JPH01170941U - - Google Patents

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図はこの考案の一実施例の分解斜視図、第
２図はバイメタルの支持状態の部分断面図、第３
図は回路しや断器の部分破断図、第４図は従来例
の側面図、第５図はその側面図、第６図はその部
分分解斜視図、第７図は断面図、第８図はバイメ
タルの基端部の斜視図、第９図は他の従来例の側
面図、第１０図はその分解斜視図である。 １……端面、４……かしめ突起、５……基板、
６……矩形孔、７……基端部、８……バイメタル
。 Fig. 1 is an exploded perspective view of one embodiment of this invention, Fig. 2 is a partial sectional view of the bimetal support state, and Fig. 3 is a partial sectional view of the bimetal support state.
The figure is a partially cutaway view of the circuit breaker, Figure 4 is a side view of a conventional example, Figure 5 is a side view, Figure 6 is a partially exploded perspective view, Figure 7 is a sectional view, and Figure 8. 9 is a side view of another conventional example, and FIG. 10 is an exploded perspective view thereof. 1... End face, 4... Caulking projection, 5... Board,
6... Rectangular hole, 7... Base end, 8... Bimetal.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 板厚よりも大きい幅をもつた平板であつて端面
の幅方向の中間部に板幅よりも狭い幅で突設され
た平板状のかしめ突起を有する基板と、前記かし
め突起に嵌合し前記端面に孔縁部が当接する矩形
孔の長手方向を幅方向に平行に基端部に形成した
バイメタルとを備えたバイメタル支持装置におい
て、前記かしめ突起の厚さを前記基板の板厚より
も小さくしたことを特徴とするバイメタル支持装
置。 a substrate which is a flat plate having a width greater than the thickness of the plate and has a flat caulking protrusion protruding from the middle part of the end face in the width direction with a width narrower than the plate width; In a bimetal support device comprising a bimetal formed at the base end of a rectangular hole whose longitudinal direction is parallel to the width direction of the rectangular hole whose end surface abuts, the thickness of the caulking protrusion is smaller than the plate thickness of the substrate. A bimetal support device characterized by: