JPH01176257A - Dry mica forming material - Google Patents
Dry mica forming materialInfo
- Publication number
- JPH01176257A JPH01176257A JP33029587A JP33029587A JPH01176257A JP H01176257 A JPH01176257 A JP H01176257A JP 33029587 A JP33029587 A JP 33029587A JP 33029587 A JP33029587 A JP 33029587A JP H01176257 A JPH01176257 A JP H01176257A
- Authority
- JP
- Japan
- Prior art keywords
- mica
- adhesive
- resin
- dry
- backing material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000010445 mica Substances 0.000 title claims abstract description 71
- 229910052618 mica group Inorganic materials 0.000 title claims abstract description 71
- 239000000463 material Substances 0.000 title claims abstract description 23
- 239000000853 adhesive Substances 0.000 claims abstract description 31
- 230000001070 adhesive effect Effects 0.000 claims abstract description 31
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 13
- 239000002562 thickening agent Substances 0.000 claims abstract description 9
- 239000003822 epoxy resin Substances 0.000 claims abstract description 8
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 8
- 239000000843 powder Substances 0.000 claims abstract description 7
- 239000000377 silicon dioxide Substances 0.000 claims abstract description 6
- 229920005989 resin Polymers 0.000 claims description 23
- 239000011347 resin Substances 0.000 claims description 23
- 239000012778 molding material Substances 0.000 claims description 8
- 239000004840 adhesive resin Substances 0.000 claims 1
- 229920006223 adhesive resin Polymers 0.000 claims 1
- 239000002966 varnish Substances 0.000 abstract description 17
- 239000011521 glass Substances 0.000 abstract description 9
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 abstract description 6
- 239000004744 fabric Substances 0.000 abstract description 6
- 238000000034 method Methods 0.000 abstract description 6
- 239000012784 inorganic fiber Substances 0.000 abstract description 3
- 239000002904 solvent Substances 0.000 abstract description 3
- 239000011248 coating agent Substances 0.000 abstract description 2
- 238000000576 coating method Methods 0.000 abstract description 2
- 238000007865 diluting Methods 0.000 abstract 1
- 238000001035 drying Methods 0.000 abstract 1
- 230000008719 thickening Effects 0.000 abstract 1
- 238000005470 impregnation Methods 0.000 description 15
- 238000004804 winding Methods 0.000 description 7
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 239000004745 nonwoven fabric Substances 0.000 description 6
- 229920002050 silicone resin Polymers 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 230000015556 catabolic process Effects 0.000 description 3
- 239000011810 insulating material Substances 0.000 description 3
- 239000004925 Acrylic resin Substances 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 2
- 229910002012 Aerosil® Inorganic materials 0.000 description 2
- 239000005062 Polybutadiene Substances 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 239000004760 aramid Substances 0.000 description 2
- 239000004359 castor oil Substances 0.000 description 2
- 235000019438 castor oil Nutrition 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- ZEMPKEQAKRGZGQ-XOQCFJPHSA-N glycerol triricinoleate Natural products CCCCCC[C@@H](O)CC=CCCCCCCCC(=O)OC[C@@H](COC(=O)CCCCCCCC=CC[C@@H](O)CCCCCC)OC(=O)CCCCCCCC=CC[C@H](O)CCCCCC ZEMPKEQAKRGZGQ-XOQCFJPHSA-N 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 230000035515 penetration Effects 0.000 description 2
- 229920002857 polybutadiene Polymers 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 229920005749 polyurethane resin Polymers 0.000 description 2
- 239000011342 resin composition Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 229920003043 Cellulose fiber Polymers 0.000 description 1
- RJDOZRNNYVAULJ-UHFFFAOYSA-L [O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[F-].[F-].[Mg++].[Mg++].[Mg++].[Al+3].[Si+4].[Si+4].[Si+4].[K+] Chemical compound [O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[F-].[F-].[Mg++].[Mg++].[Mg++].[Al+3].[Si+4].[Si+4].[Si+4].[K+] RJDOZRNNYVAULJ-UHFFFAOYSA-L 0.000 description 1
- 229920006231 aramid fiber Polymers 0.000 description 1
- 229920003235 aromatic polyamide Polymers 0.000 description 1
- 239000010425 asbestos Substances 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 229920006015 heat resistant resin Polymers 0.000 description 1
- 239000010954 inorganic particle Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000005416 organic matter Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 125000000843 phenylene group Chemical group C1(=C(C=CC=C1)*)* 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
- 239000004590 silicone sealant Substances 0.000 description 1
- 229920002994 synthetic fiber Polymers 0.000 description 1
- 239000012209 synthetic fiber Substances 0.000 description 1
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、ドライマイカ成形材料に係り、特に高電圧、
高容量の電機機器用コイルの絶縁材料、特に真空含浸用
に使用されるドライマイカテープを改良したものに関す
る。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a dry mica molding material, particularly for high voltage,
This invention relates to an insulating material for high-capacity electrical equipment coils, particularly an improved dry mica tape used for vacuum impregnation.
従来の技術
発電機や電動機あるいは静止機等に用いられるコイルに
は、特に高電圧、高容量型のものでは耐電圧特性等電気
的、熱的特性に優れているマイカ材料が絶縁材料として
使用されている。このマイカ材料にはマイカを裏打材と
ともに巻線に巻き付けた後フェスを真空加圧含浸させ、
その後加熱加圧してコイルを成形するときに用いられる
ドライマイカテープがある。Conventional technology Mica material, which has excellent electrical and thermal properties such as withstand voltage properties, is used as an insulating material for coils used in generators, electric motors, stationary machines, etc., especially for high-voltage, high-capacity types. ing. For this mica material, mica is wrapped around a winding wire together with a backing material, and then the face is impregnated with vacuum pressure.
There is a dry mica tape that is used when heating and pressurizing it to form a coil.
このドライマイカテープを電機子巻線に通用するには、
第５図に示すように導体に絶縁被覆を施した複数本の絶
縁電線ａ、ａ・・からなるコイル本体すにｉきつけられ
て−イカ會フ形成された後、フェスを含浸されるが、こ
の際ボイドが発生すると絶縁破壊電圧を小さくするので
その発生を抑制する工夫が行われている。In order to use this dry mica tape for armature winding,
As shown in Fig. 5, a coil body consisting of a plurality of insulated wires a, a, etc. each having an insulating coating applied to the conductor is attached to the coil body to form a ferrule, and then the face is impregnated. At this time, if voids occur, the dielectric breakdown voltage is reduced, so measures are being taken to suppress their occurrence.
例えば含浸するワニスを加温してワニスの粘度を下げた
り、含浸の際に真空度を高（したり、ドライマイカテー
プをコイル本体に巻きつけるときにゆる（したり、ある
いは真空含浸した後に加圧したりすることによりワニス
の浸透をし易くしている。For example, heating the varnish to be impregnated to lower the viscosity of the varnish, increasing the degree of vacuum during impregnation, loosening the dry mica tape when wrapping it around the coil body, or adding water after vacuum impregnation. By applying pressure, the varnish penetrates easily.
発明が解決しようとする問題点
しかしながら、このような工夫を行なってもワニスを隈
無（十分に浸透させることは容易ではなく、ワニス含浸
不十分によるボイドの発生により絶縁破壊電圧を規定以
上にできないというコイルの不良は、その率にして数％
にもなるという問題点がある。Problems to be Solved by the Invention However, even with these efforts, it is not easy to penetrate the varnish sufficiently, and the dielectric breakdown voltage cannot exceed the specified level due to the generation of voids due to insufficient varnish impregnation. The number of coil defects is a few percent.
There is also the problem that it becomes
また、このようにワニスの含浸性が十分でないと、樹脂
そのものに耐熱性があってもこれを活かせないのみなら
ず、樹脂の持つ絶縁性等の電気特性も十分に活かすこと
ができない。Furthermore, if the impregnating properties of the varnish are not sufficient as described above, not only will it not be possible to take advantage of the heat resistance of the resin itself, but also the electrical properties of the resin, such as insulation, will not be fully utilized.
このように従来のドライマイカテープの含浸性が十分で
ない理由は、マイカテープはマイカ単体では取扱上強度
的に弱いので裏打材により補強して使用され、この裏打
材はマイカ層に接着剤により接着されるため、この接着
剤の種類と使用量が重要な役割を果たすが、その適当な
例が見出せないことにある。すなわち、接着剤は接着後
のテープの柔軟性と接着力を両立させることが必要であ
り、これを実現しようとすると、アクリル樹脂やポリブ
タジェン樹脂、ポリウレタン樹脂、あるいはシリコーン
樹脂系の粘着剤が適当であるが、−方ではコイル用ドラ
イマイカテープとして使用する接着剤には耐熱性を要す
るので前二者はこの点で問題がある。また、シリコーン
樹脂系粘着剤は、真空加圧含浸用樹脂として現在広く使
用されているエポキシ樹脂系あるいはシリコーン樹脂系
ワニスに対する相溶性が悪（、含浸により形成する樹脂
層にボイドを発生し易く、上述の如く電気特性を低下さ
せ易い。The reason why conventional dry mica tape does not have sufficient impregnating properties is that mica tape is weak in handling strength when used alone, so it is reinforced with a backing material, and this backing material is bonded to the mica layer with an adhesive. Therefore, the type and amount of adhesive used play an important role, but no suitable example has been found. In other words, it is necessary for the adhesive to have both flexibility and adhesive strength for the tape after adhesion, and to achieve this, acrylic resin, polybutadiene resin, polyurethane resin, or silicone resin adhesives are suitable. However, in the first method, the adhesive used as the dry mica tape for coils requires heat resistance, so the first two have problems in this respect. In addition, silicone resin adhesives have poor compatibility with epoxy resin or silicone resin varnishes, which are currently widely used as resins for vacuum pressure impregnation. As mentioned above, electrical characteristics tend to deteriorate.
一方、これらの含浸用樹脂に相溶するエポキシ樹脂、シ
リコーン樹脂（特にフェニレン系シリコーン樹脂）は、
耐熱性はあるが、裏打材用接着剤としでは接着力が弱く
、特にガラスクロスやポリエステル不織布のような表面
が毛羽立っているものには接着面積が十分に大きくでき
ないため、接着剤量を少なくするとガラス糸のホツレや
繊維の毛羽立ちが生じ、甚だしいときはマイカ層から裏
打材が剥離する。また、この接着剤量が多いと、後の真
空加圧含浸の際ワニスの含浸性が悪（なるという問題点
がある。On the other hand, epoxy resins and silicone resins (especially phenylene silicone resins) that are compatible with these impregnating resins are
Although it is heat resistant, it has weak adhesive strength as a backing adhesive, and the adhesive area cannot be large enough especially for materials with fluffy surfaces such as glass cloth or polyester nonwoven fabric, so if you reduce the amount of adhesive The glass thread frays and the fibers become frayed, and in severe cases, the backing material peels off from the mica layer. Moreover, if the amount of adhesive is large, there is a problem that the impregnating property of the varnish becomes poor during the subsequent vacuum pressure impregnation.
本発明の目的は、例えば巻回して使用されるコイル用の
ドライマイカテープのように使用形態で樹脂をさらに含
浸させるようなドライマイカ成形材料において、耐熱性
を備えることを選択できるとともに十分な接着力を保持
してワニスの含浸性を損なず、含浸樹脂の性質を活かす
ことができるドライマイカ成形材料を提供することにあ
る。An object of the present invention is to make it possible to select a dry mica molding material that is further impregnated with resin in the usage form, such as a dry mica tape for a coil that is used by winding, to have heat resistance and to have sufficient adhesion. To provide a dry mica molding material that retains strength without impairing varnish impregnating properties and can take advantage of the properties of an impregnated resin.
問題点を解決するための手段
本発明は、上記問題点を解決するために、マイカを主成
分に有するマイカ層と裏打材を層状に接着して有する層
状体において、この接着に無機系増粘剤を含有する接着
剤を用いることを特徴とするドライマイカ成形材料を提
供するものである。Means for Solving the Problems In order to solve the above problems, the present invention provides a layered body in which a mica layer containing mica as a main component and a backing material are bonded together in a layered manner. The present invention provides a dry mica molding material characterized by using an adhesive containing an adhesive.
次に本発明の詳細な説明する。Next, the present invention will be explained in detail.
本発明において使用するマイカは天然又は合成のいずれ
のマイカも使用できるが、経済性に有利な天然マイカを
使用することが好ましい。このマイカには、通常はおよ
そ２ｍｎ？以下に粉砕したマイカを例えば抄紙と同じ方
法で紙状に抄造した集成マイカを使用することが好まし
い。この集成マイカには、マイカを例えば約７５０℃で
焼いて結晶水の一部を除いた後に粉砕、抄造する、いわ
ゆる焼成集成マイカ、焼かないで粉砕、抄造する、いわ
ゆる無焼成集成マイカのいずれも使用でき、またこれら
を併用することもできる。また、マイカとしては軟質、
硬質のマイカ片のいずれも使用できる。このマイカ層は
、マイカを主成分に有するが、その強度を維持するため
にアラミツド繊維やセルローズ繊維、ガラス繊維等の有
機、無機の繊維を併用しても良い。Although either natural or synthetic mica can be used as the mica used in the present invention, it is preferable to use natural mica because it is economically advantageous. This mica usually has about 2mm? It is preferable to use laminated mica, which is made from pulverized mica and made into paper, for example, by the same method as paper making. This laminated mica includes both so-called fired laminated mica, in which mica is fired at about 750°C to remove some of the crystallized water, and then crushed and made into paper, and so-called unfired laminated mica, in which mica is crushed and made into paper without baking. These can be used together or in combination. In addition, mica is soft,
Any piece of hard mica can be used. This mica layer has mica as a main component, but in order to maintain its strength, organic and inorganic fibers such as aramid fibers, cellulose fibers, and glass fibers may be used in combination.
本発明において使用される接着剤としては、エポキシ樹
脂、シリコーン樹脂等の耐熱性のある樹脂を使用するこ
とが好ましく、これらには例えば液状エポキシ樹脂のＡ
ＥＲ３３１，３３７（旭化成社製）等が挙げられるが、
それほどの耐熱性を必要としない場合にはアクリル樹脂
、ポリブタジェン樹脂、ポリウレタン樹脂等も使用でき
る。 また、本発明で使用される無機系増粘剤としては
、シリカ微粉末が挙げられ、その具体例としてはアエロ
ジル（日本アエロジル社製）、石綿微粉末が挙げられ、
その平均粒径としては１０〜２０ ｍμが好ましい。As the adhesive used in the present invention, it is preferable to use a heat-resistant resin such as an epoxy resin or a silicone resin.
Examples include ER331, 337 (manufactured by Asahi Kasei Corporation),
If high heat resistance is not required, acrylic resin, polybutadiene resin, polyurethane resin, etc. can also be used. In addition, examples of the inorganic thickener used in the present invention include fine silica powder, specific examples of which include Aerosil (manufactured by Nippon Aerosil Co., Ltd.), fine asbestos powder,
The average particle diameter is preferably 10 to 20 mμ.
この無機系増粘剤の接着剤中に混合される割合は、樹脂
１００Ｍ量部に対して０．５〜５０重量部が好ましく、
最も好ましくは２〜２０重量部である。The proportion of this inorganic thickener mixed in the adhesive is preferably 0.5 to 50 parts by weight per 100 M parts of resin.
Most preferably it is 2 to 20 parts by weight.
