JPH01170098A - Transparent board for shielding electromagnetic wave - Google Patents
Transparent board for shielding electromagnetic waveInfo
- Publication number
- JPH01170098A JPH01170098A JP62327398A JP32739887A JPH01170098A JP H01170098 A JPH01170098 A JP H01170098A JP 62327398 A JP62327398 A JP 62327398A JP 32739887 A JP32739887 A JP 32739887A JP H01170098 A JPH01170098 A JP H01170098A
- Authority
- JP
- Japan
- Prior art keywords
- transparent
- electromagnetic wave
- film
- conductive film
- transparent plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011521 glass Substances 0.000 claims description 14
- 238000000034 method Methods 0.000 abstract description 8
- 230000000694 effects Effects 0.000 abstract description 6
- 239000005357 flat glass Substances 0.000 abstract description 3
- 230000002349 favourable effect Effects 0.000 abstract description 2
- 239000010408 film Substances 0.000 description 88
- 239000010410 layer Substances 0.000 description 13
- 229910052751 metal Inorganic materials 0.000 description 11
- 239000002184 metal Substances 0.000 description 11
- 239000004020 conductor Substances 0.000 description 7
- 238000005516 engineering process Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 229910045601 alloy Inorganic materials 0.000 description 4
- 239000000956 alloy Substances 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 3
- 239000011229 interlayer Substances 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 238000007639 printing Methods 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 3
- 229910001887 tin oxide Inorganic materials 0.000 description 3
- 239000011247 coating layer Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 229910003437 indium oxide Inorganic materials 0.000 description 2
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 2
- 230000007257 malfunction Effects 0.000 description 2
- 230000013011 mating Effects 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 125000006850 spacer group Chemical group 0.000 description 2
- 238000002834 transmittance Methods 0.000 description 2
- 239000012780 transparent material Substances 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- -1 etc. Substances 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000006187 pill Substances 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000002195 synergetic effect Effects 0.000 description 1
- 238000009834 vaporization Methods 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
- 239000005322 wire mesh glass Substances 0.000 description 1
Abstract
Description
【発明の詳細な説明】 ［産業上の利用分野］ 本発明は、優れた電磁波遮蔽性能を何し窓。[Detailed description of the invention] [Industrial application field] The present invention provides a window with excellent electromagnetic shielding performance.
ドア等に使用するのに適した電磁波遮蔽透明板に関する
ものである。This invention relates to an electromagnetic wave shielding transparent plate suitable for use in doors, etc.
［従来技術］
近年、ピル、その他各種の建物において、電磁波による
ノイズが大きな問題となっている。[Prior Art] In recent years, noise caused by electromagnetic waves has become a major problem in buildings such as pill bars and various other buildings.
かかる電磁波によるノイズ対策として、外部の電磁波ノ
イズによって建物内部の機器が障害を−受けない様に、
外部の電磁波を建物内部に入れない技術の開発や、他の
建物に対しては電磁波による影響を与えない様に、建物
の内部から外部に電磁波を出さない技術の開発が要望さ
れている。特に、ビル内に光ファイバー・ケーブルや同
軸ケーブル、あるいは無線通信などの情報ネットワーク
システムを張りめぐらしたインテリジェントビル、コン
ピューター・センター、精密電子機器類を使用する建物
、オフィスや病院などでは、ノイズ発生、誤動作、情報
の漏洩、あるいは情報の盗聴防止の点から、電磁波を出
さない技術及び電磁波を入れない技術が必要であり、今
後その必要性は益々増大することが予想される。又、電
車や高圧送電線等に近い電磁環境の悪い場所では、電磁
波を入れない電磁遮蔽建物が要求されている。As a countermeasure against noise caused by such electromagnetic waves, measures are taken to prevent equipment inside the building from being interfered with by external electromagnetic noise.
There is a demand for the development of technology that prevents external electromagnetic waves from entering buildings, and the development of technology that prevents electromagnetic waves from emitting from inside buildings to the outside so that electromagnetic waves do not affect other buildings. Especially in intelligent buildings with optical fiber cables, coaxial cables, or information network systems such as wireless communications, computer centers, buildings using precision electronic equipment, offices, hospitals, etc., noise generation and malfunction may occur. From the viewpoint of preventing information leakage or information theft, technology that does not emit electromagnetic waves or technology that does not allow electromagnetic waves to enter is necessary, and the need for this is expected to increase more and more in the future. Furthermore, in places with poor electromagnetic environments near trains, high-voltage power lines, etc., electromagnetic shielding buildings are required to prevent electromagnetic waves from entering.
この様な電磁波を入れない、出さないビルその他各種建
物、オフィス等を構築する際に、最も電磁波遮蔽性能を
必要とする部位に窓や出入口などの開口部がある。しか
し、従来においては、窓あるいは出入口などの開口部の
材料、特に透明性を要求されるガラスなどの窓・開口部
材料は、電磁波遮蔽性能がなかったので、電磁波遮蔽を
行なうことができなかった。そのため、今までは、高度
な電磁波遮蔽性能を有する建物は窓のない建物であり、
太陽光が入らず、又職務環境も好ましいものではなかっ
た。あるいは又１通常の建物において、電磁波を遮蔽す
る空間が必要な場合には、ビル内、又は室内に窓のない
電磁波シールドルームを作る必要があり、この場合にも
前述した様な欠点があった。When constructing buildings, offices, etc. that do not allow or emit electromagnetic waves, openings such as windows and doorways are among the areas that most require electromagnetic wave shielding performance. However, in the past, materials for openings such as windows and doorways, especially glass and other window/opening materials that required transparency, did not have electromagnetic wave shielding performance, so it was not possible to shield electromagnetic waves. . Therefore, until now, buildings with advanced electromagnetic shielding performance were those without windows.
