JPH01171087U - - Google Patents

Info

Publication number
JPH01171087U
JPH01171087U JP1988067507U JP6750788U JPH01171087U JP H01171087 U JPH01171087 U JP H01171087U JP 1988067507 U JP1988067507 U JP 1988067507U JP 6750788 U JP6750788 U JP 6750788U JP H01171087 U JPH01171087 U JP H01171087U
Authority
JP
Japan
Prior art keywords
heat generating
generating component
heat sink
threaded member
insertion hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1988067507U
Other languages
Japanese (ja)
Other versions
JPH0611581Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988067507U priority Critical patent/JPH0611581Y2/en
Publication of JPH01171087U publication Critical patent/JPH01171087U/ja
Application granted granted Critical
Publication of JPH0611581Y2 publication Critical patent/JPH0611581Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress
    • H01L2924/3511—Warping

Landscapes

  • Resistance Heating (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

図面は本考案の技術的内容を示すものであつて
、第１図は本考案による１つの実施形態について
の平面図、第２図はその圧着板セツト状態の断面
図、第３図はその螺条部材の螺入完了状態の拡大
断面図、第４図は本考案によるもう１つの実施態
様についての平面図、第５図はその螺入定着完了
状態の断面図、第６図は従来のものの平面図、第
７図はその断面図、第８図はその圧着板による圧
着完了状態の断面図である。 然してこれらの図面において、１はパワーＩＣ
のような発熱部品、２は圧着板、３はヒートシン
ク、４は螺条部材、５は螺条部材挿通孔、６は切
欠、８はプリント配線基板、１０はシヤーシを示
すものである。 The drawings show the technical contents of the present invention, in which Fig. 1 is a plan view of one embodiment of the invention, Fig. 2 is a cross-sectional view of the crimp plate set state, and Fig. 3 is a view of the screw. FIG. 4 is a plan view of another embodiment of the present invention, FIG. 5 is a sectional view of the strip member in a state where screwing is completed, and FIG. 6 is a diagram of the conventional one. FIG. 7 is a plan view, FIG. 7 is a sectional view thereof, and FIG. 8 is a sectional view of the crimping plate in a state in which crimping is completed. However, in these drawings, 1 is a power IC.
2 is a pressure bonding plate, 3 is a heat sink, 4 is a threaded member, 5 is a threaded member insertion hole, 6 is a notch, 8 is a printed wiring board, and 10 is a chassis.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 発熱部品装入用凹部の形成されたヒートシンク
、該凹部内に装入された発熱部品を有し、該発熱
部品と前記ヒートシンクに配設された圧着板と、
この圧着板と上記ヒートシンクとを螺着する螺条
部材から成り、前記圧着板における螺条部材挿入
孔の周辺に該挿入孔部分に可曲作用を与えるスリ
ツト状その他の切欠を設けたことを特徴とする発
熱部品取付機構。 A heat sink having a recess for inserting a heat generating component, a heat generating component inserted into the recess, and a pressure bonding plate disposed on the heat generating component and the heat sink;
It consists of a threaded member that screws together the crimp plate and the heat sink, and is characterized in that a slit-shaped or other cutout is provided around the threaded member insertion hole in the crimp plate to give a bending effect to the insertion hole portion. Heat generating parts mounting mechanism.
JP1988067507U 1988-05-24 1988-05-24 Heating component mounting mechanism Expired - Lifetime JPH0611581Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988067507U JPH0611581Y2 (en) 1988-05-24 1988-05-24 Heating component mounting mechanism

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988067507U JPH0611581Y2 (en) 1988-05-24 1988-05-24 Heating component mounting mechanism

Publications (2)

Publication Number Publication Date
JPH01171087U true JPH01171087U (en) 1989-12-04
JPH0611581Y2 JPH0611581Y2 (en) 1994-03-23

Family

ID=31292879

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988067507U Expired - Lifetime JPH0611581Y2 (en) 1988-05-24 1988-05-24 Heating component mounting mechanism

Country Status (1)

Country Link
JP (1) JPH0611581Y2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007110161A (en) * 2001-07-30 2007-04-26 Fujitsu Hitachi Plasma Display Ltd Mounting structure for ic chip and display device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007110161A (en) * 2001-07-30 2007-04-26 Fujitsu Hitachi Plasma Display Ltd Mounting structure for ic chip and display device
JP4528788B2 (en) * 2001-07-30 2010-08-18 日立プラズマディスプレイ株式会社 Plasma display device

Also Published As

Publication number Publication date
JPH0611581Y2 (en) 1994-03-23

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