０．５重量部未満であると、裏打材とマイカ層の接着が
十分でない場合があり、５０重量部より多いと、この接
着力は十分であるが、裏打材面あるいは裏打材とマイカ
層の境界面に樹脂が残り過ぎ、ドライマイカテープをコ
イルに巻いてワニスを含浸するときの含浸性を損なうの
みならず、ドライマイカテープを製造後ロール状に巻い
た場合にその使用時に巻戻すときテープ層間が粘着、一
体化してしまうことがある。このドライマイカテープ相
互間の粘着を防止するためにセパレータを巻き込む方法
もあるが、ドライマイカテープの製造後の巻取り作業性
が劣り、好ましくない。If the amount is less than 0.5 parts by weight, the adhesion between the backing material and the mica layer may not be sufficient. If it is more than 50 parts by weight, the adhesive force is sufficient, but the adhesion between the backing material surface or the backing material and the mica layer may be insufficient. Too much resin remains on the interface, which not only impairs the impregnating properties when the dry mica tape is wound into a coil and impregnated with varnish, but also when the dry mica tape is rolled into a roll after manufacturing and is unwound for use. The layers may stick together and become integrated. Although there is a method of winding up a separator to prevent adhesion between the dry mica tapes, this method is not preferable because the winding workability after manufacturing the dry mica tape is poor.
本発明に使用される裏打材としてはガラスクロス、ポリ
オレフィンフィルム、ポリエステルフィルム等のプラス
チックフィルム、紙、ガラスヤーン（商品名タテソフヤ
ーンやヤーンを縦横に接着させたもの）等が使用できる
。また、乾式法、湿式法いずれでも良いポリエステル不
織布、アラミツド不織布等の合成繊維不織布や、ガラス
不織布、無機ペーパー（バインダー等有機物が１０％以
下のもの）等の無機繊維不織布等も使用でき、これらは
ドライマイカテープをコイル本体に巻いてワニスを含浸
させるときに浸透し易く、これが通路になって内部の巻
回層にワニスを浸透できる。As the backing material used in the present invention, glass cloth, plastic films such as polyolefin films and polyester films, paper, glass yarn (trade name: Vertical Soft Yarn, yarns bonded vertically and horizontally), etc. can be used. In addition, synthetic fiber non-woven fabrics such as polyester non-woven fabrics and aramid non-woven fabrics, which can be processed by either dry or wet processes, as well as inorganic fiber non-woven fabrics such as glass non-woven fabrics and inorganic paper (with less than 10% organic matter such as binder) can also be used. When the dry mica tape is wrapped around the coil body and impregnated with varnish, it easily penetrates, and this becomes a passageway that allows the varnish to penetrate into the inner wound layer.
作用
無機系増粘剤は上記のエポキシ樹脂等の溶液と混合され
て使用されると、樹脂量を少なくしてその粘度を増加で
き、例えばローラコータ等でマイカ層を裏打ちする裏打
材側に塗布すると、その塗布量を少な（して裏打材とマ
イカ層の界面に樹脂を留めることができ、より少ない樹
脂で高い接着力を発揮することができ、この樹脂が少な
いだけ後の含浸樹脂の浸透を良くできる。これは、無機
系増粘剤の粒子はマイカ層の隙間に侵入を阻止され易く
、この隙間を塞ぐので樹脂の侵入も抑制されるためと考
えられる。この際無機系増粘剤と樹脂の親和性の高いも
のであると、樹脂が増粘剤から分離することが少な（、
それだけ侵入を阻止された無機系粒子に樹脂が付着して
離れ難いのでより好ましい。Function When an inorganic thickener is mixed with a solution such as the above-mentioned epoxy resin, it can increase its viscosity while reducing the amount of resin. For example, when applied to the backing material side that backs the mica layer with a roller coater , the amount of resin applied can be kept at the interface between the backing material and the mica layer, and high adhesion can be achieved with less resin. This is thought to be because the particles of the inorganic thickener are easily prevented from penetrating into the gaps in the mica layer, and by blocking these gaps, the penetration of the resin is also suppressed. If the resin has a high affinity, the resin will be less likely to separate from the thickener (,
This is more preferable because the resin adheres to the inorganic particles that are prevented from entering and is difficult to separate from.
実施例 次に本発明の一実施例を説明する。Example Next, one embodiment of the present invention will be described.