There was no sunlight and the work environment was not favorable. Alternatively, in a normal building, if a space to shield electromagnetic waves is needed, it is necessary to create an electromagnetic shielding room with no windows inside the building or indoors, which also has the drawbacks mentioned above. .
かかる点から、高い電磁波遮蔽性能を有し、かつ十分な
太陽光の可視光域の透過性能を有するガラス等の透明材
料の開発が要求されていた。From this point of view, there has been a demand for the development of transparent materials such as glass that have high electromagnetic wave shielding performance and sufficient transmission performance in the visible light range of sunlight.
従来、高度な電磁波遮蔽性能を有し、かつ太陽光の可視
光域の透過性能を有する窓ガラスは高度な電磁波遮蔽性
能を有する細線で織られた布状のもの、例えばメツシュ
布を２枚のガラス板で挟む類いのもの、あるいは膜厚の
大きな金属膜をガラス面に付着させる類いのものであり
、前者は電磁波遮蔽性能の面で満足のゆくものではなく
、かつ、太陽光の可視光域の透過性に難点がある。又、
後者は太陽光の可視光域の透過性に大きな問題を有する
という欠点を有していた。Conventionally, window glass that has high electromagnetic wave shielding performance and transmission performance in the visible light range of sunlight has been manufactured using two sheets of cloth-like material woven with fine wires, such as mesh cloth, that has high electromagnetic wave shielding performance. These are the type that is sandwiched between glass plates, or the type where a thick metal film is attached to the glass surface.The former is not satisfactory in terms of electromagnetic wave shielding performance, and There is a problem with the transparency of the light range. or,
The latter had the disadvantage of having a major problem in transmittance in the visible light range of sunlight.
［発明の解決しようとする問題点］
本発明は、前述した様な欠点がなく、高い電磁波遮蔽性
能を有し、かつ十分な太陽光の可視光域の透過性能を有
するガラス等の透明材料、特に電磁波を遮蔽するビル、
建物、部屋の窓や出入口などの開口部に使用するのに適
した透明板を提供することを目的とする。[Problems to be Solved by the Invention] The present invention provides a transparent material such as glass that does not have the above-mentioned drawbacks, has high electromagnetic wave shielding performance, and has sufficient transmission performance in the visible light range of sunlight; Especially buildings that shield electromagnetic waves,
The purpose is to provide a transparent plate suitable for use in openings such as windows and doorways of buildings and rooms.
［問題点を解決するための手段］
本発明は、前述の目的に基づき発明されたものであり、
その要旨は、透明板であって、該透明板には透明性導電
膜と導電性の格子パターンが形成されていることを特徴
とする電磁波遮蔽透明体に関するものである。[Means for solving the problems] The present invention was invented based on the above-mentioned objectives,
The gist thereof relates to an electromagnetic wave shielding transparent body characterized by being a transparent plate, on which a transparent conductive film and a conductive lattice pattern are formed.
［実施例］
以下、本発明の実施例について、図面を参照しながら説
明する。[Examples] Examples of the present invention will be described below with reference to the drawings.
第１．３．５．７．９〜１２図は、本発明に係る電磁波
遮蔽透明板の横断面図であり、第２図は第１図の、第４
図は第３図の、第６図は第５図の、第８図は第７図の電
磁波遮蔽透明板の平面図を示す。図において、ｌは電磁
波遮蔽透明板、２．３．４は透明板、５．６は透明性導
電膜、７，８．９は導電性の格子パターン、１０は合せ
中間膜、１１は複層用スペーサー、１２は内部中空層を
示す。1.3.5.7.9 to 12 are cross-sectional views of the electromagnetic wave shielding transparent plate according to the present invention, and FIG.
The figure shows a plan view of the electromagnetic wave shielding transparent plate of FIG. 3, FIG. 6 of FIG. 5, and FIG. 8 of FIG. 7. In the figure, l is an electromagnetic wave shielding transparent plate, 2.3.4 is a transparent plate, 5.6 is a transparent conductive film, 7 and 8.9 are conductive lattice patterns, 10 is a laminated interlayer film, and 11 is a multilayer spacer, 12 indicates an internal hollow layer.
本発明のおける透明体としては、透明性、半透明性、青
色透明性、又は着色半透明性のガラス板、あるいは各種
プラスチック板が使用できる。中でも、ガラス板は光学
的特性、耐久性などの点から好ましい。この透明板は、
第１゜３．５，７．９図の様に透明板２が１枚からなる
ものであってもよいし、第１０図の様に２枚の透明板２
．４を合せ中間膜１０により接合した合せタイプのもの
であってもよいし、又、第１１゜１２図の様に２枚の透
明板２．４をスペーサー１゜を介在されて内部中空層１
２ができる様に互に所定間隔をおいて隔置してなる複層
タイプ、あるいは２枚の透明板を枠体により内部中空層
ができる様に互に所定間隔をおいて隔置してなる二重タ
イプのものであってもよい。あるいは又、透明板は３枚
以上の透明板を合せ中間膜により接合した合せタイプで
あってもよいし、３枚以上の透明板をスペーサーにより
隔置してなる複層タイプであってもよいし、３枚以上の
透明板を枠体により隔置してなる多重タイプであっても
よい。As the transparent body in the present invention, transparent, translucent, blue transparent, or colored semitransparent glass plates, or various plastic plates can be used. Among these, glass plates are preferred from the viewpoint of optical properties, durability, and the like. This transparent plate is
The transparent plate 2 may consist of one piece as shown in Figures 1.3.5 and 7.9, or it may consist of two transparent plates 2 as shown in Figure 10.
．． It may be of a laminated type in which the two transparent plates 2.4 are laminated and joined by an interlayer film 10, or as shown in FIGS.
