明する。(Third Embodiment) Next, a third embodiment of the present invention will be described with reference to FIGS. 7 and 8.
本発明の第三実施例は、金属粒状体16の相互接触部を
接合する金属接合材17がロウ材である点においてのみ
、第一実施例と相違している。The third embodiment of the present invention differs from the first embodiment only in that the metal bonding material 17 for bonding the mutually contacting portions of the metal particles 16 is a brazing material.
このポーラス雌型1の製造方法を説明する。A method of manufacturing this porous female mold 1 will be explained.
まず、第一実施例の通り電鋳形成したポーラス金型本体
6をマンドレル20がら取外し、同ポーラス金型本体6
に枠部11を数例(つる。First, the porous mold body 6 electroformed as in the first embodiment is removed from the mandrel 20, and the porous mold body 6 is removed from the mandrel 20.
There are several examples of frame parts 11 (vines).
次に、第7図に示すように、予めロウ材38としてのす
ず一鉛系はんだを膜厚的50μmにコーティングした銅
製の金属粒状体16を、ポーラス金型本体6の裏面に約
30mの厚さになるよう振掛ける。これらを図示しない
加熱炉に入れて約2oo’cに加熱した後に取出すと、
前記金属粒状体16のロウ材38のみが溶融・固化して
金属接合材17となり、ポーラス金型本体6と金属粒状
体16の間や、金属粒状体16の相互接触部を接合する
。その後のバックアップ充填体19の形成方法等は第一
実施例と同様である。Next, as shown in FIG. 7, copper metal particles 16 coated in advance with tin-lead solder as a brazing material 38 to a thickness of 50 μm are placed on the back surface of the porous mold body 6 to a thickness of about 30 m. Sprinkle until smooth. When these are placed in a heating furnace (not shown) and heated to about 2oo'c, they are taken out.
Only the brazing material 38 of the metal granules 16 melts and solidifies to become the metal bonding material 17, which joins the porous mold body 6 and the metal granules 16 and the mutual contact portions of the metal granules 16. The subsequent method of forming the backup filling body 19 and the like are the same as in the first embodiment.
このように、本実施例によればポーラス雌型1を極めて
容易に製造リ−ることができる。In this way, according to this embodiment, the porous female mold 1 can be manufactured very easily.
なお、本発明は前記実施例の構成に限定されるものでは
なく、例えば以下のように発明の趣旨から逸脱しない範
囲で任意に変更して具体化することもできる。It should be noted that the present invention is not limited to the configuration of the above-mentioned embodiments, and may be modified and embodied as desired without departing from the spirit of the invention, for example, as described below.
(1) 金属粒状体]6の材料として、銅以外にも、鉄
、ニッケル、亜鉛、アルミニウム、これらの合金等、必
らゆる固体金属及び合金を採用することができる。(1) Metal granules] In addition to copper, any solid metals and alloys such as iron, nickel, zinc, aluminum, and alloys thereof can be used as the material for the metal granules 6.
(2) 前記第−及び第二実施例における金属接合材1
7の材料として、ニッケル以外にも、亜鉛、クロム、銀
等、メッキ可能なあらゆる金属及び合金を採用すること
ができる。第三実施例における金属接合材17の材料と
しても、すず−鉛系はんだ以外に、あらゆるロウ材を採
用することができる。(2) Metal bonding material 1 in the above-mentioned first and second embodiments
In addition to nickel, any metal or alloy that can be plated, such as zinc, chromium, silver, etc., can be used as the material for the plate 7. As the material for the metal bonding material 17 in the third embodiment, any brazing material can be used in addition to tin-lead solder.
(3) バックアップ充填材19は剛性(場合によって
は切削性も)が高いものならばどのようなものでもよく
、熱伝導性や通気性は不要である。(3) The backup filler 19 may be of any material as long as it has high rigidity (and machinability in some cases), and does not require thermal conductivity or air permeability.
従って、ZAS (亜鉛合金)、低融点金属、多数の径
の大きい球状体等を適用丈ることもできる。Therefore, ZAS (zinc alloy), a low melting point metal, a large number of large diameter spherical bodies, etc. can also be applied.
(4) 本発明のポーラス金型は特に剛性が高いので、
産業上の利用分野の欄に記載した各種成形(特にインジ
ェクション成形)用金型として具体化することもできる
。(4) Since the porous mold of the present invention has particularly high rigidity,
It can also be embodied as molds for various moldings (particularly injection molding) described in the field of industrial application.
発明の効果
以上詳述したように、本発明のポーラス金型は、同金型
に要求される通気性、剛性及び熱伝導性の3点すべてを
高いレベルで満たすため、スタンピング成形やインジェ
クション成形にも使用することができ、成形サイクルを
短縮することもできるという優れた効果を奏する。Effects of the Invention As detailed above, the porous mold of the present invention satisfies all three requirements of the mold at a high level: air permeability, rigidity, and thermal conductivity, so it is suitable for stamping molding and injection molding. It also has the excellent effect of shortening the molding cycle.