液状エポキシ樹脂（旭化成社！！ＡＥＲ３３１） １０
０重量部に対し、シリカ微粉末（日本アエロシール社製
アエロシール２００）を表に示す量加え、ボールミルで
良く混練し、粘稠な樹脂組成物を得た。この樹脂組成物
が３０％になるようにメチルエチルケトンで希釈したも
のの粘度はブルックフィールド型粘度計で０．５〜８．
０ボイズ（２５℃）であった。Liquid epoxy resin (Asahi Kasei!! AER331) 10
To 0 parts by weight, fine silica powder (Aeroseal 200 manufactured by Nippon Aeroseal Co., Ltd.) was added in the amount shown in the table and thoroughly kneaded in a ball mill to obtain a viscous resin composition. The viscosity of this resin composition diluted with methyl ethyl ketone to 30% was 0.5 to 8.0 using a Brookfield viscometer.
0 voids (25°C).
次に厚さ０．１３ｍｍの硬質焼成集成マイカの一面に厚
さ０．０３１１１１のガラスクロス（日東紡績社製ＷＨ
Ｏ３Ｆ）を重ね、上記で得た接着剤をガラスクロス側か
らロールコータにより塗布し、乾燥器に入れて溶剤を揮
発させ、樹脂量約８％のドライマイカシートを作製した
。Next, one side of the hard calcined laminated mica with a thickness of 0.13 mm was covered with glass cloth with a thickness of 0.031111 (WH made by Nittobo Co., Ltd.).
O3F) was layered, and the adhesive obtained above was applied from the glass cloth side using a roll coater, and then placed in a dryer to volatilize the solvent to produce a dry mica sheet with a resin content of approximately 8%.
比較例
シリカ微粉末を使用しながった以外は実施例と同様にし
て接着剤を作製し、これを実施例と同様に塗布して樹脂
屋約８％のドライマイカシートを作製した。Comparative Example An adhesive was prepared in the same manner as in the example except that fine silica powder was not used, and this was applied in the same manner as in the example to prepare a dry mica sheet having a resin content of approximately 8%.
上記実施例、比較例のドライマイカシートについて接着
力試験、含浸性試験、真空含浸試験を行ない、その結果
を表に示す。The dry mica sheets of the above Examples and Comparative Examples were subjected to an adhesion test, an impregnation test, and a vacuum impregnation test, and the results are shown in the table.
■ 接着力試験
上記のドライマイカシートを幅２５龍で第１図に示す形
状に切断し、接着力測定用試験片１とした。この試験片
を第２図に示すようにシッッパー型引張拭験機の把持部
２にセットし、引張速度２００ ｔｍ／分で引張り、ガ
ラスクロスから集成マイカ層が剥離したり、ガラスクロ
スが捩れたり、あるいはマイカ層に亀裂が入ったときの
引張り荷重を接着力として表に示す。(2) Adhesion Test The dry mica sheet described above was cut into the shape shown in FIG. 1 with a width of 25mm to obtain a test piece 1 for measuring adhesive strength. This test piece was set in the grip part 2 of a Schipper type tensile wiping machine as shown in Fig. 2, and pulled at a pulling speed of 200 tm/min. , or the tensile load when a crack appears in the mica layer is shown in the table as adhesive strength.
■ 含浸性試験
上記ドライマイカシートを８０ｍｍ四方に切断して試験
片を形成し、第３図（ａ）に示すようにウィリアム型ペ
ネトレーションテスターを使用して測定する。すなわち
、器体３にひまし油トルエン溶液 （粘度２６Ｐａ−Ｓ
（２５℃））４を収容し、器体上面に開口を形成して直
径６０鶴のオリフィス５を形成し、これを上記の試験片
６でガラスクロス側を内側にしてねじにより封鎖し、同
図（ｂ）のように２０度傾け、ひまし油トルエン溶液が
試験片の外側全面に滲み出すまでに要する時間を測定し
、含浸時間とする。(2) Impregnation test The above dry mica sheet is cut into 80 mm squares to form test pieces, and the test pieces are measured using a William type penetration tester as shown in FIG. 3(a). That is, a castor oil toluene solution (viscosity 26 Pa-S
(25°C)) 4, an opening was formed on the top surface of the vessel to form an orifice 5 with a diameter of 60 mm, and this was sealed with the above test piece 6 with the glass cloth side inside with a screw. Tilt the test piece at 20 degrees as shown in Figure (b), and measure the time required for the castor oil toluene solution to ooze out over the entire outside of the test piece, and use this as the impregnation time.