A multi-layer type in which two transparent plates are spaced apart from each other at a predetermined distance to create a hollow layer, or two transparent plates are spaced apart from each other at a predetermined distance so that a hollow layer is created inside the frame. It may be of a double type. Alternatively, the transparent plate may be a laminated type in which three or more transparent plates are laminated and joined by an interlayer film, or a multilayer type in which three or more transparent plates are separated by spacers. However, it may be a multiplex type in which three or more transparent plates are spaced apart by a frame.
本発明において、透明板に形成される透明性導電膜とし
ては、例えば、透明性酸化錫導電膜（アンチモンやフッ
素のドーピングされた酸化錫導電膜）や透明性酸化イン
ジウム導電膜（錫のドーピングされた酸化インジウム導
電膜）などのほか、Ｃｒ、 Ｔｉ、へｇ、Ａｕ、Ａ１２
．Ｃｕ、Ｎｉ等の透明性金属又は透明性合金などからな
る単層薄膜タイプのもの、もしくは、これらの透明性金
属を例えば、Ｚｎ口、 Ｓｎ０ｍ、 Ｉ ｎｍＯｓ、
Ｔｉｅｓ、 Ｂ ｉ ｓｒｓ、 Ｔａ１ｌｓ、 ＷＯｓ
。In the present invention, the transparent conductive film formed on the transparent plate is, for example, a transparent tin oxide conductive film (a tin oxide conductive film doped with antimony or fluorine) or a transparent indium oxide conductive film (a tin oxide conductive film doped with tin). indium oxide conductive film), as well as Cr, Ti, Heg, Au, A12
．． Single layer thin film type made of transparent metals such as Cu and Ni or transparent alloys, or these transparent metals such as Zn, Sn0m, InmOs,
Ties, B i srs, Ta1ls, WOs
.
ＺｎＳなどからなる薄膜で上下からサンドイッチ状に挟
み込んでなる多層薄膜タイプのもの、例えばＴｉｎ５膜
／＾ｇ膜／Ｔｉｎ、膜、 ＺｎＯ膜／Ａｇ膜／ＺｎＯ膜
、ＳｎＯ＊膜／Ａｇ膜／５ｎＯｓ膜などの３層タイプ、
Ｔｉｅｓ膜／Ａｇ膜／Ｔｉｅｓ膜／Ａｇ膜／Ｔｉｅ、膜
、ＺｎＯ膜／Ａｇ膜／ＺｎＯ膜／Ａｇ膜／ＺｎＯ膜など
の５層タイプやその他適宜の構成のものを用いることが
できる。これらの透明性導電膜は、いずれも熱線反射性
の高い性質を有するものを用いた場合を例示しであるが
、必要によっては、上記以外の熱線反射性の比較的低い
性質を有する膜を用いることもできる。なお、熱線反射
性に富む膜を用いて透明性導電膜を形成しであるときは
、冷暖房負荷軽減機能を有して断熱性に富む窓材として
使用することもできる。A multilayer thin film type made by sandwiching thin films made of ZnS or the like from above and below, such as Tin5 film/^g film/Tin film, ZnO film/Ag film/ZnO film, SnO* film/Ag film/5nOs film. 3-layer type, such as
A five-layer type such as Ties film/Ag film/Ties film/Ag film/Tie film, ZnO film/Ag film/ZnO film/Ag film/ZnO film, or any other appropriate structure can be used. These transparent conductive films are exemplified using films with high heat ray reflection properties, but if necessary, films with relatively low heat ray reflection properties other than those mentioned above may be used. You can also do that. In addition, when a transparent conductive film is formed using a film that is highly reflective of heat rays, it can also be used as a window material that has a cooling/heating load reduction function and is highly heat insulating.
また、上記した構成からなる透明性導電膜は、真空蒸ｎ
法、スパッター法、ＣＶＤ法、スプレー法、ＣＬＤ法、
プリント印刷法など、適宜の被膜形成法を用いて形成す
ることができる。この場合、透明性導電膜は、透明板面
に直接積層させて形成するのが望ましいが、例えば、ポ
リエステルフィルムなどのプラスチック・フィルム面に
透明性導電膜を積層することで形成した透明導電性プラ
スチックフィルムを透明性導電膜として使用し、これを
透明板に積層することで使用することもできる。In addition, the transparent conductive film having the above-mentioned structure can be made by vacuum vaporization.
method, sputter method, CVD method, spray method, CLD method,
It can be formed using an appropriate film forming method such as a printing method. In this case, it is preferable to form the transparent conductive film by directly laminating it on the surface of the transparent plate. A film can also be used as a transparent conductive film and laminated on a transparent plate.
本発明において使用される透明性導電膜としては、高い
電磁波遮蔽効果が得られる様に、２０Ω／口以下の面積
抵抗とするのが好ましい。The transparent conductive film used in the present invention preferably has a sheet resistance of 20 Ω/hole or less so as to obtain a high electromagnetic wave shielding effect.
特に４０ Ｍ ＩＩ ｚ以上の広い高周波領域の電磁波
が効果的に遮蔽される様に、１００７口以下とするのが
最適である。透明性導電膜の膜厚は、上記した様な所望
の抵抗値と所望の可視光透過率が得られる様に、又所望
の色調が得られる様に、適宜決定される。In particular, it is optimal to set the number to 1007 or less so that electromagnetic waves in a wide high frequency range of 40 M II z or more can be effectively shielded. The thickness of the transparent conductive film is appropriately determined so as to obtain the desired resistance value and desired visible light transmittance as described above, and to obtain the desired color tone.