第1図は第一実施例のポーラス金型を示す断面図、第2
図は同じくポーラス金型本体の一部を切断及び拡大して
示す斜視図、第3図は同じくポーラス金型の部分拡大断
面図、第4図は同じくポーラス金型の製造方法を示す概
略図、第5図は第二実施例のポーラス金型を示す断面図
、第6図は同ポーラス金型の製造方法を示す概略図、第
7図は第三実施例の通気性バックアップ体の接合前の状
態を示す部分拡大断面図、第8図は同じく接合後の状態
を示す部分拡大断面図である。
6・・・ポーラス金型本体、15・・・通気性バックア
ップ体、16・・・金属粒状体、17・・・金属接合材
。Figure 1 is a sectional view showing the porous mold of the first embodiment,
FIG. 3 is a partially enlarged cross-sectional view of the porous mold, and FIG. 4 is a schematic diagram showing a method of manufacturing the porous mold. Fig. 5 is a cross-sectional view showing the porous mold of the second embodiment, Fig. 6 is a schematic diagram showing the manufacturing method of the same porous mold, and Fig. 7 is a cross-sectional view of the porous mold of the third embodiment before joining. FIG. 8 is a partially enlarged sectional view showing the state after bonding. 6...Porous mold body, 15...Air permeable backup body, 16...Metal granules, 17...Metal bonding material.
Claims (1)
体(16)の相互接触部を金属接合材(17)により接
合してなる通気性バックアップ体(15)を設けたこと
を特徴とするポーラス金型。 2、前記金属接合材(17)は金属粒状体(16)の相
互接触部に無電解メッキしてなるメッキ材である特許請
求の範囲第1項に記載のポーラス金型。 3、前記金属接合材(17)は金属粒状体(16)の相
互接触部に電気メッキしてなるメッキ材である特許請求
の範囲第1項に記載のポーラス金型。 4、前記金属接合材(17)は金属粒状体(16)の相
互接触部を接合するロウ材である特許請求の範囲第1項
に記載のポーラス金型。[Claims] 1. A breathable backup body (15) formed by bonding the mutual contact portions of a large number of metal particles (16) to the back surface of a porous mold body (6) with a metal bonding material (17). A porous mold characterized by having a. 2. The porous mold according to claim 1, wherein the metal bonding material (17) is a plating material formed by electroless plating on mutual contact portions of the metal particles (16). 3. The porous mold according to claim 1, wherein the metal bonding material (17) is a plating material formed by electroplating the mutual contact portions of the metal particles (16). 4. The porous mold according to claim 1, wherein the metal bonding material (17) is a brazing material for bonding the mutual contact portions of the metal particles (16).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP33570787A JPH01176513A (en) | 1987-12-30 | 1987-12-30 | Porous mold |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP33570787A JPH01176513A (en) | 1987-12-30 | 1987-12-30 | Porous mold |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH01176513A true JPH01176513A (en) | 1989-07-12 |
Family
ID=18291581
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP33570787A Pending JPH01176513A (en) | 1987-12-30 | 1987-12-30 | Porous mold |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH01176513A (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5587121A (en) * | 1993-01-13 | 1996-12-24 | Vesa; Juha | Method and apparatus for the production of a gas-pervious part in a gas-pervious mould and a product made by this method |
US5776524A (en) * | 1996-10-30 | 1998-07-07 | The Iams Company | Process for treating small intestine bacterial overgrowth in animals |
WO2002081166A3 (en) * | 2001-04-05 | 2002-12-12 | Fraunhofer Ges Forschung | Moulding tool |
JP2007176053A (en) * | 2005-12-28 | 2007-07-12 | Inoac Corp | Manufacturing method for polyolefin foam product, and mold |
JP2010030159A (en) * | 2008-07-29 | 2010-02-12 | Toyota Boshoku Corp | Mold for injection molding |
WO2021097525A1 (en) * | 2019-11-19 | 2021-05-27 | Varden Process Pty Ltd | A tool for use in a thermoforming process |
-
1987
- 1987-12-30 JP JP33570787A patent/JPH01176513A/en active Pending
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5587121A (en) * | 1993-01-13 | 1996-12-24 | Vesa; Juha | Method and apparatus for the production of a gas-pervious part in a gas-pervious mould and a product made by this method |
US5776524A (en) * | 1996-10-30 | 1998-07-07 | The Iams Company | Process for treating small intestine bacterial overgrowth in animals |
WO2002081166A3 (en) * | 2001-04-05 | 2002-12-12 | Fraunhofer Ges Forschung | Moulding tool |
JP2007176053A (en) * | 2005-12-28 | 2007-07-12 | Inoac Corp | Manufacturing method for polyolefin foam product, and mold |
JP2010030159A (en) * | 2008-07-29 | 2010-02-12 | Toyota Boshoku Corp | Mold for injection molding |
WO2021097525A1 (en) * | 2019-11-19 | 2021-05-27 | Varden Process Pty Ltd | A tool for use in a thermoforming process |
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