■ 真空含浸試験
上記ドライマイカシートを３２鶴幅に切断し、第４図に
示すように厚さ５鶴、幅２５ｍ、長さ５００ｆｉのアル
ミパー７に１６鶴重ね（ハーフラップ）で２０回巻いて
テープ巻回マイカＮ８を形成し、２５℃で粘度１ポイズ
のエポキシ樹脂溶液からなる含浸ワニス中に入れ、真空
度ＩＴｏｒｒで５時間含浸させた。■ Vacuum impregnation test The above dry mica sheet was cut into 32 mm width, and as shown in Figure 4, it was wrapped 20 times in a 16 mm layer (half wrap) around an aluminum par 7 with a thickness of 5 mm, width of 25 m, and length of 500 fi. A tape-wound mica N8 was formed, placed in an impregnating varnish consisting of an epoxy resin solution with a viscosity of 1 poise at 25° C., and impregnated for 5 hours at a vacuum degree of I Torr.
この試験片に対する含浸に当たっては、ワニスがコイル
端部から含浸される影響を除くためにそれぞれのコイル
の端部をシリコーンシーラント９で完全にシールした。When impregnating this test piece, the end of each coil was completely sealed with silicone sealant 9 to eliminate the effect of varnish being impregnated from the end of the coil.
硬化後の試験片を鎖線のところで切断し、ワニスの含浸
状態を目視してその含浸が外側から内側のどの層まで及
んでいるかを目視し、表に示す。After curing, the test piece was cut along the chain line, and the impregnated state of the varnish was visually observed to determine which layers from the outside to the inside the impregnation had reached, and the results are shown in the table.
上記結果から、実施例のものはいずれも接着力が太き（
、真空含浸性もよいことがわかる。一方比較例のものは
、含浸性は良いが、接着力が小さく、高張力で巻き付け
るテープマシンを使用するとマイカ層が剥離し、実用的
でない。この比較例のものの接着力を大きくするために
は、接着剤含有量を十分に多くしなければならず、そう
すると含浸樹脂の含浸性を損なうことになる。このよう
に比較例のものは接着力と含浸性の両方を満足させるこ
とができない。From the above results, it can be seen that the adhesive strength of all of the examples is strong (
It can be seen that the vacuum impregnability is also good. On the other hand, the comparative example has good impregnating properties, but its adhesive strength is low, and when a tape machine is used to wrap it with high tension, the mica layer peels off, making it impractical. In order to increase the adhesive strength of this comparative example, the adhesive content must be sufficiently increased, which would impair the impregnating properties of the impregnating resin. As described above, the comparative example cannot satisfy both adhesion and impregnability.
発明の効果
本発明によれば、無機系増粘剤を接着剤に含有させたの
で、塗布量を少なくすることができ、しかも少ない樹脂
量で裏打材とマイカ層を十分な実用強度で接着すること
ができる。また、例えばエポキシ樹脂を使用すると、耐
熱性も持たせることができ、裏打材に保持される樹脂量
が少なければ、コイルにドライマイカテープを巻いてワ
ニスを含浸させるときの含浸性も良くすることができる
。Effects of the Invention According to the present invention, since an inorganic thickener is contained in the adhesive, the amount of application can be reduced, and the backing material and mica layer can be bonded with sufficient practical strength with a small amount of resin. be able to. In addition, for example, if epoxy resin is used, heat resistance can be imparted, and if the amount of resin retained in the backing material is small, the impregnation property when impregnating with varnish by wrapping dry mica tape around the coil can be improved. Can be done.
これによりボイドの発生を抑制して絶縁破壊電圧の低下
を抑制し、優れた電気絶縁材料を提供することができる
。This suppresses the generation of voids, suppresses a decrease in dielectric breakdown voltage, and provides an excellent electrical insulating material.