透明板に形成される透明性導電膜を２つあるいはそれ以
上に分割されたタイプとし、複数枚の透明性導電膜から
構成される様にしてもよい。この場合、各透明性導電膜
間の間隔は電磁波が漏れない様に１ｃｍ以下とするのが
好ましい。この様に複数枚の透明性導電膜を１枚の透明
板に形成した場合には、それぞれを電気的に並列接続す
ることによって、１枚の透明板に形′成された複数枚の
透明性導電膜の全体としての電気抵抗値を下げることが
でき、電磁波遮蔽性能を向上させることができる。The transparent conductive film formed on the transparent plate may be divided into two or more types, and may be composed of a plurality of transparent conductive films. In this case, the interval between each transparent conductive film is preferably 1 cm or less so that electromagnetic waves do not leak. When multiple transparent conductive films are formed on one transparent plate in this way, by electrically connecting them in parallel, the multiple transparent conductive films formed on one transparent plate can be The electrical resistance value of the conductive film as a whole can be lowered, and the electromagnetic wave shielding performance can be improved.
かかる透明性導電膜は、透明板の露出する表面に形成し
てもよいし、あるいは合せタイプにおいては透明板の合
せ面側の表面に形成してもよいし、あるいは複層タイプ
、多重タイプにおいては透明板の内部中空層側の面に形
成してもよい、この様に透明性導電膜を合せ面側、ある
いは内部中空層側の面に形成すると、透明性導電膜を外
部に露出しない様にすることができ、透明性導電膜を保
護できるので、耐久性の面で不充分な透明性導電膜の場
合には有利である。Such a transparent conductive film may be formed on the exposed surface of the transparent plate, or in the case of a laminated type, it may be formed on the surface of the mating side of the transparent plate, or in the case of a multilayer type or multilayer type. may be formed on the inner hollow layer side of the transparent plate.If the transparent conductive film is formed on the mating surface side or the inner hollow layer side in this way, the transparent conductive film will not be exposed to the outside. Since the transparent conductive film can be protected, it is advantageous in the case of a transparent conductive film that is insufficient in terms of durability.
勿論、合せタイプ、複層タイプ、多重タイプの透明板に
おいても、露出側面に透明性導電膜を形成してもよい。Of course, a transparent conductive film may be formed on the exposed side surface of a laminated type, multilayer type, or multilayer type transparent plate.
又、透明性導電膜は、透明板の一面に形成すればよいも
のであるが、必要に応じ、二面、あるいはそれ以上の面
に形成してもよい。第１゜２．９．１１図に示した例は
透明板２の一面に透明性導電膜５を形成した例であり、
第５．７図に示した例は１枚の透明板２の両面に透明性
導電膜５．６を形成した例であり、又第１１図は２枚の
透明板から構成される複層タイプのそれぞれの透明板２
．４の片面に透明性導電膜５．６を形成した例である。Further, although the transparent conductive film may be formed on one surface of the transparent plate, it may be formed on two or more surfaces as necessary. The example shown in Figure 1.2.9.11 is an example in which a transparent conductive film 5 is formed on one surface of a transparent plate 2.
The example shown in Figure 5.7 is an example in which a transparent conductive film 5.6 is formed on both sides of one transparent plate 2, and the example shown in Figure 11 is a multilayer type consisting of two transparent plates. each transparent plate 2
．． This is an example in which a transparent conductive film 5.6 is formed on one side of 4.
又、本発明の透明板に形成される導電性の格子パターン
としては、電磁波が遮蔽される様に、導電性の優れた材
料から形成された格子パターンが用いられる。この導電
性の格子パターンは、例えばＡｇ、＾Ｑ、＾ｕ、 Ｃｕ
などの金属粉末とバインダーとを含む導電性ペーストを
所定の格子パターンにプリント印刷し、硬化あるいは焼
付けて形成されたものや、ＡＱ箔や旧情を所定の格子パ
ターンに貼り付けて形成されたものや、導電性金属から
なる格子パターンが表面に、あるいは中間層に形成され
たプラスチックフィルムを貼り付けて、あるいはサンド
イッチして形成されたものなどが使用される。かかる導
電性の格子パターンの形成された透明板としては、金属
線が格子パターンを持って封入された網入りガラス板、
あるいは網入りプラスチック板も使用することができる
。あるいは又、２枚の透明板間に格子・パターンの金属
線を挿入して合わせた透明板も使用できる。あるいは又
、電気良導体の金属又は合金（例えば、 ＡＱ、Ｃｕ、
ステンレス、真鍮など）あるいはその他の導電性材料に
より格子体を構成したもの、あるいはプラスチック等に
より格子体を構成し、その表面に電気良導体の金属又は
合金あるいはその他の導電性物質の被覆層を形成してな
るもの、あるいは電気良導体の金属又は合金、あるいは
その他の導電性物質により格子体を構成し、その表面に
塗装層や絶縁層を施したものを透明板に貼り付けたり、
接着したり、固着させるなどして格子パターンを形成し
たものであってもよい。Further, as the conductive lattice pattern formed on the transparent plate of the present invention, a lattice pattern formed from a material with excellent conductivity is used so that electromagnetic waves are shielded. This conductive lattice pattern is made of, for example, Ag, ^Q, ^u, Cu.
Those formed by printing a conductive paste containing metal powder and binder into a predetermined grid pattern, and curing or baking it, and those formed by pasting AQ foil or old fashioned paste into a predetermined grid pattern. A plastic film having a grid pattern made of conductive metal formed on the surface or as an intermediate layer is attached or sandwiched. Such transparent plates with conductive lattice patterns include wired glass plates in which metal wires are encapsulated in a lattice pattern;
Alternatively, a wired plastic plate can also be used. Alternatively, a transparent plate made by inserting a grid or pattern of metal wires between two transparent plates can also be used. Alternatively, metals or alloys that are good electrical conductors (e.g. AQ, Cu,
A grid made of stainless steel, brass, etc.) or other conductive material, or a grid made of plastic, etc., and a coating layer of a metal or alloy or other conductive substance with good electrical conductivity is formed on the surface. A lattice made of a metal or alloy with good electrical conductivity, or other conductive material, and a coating layer or an insulating layer applied to the surface of the lattice body is pasted on a transparent plate.
A grid pattern may be formed by adhering or fixing.
かかる格子パターンは透明板の一面に形成すればよいも
のであるが、必要に応じ二面あるいはそれ以−Ｌの面あ
るいは内部に設けてもよい。Such a lattice pattern may be formed on one surface of the transparent plate, but it may be formed on two or more L surfaces or inside, if necessary.
導電性の格子パターンの各単位の格子の正面形状は、特
に限定されるものではなく、三角形、四角形、五角形、
六角形などの多角形のパターン、その他各種の任意の形
状のパターンが採用できる。各単位の格子の対角線の長
い方の長さ（内寸法）は、所望の透光性、電磁波遮蔽性
能、デザインなどの点から決定される。一般的には、対
角線の長さは、それぞれ１ｃｍ〜３０ｃｍとするのが適
当である。なお、３０ｃｍより大とすると低周波帯の電
磁波遮蔽性能が低下するので好ましくなく、又Ｉ ｃｍ
より小となると格子パターンが密となって透視性、透光
性の点から好ましくない。The front shape of the lattice of each unit of the conductive lattice pattern is not particularly limited, and may be triangular, square, pentagonal,
Polygonal patterns such as hexagonal patterns and patterns of various other arbitrary shapes can be adopted. The length (inner dimension) of the longer diagonal line of the lattice of each unit is determined from the viewpoints of desired translucency, electromagnetic wave shielding performance, design, etc. Generally, it is appropriate that the length of each diagonal line is 1 cm to 30 cm. In addition, if it is larger than 30 cm, it is not preferable because the electromagnetic wave shielding performance in the low frequency band will deteriorate.
If the size is smaller, the lattice pattern becomes denser, which is not preferable in terms of visibility and translucency.
上記した様な構造、寸法の電気良導体の格子パターンを
用いることにより、各格子における電磁波の反射の繰り
返しにより電磁波を効果的に遮蔽することができる６特
に、より低周波数側の電磁波、例えば４０ＱＭＨｚ以下
の電磁波を効果的に遮蔽することができる。By using a grid pattern of a good electrical conductor with the structure and dimensions described above, it is possible to effectively shield electromagnetic waves by repeating the reflection of electromagnetic waves in each grid.6 In particular, it is possible to effectively shield electromagnetic waves on the lower frequency side, for example, 40QMHz or lower. can effectively shield electromagnetic waves.
第２．６図に示した例は、透明板としてガラス板を使用
し、このガラス板面に単位格子の形状が正方形である格
子パターンに銀ペーストをプリント印刷し、焼付けて導
電性の格子パターンを形成したものであり、正方形の格
子の対角線の長さをｌ０ｃｍ、格子パターンの膜厚な２
０μｍ。In the example shown in Figure 2.6, a glass plate is used as a transparent plate, and silver paste is printed on the surface of the glass plate in a lattice pattern in which the shape of the unit grid is square, and then baked to create a conductive lattice pattern. The length of the diagonal of the square grid is 10 cm, and the film thickness of the grid pattern is 2.
0μm.
線巾な１ｍｍとすることにより４００Ｍ１ｌｚ以下の電
磁波を効果的に遮蔽できる様にしたものである。By making the line width 1 mm, it is possible to effectively shield electromagnetic waves of 400 M1lz or less.
第４図に示した例は、透明板としてガラス板を使用し、
このガラス板面に単位格子の形状が長方形である格子パ
ターンに銀ペーストをプリント印刷し、焼付けて導電性
の格子パターンを形成したものであり、長方形の格子の
対角線の長さを２０ｃｍ、格子パターンの膜１７を２０
μｍとすることにより３００ＭＩＩｚ以下の電磁波を効
果的に遮蔽できる様にしたものである。The example shown in Figure 4 uses a glass plate as the transparent plate,
A conductive lattice pattern is formed by printing silver paste on a lattice pattern with a rectangular unit lattice shape on the surface of this glass plate, and baking it to form a conductive lattice pattern. membrane 17 to 20
By setting the thickness to μm, it is possible to effectively shield electromagnetic waves of 300 MIIz or less.
第８図に示した例は、透明板としてガラス板を使用し、
このガラス板面に１１を位格子の形状が三角形である格
子パターンに銀ペーストをプリント印刷し、焼付けて導
電性の格子パターンを形成したものであり、三角形の格
子の高さの長さを１０ｃｍ、格子パターンの膜厚を２０
μｍ１線巾を１ｍｍとすることにより、４００Ｍ１ｌｚ
以下の電磁波を効果的に遮蔽できる様にしたものである
。The example shown in Figure 8 uses a glass plate as the transparent plate,
Silver paste was printed on the surface of this glass plate in a lattice pattern in which the shape of the 11 lattice was a triangle, and was baked to form a conductive lattice pattern, and the length of the height of the triangular lattice was 10 cm. , the thickness of the grid pattern is 20
By setting μm1 line width to 1mm, 400M1lz
It is designed to effectively shield the following electromagnetic waves.