第１図は接着力試験用の試験片を示す図、第２図はその
測定状態を示す図、第３図（ａ） （ｂ）は含浸性試験
装置及びその使用状態を示す図、第４図はドライマイカ
テープをアルミバーに巻き含浸性試験をしたときの試験
片を示す図、第５図は電気子巻線の断面図である。
昭和６２年１２月２８日
第１図
第２図
第３図
（ｂ）Figure 1 is a diagram showing a test piece for adhesion test, Figure 2 is a diagram showing its measurement state, Figures 3 (a) and (b) are diagrams showing an impregnation test device and its usage state, and Figure 4 is a diagram showing a test piece for adhesion test. The figure shows a test piece obtained by winding dry mica tape around an aluminum bar and conducting an impregnation test, and FIG. 5 is a cross-sectional view of the armature winding. December 28, 1988 Figure 1 Figure 2 Figure 3 (b)
Claims (4)
に接着して有する層状体において、この接着に無機系増
粘剤を含有する接着剤を用いることを特徴とするドライ
マイカ成形材料。(1) A dry mica molding material, characterized in that a layered body has a mica layer containing mica as a main component and a backing material bonded together in a layered manner, in which an adhesive containing an inorganic thickener is used for this bonding.
をエポキシ系樹脂とすることを特徴とする特許請求の範
囲第１項記載のドライマイカ成形材料。(2) The dry mica molding material according to claim 1, characterized in that the inorganic thickener is a fine silica powder, and the adhesive resin is an epoxy resin.
て０．５〜５０重量部含有されることを特徴とする特許
請求の範囲第２項記載のドライマイカ成形材料。(3) The dry mica molding material according to claim 2, wherein the fine silica powder is contained in an amount of 0.5 to 50 parts by weight per 100 parts by weight of the resin in the adhesive.
する特許請求の範囲第１項、第２項又は第３項記載のド
ライマイカ成形材料。(4) The dry mica molding material according to claim 1, 2 or 3, which is a dry mica tape for coils.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33029587A JPH01176257A (en) | 1987-12-28 | 1987-12-28 | Dry mica forming material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33029587A JPH01176257A (en) | 1987-12-28 | 1987-12-28 | Dry mica forming material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01176257A true JPH01176257A (en) | 1989-07-12 |
Family
ID=18231053
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP33029587A Pending JPH01176257A (en) | 1987-12-28 | 1987-12-28 | Dry mica forming material |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01176257A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1383226A4 (en) * | 2001-04-27 | 2005-04-27 | Toshiba Kk | Coil of dynamoelectric machine, and mica tape and mica sheet used to insulate this coil |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5511852A (en) * | 1978-07-12 | 1980-01-28 | Hitachi Chemical Co Ltd | Mica prepreg |
| JPS5798922A (en) * | 1980-12-12 | 1982-06-19 | Meidensha Electric Mfg Co Ltd | Lumped mica tape |
| JPS57162747A (en) * | 1981-03-31 | 1982-10-06 | Nitto Electric Ind Co Ltd | Epoxy resin composition |
| JPS61254682A (en) * | 1985-05-07 | 1986-11-12 | Nippon Gakki Seizo Kk | Adhesive |
-
1987
- 1987-12-28 JP JP33029587A patent/JPH01176257A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5511852A (en) * | 1978-07-12 | 1980-01-28 | Hitachi Chemical Co Ltd | Mica prepreg |
| JPS5798922A (en) * | 1980-12-12 | 1982-06-19 | Meidensha Electric Mfg Co Ltd | Lumped mica tape |
| JPS57162747A (en) * | 1981-03-31 | 1982-10-06 | Nitto Electric Ind Co Ltd | Epoxy resin composition |
| JPS61254682A (en) * | 1985-05-07 | 1986-11-12 | Nippon Gakki Seizo Kk | Adhesive |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1383226A4 (en) * | 2001-04-27 | 2005-04-27 | Toshiba Kk | Coil of dynamoelectric machine, and mica tape and mica sheet used to insulate this coil |
| US7294788B2 (en) | 2001-04-27 | 2007-11-13 | Kabushiki Kaisha Toshiba | Coil for electric rotating machine, and mica tape and mica sheet used for the coil insulation |
| US7507911B2 (en) | 2001-04-27 | 2009-03-24 | Kabushiki Kaisha Toshiba | Coil for electric rotating machine, and mica tape and mica sheet used for the coil insulation |
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