本発明の透明性導電膜と導電性の格子パターンの形成さ
れた電磁波遮蔽透明板において、透明性導電膜と格子パ
ターンとは透明板の同一の面に重ねて形成してもよいし
、透明板の異なる面にそれぞれ形成してもよい。叉透明
性導電膜と格子パターンとを積層して透明板に形成する
場合には、どちらを上面にしてもよいが、格子パターン
の−Ｆ面に透明性導電膜を形成する場合、透明性導電膜
の重なった部分の膜性能が劣化することがあるので、格
子パターンを透明性導電膜の上面に形成するのが好まし
い。In the electromagnetic wave shielding transparent plate on which a transparent conductive film and a conductive lattice pattern are formed according to the present invention, the transparent conductive film and the lattice pattern may be formed overlappingly on the same surface of the transparent plate, or They may be formed on different surfaces of each. When a transparent conductive film and a lattice pattern are laminated to form a transparent plate, either side may be the top surface, but when a transparent conductive film is formed on the -F side of the lattice pattern, the transparent conductive film Since the film performance may deteriorate in the overlapping portion of the films, it is preferable to form a lattice pattern on the upper surface of the transparent conductive film.
本発明の電磁波遮蔽透明板において、透明性導電膜と導
電性の格子パターンとは１重ねて形成した場合、導通状
態としても構わないが、透明導電膜がより高周波数域の
電磁波（例えば、１００〜１０００Ｍ１００Ｏを、又格
子パターンが低周波数域の電磁波（例えば、４００Ｍ１
ｌｚ以下）をそれぞれ効果的に遮蔽される様に、透明性
導電膜と導電性の格子パターンとを非導通状態とするの
がより好ましい、この場合、透明性導電膜と導電性の格
子パターンとを透明板の異なる面に形成して非導通状態
としてもよいし、あるいは透明性導電膜と電気良導体の
格子とを非導通状態とするために１両者の少なくとも接
する部分の間に電気絶縁層を介在させるの様にしてもよ
い。In the electromagnetic wave shielding transparent plate of the present invention, when the transparent conductive film and the conductive lattice pattern are formed in one layer, they may be in a conductive state. ~1000M100O, or the grid pattern is electromagnetic waves in the low frequency range (for example, 400M1
It is more preferable that the transparent conductive film and the conductive lattice pattern are in a non-conducting state so that they are effectively shielded from each other.In this case, the transparent conductive film and the conductive lattice pattern may be formed on different sides of the transparent plate to make them non-conductive. Alternatively, in order to make the transparent conductive film and the grid of electrically conductive material non-conductive, an electrically insulating layer may be provided between at least the contacting portions of the transparent conductive film and the grid of electrically conductive material. It is also possible to intervene.
特に好ましい態様においては、透明板の異なる面に透明
性導電膜と導電性の格子パターンとそれぞれ別々に設け
るタイプである。この様にすれば、透明性導電膜と導電
性の格子パターンの電磁波遮蔽性能の相乗効果により広
い周波数帯域において高い電磁波遮蔽性能が得られる。In a particularly preferred embodiment, a transparent conductive film and a conductive lattice pattern are provided separately on different surfaces of a transparent plate. In this way, high electromagnetic wave shielding performance can be obtained in a wide frequency band due to the synergistic effect of the electromagnetic wave shielding performance of the transparent conductive film and the conductive grid pattern.
透明性導電膜及び電気導電性である格子パターンの少な
くともいずれか一方には、これらに入射した電磁波がア
ースに落され、電磁波遮蔽性能が発揮される様に、アー
ス用のアース接続端を設けることができる。透明性導電
膜と格子パターンが非導通状態の場合には、それぞれ別
々にアース接続端が設けられ、又導通状態の場合には、
それぞれ別々にあるいはいずれか一方にアース接続端が
設けられる。透明性導電膜及び／又は格子パターンにお
いては、通常Ａｇ、＾Ｑなど導電性金属粉末を含む導電
性ペーストを透明性導電膜面上の適宜の周辺部に所定パ
ターンをもってプリント印刷し、焼付け、あるいは硬化
させてブスバーを形成したり、あるいは、所定パターン
の＾Ｑ箔やＣｕ箔を貼り付けてブスバーを形成し、この
ブスバーの適宜の位置にアース接続端を設ける。このア
ース接続端には、必要に応じて、アース線の接続を容易
にするためにターミナルを取付けることもできる。At least one of the transparent conductive film and the electrically conductive grid pattern is provided with a ground connection end for grounding so that electromagnetic waves incident thereon are dropped to the ground and electromagnetic wave shielding performance is exhibited. Can be done. When the transparent conductive film and the grid pattern are in a non-conducting state, separate earth connection ends are provided for each, and when the transparent conductive film and the grid pattern are in a conducting state,
A ground connection end is provided separately or on either one of them. In the case of a transparent conductive film and/or a lattice pattern, a conductive paste containing a conductive metal powder such as Ag or Q is usually printed in a predetermined pattern on an appropriate peripheral area on the surface of the transparent conductive film, and then baked or A bus bar is formed by curing, or a bus bar is formed by pasting a predetermined pattern of ^Q foil or Cu foil, and a ground connection end is provided at an appropriate position of this bus bar. If necessary, a terminal can be attached to this earth connection end to facilitate connection of the earth wire.
このアース接続端は、ｔｔａ所でもよいし、又複数箇所
であってもよい。This ground connection end may be at tta locations or may be at multiple locations.
なお、透明性導電膜及び／又は格子パターンには、必ず
しもアース接続端を設ける必要はない。例えば、透明性
導電膜及び／又は格子パターンの所定部分を露出させ、
透明板をサツシ等に取付ける時に、上記透明性導電膜及
び／又は格子パターンの露出部分に導電性シーラントを
配し、これを利用してサツシとの導通をとる様にしても
よい。Note that the transparent conductive film and/or the grid pattern do not necessarily need to be provided with a ground connection end. For example, exposing a predetermined portion of the transparent conductive film and/or the grid pattern,
When attaching the transparent plate to a sash or the like, a conductive sealant may be placed on the exposed portion of the transparent conductive film and/or the grid pattern, and this may be used to establish electrical continuity with the sash.
［作用及び効果］
本発明によれば、透明板に透明性導電膜及び導電性の格
子パターンが形成されているので、透明性導電膜と導電
性の格子パターンの両方の作用により高い電磁波遮蔽効
果が得られる。特に、透明性導電膜は、 ３００ＭＩＩ
ｚ以」ユの高周波の電磁波の遮蔽性能が高く、又電気良
導体である格子パターンは４００帽ＩＺ以下の低周波の
電磁波の遮蔽性能が高いので、透明性導電膜と格子パタ
ーンの組合せ使用により、コンピューター、ワードプロ
セッサー、語測器類、ロボット類、その他各種デジタル
技術を応用した電子機器類から周囲に放射する周波数域
の電磁波、及びこれら種種の電子機器類や情報ネットワ
ーク等に誤動作や悪影響を与える周波数域の電磁波、例
えばｌＯＭＩＩｚ〜Ｉ０００Ｍｌｌｚ以上の広い（１シ
域の電磁波を効果的に遮蔽することができる。[Operations and Effects] According to the present invention, since the transparent conductive film and the conductive lattice pattern are formed on the transparent plate, a high electromagnetic wave shielding effect can be achieved due to the effects of both the transparent conductive film and the conductive lattice pattern. is obtained. In particular, the transparent conductive film is 300 MII
The lattice pattern, which is a good electrical conductor, has a high shielding performance for high-frequency electromagnetic waves below 400 IZ, so by using a combination of a transparent conductive film and a lattice pattern, Electromagnetic waves in the frequency range emitted from computers, word processors, word measuring instruments, robots, and other electronic devices that apply various digital technologies, and frequencies that cause malfunctions or adverse effects on these types of electronic devices and information networks, etc. It is possible to effectively shield electromagnetic waves in a wide range (for example, 1000Mllz or more).
本発明の電磁波遮蔽複層透明体は、透視性、透光性が要
求され、かつ高い電磁波遮蔽性能が要求されるインデリ
ジェントビルやコンビュ−タセンター、精密電子機器類
が使用される建物、オフィス、病院あるいはその他種々
の建物の窓用ガラスとして有用である。The electromagnetic wave shielding multi-layer transparent body of the present invention is suitable for use in intelligent buildings and computer centers that require transparency and translucency as well as high electromagnetic wave shielding performance, as well as buildings and offices where precision electronic equipment is used. It is useful as window glass for hospitals and various other buildings.
第１．３，５．７．９〜１２図は、本発明に係る電磁波
遮蔽透明体の横断面図であり、第２図は第１図の、第４
図は第３図の、第６図は第５の、第８図は第７図の電磁
波遮蔽透明板の平面図を示す。
１：電磁波遮蔽透明板、２，３，４：透明板、５，６．
透明性導電膜、７，８，９；導電性の格子パターン。
馬１図1.3, 5.7.9 to 12 are cross-sectional views of the electromagnetic wave shielding transparent body according to the present invention, and FIG.
The figure shows a plan view of the electromagnetic wave shielding transparent plate of FIG. 3, FIG. 6 of FIG. 5, and FIG. 8 of FIG. 7. 1: Electromagnetic wave shielding transparent plate, 2, 3, 4: Transparent plate, 5, 6.
Transparent conductive film, 7, 8, 9; conductive grid pattern. horse 1 diagram
Claims (5)
電性の格子パターンが形成されていることを特徴とする
電磁波遮蔽透明板。(1) An electromagnetic wave shielding transparent plate, characterized in that the transparent plate has a transparent conductive film and a conductive grid pattern formed thereon.
反対面には導電性の格子パターンが形成されていること
を特徴とする特許請求の範囲第１項記載の電磁波遮蔽透
明板。(2) An electromagnetic wave shielding transparent plate according to claim 1, characterized in that a transparent conductive film is formed on one side of the transparent plate, and a conductive lattice pattern is formed on the opposite side. .
ターンとが積層されて形成されていることを特徴とする
特許請求の範囲第１項記載の電磁波遮蔽透明板。(3) The electromagnetic wave shielding transparent plate according to claim 1, wherein a transparent conductive film and a conductive grid pattern are laminated on one side of the transparent plate.
透明板の少なくとも片面には導電性の格子パターンが形
成されていることを特徴とする特許請求の範囲第１項記
載の電磁波遮蔽透明板。(4) Electromagnetic waves according to claim 1, characterized in that a transparent conductive film is formed on both sides of the transparent plate, and a conductive lattice pattern is formed on at least one side of the transparent plate. Shielding transparent plate.
求の範囲第１項記載の電磁波遮蔽透明板。(5) The electromagnetic wave shielding transparent plate according to claim 1, wherein the transparent plate is a glass plate.
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62327398A JPH0719994B2 (en) | 1987-12-25 | 1987-12-25 | Electromagnetic wave shielding transparent plate |
| EP88121331A EP0322720A3 (en) | 1987-12-25 | 1988-12-20 | Electromagnetic wave shielding transparent body |
| US07/288,278 US4978812A (en) | 1987-12-25 | 1988-12-22 | Electromagnetic wave shielding transparent body |
| CA000586972A CA1322398C (en) | 1987-12-25 | 1988-12-23 | Electromagnetic wave shielding transparent body |
| KR1019880017430A KR0130472B1 (en) | 1987-12-25 | 1988-12-24 | Transparent body for shielding a electro-magnetic wave |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62327398A JPH0719994B2 (en) | 1987-12-25 | 1987-12-25 | Electromagnetic wave shielding transparent plate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01170098A true JPH01170098A (en) | 1989-07-05 |
| JPH0719994B2 JPH0719994B2 (en) | 1995-03-06 |
Family
ID=18198707
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62327398A Expired - Fee Related JPH0719994B2 (en) | 1987-12-25 | 1987-12-25 | Electromagnetic wave shielding transparent plate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0719994B2 (en) |
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0352381U (en) * | 1989-09-28 | 1991-05-21 | ||
| US5885723A (en) * | 1996-12-25 | 1999-03-23 | Hitachi Chemical Company, Ltd. | Bonding film for printed circuit boards |
| US6086979A (en) * | 1997-11-11 | 2000-07-11 | Hitachi Chemical Company, Ltd. | Electromagnetically shielding bonding film, and shielding assembly and display device using such film |
| US6207266B1 (en) | 1997-06-03 | 2001-03-27 | Hitachi Chemical Company, Ltd. | Electromagnetically shielding bonding film |
| EP1215705A2 (en) * | 2000-12-12 | 2002-06-19 | Nisshinbo Industries, Inc. | Transparent electromagnetic radiation shielding material |
| JP2002198688A (en) * | 2000-10-19 | 2002-07-12 | Nisshinbo Ind Inc | See-through electromagnetic wave shield and near infrared ray cut material and method for manufacturing the same |
| US6448492B1 (en) | 1997-12-24 | 2002-09-10 | Gunze Limited | Transparent member for shielding electromagnetic waves and method of producing the same |
| JP2007027389A (en) * | 2005-07-15 | 2007-02-01 | Dainippon Printing Co Ltd | Electromagnetic wave shield filter, its production method, display equipped therewith and electromagnetic wave shield structure |
| JP2009055012A (en) * | 2007-08-24 | 2009-03-12 | Samsung Corning Precision Glass Co Ltd | Electromagnetic wave screen member for display device |
| WO2010055656A1 (en) * | 2008-11-14 | 2010-05-20 | Ｎｅｃトーキン株式会社 | Electromagnetic shield panel, window member, structure, electromagnetic shield room and electromagnetic shield box |
| WO2012065987A1 (en) * | 2010-11-16 | 2012-05-24 | Thales | Optronic window transparent to ir and reflecting rf |
| WO2013065683A1 (en) * | 2011-11-02 | 2013-05-10 | 富士フイルム株式会社 | Base material for forming electroconductive pattern, circuit board, and method for producing each |
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-
1987
- 1987-12-25 JP JP62327398A patent/JPH0719994B2/en not_active Expired - Fee Related
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|---|---|---|---|---|
| JPH0352381U (en) * | 1989-09-28 | 1991-05-21 | ||
| US5885723A (en) * | 1996-12-25 | 1999-03-23 | Hitachi Chemical Company, Ltd. | Bonding film for printed circuit boards |
| US6207266B1 (en) | 1997-06-03 | 2001-03-27 | Hitachi Chemical Company, Ltd. | Electromagnetically shielding bonding film |
| US6086979A (en) * | 1997-11-11 | 2000-07-11 | Hitachi Chemical Company, Ltd. | Electromagnetically shielding bonding film, and shielding assembly and display device using such film |
| US6197408B1 (en) | 1997-11-11 | 2001-03-06 | Hitachi Chemical Company, Ltd. | Electromagnetically shielding bonding film, and shielding assembly and display device using such film |
| US6448492B1 (en) | 1997-12-24 | 2002-09-10 | Gunze Limited | Transparent member for shielding electromagnetic waves and method of producing the same |
| JP2002198688A (en) * | 2000-10-19 | 2002-07-12 | Nisshinbo Ind Inc | See-through electromagnetic wave shield and near infrared ray cut material and method for manufacturing the same |
| EP1215705A2 (en) * | 2000-12-12 | 2002-06-19 | Nisshinbo Industries, Inc. | Transparent electromagnetic radiation shielding material |
| EP1215705A3 (en) * | 2000-12-12 | 2003-05-21 | Nisshinbo Industries, Inc. | Transparent electromagnetic radiation shielding material |
| JP2007027389A (en) * | 2005-07-15 | 2007-02-01 | Dainippon Printing Co Ltd | Electromagnetic wave shield filter, its production method, display equipped therewith and electromagnetic wave shield structure |
| JP2009055012A (en) * | 2007-08-24 | 2009-03-12 | Samsung Corning Precision Glass Co Ltd | Electromagnetic wave screen member for display device |
| US8242670B2 (en) | 2007-08-24 | 2012-08-14 | Samsung Corning Precision Materials Co., Ltd. | Electromagnetic wave blocking member for display apparatus |
| WO2010055656A1 (en) * | 2008-11-14 | 2010-05-20 | Ｎｅｃトーキン株式会社 | Electromagnetic shield panel, window member, structure, electromagnetic shield room and electromagnetic shield box |
| JP4779059B2 (en) * | 2008-11-14 | 2011-09-21 | Ｎｅｃトーキン株式会社 | Electromagnetic shielding panel, window member, structure, electromagnetic shielding room and electromagnetic shielding box |
| WO2012065987A1 (en) * | 2010-11-16 | 2012-05-24 | Thales | Optronic window transparent to ir and reflecting rf |
| US9012788B2 (en) | 2010-11-16 | 2015-04-21 | Thales | Optronic window transparent to IR and reflecting RF |
| WO2013065683A1 (en) * | 2011-11-02 | 2013-05-10 | 富士フイルム株式会社 | Base material for forming electroconductive pattern, circuit board, and method for producing each |
| JP2013118362A (en) * | 2011-11-02 | 2013-06-13 | Fujifilm Corp | Base material for conductive pattern formation, circuit board, and method for manufacturing the same |
| WO2014148589A1 (en) * | 2013-03-21 | 2014-09-25 | 株式会社ノリタケカンパニーリミテド | Electromagnetic shield |
| US10655209B2 (en) | 2013-03-21 | 2020-05-19 | Noritake Co., Limited | Electromagnetic shield |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0719994B2 (en) | 1995-03-06 |
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| LAPS | Cancellation because of no payment of annual fees |